ETC DEM-OPA64X

®
DEM-OPA64x
EVALUATION FIXTURES
FEATURES
DESCRIPTION
● SOIC AND DIP VERSIONS
The DEM-OPA64x evaluation fixtures are fully assembled printed circuit boards, except for the gain
setting resistors, which are included. There are six
different layouts—three for SOICs and three for DIPs.
The three layouts are optimized for different circuits,
which include a voltage follower, an inverting and a
non-inverting configuration.
● SURFACE MOUNT COMPONENTS
FOR OPTIMUM PERFORMANCE
● SMA INPUT AND OUTPUT JACKS
FOR MAXIMUM FREQUENCY RESPONSE
● 2.5" X 2.5" DIMENSIONS
● DIP WITH PIN SOCKETS
These demonstration boards are used to evaluate the
Burr-Brown OPA64x series of operational amplifiers.
Operational amplifiers are not included with the DEMOPA64x. These demonstration boards incorporate
surface-mount resistors and surface-mount ceramic
bypass capacitors. The feedback resistor is placed
directly between the input and output pins. This is
necessary to achieve greater than 500MHz bandwidth
performance. The size of the circuit traces and feedthroughs are minimized to reduce parasitic capacitance, and separate bypass capacitors are placed
directly at each of the four power pins to maintain low
harmonic distortion.
● UNIVERSAL POWER SUPPLY
CONNECTIONS
● INPUT AND OUTPUT TERMINATION
INCLUDED
APPLICATIONS
● EVALUATE OPA64xU (SOIC) AND
OPA64xP (DIP) PERFORMANCE
● EVALUATE HIGH-FREQUENCY,
TWO LAYER PCB LAYOUT
● INCOMING INSPECTION TEST FIXTURE
The fixture requires a bipolar ±5V power supply.
Separate power supply paths are required for each
International Airport Industrial Park • Mailing Address: PO Box 11400
Tel: (602) 746-1111 • Twx: 910-952-1111 • Cable: BBRCORP •
• Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd. • Tucson, AZ 85706
Telex: 066-6491 • FAX: (602) 889-1510 • Immediate Product Info: (800) 548-6132
© 1993 Burr-Brown Corporation
LI-445
Printed in U.S.A. July, 1993
ORDERING INFORMATION
power pin to achieve low even-order harmonic distortion.
This approach minimizes non-linear output stage currents
coupling into the input gain stages. The orientation of the
power traces and the ceramic bypass capacitors have been
empirically determined to give the best harmonic distortion.
The connection from the top side of the board to the bottom
was made as short as possible. Wide power supply traces are
recommended to reduce series impedance at high frequencies.
PART NUMBER
PACKAGE
CIRCUIT CONFIGURATION
DEM-OPA640xU-F
DEM-OPA64xU-I
DEM-OPA64xU-N
SOIC
SOIC
SOIC
Voltage Follower
Inverting
Non-Inverting
DEM-OPA64xP-F
DEM-OPA64xP-I
DEM-OPA64xP-N
DIP
DIP
DIP
Voltage Follower
Inverting
Non-Inverting
Solid ground planes are used on both sides of the board and
are connected solidly together. The ground plane is removed
around the feedback resistor and signal paths to reduce
parasitic capacitance and ground plane noise coupling.
COMPONENT LIST
REF. DES.
QUANTITY
PART NUMBER
DESCRIPTION
MANUFACTURER
C1-4
4
C1206C104M5UAC
0.1µF 50V X7R Ceramic Capacitor
Kemet
C5-8
4
TAP225K025SCS
2.2µF 25V Tantalum Capacitor
AVX
P1, 2
2
ED500/2DS
2-Pin Power Block
On-Shore Technology
J1, 2
2
9650-1111-0000
PCB Mount SMA Connector
AEP
5
CRCW1206000ZT
0Ω 1206 Chip Resistor
Dale
Dale
5
CRCW12061000FT
100Ω 1206 Chip Resistor, 1% MF
5
CRCW12062000FT
200Ω 1206 Chip Resistor, 1% MF
Dale
5
CRCW120624R9FT
24.9Ω 1206 Chip Resistor, 1% MF
Dale
Dale
5
CRCW120644R2FT
44.2Ω 1206 Chip Resistor, 1% MF
5
CRCW120649R9FT
49.9Ω 1206 Chip Resistor, 1% MF
Dale
5
CRCW120656R2FT
56.2Ω 1206 Chip Resistor, 1% MF
Dale
Dale
5
CRCW120666R5FT
66.5Ω 1206 Chip Resistor, 1% MF
5
CRCW12064020FT
402Ω 1206 Chip Resistor, 1% MF
Dale
1
PPCDIP-308-710C
8-Pin Socket
McKenzie
1
Printed Circuit Board
®
DEM-OPA64X
2
R1
22Ω
C5
2.2µF
C6
2.2µF
P1
1
C1
0.1µF
+5V
GND
C2
0.1µF
2
2
R2
49.9Ω
8
7
6
J1
3
J2
4
P2
5
R3
49.9Ω
1
U1
OPA64xU/P
2
C3
0.1µF
C4
0.1µF
C8
2.2µF
–5v
GND
C7
2.2µF
FIGURE 1. DEM-OPA64xU/P-F Voltage Follower.
Top View
Top View
FIGURE 2. DEM-OPA64xU-F. The layout shown is 1.2x actual for clarity.
®
3
DEM-OPA64X
Top View
Top View
FIGURE 3. DEM-OPA64xP-F. The layout shown is 1.2x actual for clarity.
®
DEM-OPA64X
4
C5
2.2µF
C6
2.2µF
R1
xxxx
P1
1
C1
0.1µF
R4
xxxx
J1
+5V
GND
C2
0.1µF
2
2
8
7
6
3
R3
xxxx
R2
49.9
J2
4
P2
5
1
U1
OPA64xU/P
2
C3
0.1µF
C4
0.1µF
C8
2.2µF
–5v
GND
C7
2.2µF
FIGURE 4. DEM-OPA64xU/P-I Inverting.
Top View
Top View
FIGURE 5. DEM-OPA64xU-I. The layout shown is 1.2x actual for clarity.
®
5
DEM-OPA64X
Top View
Top View
FIGURE 6. DEM-OPA64xP-I. The layout shown is 1.2x actual for clarity.
®
DEM-OPA64X
6
R4
xxxx
R1
xxxx
C6
2.2µF
C5
2.2µF
P1
1
C1
0.1µF
+5V
GND
C2
0.1µF
2
2
R2
49.9
8
7
6
J1
3
J2
4
P2
5
R3
49.9Ω
1
U1
OPA64xU/P
2
C3
0.1µF
C4
0.1µF
C8
2.2µF
–5v
GND
C7
2.2µF
FIGURE 7. DEM-OPA64xU/P-N Non-Inverting.
Top View
Top View
FIGURE 8. DEM-OPA64xU-N. The layout shown is 1.2x actual for clarity.
®
7
DEM-OPA64X
Top View
Top View
FIGURE 9. DEM-OPA64xP-N. The layout shown is 1.2x actual for clarity.
®
DEM-OPA64X
8