MICROCIRCUIT DATA SHEET Original Creation Date: 03/04/02 Last Update Date: 03/15/02 Last Major Revision Date: MNLM137-WG REV 0A0 3-TERMINAL VOLTAGE REGULATOR, -37 VOLTS < VO < -1.25 VOLTS AT 0.5A General Description The LM137H is an adjustable 3-terminal negative voltage regulator capable of supplying in excess of -0.5A over an output voltage range of -1.2V to -37V. This regulator is exceptionally easy to apply, requiring only 2 external resistors to set the output voltage and 1 output capacitor for frequency compensation. The circuit design has been optimized for excellent regulation and low thermal transients. Futher, the LM137H features internal current limiting, thermal shutdown and safe-area compensation, making it virtually blowout-proof against overloads. The LM137H serve a wide variety of applications including local on-card regulation, programmable-output voltage regulation or precision current regulation. The LM137H is an ideal complement to the LM117H adjustable positive regulator. Industry Part Number NS Part Numbers LM137 LM137WG-QMLV Prime Die LM137 Controlling Document SEE FEATURES SECTION Processing Subgrp Description MIL-STD-883, Method 5004 1 2 3 4 5 6 7 8A 8B 9 10 11 Quality Conformance Inspection MIL-STD-883, Method 5005 1 Static tests at Static tests at Static tests at Dynamic tests at Dynamic tests at Dynamic tests at Functional tests at Functional tests at Functional tests at Switching tests at Switching tests at Switching tests at Temp ( oC) +25 +125 -55 +25 +125 -55 +25 +125 -55 +25 +125 -55 MICROCIRCUIT DATA SHEET MNLM137-WG REV 0A0 Features - Output voltage adjustable from -1.2V to -37V 0.5A output current guaranteed, -55 C to +150 C Line regulation typically 0.01%/V Load regulation typically 0.3% Excellent thermal regulation, 0.002%/W 50 ppm/ C temperature coefficient Temperature-independent current limit Internal thermal overload protection Stantard 3-lead transistor package Output short circuit protected CONTROLLING DOCUMENTS: LM137WG-QMLV 5962-9951701VZA 2 MICROCIRCUIT DATA SHEET MNLM137-WG REV 0A0 (Absolute Maximum Ratings) (Note 1) Power Dissipation Internally Limited Input-Output Voltage Differential 40V Operatuing Junction Temperature -55 C < Ta < +150 C Maximum Junction Temperature (Note 2) 150 C Maximum Power Dissipation (@ 25 C) Minimum Input Voltage 2.5 Watts -41.25V Storage Temperature -65 C < Ta < +150 C Lead Temperature (Soldering, 10 seconds) Thermal Resistance ThetaJA CERAMIC SOIC (Still Air @ 0.5W) (500LF/Min Air Flow @ 0.5W) 300 C 108 C/W 65 C/W ThetaJC CERAMIC SOIC (@ 1.0W) Package Weight (Typical) CERAMIC SOIC ESD Rating (Note 3) 2.7 C/W 370mg 4000V Note 1: Note 2: Note 3: Note 4: Note 5: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Rating indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. The maximum power dissipation must be derated at elevated temperatures and is dictated by Tjmax (maximum junction temperature), ThetaJA (package junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any temperature is Pdmax = (Tjmax - TA) /ThetaJA or the number given in the Absolute Maximum Ratings, whichever is lower. For the CERAMIC SOIC device to function properly, the "Output" and "Output/Sense" pins must be connected on the users printed circuit board. The package material for these devices allows much improved heat transfer over our standard ceramic packages. In order to take full advantage of this improved heat transfer, heat sinking must be provided between the package base (directly beneath the die), and either metal traces on, or thermal vias through, the printed circuit board. Without this additional heat sinking, device power dissipation must be calculated using junction-to-ambient, rather than junction -to-case, thermal resistance. It must not be assumed that the device leads will provide substantial heat transfer out the package, since the thermal resistance of the leadframe material is very poor, relative to the material of the package base. The stated junction-to-case thermal resistance is for the package material only, and does not account for the additional thermal resistance between the package base and the printed circuit board. The user must determine the value of the additional thermal resistance and must combine this with the stated value for the package, to calculate the total allowed power dissipation for the device. Human body model, 1.5K Ohms in series with 100pF. 3 MICROCIRCUIT DATA SHEET MNLM137-WG REV 0A0 Recommended Operating Conditions Ta -55 C < Ta < +125 C Input Voltage Range -41.25V to -4.25V 4 MICROCIRCUIT DATA SHEET MNLM137-WG REV 0A0 Electrical Characteristics DC PARAMETERS: SYMBOL Vout PARAMETER Output Voltage CONDITIONS NOTES Vin = -4.25V, Il = 5mA Vin = -4.25V, Il = 500mA Vin = -41.25V, Il = 5mA Vin = -41.25V, Il = 50mA Vrline Vrload Line Regulation Load Regulation Vin = -41.25V to -4.25V, Il = 5mA Vin = -6.25V, Il = 5mA to 500mA Vin = -41.25V, Il = 5mA to 50mA Vin = -6.25V, Il = 5mA to 200mA PINNAME MIN MAX UNIT SUBGROUPS -1.275 -1.225 V 1 -1.3 2, 3 -1.2 V -1.275 -1.225 V 1 -1.3 2, 3 -1.2 V -1.275 -1.225 V 1 -1.3 2, 3 -1.2 V -1.275 -1.225 V 1 -1.3 -1.2 V 2, 3 -9 9 mV 1 -23 23 mV 2, 3 -12 12 mV 1 -24 24 mV 2, 3 -6 6 mV 1 -12 12 mV 2, 3 -6 6 mV 1 -12 12 mV 2, 3 Vrth Thermal Regulation Vin = -14.6V, Il = 500mA -5 5 mV 1 Iadj Adjust Pin Current Vin = -4.25V, Il = 5mA 25 100 uA 1, 2, 3 Vin = -41.25V, Il = 5mA 25 100 uA 1, 2, 3 Delta Iadj(line) Adjust Pin Current Change vs. Line Voltage Vin = -41.25V to -4.25V, Il = 5mA -5 5 uA 1, 2, 3 Delta Iadj(load) Adjust Pin Current Change vs. Load Current Vin = -6.25V, Il = 5mA to 500mA -5 5 uA 1, 2, 3 Ios Output Short Circuit Current Vin = -4.25V 0.5 1.8 A 1, 2, 3 Vin = -40V 0.05 0.5 A 1, 2, 3 Vin = -4.25V -1.275 -1.225 V 1 -1.3 2, 3 Vout (Recovery) Output Voltage Recovery After Output Short Circuit Current Vin = -40V 5 -1.2 V -1.275 -1.225 V 1 -1.3 2, 3 -1.2 V MICROCIRCUIT DATA SHEET MNLM137-WG REV 0A0 Electrical Characteristics DC PARAMETERS:(Continued) SYMBOL PARAMETER Iq Minimum Load Current Vstart Voltage Start-up Vout Output Voltage CONDITIONS NOTES PINNAME MIN MAX UNIT SUBGROUPS Vin = -4.25V 0.2 3 mA 1, 2, 3 Vin = -14.25V 0.2 3 mA 1, 2, 3 Vin = -41.25V 1 5 mA 1, 2, 3 Vin = -4.25V, Il = 500mA -1.275 -1.225 V 1 -1.3 -1.2 V 2, 3 -1.3 -1.2 V 2 dB 9 Vin = -6.25V, Il = 5mA 1 AC PARAMETERS: Delta Vin/Delta Vout Ripple Rejection Vin = -6.25V, Il = 125mA, ei = 1Vrms at 2400Hz 48 Vno Output Noise Voltage Vin = -6.25V, Il = 50mA 120 uVrms 9 Delta Vout/Delta Vin Line Transient Response Vin = -6.25V, Vpulse = -1V, Il = 50mA 80 mV/V 9 Delta Vout/Delta Il Load Transient Response Vin = -6.25V, Il = 50mA, Delta Il = 200mA 60 mV 9 2 DC PARAMETERS: DRIFT VALUES (The following conditions apply to all the following parameters, unless otherwise specified.) DC: "Delta calculations performed on JAN S and QMLV devices at group B, subgroup 5 only". Vout Output Voltage Vin = -4.25V, Il = 5mA -0.01 0.01 V 1 Vin = -4.25V, Il = 500mA -0.01 0.01 V 1 Vin = -41.25V, Il = 5mA -0.01 0.01 V 1 Vin = -41.25V, Il = 50mA -0.01 0.01 V 1 Vrline Line Regulation Vin = 41.25V to -4.25V, Il = 5mA -4 4 mV 1 Iadj Adjust Pin Current Vin = -4.25V, Il = 5mA -10 10 uA 1 Vin = -41.25V, Il = 5mA -10 10 uA 1 Note 1: Note 2: Tested at +125 C; correlated to 150 C. Limit of 0.3mV/mA is equivalent to 60mV. 6 MICROCIRCUIT DATA SHEET MNLM137-WG REV 0A0 Graphics and Diagrams GRAPHICS# DESCRIPTION 06367HRA1 CERAMIC SOIC (WG), 16 LEAD (B/I CKT) P000463A CERAMIC SOIC (WG), 16 LEAD (PINOUT) WG16ARC CERAMIC SOIC (WG), 16 LEAD (P/P DWG) See attached graphics following this page. 7 N/C 1 16 N/C N/C 2 15 N/C ADJ 3 14 N/C INPUT 4 13 N/C N/C 5 12 OUTPUT N/C 6 11 OUTPUT/SENSE N/C 7 10 N/C N/C 8 9 LM137WG 16 - LEAD CERAMIC SOIC CONNECTION DIAGRAM TOP VIEW P000463A N MIL/AEROSPACE OPERATIONS 2900 SEMICONDUCTOR DRIVE SANTA CLARA, CA 95050 N/C MICROCIRCUIT DATA SHEET MNLM137-WG REV 0A0 Revision History Rev ECN # 0A0 M0003963 03/15/02 Rel Date Originator Changes Rose Malone Initial MDS Release: MNLM137-WG, Rev. 0A0. 8