NCP4569 300 mA CMOS LDO with Shutdown and VREF Bypass The NCP4569 is a fixed output, high accuracy (typically 0.5%) CMOS upgrade for older (bipolar) low dropout regulators. Total supply current is typically 50 µA at full load (20 to 60 times lower than in bipolar regulators). NCP4569 key features include ultra low noise operation (plus optional Bypass input); very low dropout voltage (typically 240 mV at full load), and fast response to step changes in load. Supply current is reduced to 0.05 µA (typical) and VOUT falls to zero when the shutdown input is low. The NCP4569 incorporates both over–temperature and over–current protection. The NCP4569 is stable with an output capacitor of only 1.0 µF and has a maximum output current of 300 mA. http://onsemi.com MICRO–8 DM SUFFIX CASE 846A 8 1 Features • • • • • • • • • Zero Ground Current for Longer Battery Life Very Low Dropout Voltage Guaranteed 300 mA Output High Output Voltage Accuracy Standard or Custom Output Voltages Power–Saving Shutdown Mode Bypass Input for Ultra–Quiet Operation Over–Current and Over–Temperature Protection Space–Saving Micro–8 Package PIN CONFIGURATION 8 VIN VOUT 1 NC 2 7 SHDN NC 3 6 NC GND 4 5 Bypass (Top View) Applications • • • • • • • • ORDERING INFORMATION Battery–Operated Systems Portable Computers Medical Instruments Instrumentation Cellular/GSM/PHS Phones Linear Post–Regulator for SMPS Pagers Digital Cameras VOUT 1 + C1 1 µF VOUT See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. VIN 8 VIN 7 2 NC SHDN NC NC 3 Shutdown Control (from Power Control Logic) 6 4 GND Bypass CBypass 470 pF (Optional) Figure 1. Typical Application Semiconductor Components Industries, LLC, 2001 February, 2001 – Rev. 0 1 Publication Order Number: NCP4569/D NCP4569 ABSOLUTE MAXIMUM RATINGS* Symbol Value Unit Input Voltage Rating – 6.5 V Output Voltage – VSS – 0.3 to VIN + 0.3 – Power Dissipation – Internally Limited (Note 8.) – Operating Temperature TA –40 TJ 125 °C Storage Temperature Tstg –65 to +150 °C Maximum Voltage on any Pin – VIN + 0.3 to – 0.3 V Lead Temperature (Soldering, 10 Sec.) – +300 °C VESD 2000 V ESD Withstand Voltage Human Body Model (Note 1.) Latch–Up Performance (Note 2.) ILATCH–UP mA 500 500 Positive Negative *Absolute Maximum Ratings indicate device operation limits beyond damage may occur. Device operation beyond the limits listed in Electrical Characteristics is not recommended. 1. Tested to EIA/JESD22–A114–A 2. Tested to EIA/JESD78 ELECTRICAL CHARACTERISTICS (VIN = VOUT + 1.0 V, IL = 0.1 µA, CL = 3.3 µF, SHDN VIH, TA = 25°C, unless otherwise noted. Boldface type specifications apply for junction temperatures of –40°C to +125°C.) Characteristics Input Operating Voltage Maximum Output Current Test Conditions Symbol Min Typ Max Unit – VIN – – 6.0 V – IOUTMAX 300 – – mA Output Voltage Note 3. VOUT – VR – 2.5% VR 0.5% – – VR + 2.5% V VOUT Temperature Coefficient Note 4. VOUT/T – 40 – ppm/°C Line Regulation (VR + 1.0 V) VIN 6.0 V VOUT/VIN – 0.05 0.35 % Load Regulation IL = 0.1 mA to IOUTMAX VOUT/VOUT – 0.5 2.0 % Dropout Voltage IL = 0.1 mA IL = 100 mA IL = 300 mA Note 6. VIN – VOUT – – – 20 80 240 30 160 480 mV Supply Current SHDN = VIH ISS1 – 50 90 µA Shutdown Supply Current SHDN = 0 V ISS2 – 0.05 0.5 µA FRE 1.0 kHz PSRR – 60 – dB VOUT = 0 V IOUTSC – 550 650 mA Note 7. VOUT/PD – 0.04 – V/W F = 1.0 kHz, COUT = 1.0 µF, RLOAD = 50 Ω eN – 260 – nV Hz SHDN Input High Threshold – VIH 45 – – %VIN SHDN Input Low Threshold – VIL – – 15 %VIN Power Supply Rejection Ratio Output Short Circuit Current Thermal Regulation Output Noise SHDN Input 3. VR is the regulator output voltage setting. 4. TC VOUT = (VOUTMAX VOUTMIN) 106 VOUT T 5. Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 6. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1.0 V differential. 7. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6.0 V for T = 10 msec. 8. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature, and the thermal resistance from junction–to–air (i.e. TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Thermal Considerations section of this data sheet for more details. http://onsemi.com 2 NCP4569 DETAILED DESCRIPTION The NCP4569 is a precision regulator available in fixed voltages. Unlike the bipolar regulators, the NCP4569 supply current does not increase with load current. In addition, VOUT remains stable and within regulation at very low load currents (an important consideration in RTC and CMOS RAM battery backup applications). NCP4569 pin functions are detailed below. PIN DESCRIPTION Pin Number Symbol 1 VOUT 2 NC No connect. 3 NC No connect. 4 GND 5 Bypass 6 NC 7 SHDN 8 VIN Description Regulated voltage output. Ground terminal. Reference bypass input. Connecting a 470 pF to this input further reduces output noise. No connect. Shutdown control input. The regulator is fully enabled when a logic high is applied to this input. The regulator enters shutdown when a logic low is applied to this input. During shutdown, output voltage falls to zero and supply current is reduced to 0.05 µA (typical). Unregulated supply input. or I/O port of a microcontroller. If the SHDN input is not required, it should be connected directly to the input supply. While in shutdown, supply current decreases to 0.05 µA (typical), VOUT falls to zero. Figure 2 shows a typical application circuit. The regulator is enabled any time the shutdown input (SHDN) is at or above VIH, and shutdown (disabled) when SHDN is at or below VIL. SHDN may be controlled by a CMOS logic gate, VOUT 1 + C1 1 µF VOUT VIN 8 + 7 2 C1 1 µF BATTERY + SHDN NC Shutdown Control (from Power Control Logic) NCP4569 3 6 NC NC – 4 GND Bypass CBypass 470 pF (Optional) Figure 2. Typical Application Circuit frequency above 1.0 MHz. A 1.0 µF capacitor should be connected from VIN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor, or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitor types can be used. (Since many aluminum electrolytic capacitors freeze at approximately –30°C, solid tantalums are recommended for applications operating below –25°C.) When operating from sources other than batteries, supply–noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. Bypass Input A 470 pF capacitor connected from the Bypass input to ground reduces noise present on the internal reference, which in turn significantly reduces output noise. If output noise is not a concern, this input may be left unconnected. Larger capacitor values may be used, but results in a longer time period to rated output voltage when power is initially applied. Output Capacitor A 1.0 µF (min) capacitor from VOUT to ground is recommended. The output capacitor should have an effective series resistance of 5.0 Ω or less, and a resonant http://onsemi.com 3 NCP4569 Thermal Considerations Equation 1 can be used in conjunction with Equation 2 to ensure regulator thermal operation is within limits. For example: Thermal Shutdown Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 150°C. The regulator remains off until the die temperature drops to approximately 140°C. GIVEN : Power Dissipation Micro8 Package The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst case actual power dissipation: FIND : 1. Actual power dissipation. 2. Maximum allowable dissipation. Actual power dissipation : PD (VINMAX VOUTMIN)ILOADMAX PD (VINMAX VOUTMIN)ILOADMAX [(3.0 1.1) (2.7 .975)] 250 10 3 PD worst case actual power dissipation VINMAX maximum voltage on VIN VOUTMIN minimum regulator output voltage ILOADMAX maximum output (load) current Where : 167 mW Maximum allowable power dissipation : (eq. 1) The maximum allowable power dissipation (Equation 2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (125°C), and the thermal resistance from junction–to–air (JA). The Micro–8 package has a JA of approximately 200C/Watt; both when mounted on a single layer FR4 dielectric copper clad PC board. PDMAX (TJMAX TAMAX) JA (125 55) 200 350 mW In this example, the NCP4569 dissipates a maximum of only 167 mW; far below the allowable limit of 350 mW. In a similar manner, Equation 1 and Equation 2 can be used to calculate maximum current and/or input voltage limits. (TJMAX TAMAX) PDMAX JA Where all terms are previously defined. VINMAX 3.0 V 10% VOUTMIN 2.7 V 2.5% ILOAD 250 mA TAMAX 55°C (eq. 2) Layout Considerations The primary path of heat conduction out of the package is via the package leads. Therefore, layouts having a ground plane, wide traces at the pads, and wide power supply bus lines combine to lower JA and, therefore, increase the maximum allowable power dissipation limit. http://onsemi.com 4 NCP4569 TYPICAL CHARACTERISTICS 0.012 10.0 RLOAD = 50 Ω COUT = 1 µF 0.008 NOISE (µV/√/Hz) LINE REGULATION (%) 0.010 0.006 0.004 0.002 1.0 0.1 0.000 –0.002 –0.004 –40 –20 0 20 40 60 80 0.0 0.001 120 100 0.01 1 10 100 TEMPERATURE (°C) FREQUENCY (kHz) Figure 3. Line Regulation Figure 4. Output Noise 2.00 1000 100.0 1 to 300 mA 1.60 SUPPLY CURRENT (µA) LOAD REGULATION (%) 1.80 1.40 1.20 1.00 0.80 1 to 100 mA 0.60 0.40 0.20 80.0 70.0 60.0 50.0 1 to 50 mA 0.00 –40 –20 0 20 40 60 80 100 40.0 –40 120 –20 0 20 40 60 80 TEMPERATURE (°C) TEMPERATURE (°C) Figure 5. Load Regulation Figure 6. Supply Current 0.40 100 120 100 120 3.075 VIN = 4 V ILOAD = 100 µA CLOAD = 3.3 µF 125°C 0.35 0.30 85°C 3.025 0.25 70°C 0.20 –40°C 0.15 VOUT (V) DROPOUT VOLTAGE (V) 90.0 2.975 0°C 0.10 25°C 0.05 0.00 0 50 100 150 200 250 300 2.925 –40 –20 0 20 40 60 80 LOAD CURRENT (mA) TEMPERATURE (°C) Figure 7. Dropout Voltage vs. Load Current Figure 8. VOUT vs. Temperature http://onsemi.com 5 NCP4569 TYPICAL CHARACTERISTICS –30 VOUT = 5 V RLOAD = 50 Ω VINAC = 50 mV p–p –35 –40 PSRR (dB) –45 –50 COUT = 1 µF –55 –60 –65 –70 –75 –80 0 10 100 1k 10 k 100 k 1M Frequency (Hz) Figure 9. Power Supply Rejection Ratio Component Taping Orientation for Micro–8 Devices USER DIRECTION OF FEED USER DIRECTION OF FEED PIN 1 W PIN 1 Standard Reel Component Orientation for TR Suffix Device P Reverse Reel Component Orientation for RT Suffix Device Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size Micro–8 12 mm 8 mm 2500 13 inches http://onsemi.com 6 NCP4569 ORDERING INFORMATION Device Output Voltage (V)* NCP4569DM25R2 2.5 NCP4569DM28R2 2.8 NCP4569DM30R2 3.0 NCP4569DM33R2 3.3 NCP4569DM50R2 5.0 Package Junction Temperature Range Shipping Micro–8 –40°C to + 125°C 2500 Tape & Reel *Other output voltages available. Please contact ON Semiconductor for details. http://onsemi.com 7 NCP4569 PACKAGE DIMENSIONS MICRO–8 DM SUFFIX CASE 846A–02 ISSUE E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. –A– –B– K PIN 1 ID G D 8 PL 0.08 (0.003) –T– M T B A S S SEATING PLANE 0.038 (0.0015) C H DIM A B C D G H J K L MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 --1.10 0.25 0.40 0.65 BSC 0.05 0.15 0.13 0.23 4.75 5.05 0.40 0.70 INCHES MIN MAX 0.114 0.122 0.114 0.122 --0.043 0.010 0.016 0.026 BSC 0.002 0.006 0.005 0.009 0.187 0.199 0.016 0.028 L J ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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