MICROCIRCUIT DATA SHEET Original Creation Date: 09/12/00 Last Update Date: 11/03/00 Last Major Revision Date: MNLM137-X REV 0B1 3 TERMINAL ADJUSTABLE NEGATIVE REGULATOR General Description The LM137H is an adjustable 3-terminal negative voltage regulator capable of supplying in excess of -0.5A over an output voltage range of -1.2V to -37V. This regulator is exceptionally easy to apply, requiring only 2 external resistors to set the output voltage and 1 output capacitor for frequency compensation. The circuit design has been optimized for excellent regulation and low thermal transients. Futher, the LM137H features internal current limiting, thermal shutdown and safe-area compensation, making it virtually blowout-proof against overloads. The LM137H serves a wide variety of applications including local on-card regulation, programmable-output voltage regulation or precision current regulation. The LM137H is an ideal complement to the LM117H adjustable positive regulator. Industry Part Number NS Part Numbers LM137 LM137H/883 LM137WG/883 Prime Die LM137 Processing Subgrp Description MIL-STD-883, Method 5004 1 2 3 4 5 6 7 8A 8B 9 10 11 Quality Conformance Inspection MIL-STD-883, Method 5005 1 Static tests at Static tests at Static tests at Dynamic tests at Dynamic tests at Dynamic tests at Functional tests at Functional tests at Functional tests at Switching tests at Switching tests at Switching tests at Temp ( oC) +25 +125 -55 +25 +125 -55 +25 +125 -55 +25 +125 -55 MICROCIRCUIT DATA SHEET MNLM137-X REV 0B1 Features - Output voltage adjustable from -1.2V to -37V 0.5A output current guaranteed, -55 C to +150 C Line regulation typically 0.01%/V Load regulation typically 0.3% Excellent thermal regulation, 0.002%/W 50 ppm/ C temperature coefficient Temperature-independent current limit Internal thermal overload protection Stantard 3-lead transistor package Output short circuit protected 2 MICROCIRCUIT DATA SHEET MNLM137-X REV 0B1 (Absolute Maximum Ratings) (Note 1) Power Dissipation Internally Limited Input-Output Voltage Differential 40V Operating Temperature -55 C < Ta < +125 C Maximum Junction Temperature (Note 2) 150 C Storage Temperature -65 C to +150 C Lead Temperature (Soldering, 10 seconds) Thermal Resistance ThetaJA Metal Can (Still Air @ 0.5W) (500LF/Min Air flow @ 0.5W) CERAMIC SOIC (Still Air @ 0.5W) (500LF/Min Air flow @ 0.5W) 300 C 174 C/W 64 C/W 108 C/W 65 C/W ThetaJC Metal Can (@ 1.0W) CERAMCI SOIC (@ 1.0W) (Note 3, 4) Package Weight (Typical) Metal Can CERAMIC SOIC ESD Rating (Note 5) 15 C/W 2.7 C/W 995mg 370mg 4000V Note 1: Note 2: Note 3: Note 4: Note 5: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Rating indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. The maximum power dissipation must be derated at elevated temperatures and is dictated by Tjmax (maximum junction temperature), ThetaJA (package junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any temperature is Pdmax = (Tjmax - TA) /ThetaJA or the number given in the Absolute Maximum Ratings, whichever is lower. For the CERAMIC SOIC device to function properly, the "Output" and "Output/Sense" pins must be connected on the users printed circuit board. The package material for these devices allows much improved heat transfer over our standard ceramic packages. In order to take full advantage of this improved heat transfer, heat sinking must be provided between the package base (directly beneath the die), and either metal traces on, or thermal vias through, the printed circuit board. Without this additional heat sinking, device power dissipation must be calculated using junction-to-ambient, rather than junction-to-case, thermal resistance. It must not be assumed that the device leads will provide substantial heat transfer out of the package, since the thermal resistance of the leadframe materical is very poor, relatvie to the materical of the package base. The stated junction-to-case thermal resistance is for the package material only, and does not account for the additional thermal resistance between the package base and the printed circuit board. The user must determine the value of the additional thermal resistance and must combine this with the stated value for the package, to calculate the total allowed power dissipation for the device. Human body model, 100pF discharged through 1.5K Ohms. 3 MICROCIRCUIT DATA SHEET MNLM137-X REV 0B1 Recommended Operating Conditions Ta -55 C to +125 C Input Voltage Range -41.25V to -4.25V 4 MICROCIRCUIT DATA SHEET MNLM137-X REV 0B1 Electrical Characteristics DC PARAMETERS (The following conditions apply to all the following parameters, unless otherwise specified.) DC: Vin=-4.25V, Il=8mA, Vout=Vref SYMBOL Vref Iq Rline Rload Iadj PARAMETER Minimum Load Current Line Regulation Load Regulation Adjustment Pin Current Change vs Line Voltage Delta Iadj/ (load) Theta R Icl Vout NOTES Reference Voltage Delta Iadj/ (line) Theta JC CONDITIONS PINNAME MIN MAX UNIT SUBGROUPS -1.275 -1.225 V 1 -1.3 2, 3 -1.2 V Vin= -42V -1.275 -1.225 V 1 Vin= -41.3V -1.3 -1.2 V 2, 3 Vout= -1.7V 3 mA 1, 2, 3 Vout= -1.7V, Vin= -11.75V 3 mA 1, 2, 3 Vout= -1.7V, Vin= -42V 5 mA 1 Vout= -1.7V, Vin= -41.3V 5 mA 2, 3 -42V < Vin < -4.25V -9 9 mV 1 -41.3V < Vin < -4.25V -23 23 mV 2, 3 5mA < Il < 500mA, Vin=-6.25V -25 25 mV 1, 2, 3 5mA < Il < 500mA, Vin=-14.5V -25 25 mV 1 5mA < Il < 150mA, Vin=-40V -25 25 mV 1, 2, 3 Il = 5 mA 100 uA 1, 2, 3 Vin = -42V 100 uA 1 Vin = -41.3V 100 uA 2, 3 -42V < Vin < -4.25V, Il=5 mA -5 5 uA 1 -41.3V < Vin < -4.25V, Il=5 mA -5 5 uA 2, 3 Change vs Load Current 5 mA < Il < 500 mA, Vin= -6.5V -5 5 uA 1, 2, 3 Thermal Regulation Vin= -14.5V, Il=500mA, t=10mS -5 5 mV 1 Vin= -14.5V, Il=5mA, t=10mS -5 5 mV 1 15 Deg 1 Thermal Resistance Current Limit 1 Vin= -5V -1.8 -0.5 C/W A Vin= -40V -0.65 -0.15 A 1, 2, 3 -1.28 -1.22 V 1 -1.3 -1.2 V 2, 3 Output Voltage 5 1, 2, 3 MICROCIRCUIT DATA SHEET MNLM137-X REV 0B1 Electrical Characteristics AC PARAMETERS SYMBOL Rr PARAMETER Ripple Rejection Ratio CONDITIONS NOTES Vin= -6.25V, Vout=Vref, Il=125mA, ei=1Vrms, F=120Hz PINNAME 2, 3 MIN MAX 66 UNIT dB SUBGROUPS 4, 5, 6 DC PARAMETERS: DRIFT VALUES (The following conditions apply to all the following parameters, unless otherwise specified.) DC: Vin = -4.25V, Il = 8mA, Vout=Vref. "Deltas not required on B-Level product. Deltas required for S-Level product ONLY as specified on Internal Processing Instructions (IPI)." Vref Reference Voltage Rline Line Regulation Iadj Adjustment Pin Current Note 1: Note 2: Note 3: -0.01 0.01 V 1 -42V < Vin < -4.25V -4 4 mV 1 Il = 5mA -10 10 uA 1 Guaranteed parameter, not tested. Tested at +25 C; guaranteed but not tested at +125 C and -55 C. Bench test refer to (SG) RPI-3-362. 6 MICROCIRCUIT DATA SHEET MNLM137-X REV 0B1 Graphics and Diagrams GRAPHICS# DESCRIPTION 05192HRC1 METAL CAN (H), TO-39, 3LD, .200 DIA P.C. (P/P DWG) 06367HRA1 CERAMIC SOIC (WG), 16 LEAD (B/I CKT) H03ARD METAL CAN (H), TO-39, 3LD, .200 DIA P.C. (P/P DWG) P000199A METAL CAN (H), TO-39, 3LD, .200 DIA P.C. P000463A CERAMIC SOIC (WG), 16 LEAD (PINOUT) WG16ARC CERAMIC SOIC (WG), 16 LEAD (P/P DWG) See attached graphics following this page. 7 (PINOUT) ADJUSTMENT OUTPUT INPUT LM137H, LM137HVH 3 - LEAD TO-39 CONNECTION DIAGRAM BOTTOM VIEW P000199A N MIL/AEROSPACE OPERATIONS 2900 SEMICONDUCTOR DRIVE SANTA CLARA, CA 95050 N/C 1 16 N/C N/C 2 15 N/C ADJ 3 14 N/C INPUT 4 13 N/C N/C 5 12 OUTPUT N/C 6 11 OUTPUT/SENSE N/C 7 10 N/C N/C 8 9 LM137WG 16 - LEAD CERAMIC SOIC CONNECTION DIAGRAM TOP VIEW P000463A N MIL/AEROSPACE OPERATIONS 2900 SEMICONDUCTOR DRIVE SANTA CLARA, CA 95050 N/C MICROCIRCUIT DATA SHEET MNLM137-X REV 0B1 Revision History Rev ECN # Originator Changes 0A0 M0003391 11/03/00 Rel Date Rose Malone Initial MDS Release: MNLM137-X, Rev. 0A0. Replaced MNLM137-H, Rev. 0BL. 0B1 M0003763 11/03/00 Rose Malone Update MDS: MNLM137-X, Rev. 0A0 to MNLM137-X, Rev. 0B1. Added Package Weight for CERAMIC SOIC in Absolute Section. Revision update to burn-in ckt from 05192HRB2 to 05192HRC1. 8