® DEM-OPA64x EVALUATION FIXTURES FEATURES DESCRIPTION ● SOIC AND DIP VERSIONS The DEM-OPA64x evaluation fixtures are fully assembled printed circuit boards, except for the gain setting resistors, which are included. There are six different layouts—three for SOICs and three for DIPs. The three layouts are optimized for different circuits, which include a voltage follower, an inverting and a non-inverting configuration. ● SURFACE MOUNT COMPONENTS FOR OPTIMUM PERFORMANCE ● SMA INPUT AND OUTPUT JACKS FOR MAXIMUM FREQUENCY RESPONSE ● 2.5" X 2.5" DIMENSIONS ● DIP WITH PIN SOCKETS These demonstration boards are used to evaluate the Burr-Brown OPA64x series of operational amplifiers. Operational amplifiers are not included with the DEMOPA64x. These demonstration boards incorporate surface-mount resistors and surface-mount ceramic bypass capacitors. The feedback resistor is placed directly between the input and output pins. This is necessary to achieve greater than 500MHz bandwidth performance. The size of the circuit traces and feedthroughs are minimized to reduce parasitic capacitance, and separate bypass capacitors are placed directly at each of the four power pins to maintain low harmonic distortion. ● UNIVERSAL POWER SUPPLY CONNECTIONS ● INPUT AND OUTPUT TERMINATION INCLUDED APPLICATIONS ● EVALUATE OPA64xU (SOIC) AND OPA64xP (DIP) PERFORMANCE ● EVALUATE HIGH-FREQUENCY, TWO LAYER PCB LAYOUT ● INCOMING INSPECTION TEST FIXTURE The fixture requires a bipolar ±5V power supply. Separate power supply paths are required for each International Airport Industrial Park • Mailing Address: PO Box 11400 Tel: (602) 746-1111 • Twx: 910-952-1111 • Cable: BBRCORP • • Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd. • Tucson, AZ 85706 Telex: 066-6491 • FAX: (602) 889-1510 • Immediate Product Info: (800) 548-6132 © 1993 Burr-Brown Corporation LI-445 Printed in U.S.A. July, 1993 ORDERING INFORMATION power pin to achieve low even-order harmonic distortion. This approach minimizes non-linear output stage currents coupling into the input gain stages. The orientation of the power traces and the ceramic bypass capacitors have been empirically determined to give the best harmonic distortion. The connection from the top side of the board to the bottom was made as short as possible. Wide power supply traces are recommended to reduce series impedance at high frequencies. PART NUMBER PACKAGE CIRCUIT CONFIGURATION DEM-OPA640xU-F DEM-OPA64xU-I DEM-OPA64xU-N SOIC SOIC SOIC Voltage Follower Inverting Non-Inverting DEM-OPA64xP-F DEM-OPA64xP-I DEM-OPA64xP-N DIP DIP DIP Voltage Follower Inverting Non-Inverting Solid ground planes are used on both sides of the board and are connected solidly together. The ground plane is removed around the feedback resistor and signal paths to reduce parasitic capacitance and ground plane noise coupling. COMPONENT LIST REF. DES. QUANTITY PART NUMBER DESCRIPTION MANUFACTURER C1-4 4 C1206C104M5UAC 0.1µF 50V X7R Ceramic Capacitor Kemet C5-8 4 TAP225K025SCS 2.2µF 25V Tantalum Capacitor AVX P1, 2 2 ED500/2DS 2-Pin Power Block On-Shore Technology J1, 2 2 9650-1111-0000 PCB Mount SMA Connector AEP 5 CRCW1206000ZT 0Ω 1206 Chip Resistor Dale Dale 5 CRCW12061000FT 100Ω 1206 Chip Resistor, 1% MF 5 CRCW12062000FT 200Ω 1206 Chip Resistor, 1% MF Dale 5 CRCW120624R9FT 24.9Ω 1206 Chip Resistor, 1% MF Dale Dale 5 CRCW120644R2FT 44.2Ω 1206 Chip Resistor, 1% MF 5 CRCW120649R9FT 49.9Ω 1206 Chip Resistor, 1% MF Dale 5 CRCW120656R2FT 56.2Ω 1206 Chip Resistor, 1% MF Dale Dale 5 CRCW120666R5FT 66.5Ω 1206 Chip Resistor, 1% MF 5 CRCW12064020FT 402Ω 1206 Chip Resistor, 1% MF Dale 1 PPCDIP-308-710C 8-Pin Socket McKenzie 1 Printed Circuit Board ® DEM-OPA64X 2 R1 22Ω C5 2.2µF C6 2.2µF P1 1 C1 0.1µF +5V GND C2 0.1µF 2 2 R2 49.9Ω 8 7 6 J1 3 J2 4 P2 5 R3 49.9Ω 1 U1 OPA64xU/P 2 C3 0.1µF C4 0.1µF C8 2.2µF –5v GND C7 2.2µF FIGURE 1. DEM-OPA64xU/P-F Voltage Follower. Top View Top View FIGURE 2. DEM-OPA64xU-F. The layout shown is 1.2x actual for clarity. ® 3 DEM-OPA64X Top View Top View FIGURE 3. DEM-OPA64xP-F. The layout shown is 1.2x actual for clarity. ® DEM-OPA64X 4 C5 2.2µF C6 2.2µF R1 xxxx P1 1 C1 0.1µF R4 xxxx J1 +5V GND C2 0.1µF 2 2 8 7 6 3 R3 xxxx R2 49.9 J2 4 P2 5 1 U1 OPA64xU/P 2 C3 0.1µF C4 0.1µF C8 2.2µF –5v GND C7 2.2µF FIGURE 4. DEM-OPA64xU/P-I Inverting. Top View Top View FIGURE 5. DEM-OPA64xU-I. The layout shown is 1.2x actual for clarity. ® 5 DEM-OPA64X Top View Top View FIGURE 6. DEM-OPA64xP-I. The layout shown is 1.2x actual for clarity. ® DEM-OPA64X 6 R4 xxxx R1 xxxx C6 2.2µF C5 2.2µF P1 1 C1 0.1µF +5V GND C2 0.1µF 2 2 R2 49.9 8 7 6 J1 3 J2 4 P2 5 R3 49.9Ω 1 U1 OPA64xU/P 2 C3 0.1µF C4 0.1µF C8 2.2µF –5v GND C7 2.2µF FIGURE 7. DEM-OPA64xU/P-N Non-Inverting. Top View Top View FIGURE 8. DEM-OPA64xU-N. The layout shown is 1.2x actual for clarity. ® 7 DEM-OPA64X Top View Top View FIGURE 9. DEM-OPA64xP-N. The layout shown is 1.2x actual for clarity. ® DEM-OPA64X 8