NCP4561 Advance Information Ultra Low-Noise Low Dropout Voltage Regulator with 1.0 V ON/OFF Control The NCP4561 is a Low DropOut (LDO) regulator featuring excellent noise performances. Thanks to its innovative concept, the circuit reaches an incredible 40 µVRMS noise level without an external bypass capacitor. Housed in a small SOT–23 5 leads–like package, it represents the ideal designer’s choice when space and noise are at premium. The absence of external bandgap capacitor unleashes the response time to a wake–up signal and makes it stay within 40 µs (in repetitive mode), pushing the NCP4561 as a natural candidate in portable applications. The NCP4561 also hosts a novel architecture which prevents excessive undershoots when the regulator is the seat of fast transient bursts, as in any bursting systems. Finally, with a static line regulation better than –75 dB, it naturally shields the downstream electronics against choppy lines. Features • • • • • • • 100 kHz Typical, Iout = 60 mA, Co = 1.0 µF Fast Response Time from OFF to ON: 40 µs Typical at a 200 Hz Repetition Rate Ready for 1.0 V Platforms: ON with a 900 mV High Level Nominal Output Current of 80 mA with a 100 mA Peak Capability Typical Dropout of 90 mV @ 30 mA, 160 mV @ 80 mA Ripple Rejection: 70 dB @ 1.0 kHz 1.5% Output Precision @ 25°C Thermal Shutdown Applications • Noise Sensitive Circuits: VCOs RF Stages, etc. • Bursting Systems (TDMA Phones) • All Battery Operated Devices ON/ OFF 1 NC 3 GND 2 On/Off 5 Vin 4 Vout Thermal Shutdown 5 1 TSOP–5 SN SUFFIX CASE 483 PIN CONNECTIONS AND MARKING DIAGRAM ON/OFF 1 GND 2 NC 3 5 Vin 4 Vout P28YW • Ultra Low–Noise: 150 nV/√Hz @ 100 Hz, 40 µVRMS 100 Hz – http://onsemi.com (Top View) P28 = Device Code Y = Year W = Work Week ORDERING INFORMATION Device Voltge Output* Shipping NCP4561SNT1–28 2.8 V 3000/Tape & Reel * Contact your ON Semiconductor sales representative for other output voltage values. Band Gap Reference *Current Limit *Antisaturation Protection *Load Transient Improvement Figure 1. Simplified Block Diagram This document contains information on a new product. Specifications and information herein are subject to change without notice. Semiconductor Components Industries, LLC, 2001 February, 2001 – Rev. 0 1 Publication Order Number: NCP4561/D NCP4561 PIN FUNCTION DESCRIPTIONS Pin # Pin Name Function 1 ON/OFF Shuts or wakes–up the IC Description 2 GND The IC’s ground 3 NC None It makes no arm to connect the pin to a known potential, like in a pin–to–pin replacement case. 4 Vout Delivers the output voltage This pin requires a 1.0 µF output capacitor to be stable. 5 Vin Powers the IC A positive voltage up to 12 V can be applied upon this pin. A 900 mV level on this pin is sufficient to start the IC. A 150 mV shuts it down. MAXIMUM RATINGS Value Rating Pin # Symbol Min Max Unit 5 Vin – 12 V Power Supply Voltage ESD Capability, HBM Model All Pins – 1.0 kV ESD Capability, Machine Model All Pins – 200 V W Maximum Power Dissipation NW Suffix, Plastic Package Thermal Resistance Junction–to–Air PD – RJ–A – Internally Limited 210 Operating Ambient Temperature Maximum Junction Temperature (Note 1.) Maximum Operating Junction Temperature (Note 2.) TA TJmax TJ – – – –40 to +85 150 125 °C Tstg – –60 to +150 °C Storage Temperature Range °C/W ELECTRICAL CHARACTERISTICS (For Typical Values TA = 25°C, for Min/Max values TA = –40°C to +85°C, Max TJ = 125°C unless otherwise noted) Characteristics Pin # Symbol Min Typ Max Unit Input Voltage Range 1 VON/OFF 0 – Vin V ON/OFF Input Resistance 1 RON/OFF – 250 – k ON/OFF Control Voltages (Note 3.) Logic Zero, OFF State, IO = 50 mA Logic One, ON State, IO = 50 mA 1 VON/OFF – 900 – – 150 – Logic Control Specifications mV Currents Parameters Current Consumption in OFF State OFF Mode Current: Vin = Vout + 1.0 V, IO = 0, VOFF = 150 mV IQOFF – 0.1 2.0 A Current Consumption in ON State ON Mode Current: Vin = Vout + 1.0 V, IO = 0, VON = 3.5 V IQON – 180 – A Current Consumption in ON State, ON Mode Saturation Current: Vin = Vout – 0.5 V, No Output Load IQSAT – 800 – A Current Limit Vin = Voutnom + 1.0 V, Output is brought to Voutnom – 0.3 V IMAX 100 180 – mA 1. Internally Limited by Shutdown. 2. Specifications are guaranteed below this value. 3. Voltage Slope should be Greater than 2.0 mV/s. http://onsemi.com 2 NCP4561 ELECTRICAL CHARACTERISTICS (continued) (For Typical Values TA = 25°C, for Min/Max values TA = –40°C to +85°C, Max TJ = 125°C unless otherwise noted) Characteristics Pin # Symbol Min Typ Max Unit Vout + 1.0 V < Vin < 6.0 V, TA = 25°C, 1.0 mA < Iout < 80 mA 4 Vout 2.758 2.8 2.842 V Vout + 1.0 V < Vin < 6.0 V, TA = –40°C to +85°C, 1.0 mA < Iout < 80 mA 4 Vout 2.716 2.8 2.884 V 4/5 Regline – – 20 mV 4 Regload – – 40 mV 4 4 4 Vin–Vout Vin–Vout Vin–Vout – – – 90 140 160 150 200 250 4/5 Ripple – –70 – dB – 150 – nV/ √Hz Output Voltages Line and Load Regulation, Dropout Voltages Line Regulation Vout + 1.0 V < Vin < 12 V, Iout = 80 mA Load Regulation Vin = Vout + 1.0 V, Cout = 1.0 F, Iout = 1.0 to 80 mA Dropout Voltage (Note 4.) Iout = 30 mA Iout = 60 mA Iout = 80 mA mV Dynamic Parameters Ripple Rejection Vin = Vout + 1.0 V + 1.0 kHz 100 mVpp Sinusoidal Signal Output Noise Density @ 1.0 kHz 4 RMS Output Noise Voltage Cout = 1.0 F, Iout = 50 mA, F = 100 Hz to 1.0 MHz 4 Noise – 35 – V Output Rise Time Cout = 1.0 F, Iout = 50 mA, 10% of Rising ON Signal to 90% of Nominal Vout 4 trise – 40 – s – – 125 °C Thermal Shutdown Thermal Shutdown 4. Vout is brought to Vout – 100 mV. http://onsemi.com 3 NCP4561 DEFINITIONS Load Regulation Line Regulation The change in output voltage for a change in output current at a constant chip temperature. The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse technique such that the average chip temperature is not significantly affected. One usually distinguishes static line regulation or DC line regulation (a DC step in the input voltage generates a corresponding step in the output voltage) from ripple rejection or audio susceptibility where the input is combined with a frequency generator to sweep from a few hertz up to a defined boundary while the output amplitude is monitored. Dropout Voltage The input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 100 mV below its nominal value (which is measured at 1.0 V differential value). The dropout level is affected by the chip temperature, load current and minimum input supply requirements. Thermal Protection Output Noise Voltage This is the integrated value of the output noise over a specified frequency range. Input voltage and output current are kept constant during the measurement. Results are expressed in µVRMS. Internal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated at typically 125°C, the regulator turns off. This feature is provided to prevent catastrophic failures from accidental overheating. Maximum Power Dissipation Maximum Package Power Dissipation The maximum total dissipation for which the regulator will operate within its specs. The maximum power package power dissipation is the power dissipation level at which the junction temperature reaches its maximum operating value, i.e. 125°C. Depending on the ambient temperature, it is possible to calculate the maximum power dissipation and thus the maximum available output current. Quiescent Current The quiescent current is the current which flows through the ground when the LDO operates without a load on its output: internal IC operation, bias, etc. When the LDO becomes loaded, this term is called the Ground current. It is actually the difference between the input current (measured through the LDO input pin) and the output current. http://onsemi.com 4 NCP4561 TYPICAL CHARACTERISTICS 6.000 210 QUIESCENT CURRENT (µA) GROUND CURRENT (mA) 5.500 5.000 4.500 4.000 –40°C 25°C 3.500 3.000 2.500 85°C 2.000 1.500 1.000 0.500 0.000 0 20 40 60 80 100 205 200 195 190 185 –60 –40 –20 20 0 40 60 80 100 OUTPUT CURRENT (mA) AMBIENT TEMPERATURE (°C) Figure 2. Ground Current vs. Output Current Figure 3. Quiescent Current vs. Temperature 2.810 200 2.805 150 OUTPUT VOLTAGE (V) DROPOUT (mV) 85°C 25°C 100 –40°C 50 85°C 2.800 2.795 25°C 2.790 2.785 2.780 –40°C 2.775 2.770 2.765 2.760 2.755 00 –20 40 60 80 0 100 20 40 60 80 OUTPUT CURRENT (mA) OUTPUT CURRENT (mA) Figure 4. Dropout vs. Output Current Figure 5. Output Voltage vs. Output Current 100 OUTPUT NOISE SPECTRAL DENSITY 180 1000 140 NOISE (nV/sqrt Hz) DROPOUT VOLTAGE (mV) Vin = Vout + 1 Cout = 1 µF IO = 10 & 50 mA 80 mA 160 120 60 mA 100 80 30 mA 60 40 100 10 RMS Noise 10 Hz to 100 kHz: 36 µV 10 Hz to 1 MHz: 47 µV 20 0 –60 –40 –20 0 20 40 60 80 1 0.01 100 0.1 1 10 100 1000 FREQUENCY (kHz) TEMPERATURE (°C) Figure 6. Dropout Voltage vs. Temperature Figure 7. Typical Noise Density Performance http://onsemi.com 5 NCP4561 POWER SUPPLY REJECTION RATIO Mag (dB) Vin = Vout + 1 Cout = 1 µF Iload = 10 mA –7.50 –15.00 PSSR (dB) –22.50 –30.00 –37.50 –45.00 –52.50 –60.00 –67.50 10 100 1k 10 k 100 k 1M FREQUENCY (Hz) Figure 8. Typical Ripple Rejection Performance (Iload = 10 mA) POWER SUPPLY REJECTION RATIO Mag (dB) Vin = Vout + 1 Cout = 1 µF Iload = 60 mA –7.50 –15.00 PSSR (dB) –22.50 –30.00 –37.50 –45.00 –52.50 –60.00 –67.50 10 100 1k 10 k 100 k 1M FREQUENCY (Hz) Figure 9. Typical Ripple Rejection Performance (Iload = 60 mA) http://onsemi.com 6 NCP4561 APPLICATION HINTS Input Decoupling Protections As with any regulator, it is necessary to reduce the dynamic impedance of the supply rail that feeds the component. A 1.0 µF capacitor either ceramic or tantalum is recommended and should be connected close to the NCP4561 package. Higher values will correspondingly improve the overall line transient response. The NCP4561 hosts several protections, giving natural ruggedness and reliability to the products implementing the component. The output current is internally limited to a maximum value of 180 mA typical while temperature shutdown occurs if the die heats up beyond 125°C. These values let you assess the maximum differential voltage the device can sustain at a given output current before its protections come into play. The maximum dissipation the package can handle is given by: Output Decoupling Thanks to a novel concept, the NCP4561 is a stable component and does not require any specific Equivalent Series Resistance (ESR) neither a minimum output current. Capacitors exhibiting ESRs ranging from a few m up to 3.0 can thus safely be used. The minimum decoupling value is 1.0 µF and can be augmented to fulfill stringent load transient requirements. The regulator accepts ceramic chip capacitors as well as tantalum devices. T T A P max Jmax R JA If TJmax is limited to 125°C, then the NCP4561 can dissipate up to 470 mW @ 25°C. The power dissipated by the NCP4561 can be calculated from the following formula: Noise Decoupling Ptot V Unlike other LDOs, the NCP4561 is a true low–noise regulator. Without the need of an external bypass capacitor, it typically reaches the incredible level of 40 µVRMS overall noise between 100 Hz and 100 kHz. To give maximum insight on noise specifications, ON Semiconductor includes spectral density graphics. The classical bypass capacitor impacts the start–up phase of standard LDOs. However, thanks to its low–noise architecture, the NCP4561 operates without a bypass element and thus offers a typical 40 µs start–up phase. in I (I ) V V out I out gnd out in or Vin max Ptot V out I out I gnd I out If a 80 mA output current is needed, the ground current is extracted from the data–sheet curves: 4.0 mA @ 80 mA. For a NCP4561SNT1–28 (2.8 V) delivering 80 mA and operating at 25°C, the maximum input voltage will then be 8.3 V. http://onsemi.com 7 NCP4561 Typical Applications The following figure portrays the typical application of the NCP4561. Dropout Charge SW* 4 Output 5 Input 3 1 + 2 NCP4561 C3 1.0 F + C2 1.0 F R1 100 k On/Off *Enables the IC When Closed Figure 10. A Typical Application Schematic PCB Layout Considerations inductances/capacitances are minimized. This layout is the basis for the NCP4561 performance evaluation board. The BNC connectors give the user an easy and quick evaluation mean. As for any low noise designs, particular care has to be taken when tackling Printed Circuit Board (PCB) layout. The figure below gives an example of a layout where stray ON SEMICONDUCTOR NCP4561 EVALUATION BOARD DROPOUT + OUT _ + IN _ ON Semiconductor NCP4561 EVALUATION BOARD OUT OFF ON IN ON/OFF Figure 11. PCB Layout http://onsemi.com 8 NCP4561 Understanding the Load Transient Improvement During this decreasing phase, the LDO stops the PNP bias and one can consider the LDO asleep. If by misfortune a current shot appears, the reaction time is incredibly lengthened and a strong undershoot takes place. This reaction is clearly not acceptable for line sensitive devices, such as VCOs or other Radio–Frequency parts. This problem is dramatically exacerbated when the output current drops to zero rather than a few mA. In this later case, the internal feedback network is the only discharge path, accordingly lengthening the output voltage decay period. The NCP4561 cures this problem by implementing a clever design where the LDO detects the presence of the overshoot and forces the system to go back to steady–state as soon as possible, ready for the next shot, which positively improves the response time and decreases the negative peak voltage. The NCP4561 features a novel architecture which allows the user to easily implement the regulator in burst systems where the time between two current shots is kept very small. The quality of the transient response time is related to many parameters, among which the closed–loop bandwidth with the corresponding phase margin plays an important role. However, other characteristics also come into play like the series pass transistor saturation. When a current perturbation suddenly appears on the output, e.g. a load increase, the error amplifier reacts and actively biases the PNP transistor. During this reaction time, the LDO is in open–loop and the output impedance is rather high. As a result, the voltage brutally drops until the error amplifier effectively closes the loop and corrects the output error. When the load disappears, the opposite phenomenon takes place with a positive overshoot. The problem appears when this overshoot decays down to the LDO steady–state value. NCP4561 has a fast start–up phase unacceptable level. NCP4561 offers the best of both worlds since it no longer includes a bypass capacitor and starts in less than 40 µs typically (Repetitive at 200 Hz). It also ensures a low–noise level of 40 µVRMS 100 Hz–100 kHz. The following picture details the typical NCP4561 startup phase. Thanks to the lack of bypass capacitor the NCP4561 is able to supply its downstream circuitry as soon as the OFF to ON signal appears. In a standard LDO, the charging time of the external bypass capacitor hampers the response time. A simple solution consists in suppressing this bypass element but, unfortunately, the noise rises to an Tek Run: 5.00 MS/s Sample Vout 500 mV/div C4 High 2.78 V C4 Mean 2.426 V ON/OFF Pin Voltage 1 V/div Ch3 1.00 V Ch4 500 mV M 10.0 µs Ch3 1.82 V (Conditions: Vin = 3.8 V, Iload = 10 mA, Cout = 1 µF) Figure 12. Start–Up Waveform http://onsemi.com 9 NCP4561 TYPICAL TRANSIENT RESPONSES Tek Run: 1.00 MS/s Sample Vout 200 mV/div C4 Max 2.800 V C4 Mean 2.7840 V C4 Min 2.720 V Iload 20 mA/div Ch2 20.0 mVΩ M 50.0 µs Ch2 Ch4 200 mV 38.4 mV (Conditions: Vin = 3.8 V, Cout = 1 F) Figure 13. Load Current is Pulsed from 0 to 40 mA Sample Tek Run: 1.00 MS/s Vout 200 mV/div C4 Max 2.844 V C4 Mean 2.7852 V C4 Min 2.708 V Iload 20 mA/div Ch1 20.0 mVΩ Ch4 200 mV M 50.0 µs Ch1 78.8 mV (Conditions: Vin = 3.8 V, Cout = 1 F) Figure 14. Load Current is Pulsed from 0 to 80 mA http://onsemi.com 10 NCP4561 TYPICAL TRANSIENT RESPONSES Tek Run: 1.00 MS/s Sample Vout 200 mV/div C4 Max 2.824 V C4 Mean 2.7848 V C4 Mean 2.776 V Iload 20 mA/div Ch2 20.0 mVΩ M 50.0 µs Ch2 Ch4 200 mV 38.4 mV (Conditions: Vin = 3.8 V, Cout = 1 F) Figure 15. Load Current is Switched from 40 to 0 mA Tek Stop: 1.00 MS/s 1930 Acgs Vout 200 mV/div C4 Max 2.844 V C4 Mean 2.7848 V C4 Min 2.708 V Iload 20 mA/div Ch1 20.0 mVΩ Ch4 200 mV M 50.0 µs Ch1 0V (Conditions: Vin = 3.8 V, Cout = 1 F) Figure 16. Load Current is Switched from 80 to 0 mA http://onsemi.com 11 NCP4561 MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. 0.094 2.4 0.037 0.95 0.074 1.9 0.037 0.95 0.028 0.7 0.039 1.0 inches mm TSOP–5 (TSOP–5 is footprint compatible with SOT23–5) ORDERING INFORMATION Device NCP4561SNT1–28 Voltage Output* Package Shipping 2.8 V TSOP–5 3000 Units /Tape & Reel *Contact your ON Semiconductor sales representative for other output voltage values. http://onsemi.com 12 NCP4561 PACKAGE DIMENSIONS TSOP–5 SN SUFFIX PLASTIC PACKAGE CASE 483–01 ISSUE A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. D S 5 4 1 2 3 B L G A J C 0.05 (0.002) H M K http://onsemi.com 13 DIM A B C D G H J K L M S MILLIMETERS MIN MAX 2.90 3.10 1.30 1.70 0.90 1.10 0.25 0.50 0.85 1.00 0.013 0.100 0.10 0.26 0.20 0.60 1.25 1.55 0 10 2.50 3.00 INCHES MIN MAX 0.1142 0.1220 0.0512 0.0669 0.0354 0.0433 0.0098 0.0197 0.0335 0.0413 0.0005 0.0040 0.0040 0.0102 0.0079 0.0236 0.0493 0.0610 0 10 0.0985 0.1181 NCP4561 Notes http://onsemi.com 14 NCP4561 Notes http://onsemi.com 15 NCP4561 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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