MAX8863 Pin-Compatible, Low-Dropout, 120 mA Linear Regulator Delivering up to 120 mA, the MAX8863 is a fixed output, low–dropout linear regulator that operates from a +2.5 V to +6.0 V input range. The 50 µA supply current remains independent of load, making these devices ideal for battery–operated portable equipment. The output of the MAX8863 is preset at 3.15 V, 2.84 V, 2.80 V or 1.80 V. (Other output voltage options are available – contact ON Semiconductor for more information.) The MAX8863 is pin–compatible with the Maxim MAX8863 LDO and is available in the SOT–23–5 package. Features • • • • • • • • • • • http://onsemi.com 5 4 1 2 SOT–23 EUK SUFFIX CASE 1212 3 PIN CONNECTIONS Low Cost Pin–Compatible with MAX8863 Stable with Any Type of Capacitors Low, 55 mV Dropout Voltage @ 50 mA IOUT Low, 50 µA Operating Supply Current (Even in Dropout) 140 µsec (Typ.) Turn–On Response Time from SHDN Low, 350 µVRMS Output Noise Miniature External Components Thermal Overload Protection Output Current Limit Low–Power Shutdown Mode SHDN 1 5 GND GND 2 IN 3 4 OUT (Top View) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 9 of this data sheet. Applications • • • • • • DEVICE MARKING INFORMATION Cordless, PCS, and Cellular Telephones PCMCIA Cards Modems Hand–Held Instruments Palmtop Computers Electronic Planners IN + CIN 1 µF See general marking information in the device marking section on page 9 of this data sheet. OUT Output Voltage COUT 1 µF SHDN BATTERY – GND GND Figure 1. Typical Application Semiconductor Components Industries, LLC, 2001 February, 2001 – Rev. 1 1 Publication Order Number: MAX8863/D MAX8863 ABSOLUTE MAXIMUM RATINGS* Symbol Value Unit Input Voltage Rating – 6.5 V Output Short–Circuit Duration – Infinite – SET to GND – – 0.3 to +6.5 V SHDN to GND – – 6.5 to + 6.5 V SHDN to IN – –6.5 to + 0.3 V Output Voltage – –0.3 to VIN + 0.3 V Continuous Power Dissipation (TA = +70°C) SOT–23–5 (Derate 7.1 mW/°C above +70°C) – 571 mW Operating Temperature Range TA –40 to 85 °C Storage Temperature Range Tstg –65 to +160 °C – +300 °C VESD 2000 V Lead Temperature (Soldering, 10 Sec.) ESD Withstand Voltage Human Body Model (Note 1.) Latch–Up Performance (Note 2.) ILATCH–UP mA Positive Negative 420 240 *Stresses above those listed under “Absolute Maximum Ratings’’ may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (VIN = +3.6 V, GND = 0 V, TA = TMIN to TMAX, unless otherwise specified. Typical values are at TA = +25°C.) (Note 3.) Characteristics Input Voltage (Note 4.) Output Voltage Test Conditions Symbol Min Typ Max Unit VOUT 2.5 V VOUT = 1.8 V VIN VOUT + 0.5 V 2.7 – – 6.0 6.0 V 3.05 2.75 2.70 1.745 3.15 2.84 2.80 1.80 3.25 2.93 2.88 1.85 0 mA IOUT 50 mA VOUT T S R Q V Maximum Output Current – IOUT 120 – – mA Current Limit (Note 5.) – ILIM – 280 – mA IOUT = 0 IIN – 50 90 µA IOUT = 1.0 mA IOUT = 50 mA IOUT = 100 mA – – – – 1.1 55 110 – 120 240 mV Line Regulation VIN = VOUT + 0.5 V to 6.0 V IOUT = 1.0 mA VLNR –0.10 – .001 – 0.10 – %/V Load Regulation IOUT = 0 mA to 50 mA VLDR – 0.01 0.040 10 Hz to 1.0 MHz COUT = 1.0 µF COUT = 100 µF – VIN = 3.6 V CIN = 1.0 µF, COUT = 1.0 µF IL = 30 mA, (See Fig. 1) VIN = 3.6 V CIN = 1.0 µF, COUT = 1.0 µF IL = 30 mA, (See Fig. 1) Input Current Dropout Voltage (Note 6.) Output Voltage Noise Wake Up Time (from Shutdown Mode) Settling Time (from Shutdown Mode) %/mA µVRMS – – 350 220 – – tWK – 10 – µsec tS – 140 – µsec 1. Tested to EIA/JESD22–A114–A 2. Tested to EIA/JESD78 3. Limits are 100% production tested at TA = +25°C. Limits over the operating temperature range are guaranteed through correlation using Statistical Quality Control (SQC) Methods. 4. Guaranteed by line regulation test. 5. Not tested. For design purposes, the current limit should be considered 150 mA minimum to 410 mA maximum. 6. The dropout voltage is defined as (VIN – VOUT) when VOUT is 100 mV below the value of VOUT for VIN = VOUT + 2.0 V. http://onsemi.com 2 MAX8863 ELECTRICAL CHARACTERISTICS (continued) (VIN = +3.6 V, GND = 0 V, TA = TMIN to TMAX, unless otherwise specified. Typical values are at TA = +25°C.) (Note 7.) Characteristics Test Conditions Symbol Min Typ Max Unit – VIH VIL 2.0 – – – – 0.4 V VSHDN = VIN TA = +25°C TA = TMAX ISHDN – – 0 50 100 – VOUT = 0 V TA = +25°C TA = TMAX IQSHDN – – .002 0.02 1.0 – COUT = 1.0 µF, No Load to 10% of VOUT – – 1.0 – msec Thermal Shutdown Temperature – TSHDN – 170 – °C Thermal Shutdown Hysteresis – TSHDN – 20 – °C Shutdown SHDN Input Threshold SHDN Input Bias Current Shutdown Supply Current Shutdown to Output Discharge Delay nA µA Thermal Protection 7. Limits are 100% production tested at TA = +25°C. Limits over the operating temperature range are guaranteed through correlation using Statistical Quality Control (SQC) Methods. PIN DESCRIPTION Pin Number Symbol 1 SHDN Active–Low Shutdown Input. A logic low reduces the supply current to 0.1 nA. A logic low also causes the output voltage to discharge to GND. Connect to IN for normal operation. 2 GND Ground. This pin also functions as a heatsink. Solder to large pads or the circuit board ground plane to maximize thermal dissipation. 3 IN Regulator Input. Supply voltage can range from +2.5 V (+2.7 V for VOUT = 1.8 V) to +6.0 V. Bypass with 1.0 µF to GND (see Capacitor Selection and Regulator Stability). 4 OUT Regulator Output. Sources up to 120 mA. Bypass with a 1.0 µF, 1.0 Ω typical ESR capacitor to GND. 5 GND Connect to GND. Description http://onsemi.com 3 MAX8863 VIH DETAILED DESCRIPTION The MAX8863 is a fixed output, low–dropout, low–quiescent current linear regulator designed specifically for portable, battery–operated equipment such as cellular phones, cordless phones, and modems. A 1.20 V reference, error amplifier, MOSFET driver, P–channel pass transistor, comparator, and internal feedback voltage divider comprise the MAX8863 (see Figure 3). The bandgap reference is connected to the error amplifier’s inverting input. The error amplifier then compares the reference with the selected feedback voltage and amplifies the difference. The MOSFET driver, reading the error signal, applies the correct drive to the P–channel pass transistor. If the feedback voltage is lower than the reference, the pass–transistor is pulled lower to allow more current through, and to increase the output voltage. Conversely, if the feedback voltage is higher than the reference, the pass–transistor is pulled up, which allows less current through to the output. VIL SHDN tS 98% 2% VOUT tWK Figure 2. Wake Up Response Time The total turn on response is defined as the Settling Time (tS), see Figure 2. Settling Time (inclusive with tWK) is defined as the condition when the output is within 2.0% of its fully enabled value (140 µsec typical) when released from shutdown. The settling time of the output voltage is dependent on load conditions and output capacitance on VOUT (RC response). Internal P–Channel Pass Transistor Featuring a 1.1 Ω P–channel MOSFET pass transistor, the MAX8863 offers longer battery life than similar designs using PNP pass transistors, which waste current in dropout when the pass transistor saturates. PNP–based regulators also use high base–drive currents under large loads. The P–channel MOSFET, however, does not require a base drive current, which reduces quiescent current. The MAX8863 uses only 50 µA of quiescent current. Turn On Response The turn on response is defined as two separate response categories, Wake Up Time (tWK) and Settling Time (tS). The MAX8863 has a fast Wake Up Time (10 µsec typical) when released from shutdown. See Figure 2 for the Wake Up Time designated as tWK. The Wake Up Time is defined as the time it takes for the output to rise to 2.0% of the VOUT value after being released from shutdown. IN SHDN – + SHUTDOWN LOGIC THERMAL SENSOR MOS DRIVER WITH ILIMIT P OUT N (MAX8863 Only) 1.2 V REF GND GND Figure 3. Functional Block Diagram http://onsemi.com 4 MAX8863 APPLICATIONS INFORMATION Shutdown Low input on SHDN shuts down the MAX8863 by turning off the pass transistor, control circuit, reference, and all biases. This reduces the supply current to 0.1 nA, typical. For normal operation, connect SHDN to IN. When the MAX8863 is placed in shutdown mode, the output voltage is actively discharged to ground. Capacitor Selection and Regulator Stability A 1.0 µF capacitor on the input, and a 1.0 µF capacitor on the output should generally be used on the MAX8863. For better supply–noise rejection and transient response, larger input capacitor values and lower ESR should be used. If the device is several inches from the power source or if large, fast transients are expected, a higher–value input capacitor (10 µF) may be required. Using large output capacitors may improve load–transient response, stability, and power–supply rejection. A minimum of 1.0 µF is recommended for stable operation over the full temperature range with load currents up to 120 mA. Current Limit The current limiter on the MAX8863 monitors and controls the pass transistor’s gate voltage. It estimates the output current, limiting it to 280 mA. The current limit should be considered 150 mA (min) to 410 mA (max) for design purposes. The output can be shorted to ground indefinitely without damaging the device. Noise During normal operation, the MAX8863 have low (350 µVRMS) output noise. The ADC’s power–supply rejection specifications should be considered for applications that include analog–to–digital converters of greater than 12 bits. Thermal Overload Protection The MAX8863 features thermal overload protection, which limits total power dissipation. The thermal sensor signals the shutdown logic to turn off the pass transistor when the junction temperature exceeds TJ = +170°C. This allows the IC’s junction temperature to cool by 20°C before the thermal sensor turns the pass transistor back on. This results in a pulsed output during continuous thermal overload conditions. This feature is designed to protect the MAX8863 during thermal events. High load currents and high input–output differential voltages may cause a momentary overshoot of 2.0% to 8.0% for 200 msec when the load is removed. This can be avoided by raising the minimum load current from 0 µA (+125°C) to 100 µA (+150°C). The maximum junction temperature rating of +150°C should not be exceeded for continuous operation. Power–Supply Rejection and Operation from Sources Other than Batteries Power–supply rejection for the MAX8863 is 62 dB at low frequencies, rolling off above 300 Hz. Power supply noise rejection is primarily controlled by the output capacitor at frequencies of more than 20 KHz. Supply noise rejection and transient response can be improved when operating from sources other than batteries by increasing the values of the input and output capacitors, and using passive filtering techniques. Load Transient Considerations With the MAX8863, typical overshoot for step changes in the load current from 0 mA to 50 mA is 12 mV. To lessen transient spikes, increase the output capacitor’s value, and decrease its ESR. Operating Region and Power Dissipation The MAX8863’s maximum power dissipation depends on the thermal resistance of the case and circuit board, the rate of air flow, and the temperature difference between the die junction and ambient air. The devices’ power dissipation is P = IOUT (VIN – VOUT); resulting maximum power dissipation is: Input–Output (Dropout) Voltage A regulator’s dropout voltage determines the lowest usable supply voltage. This determines the useful end–of–life battery voltage for battery–powered systems. Since the MAX8863 uses a P–channel MOSFET pass transistor, the devices’ dropout voltage is a function of RDS(ON) multiplied by the load current. PMAX (TJ TA)JA where (TJ – TA) is the temperature difference between the devices’ die junction and the surrounding air, and JA is the thermal resistance of the chosen package to the surrounding air. The devices’ GND pin provides an electrical connection to ground and channels heat away. The GND pin should be connected to ground with a large pad or ground plane. http://onsemi.com 5 MAX8863 TYPICAL CHARACTERISTICS 0.10 2.93 3.50 V to 5.50 V 0.04 0.02 0.00 –0.02 –0.04 –0.06 –0.08 0 25 70 2.89 2.87 2.85 2.83 2.81 2.79 2.77 2.75 –40 85 Figure 4. Line Regulation vs. Temperature Figure 5. Output Voltage vs. Temperature 0.040 0.035 0.035 0.030 0.025 0.020 0 to 50 mA 0.015 0.010 85 0.030 0.025 0.020 0 to 50 mA 0.015 0.010 0 to 100 mA 0.005 0.005 0 25 70 0.000 –40 85 0 TEMPERATURE (°C) 25 70 85 TEMPERATURE (°C) Figure 6. Load Regulation vs. Temperature Figure 7. Load Regulation vs. Temperature 10.0 0.12 RLOAD = 50 µ COUT = 1 µF 0.10 NOISE (µV//HZ) DROPOUT VOLTAGE (V) 70 25 TEMPERATURE (°C) 0.040 0.000 –40 0 TEMPERATURE (°C) LOAD REGULATION (%) LOAD REGULATION (%) –0.10 –40 VOUT – SET/1.0 mA @ 3.5 V (V) 2.91 VOUT, OUTPUT VOLTAGE (V) LINE REGULATION (%) 0.08 0.06 0.08 50 mA 0.06 0.04 1.0 0.1 0.02 0.00 –40 0 25 70 0.0 0.00 85 0.01 1 10 100 TEMPERATURE (°C) FREQUENCY (kHz) Figure 8. Dropout Voltage vs. Temperature Figure 9. Output Noise vs. Frequency http://onsemi.com 6 1000 MAX8863 TYPICAL CHARACTERISTICS T = 25°C CIN = 1 µF CL = 1 µF RL = ∞ VOUT = 2.84 V RLOAD = 50 Ω 28.4 kΩ 100 mVpp VOUT = 0.5 V/Div SHDN CH1 GND COUT = 1 µF SHDN = 0 V CH2 GND 10 100 1k 10 k 100 k 1M 10 M FREQUENCY (kHz) 200 µsec/Div Figure 10. Power Supply Rejection Ratio Figure 11. Shutdown Transient Response CIN = 1 µF COUT = 1 µF RL = 100 Ω VIN = 3.5 V XSHDN = 3 V VOUT = 2.7 V VIN = 4.5 V VIN = 3.5 V CH2 CH1 GND Turn On Time = 150 µS XSHDN = 0 V CH1 GND CH1 VOUTAC 20 µV/Div CIN = COUT = 1 µF RL = 470 Ω XSHDN = 3.5 V No Overshoot CH2 GND CH2 GND VOUT = 0 V 200 µsec/Div Figure 12. Shutdown Transient Response Figure 13. Line Response OUTPUT, SHUTDOWN VOLTAGE (V) 200 µsec/Div 3V SHDN 0V 2.8 V VOUT VIN = 3.6 V ILOAD = 30 mA CIN = 1 µF CLOAD = 1 µF 0V 1 2 3 4 5 TIME (100 µs/Div) Figure 14. Wake Up Response Time http://onsemi.com 7 6 MAX8863 Component Taping Orientation for 5–Pin SOT–23 Devices USER DIRECTION OF FEED DEVICE MARKING PIN 1 Standard Reel Component Orientation TR Suffix Device (Mark Right Side Up) PIN 1 USER DIRECTION OF FEED DEVICE MARKING W P Reverse Reel Component Orientation RT Suffix Device (Mark Upside Down) Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size SOT–23 8 mm 4 mm 3000 7 inches http://onsemi.com 8 MAX8863 MARKING DIAGRAM 1 2 3 4 1 and 2 3 = Two Letter Part Number Codes + Temperature Range and Voltage = Year and Quarter Code 4 = Lot ID Number ORDERING INFORMATION Device MAX8863QEUK–T MAX8863REUK–T MAX8863SEUK–T MAX8863TEUK–T Marking Output Voltage* 1 and 2 Package Junction Temperature Range Shipping 1.80 2.80 2.84 3.15 G4 G3 G2 G1 SOT–23 –40°C to +85°C 3000 Tape & Reel *Other output voltages are available. Please contact ON Semiconductor for details. http://onsemi.com 9 MAX8863 PACKAGE DIMENSIONS SOT–23 EUK SUFFIX CASE 1212–01 ISSUE O A B D 5 E 1 A2 0.05 S A1 4 2 L 3 E1 L1 B e e1 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DATUM C IS A SEATING PLANE. C 5X 0.10 M C B S A S C http://onsemi.com 10 DIM A1 A2 B C D E E1 e e1 L L1 MILLIMETERS MIN MAX 0.00 0.10 1.00 1.30 0.30 0.50 0.10 0.25 2.80 3.00 2.50 3.10 1.50 1.80 0.95 BSC 1.90 BSC 0.20 --0.45 0.75 MAX8863 Notes http://onsemi.com 11 MAX8863 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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