NSC ADC083000

June 2006
ADC083000
High Performance, Low Power, 8-Bit, 3 GSPS A/D
Converter
General Description
Features
Note: This product is currently in development. - ALL
specifications are design targets and are subject to
change.
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The ADC083000 is a single, low power, high performance
CMOS analog-to-digital converter that digitizes signals to 8
bits resolution at sampling rates up to 3.4 GSPS. Consuming
a typical 1.8 Watts at 3 GSPS from a single 1.9 Volt supply,
this device is guaranteed to have no missing codes over the
full operating temperature range. The unique folding and
interpolating architecture, the fully differential comparator
design, the innovative design of the internal sample-andhold amplifier and the self-calibration scheme enable a very
flat response of all dynamic parameters up to Nyquist, producing a high 7.0 ENOB with a 748 MHz input signal and a
3 GHz sample rate while providing a 10-18 B.E.R. The
ADC083000 achieves a 3GSPS sampling rate by utilizing
both the rising and falling edge of a 1.5 GSPS input clock.
Output formatting is offset binary and the LVDS digital outputs are compliant with IEEE 1596.3-1996, with the exception of an adjustable common mode voltage between 0.8V
and 1.2V.
The ADC has a 1:4 demultiplexer that feeds four LVDS
buses and reduces the output data rate on each bus to a
quarter of the sampling rate. The ADC can be programmed
into the 1:2 Output Mode where the data is output on the Dc
and Dd channels at the rate of the input clock.
The converter typically consumes less than 20 mW in the
Power Down Mode and is available in a 128-lead, thermally
enhanced exposed pad LQFP and operates over the Industrial (-40˚C ≤ TA ≤ +85˚C) temperature range.
© 2006 National Semiconductor Corporation
DS201932
Internal Sample-and-Hold
Single +1.9V ± 0.1V Operation
Choice of SDR or DDR output clocking
1:2 or 1:4 Selectable Output Demux
Clock Phase Adjust for Multiple ADC Synchronization
Guaranteed No Missing Codes
Serial Interface for Extended Control
Fine Adjustment of Input Full-Scale Range and Offset
Duty Cycle Corrected Sample Clock
Test pattern
Key Specifications
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Resolution
Max Conversion Rate
Bit Error Rate
ENOB @ 748 MHz Input
SNR @ 748MHz
Full Power Bandwidth
Power Consumption
— Operating
— Power Down Mode
8 Bits
3 GSPS (min)
10-18 (typ)
7.0 Bits (typ)
44 dB (typ)
3 GHz (typ)
1.8 W (typ)
20 mW (typ)
Applications
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Direct RF Down Conversion
Digital Oscilloscopes
Satellite Set-top boxes
Communications Systems
Test Instrumentation
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ADC083000 High Performance, Low Power, 8-Bit, 3 GSPS A/D Converter
ADVANCE INFORMATION
ADC083000
Block Diagram
20193253
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2
ADC083000
Pin Configuration
20193201
* Exposed pad on back of package must be soldered to ground plane to ensure rated performance.
3
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ADC083000
Pin Descriptions and Equivalent Circuits
Pin Functions
Pin No.
Symbol
Equivalent Circuit
Description
OutV / SCLK
Output Voltage Amplitude and Serial Interface Clock. Tie this
pin high for normal differential DCLK and data amplitude.
Ground this pin for a reduced differential output amplitude and
reduced power consumption. See Section 1.1.6. When the
extended control mode is enabled, this pin functions as the
SCLK input which clocks in the serial data.See Section 1.2 for
details on the extended control mode. See Section 1.3 for
description of the serial interface.
4
OutEdge / DDR
/ SDATA
DCLK Edge Select, Double Data Rate Enable and Serial Data
Input. This input sets the output edge of DCLK+ at which the
output data transitions. (See Section 1.1.5.2). When this pin is
floating or connected to 1/2 the supply voltage, DDR clocking
is enabled. When the extended control mode is enabled, this
pin functions as the SDATA input. See Section 1.2 for details
on the extended control mode. See Section 1.3 for description
of the serial interface.
15
DCLK_RST
DCLK Reset. A positive pulse on this pin is used to reset and
synchronize the DCLK outs of multiple converters. See
Section 1.5 for detailed description.
26
PD
Power Down. A logic high on the PD pin puts the entire
device into the Power Down Mode.
CAL
Calibration Cycle Initiate. A minimum 80 input clock cycles
logic low followed by a minimum of 80 input clock cycles high
on this pin initiates the self calibration sequence. See Section
2.4.2 for an overview of self-calibration and Section 2.4.2.2 for
a description of on-command calibration.
FSR/ECE
Full Scale Range Select and Extended Control Enable. In
non-extended control mode, a logic low on this pin sets the
full-scale differential input range to 650 mVP-P. A logic high on
this pin sets the full-scale differential input range to 870
mVP-P. See Section 1.1.4. To enable the extended control
mode, whereby the serial interface and control registers are
employed, allow this pin to float or connect it to a voltage
equal to VA/2. See Section 1.2 for information on the
extended control mode.
CalDly / SCS
Calibration Delay and Serial Interface Chip Select. With a
logic high or low on pin 14, this pin functions as Calibration
Delay and sets the number of input clock cycles after power
up before calibration begins (See Section 1.1.1). With pin 14
floating, this pin acts as the enable pin for the serial interface
input and the CalDly value becomes "0" (short delay with no
provision for a long power-up calibration delay).
3
30
14
127
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4
ADC083000
Pin Descriptions and Equivalent Circuits
(Continued)
Pin Functions
Pin No.
Symbol
Equivalent Circuit
Description
10
11
CLK+
CLK-
LVDS Clock input pins for the ADC. The differential clock
signal must be a.c. coupled to these pins. The input signal is
sampled on the falling edge of CLK+. See Section 1.1.2 for a
description of acquiring the input and Section 2.3 for an
overview of the clock inputs.
18
19
VIN+
VIN−
Analog signal inputs to the ADC. The differential full-scale
input range is 650 mVP-P when the FSR pin is low, or 870
mVP-P when the FSR pin is high.
7
VCMO
Common Mode Voltage. The voltage output at this pin is
required to be the common mode input voltage at VIN+ and
VIN− when d.c. coupling is used. This pin should be grounded
when a.c. coupling is used at the analog inputs. This pin is
capable of sourcing or sinking 100µA. See Section 2.2.
31
VBG
Bandgap output voltage capable of 100 µA source/sink.
126
CalRun
Calibration Running indication. This pin is at a logic high
when calibration is running.
32
REXT
External bias resistor connection. Nominal value is 3.3k-Ohms
( ± 0.1%) to ground. See Section 1.1.1.
34
35
Tdiode_P
Tdiode_N
Temperature Diode Positive (Anode) and Negative (Cathode)
for die temperature measurements. See Section 2.6.2.
5
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ADC083000
Pin Descriptions and Equivalent Circuits
(Continued)
Pin Functions
Pin No.
Symbol
Equivalent Circuit
Description
36
38
43
45
47
49
54
56
58
60
65
67
69
71
75
77
/
/
/
/
/
/
/
/
/
/
/
/
/
/
/
/
37
39
44
46
48
50
55
57
59
61
66
68
70
72
76
78
Da0+ / Da0Da1+ / Da1Da2+ / Da2−
Da3+ / Da3Da4+ / Da4−
Da5+ / Da5Da6+ / Da6−
Da7+ / Da7Dc0+ / Dc0Dc1+ / Dc1Dc2+ / Dc2−
Dc3+ / Dc3Dc4+ / Dc4−
Dc5+ / Dc5Dc6+ / Dc6−
Dc7+ / Dc7-
A and C LVDS Data Outputs from the first internal converter.
The data should be extracted in the order ABCD These
outputs should always be terminated with a 100Ω differential
resistor.
83
85
89
91
93
95
100
102
104
106
111
113
115
117
122
124
/
/
/
/
/
/
/
/
/
/
/
/
/
/
/
/
84
86
90
92
94
96
101
103
105
107
112
114
116
118
123
125
Dd7− / Dd7+
Dd6- / Dd6+
Dd5− / Dd5+
Dd4- / Dd4+
Dd3- / Dd3+
Dd2- / Dd2+
Dd1− / Dd1+
Dd0- / Dd0+
Db7- / Db7+
Db6- / Db6+
Db5− / Db5+
Db4- / Db4+
Db3− / Db3+
Db2- / Db2+
Db1− / Db1+
Db0- / Db0+
B and D LVDS Data Outputs from the second internal
converter. The data should be extracted in the order ABCD
These outputs should always be terminated with a 100Ω
differential resistor.
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80
82
81
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OR+
OR-
Out Of Range output. A differential high at these pins
indicates that the differential input is out of range (outside the
range ± 325 mV or ± 435 mV as defined by the FSR
pin).These outputs should always be terminated with a 100Ω
differential resistor.
DCLK+
DCLK-
Differential Clock outputs used to latch the output data.
Delayed and non-delayed data outputs are supplied
synchronous to this signal. This signal is at 1/2 the input clock
rate in SDR mode and at 1/4 the input clock rate in the DDR
mode. These outputs should always be terminated with a
100Ω differential resistor. The DCLK outputs are not active
during the calibration cycle depending on the setting of bit 14
of the RTRIM Disable register (address 9h). DCLK is
continuously present during the calibration cycle when bit 14
is set high and is not active during the calibration cycle when
set low. When the device is in the 1:1 Output Mode, the
signal is at the input clock rate.
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ADC083000
Pin Descriptions and Equivalent Circuits
(Continued)
Pin Functions
Pin No.
Symbol
2, 5, 8, 13,
16, 17, 20,
25, 28, 33,
128
Equivalent Circuit
Description
VA
40, 51 ,62,
73, 88, 99,
110, 121
VDR
Output Driver power supply pins. Bypass these pins to DR
GND.
1, 6, 9, 12,
21, 24, 27,
41
GND
Ground return for VA.
42, 53, 64,
74, 87, 97,
108, 119
DR GND
22,23,29,52,
63, 98,
109, 120
NC
Analog power supply pins. Bypass these pins to ground.
Ground return for VDR.
No Connection. Make no connection to these pins.
7
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ADC083000
Absolute Maximum Ratings
Operating Ratings (Notes 1, 2)
(Notes 1, 2)
Ambient Temperature Range
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (VA)
−40˚C ≤ TA ≤ +85˚C
+1.8V to +2.0V
Driver Supply Voltage (VDR)
+1.8V to VA
Supply Voltage (VA, VDR)
2.2V
Analog Input Common Mode
Voltage
VCMO ± 50mV
Voltage on Any Input Pin
−0.15V to (VA
+0.15V)
VIN+, VIN- Voltage Range
(Maintaining Common Mode)
200mV to VA
0V to 100 mV
Ground Difference
(|GND - DR GND|)
Ground Difference
|GND - DR GND|
Package Input Current (Note 3)
± 25 mA
± 50 mA
Power Dissipation at TA ≤ 85˚C
TBD W
Input Current at Any Pin (Note 3)
ESD Susceptibility (Note 4)
Human Body Model
Machine Model
Storage Temperature
0V to VA
Differential CLK Amplitude
0.4VP-P to 2.0VP-P
Package Thermal Resistance
2500V
250V
Soldering Temperature, Infrared,
10 seconds, (Note 5), (Applies
to standard plated package only)
0V
CLK Pins Voltage Range
Package
θJA
θJC (Top of
θJ-PAD
Package)
(Thermal
10˚C / W
2.8˚C / W
Pad)
128-Lead
Exposed Pad
LQFP
235˚C
−65˚C to +150˚C
26˚C / W
Converter Electrical Characteristics
NOTE: This product is currently in development and the parameters specified in this section are DESIGN TARGETS.
The specifications in this section cannot be guaranteed until device characterization has taken place. The following
specifications apply after calibration for VA = VDR = +1.9VDC, OutV = 1.9V, VIN FSR (a.c. coupled) = differential 870mVP-P, CL
= 10 pF, Differential, a.c. coupled Sinewave Input Clock, fCLK = 1.5GHz at 0.5VP-P with 50% duty cycle, VBG = Floating, NonExtended Control Mode, SDR Mode, REXT = 3300Ω ± 0.1%, Analog Signal Source Impedance = 100Ω Differential. Boldface
limits apply for TA = TMIN to TMAX. All other limits TA = 25˚C, unless otherwise noted. (Notes 6, 7)
Symbol
Parameter
Conditions
Typical
(Note 8)
Limits
(Note 8)
Units
(Limits)
STATIC CONVERTER CHARACTERISTICS
INL
Integral Non-Linearity (Best fit)
DC Coupled, 1MHz Sine Wave
Overanged
± 0.35
± TBD
LSB (max)
DNL
Differential Non-Linearity
DC Coupled, 1MHz Sine Wave
Overanged
± 0.25
± TBD
LSB (max)
8
Bits
−TBD
TBD
LSB (min)
LSB (max)
Resolution with No Missing
Codes
VOFF
Offset Error
-0.45
± 45
VOFF_ADJ
Input Offset Adjustment Range
PFSE
Positive Full-Scale Error (Note
9)
−0.6
± TBD
mV (max)
NFSE
Negative Full-Scale Error (Note
9)
−1.31
± TBD
mV (max)
FS_ADJ
Full-Scale Adjustment Range
± 20
± 15
%FS
Extended Control Mode
Extended Control Mode
mV
DYNAMIC CONVERTER CHARACTERISTICS
FPBW
Full Power Bandwidth
TBD
GHz
B.E.R.
Bit Error Rate
10-18
Error/Sample
± TBD
± TBD
dBFS
Gain Flatness
ENOB
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Effective Number of Bits
d.c. to 1500 MHz
d.c. to 3 GHz
dBFS
fIN = 248 MHz, VIN = FSR − 0.5 dB
7.4
TBD
Bits (min)
fIN = 748 MHz, VIN = FSR − 0.5 dB
7.0
TBD
Bits (min)
fIN = 1498 MHz, VIN = FSR − 0.5 dB
6.5
TBD
Bits (min)
8
(Continued)
NOTE: This product is currently in development and the parameters specified in this section are DESIGN TARGETS.
The specifications in this section cannot be guaranteed until device characterization has taken place. The following
specifications apply after calibration for VA = VDR = +1.9VDC, OutV = 1.9V, VIN FSR (a.c. coupled) = differential 870mVP-P, CL
= 10 pF, Differential, a.c. coupled Sinewave Input Clock, fCLK = 1.5GHz at 0.5VP-P with 50% duty cycle, VBG = Floating, NonExtended Control Mode, SDR Mode, REXT = 3300Ω ± 0.1%, Analog Signal Source Impedance = 100Ω Differential. Boldface
limits apply for TA = TMIN to TMAX. All other limits TA = 25˚C, unless otherwise noted. (Notes 6, 7)
Symbol
Typical
(Note 8)
Limits
(Note 8)
Units
(Limits)
fIN = 248 MHz, VIN = FSR − 0.5 dB
46.3
TBD
dB (min)
fIN = 748 MHz, VIN = FSR − 0.5 dB
44.5
TBD
dB (min)
fIN = 1498 MHz, VIN = FSR − 0.5 dB
40.9
TBD
dB (min)
fIN = 248 MHz, VIN = FSR − 0.5 dB
46.9
TBD
dB (min)
fIN = 748 MHz, VIN = FSR − 0.5 dB
44.0
TBD
dB (min)
Parameter
Conditions
DYNAMIC CONVERTER CHARACTERISTICS
SINAD
SNR
THD
2nd Harm
3rd Harm
SFDR
IMD
Signal-to-Noise Plus Distortion
Ratio
Signal-to-Noise Ratio
Total Harmonic Distortion
Second Harmonic Distortion
Third Harmonic Distortion
Spurious-Free dynamic Range
Intermodulation Distortion
Out of Range Output Code
(In addition to OR Output high)
fIN = 1498 MHz, VIN = FSR − 0.5 dB
42.0
TBD
dB (min)
fIN = 248 MHz, VIN = FSR − 0.5 dB
-55
-TBD
dB (max)
fIN = 748 MHz, VIN = FSR − 0.5 dB
-54
-TBD
dB (max)
fIN = 1498 MHz, VIN = FSR − 0.5 dB
-47.4
-TBD
dB (max)
fIN = 248 MHz, VIN = FSR − 0.5 dB
−60
dB
fIN = 748 MHz, VIN = FSR − 0.5 dB
−60
dB
fIN = 1498 MHz, VIN = FSR − 0.5 dB
−60
dB
fIN = 248 MHz, VIN = FSR − 0.5 dB
−65
dB
fIN = 748 MHz, VIN = FSR − 0.5 dB
−65
dB
fIN = 1498 MHz, VIN = FSR − 0.5 dB
−65
dB
fIN = 248 MHz, VIN = FSR − 0.5 dB
55
TBD
dB (min)
fIN = 748 MHz, VIN = FSR − 0.5 dB
49
TBD
dB (min)
fIN = 1498 MHz, VIN = FSR − 0.5 dB
43
TBD
dB (min)
fIN1 = 321 MHz, VIN = FSR − 7 dB
fIN2 = 326 MHz, VIN = FSR − 7 dB
-50
dB
(VIN+) − (VIN−) > + Full Scale
255
(VIN+) − (VIN−) < − Full Scale
0
ANALOG INPUT AND REFERENCE CHARACTERISTICS
VIN
VCMI
CIN
RIN
Full Scale Analog Differential
Input Range
FSR pin 14 Low
600
FSR pin 14 High
800
Analog Input Common Mode
Voltage
VCMO
520
mVP-P (min)
680
mVP-P (max)
720
mVP-P (min)
880
mVP-P (max)
VCMO − 50
VCMO + 50
mV (min)
mV (max)
Analog Input Capacitance,
Normal operation (Notes 10,
11)
Differential
0.02
pF
Each input pin to ground
1.6
pF
Analog Input Capacitance, DES
Mode (Notes 10, 11)
Differential
0.08
pF
Each input pin to ground
2.2
Differential Input Resistance
100
pF
94
Ω (min)
106
Ω (max)
0.95
1.45
V (min)
V (max)
ANALOG OUTPUT CHARACTERISTICS
VCMO
Common Mode Output Voltage
VCMO_LVL
VCMO input threshold to set DC
Coupling mode
TC VCMO
Common Mode Output Voltage
Temperature Coefficient
1.26
VA = 1.8V
0.60
V
VA = 2.0V
0.66
V
TA = −40˚C to +85˚C
118
ppm/˚C
9
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ADC083000
Converter Electrical Characteristics
ADC083000
Converter Electrical Characteristics
(Continued)
NOTE: This product is currently in development and the parameters specified in this section are DESIGN TARGETS.
The specifications in this section cannot be guaranteed until device characterization has taken place. The following
specifications apply after calibration for VA = VDR = +1.9VDC, OutV = 1.9V, VIN FSR (a.c. coupled) = differential 870mVP-P, CL
= 10 pF, Differential, a.c. coupled Sinewave Input Clock, fCLK = 1.5GHz at 0.5VP-P with 50% duty cycle, VBG = Floating, NonExtended Control Mode, SDR Mode, REXT = 3300Ω ± 0.1%, Analog Signal Source Impedance = 100Ω Differential. Boldface
limits apply for TA = TMIN to TMAX. All other limits TA = 25˚C, unless otherwise noted. (Notes 6, 7)
Symbol
Parameter
Conditions
Typical
(Note 8)
Limits
(Note 8)
Units
(Limits)
80
pF
1.20
1.33
V (min)
V (max)
ANALOG OUTPUT CHARACTERISTICS
CLOAD
VCMO
Maximum VCMO load
Capacitance
VBG
Bandgap Reference Output
Voltage
IBG = ± 100 µA
TC VBG
Bandgap Reference Voltage
Temperature Coefficient
TA = −40˚C to +85˚C,
IBG = ± 100 µA
CLOAD
VBG
Maximum Bandgap Reference
load Capacitance
1.26
28
ppm/˚C
80
pF
TEMPERATURE DIODE CHARACTERISTICS
∆VBE
Temperature Diode Voltage
192 µA vs. 12 µA,
TJ = 25˚C
71.23
mV
192 µA vs. 12 µA,
TJ = 85˚C
85.54
mV
Sine Wave Clock
0.6
0.4
2.0
VP-P (min)
VP-P (max)
Square Wave Clock
0.6
0.4
2.0
VP-P (min)
VP-P (max)
CLOCK INPUT CHARACTERISTICS
VID
II
CIN
Differential Clock Input Level
Input Current
VIN = 0 or VIN = VA
±1
µA
Input Capacitance (Notes 10,
11)
Differential
0.02
pF
Each input to ground
1.5
pF
DIGITAL CONTROL PIN CHARACTERISTICS
VIH
Logic High Input Voltage
(Note 12)
0.85 x VA
V (min)
VIL
Logic Low Input Voltage
(Note 12)
0.15 x VA
V (max)
CIN
Input Capacitance (Notes 11,
13)
Each input to ground
1.2
Measured differentially, OutV = VA,
VBG = Floating (Note 15)
710
pF
DIGITAL OUTPUT CHARACTERISTICS
VOD
LVDS Differential Output
Voltage
∆ VO DIFF
Change in LVDS Output Swing
Between Logic Levels
VOS
Output Offset Voltage, see
Figure 1
VOS
Output Offset Voltage, see
Figure 1
∆ VOS
Output Offset Voltage Change
Between Logic Levels
IOS
Output Short Circuit Current
ZO
Differential Output Impedance
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Measured differentially, OutV =
GND, VBG = Floating (Note 15)
510
400
mVP-P (min)
920
mVP-P (max)
280
mVP-P (min)
720
mVP-P (max)
±1
mV
VBG = Floating
800
mV
VBG = VA (Note 15)
1200
mV
±1
mV
±4
mA
100
Ohms
Output+ & Output- connected to
0.8V
10
(Continued)
NOTE: This product is currently in development and the parameters specified in this section are DESIGN TARGETS.
The specifications in this section cannot be guaranteed until device characterization has taken place. The following
specifications apply after calibration for VA = VDR = +1.9VDC, OutV = 1.9V, VIN FSR (a.c. coupled) = differential 870mVP-P, CL
= 10 pF, Differential, a.c. coupled Sinewave Input Clock, fCLK = 1.5GHz at 0.5VP-P with 50% duty cycle, VBG = Floating, NonExtended Control Mode, SDR Mode, REXT = 3300Ω ± 0.1%, Analog Signal Source Impedance = 100Ω Differential. Boldface
limits apply for TA = TMIN to TMAX. All other limits TA = 25˚C, unless otherwise noted. (Notes 6, 7)
Symbol
Parameter
Conditions
Typical
(Note 8)
Limits
(Note 8)
Units
(Limits)
POWER SUPPLY CHARACTERISTICS
IA
Analog Supply Current
PD = Low
PD = High
745
10.2
TBD
TBD
mA (max)
mA (max)
IDR
Output Driver Supply Current
PD = Low
PD = High
200
0.012
TBD
TBD
mA (max)
mA (max)
PD
Power Consumption
PD = Low
PD = High
1.8
20
TBD
TBD
W (max)
mW (max)
PSRR1
D.C. Power Supply Rejection
Ratio
Change in Full Scale Error with
change in VA from 1.8V to 2.0V
30
dB
PSRR2
A.C. Power Supply Rejection
Ratio
248 MHz, 50mVP-P riding on VA
51
dB
AC ELECTRICAL CHARACTERISTICS
fCLK1
Maximum Input Clock
Frequency
Sampling rate is 2x clock input
1.7
fCLK2
Minimum Input Clock
Frequency
Sampling rate is 2x clock input
500
Input Clock Duty Cycle
500MHz ≤ Input clock frequency ≤
1.5 GHz (Note 12)
50
20
80
% (min)
% (max)
tCL
Input Clock Low Time
(Note 11)
333
133
ps (min)
tCH
Input Clock High Time
(Note 11)
333
133
ps (min)
45
55
% (min)
% (max)
1.5
GHz (min)
MHz
DCLK Duty Cycle
(Note 11)
50
tRS
Reset Setup Time
(Note 11)
150
ps
tRH
Reset Hold Time
(Note 11)
250
ps
tSD
Syncronizing Edge to DCLK
Output Delay
fCLKIN = 1.5 GHz
fCLKIN = 500 MHz
TBD
TBD
ns
tRPW
Reset Pulse Width
(Note 11)
tLHT
Differential Low to High
Transition Time
10% to 90%, CL = 2.5 pF
250
ps
tHLT
Differential High to Low
Transition Time
10% to 90%, CL = 2.5 pF
250
ps
tOSK
DCLK to Data Output Skew
50% of DCLK transition to 50% of
Data transition, SDR Mode
and DDR Mode, 0˚ DCLK (Note 11)
± 50
ps (max)
tSU
Data to DCLK Set-Up Time
DDR Mode, 90˚ DCLK (Note 11)
667
ps
tH
DCLK to Data Hold Time
DDR Mode, 90˚ DCLK (Note 11)
667
ps
tAD
Sampling (Aperture) Delay
Input CLK+ Fall to Acquisition of
Data
1.3
ns
tAJ
Aperture Jitter
0.4
ps rms
tOD
Input Clock to Data Output
Delay (in addition to Pipeline
Delay)
3.1
ns
4
50% of Input Clock transition to 50%
of Data transition
11
Clock Cycles
(min)
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ADC083000
Converter Electrical Characteristics
ADC083000
Converter Electrical Characteristics
(Continued)
NOTE: This product is currently in development and the parameters specified in this section are DESIGN TARGETS.
The specifications in this section cannot be guaranteed until device characterization has taken place. The following
specifications apply after calibration for VA = VDR = +1.9VDC, OutV = 1.9V, VIN FSR (a.c. coupled) = differential 870mVP-P, CL
= 10 pF, Differential, a.c. coupled Sinewave Input Clock, fCLK = 1.5GHz at 0.5VP-P with 50% duty cycle, VBG = Floating, NonExtended Control Mode, SDR Mode, REXT = 3300Ω ± 0.1%, Analog Signal Source Impedance = 100Ω Differential. Boldface
limits apply for TA = TMIN to TMAX. All other limits TA = 25˚C, unless otherwise noted. (Notes 6, 7)
Symbol
Parameter
Typical
(Note 8)
Conditions
Limits
(Note 8)
Units
(Limits)
AC ELECTRICAL CHARACTERISTICS
Dd Outputs
Pipeline Delay (Latency)
(Notes 11, 14)
Over Range Recovery Time
13
Db Outputs
14
Dc Outputs
13.5
Da Outputs
14.5
Differential VIN step from ± 1.2V to
0V to get accurate conversion
Input Clock
Cycles
1
Input Clock
Cycle
500
ns
tWU
PD low to Rated Accuracy
Conversion (Wake-Up Time)
fSCLK
Serial Clock Frequency
(Note 11)
100
MHz
tSSU
Data to Serial Clock Setup
Time
(Note 11)
2.5
ns (min)
tSH
Data to Serial Clock Hold Time
(Note 11)
1
ns (min)
Serial Clock Low Time
4
Serial Clock High Time
4
1.4 x 105
ns (min)
ns (min)
tCAL
Calibration Cycle Time
tCAL_L
CAL Pin Low Time
See Figure 9 (Note 11)
80
Clock Cycles
(min)
tCAL_H
CAL Pin High Time
See Figure 9 (Note 11)
80
Clock Cycles
(min)
tCalDly
Calibration delay determined by
pin 127
See Section 1.1.1, Figure 9, (Note
11)
225
Clock Cycles
(min)
tCalDly
Calibration delay determined by
pin 127
See Section 1.1.1, Figure 9, (Note
11)
231
Clock Cycles
(max)
Clock Cycles
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. There is no guarantee of operation at the Absolute Maximum
Ratings. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and
test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
Note 2: All voltages are measured with respect to GND = DR GND = 0V, unless otherwise specified.
Note 3: When the input voltage at any pin exceeds the power supply limits (that is, less than GND or greater than VA), the current at that pin should be limited to
25 mA. The 50 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 25 mA to two.
This limit is not placed upon the power, ground and digital output pins.
Note 4: Human body model is 100 pF capacitor discharged through a 1.5 kΩ resistor. Machine model is 220 pF discharged through ZERO Ohms.
Note 5: See AN-450, “Surface Mounting Methods and Their Effect on Product Reliability”.
Note 6: The analog inputs are protected as shown below. Input voltage magnitudes beyond the Absolute Maximum Ratings may damage this device.
20193204
Note 7: To guarantee accuracy, it is required that VA and VDR be well bypassed. Each supply pin must be decoupled with separate bypass capacitors. Additionally,
achieving rated performance requires that the backside exposed pad be well grounded.
Note 8: Typical figures are at TA = 25˚C, and represent most likely parametric norms. Test limits are guaranteed to National’s AOQL (Average Outgoing Quality
Level).
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12
(Continued)
Note 9: Calculation of Full-Scale Error for this device assumes that the actual reference voltage is exactly its nominal value. Full-Scale Error for this device,
therefore, is a combination of Full-Scale Error and Reference Voltage Error. See Figure 2. For relationship between Gain Error and Full-Scale Error, see Specification
Definitions for Gain Error.
Note 10: The analog and clock input capacitances are die capacitances only. Additional package capacitances of 0.65 pF differential and 0.95 pF each pin to ground
are isolated from the die capacitances by lead and bond wire inductances.
Note 11: This parameter is guaranteed by design and is not tested in production.
Note 12: This parameter is guaranteed by design and/or characterization and is not tested in production.
Note 13: The digital control pin capacitances are die capacitances only. Additional package capacitance of 1.6 pF each pin to ground are isolated from the die
capacitances by lead and bond wire inductances.
Note 14: Each of the two converters of the ADC083000 has two LVDS output buses, which each clock data out at one half the sample rate. The data at each bus
is clocked out at one half the sample rate. The second bus (D0 through D7) has a pipeline latency that is one Input Clock cycle less than the latency of the first bus
(Dd0 through Dd7).
Note 15: Tying VBG to the supply rail will increase the output offset voltage (VOS) by 400mv (typical), as shown in the VOS specification above. Tying VBG to the
supply rail will also affect the differential LVDS output voltage (VOD), causing it to increase by 40mV (typical).
It is defined as the ratio of the power in the second and third
order intermodulation products to the power in one of the
original frequencies. IMD is usually expressed in dBFS.
Specification Definitions
APERTURE (SAMPLING) DELAY is that time required after
the fall of the clock input for the sampling switch to open. The
Sample/Hold circuit effectively stops capturing the input signal and goes into the “hold” mode the aperture delay time
(tAD) after the input clock goes low.
APERTURE JITTER (tAJ) is the variation in aperture delay
from sample to sample. Aperture jitter shows up as input
noise.
Bit Error Rate (B.E.R.) is the probability of error and is
defined as the probable number of errors per unit of time
divided by the number of bits seen in that amount of time. A
B.E.R. of 10-18 corresponds to a statistical error in one bit
about every four (4) years.
CLOCK DUTY CYCLE is the ratio of the time that the clock
wave form is at a logic high to the total time of one clock
period.
DIFFERENTIAL NON-LINEARITY (DNL) is the measure of
the maximum deviation from the ideal step size of 1 LSB.
Measured at 3 GSPS with a ramp input.
EFFECTIVE NUMBER OF BITS (ENOB, or EFFECTIVE
BITS) is another method of specifying Signal-to-Noise and
Distortion Ratio, or SINAD. ENOB is defined as (SINAD −
1.76) / 6.02 and says that the converter is equivalent to a
perfect ADC of this (ENOB) number of bits.
LSB (LEAST SIGNIFICANT BIT) is the bit that has the
smallest value or weight of all bits. This value is
VFS / 2n
where VFS is the differential full-scale amplitude of 650 mV
or 870 mV as set by the FSR input and "n" is the ADC
resolution in bits, which is 8 for the ADC083000.
LVDS DIFFERENTIAL OUTPUT VOLTAGE (VOD) is the
absolute value of the difference between the VD+ & VDoutputs; each measured with respect to Ground.
20193246
FIGURE 1.
FULL POWER BANDWIDTH (FPBW) is a measure of the
frequency at which the reconstructed output fundamental
drops 3 dB below its low frequency value for a full scale
input.
GAIN ERROR is the deviation from the ideal slope of the
transfer function. It can be calculated from Offset and FullScale Errors:
Positive Gain Error = Offset Error − Positive Full-Scale
Error
Negative Gain Error = −(Offset Error − Negative FullScale Error)
Gain Error = Negative Full-Scale Error − Positive FullScale Error = Positive Gain Error + Negative Gain Error
INTEGRAL NON-LINEARITY (INL) is a measure of the
deviation of each individual code from a straight line through
the input to output transfer function. The deviation of any
given code from this straight line is measured from the
center of that code value. The best fit method is used.
INTERMODULATION DISTORTION (IMD) is the creation of
additional spectral components as a result of two sinusoidal
frequencies being applied to the ADC input at the same time.
LVDS OUTPUT OFFSET VOLTAGE (VOS) is the midpoint
between the D+ and D- pins output voltage; ie., [(VD+) +(
VD-)]/2.
MISSING CODES are those output codes that are skipped
and will never appear at the ADC outputs. These codes
cannot be reached with any input value.
MSB (MOST SIGNIFICANT BIT) is the bit that has the
largest value or weight. Its value is one half of full scale.
NEGATIVE FULL-SCALE ERROR (NFSE) is a measure of
how far the last code transition is from the ideal 1/2 LSB
above a differential −435 mV with the FSR pin high, or 1/2
LSB above a differential −325 mV with the FSR pin low. For
the ADC083000 the reference voltage is assumed to be
ideal, so this error is a combination of full-scale error and
reference voltage error.
OFFSET ERROR (VOFF) is a measure of how far the midscale point is from the ideal zero voltage differential input.
Offset Error = Actual Input causing average of 8k
samples to result in an average code of 127.5.
OUTPUT DELAY (tOD) is the time delay after the falling edge
of DCLK before the data update is present at the output pins.
13
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ADC083000
Converter Electrical Characteristics
ADC083000
Specification Definitions
SIGNAL TO NOISE PLUS DISTORTION (S/(N+D) or SINAD) is the ratio, expressed in dB, of the rms value of the
input signal at the output to the rms value of all of the other
spectral components below half the input clock frequency,
including harmonics but excluding d.c.
SPURIOUS-FREE DYNAMIC RANGE (SFDR) is the difference, expressed in dB, between the rms values of the input
signal at the output and the peak spurious signal, where a
spurious signal is any signal present in the output spectrum
that is not present at the input, excluding d.c.
(Continued)
OVER-RANGE RECOVERY TIME is the time required after
the differential input voltages goes from ± 1.2V to 0V for the
converter to recover and make a conversion with its rated
accuracy.
PIPELINE DELAY (LATENCY) is the number of input clock
cycles between initiation of conversion and when that data is
presented to the output driver stage. New data is available at
every clock cycle, but the data lags the conversion by the
Pipeline Delay plus the tOD.
TOTAL HARMONIC DISTORTION (THD) is the ratio expressed in dB, of the rms total of the first nine harmonic
levels at the output to the level of the fundamental at the
output. THD is calculated as
POSITIVE FULL-SCALE ERROR (PFSE) is a measure of
how far the last code transition is from the ideal 1-1/2 LSB
below a differential +435 mV with the FSR pin high, or 1-1/2
LSB below a differential +325 mV with the FSR pin low. For
the ADC083000 the reference voltage is assumed to be
ideal, so this error is a combination of full-scale error and
reference voltage error.
POWER SUPPLY REJECTION RATIO (PSRR) can be one
of two specifications. PSRR1 (DC PSRR) is the ratio of the
change in full-scale error that results from a power supply
voltage change from 1.8V to 2.0V. PSRR2 (AC PSRR) is a
measure of how well an a.c. signal riding upon the power
supply is rejected from the output and is measured with a
248 MHz, 50 mVP-P signal riding upon the power supply. It is
the ratio of the output amplitude of that signal at the output to
its amplitude on the power supply pin. PSRR is expressed in
dB.
SIGNAL TO NOISE RATIO (SNR) is the ratio, expressed in
dB, of the rms value of the input signal at the output to the
rms value of the sum of all other spectral components below
one-half the sampling frequency, not including harmonics or
d.c.
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where Af1 is the RMS power of the fundamental (output)
frequency and Af2 through Af10 are the RMS power of the
first 9 harmonic frequencies in the output spectrum.
– Second Harmonic Distortion (2nd Harm) is the difference, expressed in dB, between the RMS power in the input
frequency seen at the output and the power in its 2nd
harmonic level at the output.
– Third Harmonic Distortion (3rd Harm) is the difference
expressed in dB between the RMS power in the input frequency seen at the output and the power in its 3rd harmonic
level at the output.
14
ADC083000
Transfer Characteristic
20193222
FIGURE 2. Input / Output Transfer Characteristic
15
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ADC083000
Timing Diagrams
20193214
FIGURE 3. ADC083000 Timing — SDR Clocking
20193259
FIGURE 4. ADC083000 Timing — DDR Clocking
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16
ADC083000
Timing Diagrams
(Continued)
20193219
FIGURE 5. Serial Interface Timing
20193220
FIGURE 6. Clock Reset Timing in DDR Mode
20193223
FIGURE 7. Clock Reset Timing in SDR Mode with OUTEDGE Low
17
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ADC083000
Timing Diagrams
(Continued)
20193224
FIGURE 8. Clock Reset Timing in SDR Mode with OUTEDGE High
20193225
FIGURE 9. Self Calibration and On-Command Calibration Timing
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18
The ADC083000 is a versatile A/D Converter with an innovative architecture permitting very high speed operation. The
controls available ease the application of the device to circuit
solutions. Optimum performance requires adherence to the
provisions discussed here and in the Applications Information Section.
While it is generally poor practice to allow an active pin to
float, pins 4, 14 and 127 of the ADC083000 are designed to
be left floating without jeopardy. In all discussions throughout
this data sheet, whenever a function is called by allowing a
control pin to float, connecting that pin to a potential of one
half the VA supply voltage will have the same effect as
allowing it to float.
In normal operation, calibration is performed just after application of power and whenever a valid calibration command
is given, which is holding the CAL pin low for at least 80 input
clock cycles, then hold it high for at least another 80 input
clock cycles. The time taken by the calibration procedure is
specified in the A.C. Characteristics Table. Holding the CAL
pin high upon power up will prevent the calibration process
from running until the CAL pin experiences the abovementioned 80 input clock cycles low followed by 80 cycles
high.
1.1 OVERVIEW
The ADC083000 uses a calibrated folding and interpolating
architecture that achieves over 7.4 effective bits. The use of
folding amplifiers greatly reduces the number of comparators
and power consumption. Interpolation reduces the number
of front-end amplifiers required, minimizing the load on the
input signal and further reducing power requirements. In
addition to other things, on-chip calibration reduces the INL
bow often seen with folding architectures. The result is an
extremely fast, high performance, low power converter.
The analog input signal that is within the converter’s input
voltage range is digitized to eight bits at speeds of 500
MSPS to 3.0 GSPS, typical. Differential input voltages below
negative full-scale will cause the output word to consist of all
zeroes. Differential input voltages above positive full-scale
will cause the output word to consist of all ones. Either of
these conditions at the analog input will cause the OR (Out
of Range) output to be activated. This single OR output
indicates when the output code from the converter is below
negative full scale or above positive full scale.
The ADC083000 has a selectable 1:2 or 1:4 demultiplexer.
When the 1:4 demultiplexer is selected, data is output on all
four output busses at a quarter of the ADC sampling rate.
When the 1:2 demultiplexer is selected, data is output on
only the Dc and Dd output busses at half of the ADC sampling rate. In both cases, the outputs must be interleaved by
the user to provide output words at the full conversion rate.
The output levels may be selected to be normal or reduced
voltage. Using reduced levels saves power but could result
in erroneous data capture of some or all of the bits, especially at higher sample rates and in marginally designed
systems.
CalDly (pin 127) is used to select one of two delay times after
the application of power to the start of calibration. This
calibration delay is 225 input clock cycles (about 22 ms at 3
GSPS) with CalDly low, or 231 input clock cycles (about 1.4
seconds at 3 GSPS) with CalDly high. These delay values
allow the power supply to come up and stabilize before
calibration takes place. If the PD pin is high upon power-up,
the calibration delay counter will be disabled until the PD pin
is brought low. Therefore, holding the PD pin high during
power up will further delay the start of the power-up calibration cycle. The best setting of the CalDly pin depends upon
the power-on settling time of the power supply.
The CalRun output is high whenever the calibration procedure is running. This is true whether the calibration is done at
power-up or on-command.
1.1.2 Acquiring the Input
Data is acquired at the falling edge of CLK+ (pin 18) and the
digital equivalent of that data is available at the digital outputs 13 input clock cycles later for the Dd and Dc output
buses and 14 input clock cycles later for the Db and Da
output buses. There is an additional internal delay called tOD
before the data is available at the outputs. See the Timing
Diagram. The ADC083000 will convert as long as the input
clock signal is present. The fully differential comparator design and the innovative design of the sample-and-hold amplifier, together with self calibration, enables a very flat
SINAD/ENOB response beyond 1.5 GHz. The ADC083000
output data signaling is LVDS and the output format is offset
binary.
1.1.1 Self-Calibration
A self-calibration is performed upon power-up and can also
be invoked by the user upon command. Calibration trims the
100Ω analog input differential termination resistor and minimizes full-scale error, offset error, DNL and INL, resulting in
maximizing SNR, THD, SINAD (SNDR) and ENOB. Internal
bias currents are also set with the calibration process. All of
this is true whether the calibration is performed upon power
up or is performed upon command. Running the self calibration is an important part of this chip’s functionality and is
required in order to obtain adequate performance. In addition to the requirement to be run at power-up, self calibration
must be re-run whenever the sense of the FSR pin is
changed. For best performance, we recommend that self
calibration be run 20 seconds or more after application of
power and whenever the operating temperature changes
significantly relative to the specific system performance re-
1.1.3 Control Modes
Much of the user control can be accomplished with several
control pins that are provided. Examples include initiation of
the calibration cycle, power down mode and full scale range
setting. However, the ADC083000 also provides an Extended Control mode whereby a serial interface is used to
access register-based control of several advanced features.
The Extended Control mode is not intended to be enabled
and disabled dynamically. Rather, the user is expected to
employ either the normal control mode or the Extended
Control mode at all times. When the device is in the Extended Control mode, pin-based control of several features
is replaced with register-based control and those pin-based
19
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ADC083000
quirements. See Section 2.4.2.2 for more information. Calibration can not be initiated or run while the device is in the
power-down mode. See Section 1.1.7 for information on the
interaction between Power Down and Calibration.
During the calibration process, the input termination resistor
is trimmed to a value that is equal to REXT / 33. This external
resistor is located between pin 32 and ground. REXT must be
3300 Ω ± 0.1%. With this value, the input termination resistor
is trimmed to be 100 Ω. Because REXT is also used to set the
proper current for the Track and Hold amplifier, for the
preamplifiers and for the comparators, other values of REXT
should not be used.
1.0 Functional Description
ADC083000
1.0 Functional Description
feature is enabled by default and provides improved ADC
clocking. This circuitry allows the ADC to be clocked with a
signal source having a duty cycle ratio of 80 / 20 % (worst
case).
(Continued)
controls are disabled. These pins are OutV (pin 3), OutEdge/
DDR (pin 4), FSR (pin 14). See Section 1.2 for details on the
Extended Control mode.
1.1.5.1 Selectable Output Demultiplexer
1.1.4 The Analog Inputs
The ADC083000 utilizes both the rising and falling edge of
the input clock resulting in the overall sample rate being
twice the input clock frequency, or 3GSPS with a 1.5 GHz
input clock. To ease the timing requirements of a system
interfacing to the ADC output ports, a selectable output
demultiplexer is provided. The demultiplexer selection is
programmed in the extended control mode using the Configuration Register. Refer to section 1.4. The default setting
selects the 1:4 demultiplexer with data on each of the four
output busses at 750MHz with a 1.5GHz input clock. When
Bit 0 in the Configuration Register is programmed to 1b, the
data is present on Dc and Dd output busses at a rate of
1.5GHz with a 1.5GHz input clock. NOTE: Bit 0 can only be
programmed 1b when the ADC083000 is in DDR mode. If
the device is not in DDR mode and Bit 0 is set to 1b, the data
outputs will not change.
The ADC083000 must be driven with a differential input
signal. Operation with a single-ended signal is not recommended. It is important that the input signals are either a.c.
coupled to the inputs with the VCMO pin grounded, or d.c.
coupled with the VCMO pin left floating. An input common
mode voltage equal to the VCMO output must be provided
when d.c. coupling is used.
Two full-scale range settings are provided with pin 14 (FSR).
A high on pin 14 causes an input full-scale range setting of
870 mVP-P, while grounding pin 14 causes an input full-scale
range setting of 650 mVP-P. The full-scale range setting
operates equally on both ADCs.
In the Extended Control mode, the full-scale input range can
be set to values between 560 mVP-P and 840 mVP-P through
a serial interface. See Section 2.2
All data is available in parallel at the output. The four bytes of
parallel data that are output with each clock is in the following sampling order, from the earliest to the latest: Da, Db, Dc,
Dd. Table 1 indicates what the outputs represent for the
various sampling possibilities.
The ADC083000 includes an automatic clock phase background calibration feature which automatically and continuously adjusts the phase of the ADC input clock. This feature
removes the need to manually adjust the clock phase and
provides optimal ENOB performance.
1.1.5 Clocking
The ADC083000 must be driven with an a.c. coupled, differential clock signal. Section 2.3 describes the use of the clock
input pins. A differential LVDS output clock is available for
use in latching the ADC output data into whatever device is
used to receive the data.
The ADC083000 offers options for input and output clocking.
These options include a choice of on which DCLK (DCLK)
edge the output data transitions, and a choice of Single Data
Rate (SDR) or Double Data Rate (DDR) outputs.
The ADC083000 also has the option to use a duty cycle
corrected clock receiver as part of the input clock circuit. This
TABLE 1. Input Channel Samples Produced at Data Outputs
Data Outputs (Always sourced
with respect to fall of DCLK)
1:4 Demultiplex
Dd
ADC1 sampled with fall of CLK 13
cycles earlier
Db
ADC1 sampled with fall of CLK 14
cycles earlier
Dc
ADC2 sampled with rise of CLK 13.5
cycles earlier
Da
ADC2 sampled with rise of CLK 14.5
cycles earlier
1.1.5.2 OutEdge Setting
To help ease data capture in the SDR mode, the output data
may be caused to transition on either the positive or the
negative edge of the output data clock (DCLK). This is
chosen with the OutEdge input (pin 4). A high on the OutEdge input pin causes the output data to transition on the
rising edge of DCLK, while grounding this input causes the
output to transition on the falling edge of DCLK. See Section
2.4.3.
ADC1 sampled with fall of CLK 13 cycles
earlier
ADC2 sampled with rise of CLK 13.5
cycles earlier
output buses. With double data rate the DCLK frequency is
half the data rate and data is sent to the outputs on both
edges of DCLK. DDR clocking is enabled in non-Extended
Control mode by allowing pin 4 to float.
1.1.6 The LVDS Outputs
The data outputs, the Out Of Range (OR) and DCLK, are
LVDS. Output current sources provide 3 mA of output current
to a differential 100 Ohm load when the OutV input (pin 14)
is high or 2.2 mA when the OutV input is low. For short LVDS
lines and low noise systems, satisfactory performance may
be realized with the OutV input low, which results in lower
1.1.5.3 Double Data Rate
A choice of single data rate (SDR) or double data rate (DDR)
output is offered. With single data rate the output clock
(DCLK) frequency is the same as the data rate of the two
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1:2 Demultiplex
20
is already high, the device will not begin the calibration
sequence until the PD input goes low. If a manual calibration
is requested while the device is powered down, the calibration will not begin at all. That is, the manual calibration input
is completely ignored in the power down state.
(Continued)
power consumption. If the LVDS lines are long and/or the
system in which the ADC083000 is used is noisy, it may be
necessary to tie the OutV pin high.
The LVDS data output have a typical common mode voltage
of 800mV when the VBG pin is unconnected and floating.
This common mode voltage can be increased to 1.2V by
tying the VBG pin to VA if a higher common mode is required.
1.2 NORMAL/EXTENDED CONTROL
The ADC083000 may be operated in one of two modes. In
the simpler standard control mode, the user affects available
configuration and control of the device through several control pins. The "extended control mode" provides additional
configuration and control options through a serial interface
and a set of 6 registers. The two control modes are selected
with pin 14 (FSR/ECE: Extended Control Enable). The
choice of control modes is required to be a fixed selection
and is not intended to be switched dynamically while the
device is operational.
1.1.7 Power Down
The ADC083000 is in the active state when the Power Down
pin (PD) is low. When the PD pin is high, the device is in the
power down mode. In this power down mode the data output
pins (positive and negative) including DCLK+/- and OR +/are put into a high impedance state and the devices power
consumption is reduced to a minimal level.
Table 2 shows how several of the device features are affected by the control mode chosen.
If the PD input is brought high while a calibration is running,
the device will not go into power down until the calibration
sequence is complete. However, if power is applied and PD
TABLE 2. Features and modes
Feature
Normal Control Mode
Extended Control Mode
SDR or DDR Clocking
Selected with pin 4
Selected with DE bit in the
Configuration Register
DDR Clock Phase
Not Selectable (0˚ Phase Only)
Selected with DCP bit in the
Configuration Register. See Section
1.4 REGISTER DESCRIPTION
SDR Data transitions with rising or
falling DCLK edge
Selected with pin 4
Selected with the OE bit in the
Configuration Register
LVDS output level
Selected with pin 3
Selected with the OV bit (9)in the
Configuration Register
Power-On Calibration Delay
Delay Selected with pin 127
Short delay only.
Full-Scale Range
Options (650 mVP-P or 870 mVP-P)
selected with pin 14. Selected range
applies to both channels.
Up to 512 step adjustments over a
nominal range of 560 mV to 840 mV.
Selected using registers 3H.
Input Offset Adjust
Not possible
Separate ± 45 mV adjustments in 512
steps using registers 2h.
Sampling Clock Phase Adjustment
The Clock Phase is adjusted
automatically
The clock phase can be adjusted
manually through the Coarse & Fine
registers (Eh and Dh).
Test Pattern
Not Possible
A test pattern can be made present at
the data outputs by programming
register Fh.
Resistor Trim Disable
Not possible
The DCLK outputs will continuously be
present when bit 5 is set 1b in register
1h.
Not possible
If the device is set in DDR, the output
can be programmed to be 1:2
demultiplexed. Bit 0 in register 1h is
set 1b, this selects 1:2 demultiplex. If
bit 0 is 0b, this selects 1:4 demultiplex.
Selectable Output Demultiplexer
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ADC083000
1.0 Functional Description
ADC083000
1.0 Functional Description
IMPORTANT NOTE: The Serial Interface should not be
used when calibrating the ADC. Doing so will impair the
performance of the device until it is re-calibrated correctly.
Programming the serial registers will also reduce dynamic
performance of the ADC for the duration of the register
access time.
(Continued)
The default state of the Extended Control Mode is set upon
power-on reset (internally performed by the device) and is
shown in Table 3.
TABLE 3. Extended Control Mode Operation (Pin 14
Floating)
TABLE 4. Register Addresses
Feature
Extended Control Mode
Default State
SDR or DDR Clocking
DDR Clocking
DDR Clock Phase
Data changes with DCLK
edge (0˚ phase)
A3
A2
A1
A0
Hex
Register Addressed
0
0
0
0
0h
Reserved
LVDS Output Amplitude
Normal amplitude
(710 mVP-P)
0
0
0
1
1h
Configuration
0
0
1
0
2h
Offset
Calibration Delay
Short Delay
0
0
1
1
3h
Full-Scale Range
700 mV nominal for both
channels
Full-Scale Voltage
Adjust
0
1
0
0
4h
Reserved
Input Offset Adjust
No adjustment for either
channel
0
1
0
1
5h
Reserved
0
1
1
0
6h
Reserved
Selectable Output
Demultiplexer
1:4 demultiplex
0
1
1
1
7h
Reserved
1
0
0
0
8h
Reserved
Resistor Trim Disable
Trim enabled, DCLK not
continuously present at
output
1
0
0
1
9h
Reserved
1
0
1
0
Ah
Reserved
Test Pattern
Not present at output
1
0
1
1
Bh
Reserved
1
1
0
0
Ch
Reserved
1
1
0
1
Dh
Extended Clock
Phase adjust fine
1
1
1
0
Eh
Extended Clock
Phase adjust
coarse
1
1
1
1
Fh
Test Pattern
4-Bit Address
Loading Sequence:
A3 loaded after H0, A0 loaded last
1.3 THE SERIAL INTERFACE
The 3-pin serial interface is enabled only when the device is
in the Extended Control mode. The pins of this interface are
Serial Clock (SCLK), Serial Data (SDATA) and Serial Interface Chip Select (SCS) Eight write only registers are accessible through this serial interface.
SCS: This signal should be asserted low while accessing a
register through the serial interface. Setup and hold times
with respect to the SCLK must be observed.
1.4 REGISTER DESCRIPTION
Eight write-only registers provide several control and configuration options in the Extended Control Mode. These registers have no effect when the device is in the Normal
Control Mode. Each register description below also shows
the Power-On Reset (POR) state of each control bit.
SCLK: Serial data input is accepted with the rising edge of
this signal.
SDATA: Each register access requires a specific 32-bit pattern at this input. This pattern consists of a header, register
address and register value. The data is shifted in MSB first.
Setup and hold times with respect to the SCLK must be
observed. See the Timing Diagram.
Each Register access consists of 32 bits, as shown in Figure
5 of the Timing Diagrams. The fixed header pattern is 0000
0000 0001 (eleven zeros followed by a 1). The loading
sequence is such that a "0" is loaded first. These 12 bits form
the header. The next 4 bits are the address of the register
that is to be written to and the last 16 bits are the data written
to the addressed register. The addresses of the various
registers are indicated in Table 4.
Refer to the Register Description (Section 1.4) for information on the data to be written to the registers.
Subsequent register accesses may be performed immediately, starting with the 33rd SCLK. This means that the SCS
input does not have to be de-asserted and asserted again
between register addresses. It is possible, although not recommended, to keep the SCS input permanently enabled (at
a logic low) when using extended control.
Configuration Register
Addr: 1h (0001b)
W only (0xB2DF)
D15
D14
D13
1
0
1
D11
D10
D9
D8
DCS DCP
D12
nDE
OV
OE
D7
D6
D5
D4
D3
D2
D1
D0
1
1
RTD
1
1
1
1
nOT
Bit 15
Must be set to 1b
Bit 14
Must be set to 0b
Bit 13
Must be set to 1b
Bit 12
DCS:Duty Cycle Stabilizer. When this bit is
set to 1b , a duty cycle stabilzation circuit is
applied to the clock input. When this bit is set
to 0b the stabilzation circuit is disabled.
POR State: 1b
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22
Bit 11
Bit 10
(Continued)
Bits 0
DCP: DDR Clock Phase. This bit only has an
effect in the DDR mode. When this bit is set
to 0b, the DCLK edges are time-aligned with
the data bus edges ("0˚ Phase"). When this
bit is set to 1b, the DCLK edges are placed in
the middle of the data bit-cells ("90˚ Phase"),
using the one-half speed DCLK shown in
Figure 4 as the phase reference.
nTO: 1:2 Outpu Enablt. The setting of this bit
is contingent on the device being in the DDR
mode which is set by bit 10. If bit 10 is 0b, bit
0 can be set 1b. By doing this, the output
data rate on the Dc and Dd channels will be
that of the input clock rate. DCLK will be in
DDR mode. The Da and Db channels will be
held in Hi-Z. If the device is not in DDR mode
and bit 0 is set to 1b, the data outputs will not
change.
POR State: 0b
POR State: 0b
nDE: DDR Enable. When this bit is set to 0b,
data bus clocking follows the DDR (Dual
Data Rate) mode whereby a data word is
output with each rising and falling edge of
DCLK. When this bit is set to a 1b, data bus
clocking follows the SDR (single data rate)
mode whereby each data word is output with
either the rising or falling edge of DCLK , as
determined by the OutEdge bit.
Offset Adjust
Addr: 2h (0010b)
D15
OV: Output Voltage. This bit determines the
LVDS outputs’ voltage amplitude and has the
same function as the OutV pin that is used in
the normal control mode. When this bit is set
to 1b, the standard output amplitude of 710
mVP-P is used. When this bit is set to 0b, the
reduced output amplitude of 510 mVP-P is
used.
Bits 5
RTD: Resistor Trim Disable. When this bit is
set 0b, the DCLK outputs will not be active
during a calibration cycle. When this bit is set
1b, the DCLK outputs will be continuously
present during a calibration cycle. Note that
in this setting, only the ADC is calibrated.
D10
D9
D8
(LSB)
D5
D4
D3
D2
D1
D0
Sign
1
1
1
1
1
1
1
Offset Value. The input offset of the ADC is
adjusted linearly and monotonically by the
value in this field. 00h provides a nominal
zero offset, while FFh provides a nominal 45
mV of offset. Thus, each code step provides
0.176 mV of offset.
POR State: 0000 0000 b
Sign bit. 0b gives positive offset, 1b gives
negative offset.
POR State: 0b
Bit 6:0
Must be set to 1b
Full-Scale Voltage Adjust
Addr: 3h (0011b)
D15
D14
D13
(MSB)
POR State: 0b
Must be set to 1b.
D11
D6
Bit 7
OE: Output Edge. This bit selects the DCLK
edge with which the data words transition in
the SDR mode and has the same effect as
the OutEdge pin in the normal control mode.
When this bit is 1, the data outputs change
with the rising edge of DCLK+. When this bit
is 0, the data output change with the falling
edge of DCLK+.
Bits 7:6
D12
D7
POR State: 1b
Bit 8
D13
Offset Value
Bits 15:8
POR State: 0b
Bit 9
D14
(MSB)
W only (0x007F)
W only (0x807F)
D12
D11
D10
D9
D8
Adjust Value
D7
D6
D5
D4
D3
D2
D1
D0
(LSB)
1
1
1
1
1
1
1
POR State: 0b
Bits 4:1
Must be set to 1b.
23
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ADC083000
1.0 Functional Description
ADC083000
1.0 Functional Description
Bit 15:7
(Continued)
Bit 6:0
Full Scale Voltage Adjust Value. The input
full-scale voltage or gain of the ADC is
adjusted linearly and monotonically with a 9
bit data value. The adjustment range is
± 20% of the nominal 700 mVP-P differential
value.
0000 0000 0
560mVP-P
1000 0000 0
Default Value
700mVP-P
1111 1111 1
840mVP-P
Extended Clock Phase Adjust Coarse
Addr: Eh (1110b)
D15
D13
(MSB)
D11
D8
1
1
1
D6
D5
D4
D3
D2
D1
D0
1
1
1
1
1
1
1
1
Enable, default is 0b
Addr: Fh (1111b)
W only (0xFFFF)
D15
D14
D13
D12
D11
D10
D9
D8
1
1
1
1
nTP
1
1
1
D7
D6
D5
D4
D3
D2
D1
D0
1
1
1
1
1
1
1
1
Bits 15:12 Must be set to 1b
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
(LSB)
1
1
1
1
1
1
1
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D9
D7
Bit 11
FAM
Bit 15:7
D10
Test Pattern Register
W only (0x3FFF)
D12
D11
Bits 10:0 Must be set to 1b
Extended Clock Phase Adjust Fine
D14
D12
Bit 14:11 Coarse Adjust Magnitude. Each LSB results
in approximately 70ps of clock adjust. The
default setting is 0000b
Must be set to 1b
Addr: Dh (1101b)
D13
W only (0x07FF)
CAM
Bit 15
POR State: 1000 0000 0b (no adjustment)
D15
D14
ENA
For best performance, it is recommended
that the value in this field be limited to the
range of 0110 0000 0b to 1110 0000 0b. i.e.,
limit the amount of adjustment to ± 15%. The
remaining ± 5% headroom allows for the
ADC’s own full scale variation. A gain
adjustment
does
not
require
ADC
re-calibration.
Bits 6:0
Must be set to 1b
nTP: Test Pattern Output Enable. When this
bit is set 0b, the ADC is disengaged and a
test pattern generator is connected to the
outputs including OR. This test pattern will
work with the device in the SDR, DDR and
the 1:2 output modes.
POR State: 1b
Fine Adjust Magnitude. Each LSB results in
approximately 110ps of non-linear clock
adjust. The default setting is 000000000b
Bit 10:0
24
Must be set to 1b
the Timing Diagrams. The DCLK_RST pulse must be of a
minimum width and its deassertion edge must observe setup
and hold times with respect to the CLK input rising edge.
These times are specified in the AC Electrical Characteristics Table.
The DCLK_RST signal can be asserted asynchronous to the
input clock. If DCLK_RST is asserted, the DCLK output is
held in a designated state. The state in which DCLK is held
during the reset period is determined by the mode of operation (SDR/DDR) and the setting of the Output Edge configuration pin or bit. (Refer to Figure 6, Figure 7 and Figure 8 for
the DCLK reset state conditions). Therefore, depending
upon when the DCLK_RST signal is asserted, there may be
a narrow pulse on the DCLK line during this reset event.
When the DCLK_RST signal is de-asserted in synchronization with the CLK rising edge, the next CLK falling edge
synchronizes the DCLK output with those of other
ADC083000s in the system. The DCLK output is enabled
again after a constant delay (relative to the input clock
frequency) which is equal to the CLK input to DCLK output
delay (tSD). The device always exhibits this delay characteristic in normal operation.
(Continued)
1.4.1 Note Regarding Extended Mode Offset Correction
When using the Offset Adjust register, the following information should be noted.
For offset values of +0000 0000 and -0000 0000, the actual
offset is not the same. By changing only the sign bit in this
case, an offset step in the digital output code of about 1/10th
of an LSB is experienced. This is shown more clearly in the
Figure below.
If the device is not programmed to allow DCLK to run continuously, DCLK will become inactive during a calibration
cycle. Therefore, it is strongly recommended that DCLK only
be used as a data capture clock and not as a system clock.
The DCLK-RST pin should NOT be brought high while the
calibration process is running (while CalRun is high). Doing
so could cause a digital glitch in the digital circuitry, resulting
in corruption and invalidation of the calibration.
20193230
FIGURE 10. Extended Mode Offset Behaviour
1.5 MULTIPLE ADC SYNCHRONIZATION
The ADC083000 has the capability to precisely reset its
sampling clock input to DCLK output relationship as determined by the user-supplied DCLK_RST pulse. This allows
multiple ADCs in a system to have their DCLK (and data)
outputs transition at the same time with respect to the shared
CLK input that they all use for sampling.
The DCLK_RST signal must observe some timing requirements that are shown in Figure 6, Figure 7 and Figure 8 of
1.6 ADC TEST PATTERN
To aid in system debug, the ADC083000 has the capability of
providing a test pattern at the four output ports completely
independent of the input signal. The ADC is disengaged and
a test pattern generator is connected to the outputs including
OR. Each port is given a unique 8-bit word, alternating
between 1’s and 0’s as described in theTable 5.
TABLE 5. Test Pattern by Output Port in 1:4 Demultiplex Mode
Time
Da
Db
Dc
Dd
T0
01h
02h
03h
04h
T1
FEh
FDh
FCh
FBh
T2
01h
02h
03h
04h
T3
FEh
FDh
FCh
FBh
T4
01h
02h
03h
04h
T5
01h
02h
03h
04h
T6
FEh
FDh
FCh
FBh
T7
01h
02h
03h
04h
T8
FEh
FDh
FCh
FBh
T9
01h
02h
03h
04h
T10
01h
02h
03h
04h
T11
...
...
...
...
Comments
Pattern Sequence n
Pattern Sequence n+1
Pattern Sequence n+2
With the part programmed into the 1:2 demutliplex mode, the
test pattern’s order will be as described in Table 6
25
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ADC083000
1.0 Functional Description
ADC083000
1.0 Functional Description
(Continued)
TABLE 6. Test Pattern by Output Port in 1:2 Demultiplex Mode
Time
Dc
Dd
T0a
01h
02h
Comments
T0b
03h
04h
T1a
FEh
FDh
T1b
FCh
FBh
T2a
01h
02h
T2b
03h
04h
T3a
FEh
FDh
T3b
FCh
FBh
T4a
01h
02h
T4b
03h
04h
T5a
01h
02h
T5b
03h
04h
T6a
FEh
FDh
T6b
FCh
FBh
T7a
01h
02h
Pattern Sequence
n
Pattern Sequence
n+1
Note: The same bit pattern repeats when the test pattern sequence is concatenated.
Serial Interface. For best performance, it is recommended
that the full-scale range be kept between 595 mVP-P and 805
mVP-P in the Extended Control mode.
Table 7 gives the input to output relationship with the FSR
pin high and the normal (non-extended) mode is used. With
the FSR pin grounded, the millivolt values in Table 7 are
reduced to 75% of the values indicated. In the Enhanced
Control Mode, these values will be determined by the full
scale range and offset settings in the Control Registers.
The test pattern is selected by setting bit 15 (TPO) in the
Extended Configuration Register. The start of the test pattern’s appearance at the digital output will not be all at once,
but will stabilize to the following fixed-pattern within several
DCLK cycles.
2.0 Applications Information
2.1 THE REFERENCE VOLTAGE
The voltage reference for the ADC083000 is derived from a
1.254V bandgap reference, a buffered version of which is
made available at pin 31, VBG for user convenience and has
an output current capability of ± 100 µA. This reference
voltage should be buffered if more current is required.
TABLE 7. DIFFERENTIAL INPUT TO OUTPUT
RELATIONSHIP (Non-Extended Control Mode, FSR
High)
The internal bandgap-derived reference voltage has a nominal value of 650 mV or 870 mV, as determined by the FSR
pin and described in Section 1.1.4.
There is no provision for the use of an external reference
voltage, but the full-scale input voltage can be adjusted
through a Configuration Register in the Extended Control
mode, as explained in Section 1.2.
Differential input signals up to the chosen full-scale level will
be digitized to 8 bits. Signal excursions beyond the full-scale
range will be clipped at the output. These large signal excursions will also activate the OR output for the time that the
signal is out of range. See Section 2.2.2.
One extra feature of the VBG pin is that it can be used to
raise the common mode voltage level of the LVDS outputs.
The output offset voltage (VOS) is typically 800mV when the
VBG pin is used as an output or left unconnected. To raise
the LVDS offset voltage to a typical value of 1200mV the VBG
pin can be connected directly to the supply rails.
VIN−
Output Code
VCM + 217.5mV
0000 0000
VCM − 109 mV
VCM + 109 mV
0100 0000
VCM
VCM
0111 1111 /
1000 0000
VCM + 109 mV
VCM −109 mV
1100 0000
VCM + 217.5mV
VCM − 217.5mV
1111 1111
The buffered analog inputs simplify the task of driving these
inputs and the RC pole that is generally used at sampling
ADC inputs is not required. If it is desired to use an amplifier
circuit before the ADC, use care in choosing an amplifier with
adequate noise and distortion performance and adequate
gain at the frequencies used for the application.
Note that a precise d.c. common mode voltage must be
present at the ADC inputs. This common mode voltage,
VCMO, is provided on-chip when a.c. input coupling is used
and the input signal is a.c. coupled to the ADC.
When the inputs are a.c. coupled, the VCMO output must be
grounded, as shown in Figure 11. This causes the on-chip
VCMO voltage to be connected to the inputs through on-chip
50k-Ohm resistors.
IMPORTANT NOTE: An Analog input channel that is not
used should be left floating when the input is a.c. coupled.
Do not connect an unused analog input to ground.
2.2 THE ANALOG INPUT
The analog input is a differential one to which the signal
source may be a.c. coupled or d.c. coupled. The full-scale
input range is selected with the FSR pin to be 650 mVP-P or
870 mVP-P, or can be adjusted to values between 560 mVP-P
and 840 mVP-P in the Extended Control mode through the
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VIN+
VCM − 217.5mV
26
Be sure that the current drawn from the VCMO output does
not exceed 100 µA.
The Input impedance in the d.c. coupled mode (VCMO pin not
grounded) consists of a precision 100Ω resistor between
VIN+ and VIN− and a capacitance from each of these inputs
to ground. In the a.c. coupled mode the input appears the
same except there is also a resistor of 50K between each
analog input pin and the VCMO potential.
(Continued)
Driving the inputs beyond full scale will result in a saturation
or clipping of the reconstructed output.
2.2.1 Handling Single-Ended Input Signals
There is no provision for the ADC083000 to adequately
process single-ended input signals. The best way to handle
single-ended signals is to convert them to differential signals
before presenting them to the ADC. The easiest way to
accomplish single-ended to differential signal conversion is
with an appropriate balun-connected transformer, as shown
in Figure 13.
20193244
FIGURE 11. Differential Input Drive
When the d.c. coupled mode is used, a common mode
voltage must be provided at the differential inputs. This
common mode voltage should track the VCMO output pin.
Note that the VCMO output potential will change with temperature. The common mode output of the driving device
should track this change.
IMPORTANT NOTE: An analog input channel that is not
used should be tied to the VCMO voltage when the input is d.c
coupled. Do not connect unused analog inputs to ground.
Full-scale distortion performance falls off rapidly as the
input common mode voltage deviates from VCMO. This is
a direct result of using a very low supply voltage to
minimize power. Keep the input common voltage within
50 mV of VCMO.
Performance is as good in the d.c. coupled mode as it is
in the a.c. coupled mode, provided the input common
mode voltage at both analog inputs remain within 50 mV
of VCMO.
If d.c. coupling is used, it is best to servo the input common
mode voltage, using the VCMO pin, to maintain optimum
performance. An example of this type of circuit is shown in
Figure 12.
20193243
FIGURE 13. Single-Ended to Differential signal
conversion with a balun-connected transformer
The 100 Ohm external resistor placed accross the output
terminals of the balun in parallel with the ADC083000’s
on-chip 100 Ohm resistor makes a 50 Ohms differential
impedance at the balun output. Or, 25 Ohms to virtual
ground at each of the balun output terminals.
Looking into the balun, the source sees the impedance of the
first coil in series with the impedance at the output of that
coil. Since the transformer has a 1:1 turns ratio, the impedance across the first coil is exactly the same as that at the
output of the second coil, namely 25 Ohms to virtual ground.
So, the 25 Ohms across the first coil in series with the 25
Ohms at its output gives 50 Ohms total impedance to match
the source.
2.2.2 Out Of Range (OR) Indication
When the conversion result is clipped the Out of Range
output is activated such that OR+ goes high and OR- goes
low. This output is active as long as accurate data on either
or both of the buses would be outside the range of 00h to
FFh.
20193255
2.2.3 Full-Scale Input Range
As with all A/D Converters, the input range is determined by
the value of the ADC’s reference voltage. The reference
voltage of the ADC083000 is derived from an internal bandgap reference. The FSR pin controls the effective reference
voltage of the ADC083000 such that the differential full-scale
input range at the analog inputs is 870 mVP-P with the FSR
pin high, or is 650 mVP-P with FSR pin low. Best SNR is
obtained with FSR high, but better distortion and SFDR are
obtained with the FSR pin low.
FIGURE 12. Example of Servoing the Analog Input with
VCMO
One such circuit should be used in front of the VIN+ input and
another in front of the VIN− input. In that figure, RD1, RD2 and
RD3 are used to divide the VCMO potential so that, after being
gained up by the amplifier, the input common mode voltage
is equal to VCMO from the ADC. RD1 and RD2 are split to
allow the bypass capacitor to isolate the input signal from
VCMO. RIN, RD2 and RD3 will divide the input signal, if necessary. Capacitor "C" in Figure 12 should be chosen to keep
any component of the input signal from affecting VCMO.
27
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ADC083000
2.0 Applications Information
ADC083000
2.0 Applications Information
where tJ(MAX) is the rms total of all jitter sources in seconds,
VIN(P-P) is the peak-to-peak analog input signal, VINFSR is the
full-scale range of the ADC, "N" is the ADC resolution in bits
and fIN is the maximum input frequency, in Hertz, to the ADC
analog input.
(Continued)
2.3 THE CLOCK INPUTS
The ADC083000 has differential LVDS clock inputs, CLK+
and CLK-, which must be driven with an a.c. coupled, differential clock signal. Although the ADC083000 is tested and its
performance is guaranteed with a differential 1.5 GHz clock,
it typically will function well with input clock frequencies
indicated in the Electrical Characteristics Table. The clock
inputs are internally terminated and biased. The input clock
signal must be capacitively coupled to the clock pins as
indicated in Figure 14.
Note that the maximum jitter described above is the arithmetic sum of the jitter from all sources, including that in the
ADC input clock, that added by the system to the ADC input
clock and input signals and that added by the ADC itself.
Since the effective jitter added by the ADC is beyond user
control, the best the user can do is to keep the sum of the
externally added input clock jitter and the jitter added by the
analog circuitry to the analog signal to a minimum.
Input clock amplitudes above those specified in the Electrical
Characteristics Table may result in increased input offset
voltage. This would cause the converter to produce an output code other than the expected 127/128 when both input
pins are at the same potential.
Operation up to the sample rates indicated in the Electrical
Characteristics Table is typically possible if the maximum
ambient temperatures indicated are not exceeded. Operating at higher sample rates than indicated for the given ambient temperature may result in reduced device reliability
and product lifetime. This is because of the higher power
consumption and die temperatures at high sample rates.
Important also for reliability is proper thermal management .
See Section 2.6.2.
2.4 CONTROL PINS
Six control pins (without the use of the serial interface)
provide a wide range of possibilities in the operation of the
ADC083000 and facilitate its use. These control pins provide
Full-Scale Input Range setting, Self Calibration, Calibration
Delay, Output Edge Synchronization choice, LVDS Output
Level choice and a Power Down feature.
2.4.1 Full-Scale Input Range Setting
The input full-scale range can be selected to be either 650
mVP-P or 870 mVP-P, as selected with the FSR control input
(pin 14) in the Normal Mode of operation. In the Extended
Control Mode, the input full-scale range may be set to be
anywhere from 560 mVP-P to 840 mVP-P. See Section 2.2 for
more information.
20193247
2.4.2 Self Calibration
The ADC083000 self-calibration must be run to achieve
specified performance. The calibration procedure is run
upon power-up and can be run any time on command. The
calibration procedure is exactly the same whether there is an
input clock present upon power up or if the clock begins
some time after application of power. The CalRun output
indicator is high while a calibration is in progress.
FIGURE 14. Differential (LVDS) Input Clock Connection
The differential input clock line pair should have a characteristic impedance of 100Ω and (when using a balun), be
terminated at the clock source in that (100Ω) characteristic
impedance. The input clock line should be as short and as
direct as possible. The ADC083000 clock input is internally
terminated with an untrimmed 100Ω resistor.
Insufficient input clock levels will result in poor dynamic
performance. Excessively high input clock levels could
cause a change in the analog input offset voltage. To avoid
these problems, keep the input clock level within the range
specified in the Electrical Characteristics Table.
The low and high times of the input clock signal can affect
the performance of any A/D Converter. The ADC083000
features a duty cycle clock correction circuit which can maintain performance over temperature. The ADC will meet its
performance specification if the input clock high and low
times are maintained within the range (20/80% ratio) as
specified in the Electrical Characteristics Table.
High speed, high performance ADCs such as the
ADC083000 require a very stable input clock signal with
minimum phase noise or jitter. ADC jitter requirements are
defined by the ADC resolution (number of bits), maximum
ADC input frequency and the input signal amplitude relative
to the ADC input full scale range. The maximum jitter (the
sum of the jitter from all sources) allowed to prevent a
jitter-induced reduction in SNR is found to be
tJ(MAX) = (VIN(P-P)/VINFSR) x (1/(2(N+1) x π x fIN))
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2.4.2.1 Power-On Calibration
Power-on calibration begins after a time delay following the
application of power. This time delay is determined by the
setting of CalDly, as described in the Calibration Delay Section, below.
The calibration process will be not be performed if the CAL
pin is high at power up. In this case, the calibration cycle will
not begin until the on-command calibration conditions are
met. The ADC083000 will function with the CAL pin held high
at power up, but no calibration will be done and performance
will be impaired. A manual calibration, however, may be
performed after powering up with the CAL pin high. See
On-Command Calibration Section 2.4.2.2.
The internal power-on calibration circuitry comes up in an
unknown logic state. If the input clock is not running at power
up and the power on calibration circuitry is active, it will hold
the analog circuitry in power down and the power consumption will typically be less than 200 mW. The power consumption will be normal after the clock starts.
28
When OutEdge (pin 4) is high, the output data is synchronized with (changes with) the rising edge of the DCLK+ (pin
82). When OutEdge is low, the output data is synchronized
with the falling edge of DCLK+.
At the very high speeds of which the ADC083000 is capable,
slight differences in the lengths of the DCLK and data lines
can mean the difference between successful and erroneous
data capture. The OutEdge pin is used to capture data on
the DCLK edge that best suits the application circuit and
layout.
(Continued)
2.4.2.2 On-Command Calibration
To initiate an on-command calibration, bring the CAL pin high
for a minimum of 80 input clock cycles after it has been low
for a minimum of 80 input clock cycles. Holding the CAL pin
high upon power up will prevent execution of power-on
calibration until the CAL pin is low for a minimum of 80 input
clock cycles, then brought high for a minimum of another 80
input clock cycles. The calibration cycle will begin 80 input
clock cycles after the CAL pin is thus brought high. The
CalRun signal should be monitored to determine when the
calibration cycle has completed.
The minimum 80 input clock cycle sequences are required to
ensure that random noise does not cause a calibration to
begin when it is not desired. As mentioned in section 1.1 for
best performance, a self calibration should be performed 20
seconds or more after power up and repeated when the
operating temperature changes significantly relative to the
specific system design performance requirements. ENOB
changes slightly with increasing junction temperature and
can be easily corrected by performing an on-command calibration.
2.4.4 LVDS Output Level Control
The output level can be set to one of two levels with OutV
(pin3). The strength of the output drivers is greater with OutV
high. With OutV low there is less power consumption in the
output drivers, but the lower output level means decreased
noise immunity.
For short LVDS lines and low noise systems, satisfactory
performance may be realized with the OutV input low. If the
LVDS lines are long and/or the system in which the
ADC083000 is used is noisy, it may be necessary to tie the
OutV pin high.
2.4.5 Power Down Feature
The Power Down pin (PD) allows the ADC083000 to be
entirely powered down. See Section 1.1.7 for details on the
power down feature.
The digital data (+/-) output pins are put into a high impedance state when the PD pin for the respective channel is
high. Upon return to normal operation, the pipeline will contain meaningless information and must be flushed.
If the PD input is brought high while a calibration is running,
the device will not go into power down until the calibration
sequence is complete. However, if power is applied and PD
is already high, the device will not begin the calibration
sequence until the PD input goes low. If a manual calibration
is requested while the device is powered down, the calibration will not begin at all. That is, the manual calibration input
is completely ignored in the power down state.
During a Power-On calibration cycle, both the ADC and the
input termination resistor are calibrated. As ENOB changes
slightly with junction temperature, an On-Command calibration can be executed to bring the performance of the ADC
inline. By default, this calibration includes calibrating the
input termination resistance and the ADC. However, since
the input termination resistance changes marginally with
temperature, the user has the option to disable the input
termination resistor trim, which will guarantee that the DCLK
is continuously present at the output. The Resistor Trim
Disable can be programmed in register 1h when in the
Extended Control mode. Refer to section 1.4 for register
programming information.
2.4.2.3 Calibration Delay
The CalDly input (pin 127) is used to select one of two delay
times after the application of power to the start of calibration,
as described in Section 1.1.1. The calibration delay values
allow the power supply to come up and stabilize before
calibration takes place. With no delay or insufficient delay,
calibration would begin before the power supply is stabilized
at its operating value and result in non-optimal calibration
coefficients. If the PD pin is high upon power-up, the calibration delay counter will be disabled until the PD pin is brought
low. Therefore, holding the PD pin high during power up will
further delay the start of the power-up calibration cycle. The
best setting of the CalDly pin depends upon the power-on
settling time of the power supply.
Note that the calibration delay selection is not possible in the
Extended Control mode and the short delay time is used.
2.5 THE DIGITAL OUTPUTS
The ADC083000 demultiplexes the output data of each of
the two ADCs on the die onto two LVDS output buses (total
of four buses, two for each ADC). For each of the two
converters, the results of successive conversions started on
the odd falling edges of the CLK+ pin are available on one of
the two LVDS buses, while the results of conversions started
on the even falling edges of the CLK+ pin are available on
the other LVDS bus. This means that, the word rate at each
LVDS bus is 1/2 the ADC083000 input clock rate and the two
buses must be multiplexed to obtain the entire 3 GSPS
conversion result.
Since the minimum recommended input clock rate for this
device is 200 MSPS, the effective rate can be reduced to as
low as 100 MSPS by using the results available on just one
of the the two LVDS buses and a 200 MHz input clock,
decimating the 200 MSPS data by two.
There is one LVDS output clock pair (DCLK+/-) available for
use to latch the LVDS outputs on all buses. Whether the data
is sent at the rising or falling edge of DCLK is determined by
the sense of the OutEdge pin, as described in Section 2.4.3.
DDR (Double Data Rate) clocking can also be used. In this
mode a word of data is presented with each edge of DCLK,
reducing the DCLK frequency to 1/4 the input clock frequency. See the Timing Diagram section for details.
2.4.3 Output Edge Synchronization
DCLK signals are available to help latch the converter output
data into external circuitry. The output data can be synchronized with either edge of these DCLK signals. That is, the
output data transition can be set to occur with either the
rising edge or the falling edge of the DCLK signal, so that
either edge of that DCLK signal can be used to latch the
output data into the receiving circuit.
29
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ADC083000
2.0 Applications Information
ADC083000
2.0 Applications Information
(Continued)
The OutV pin is used to set the LVDS differential output
levels. See Section 2.4.4.
The output format is Offset Binary. Accordingly, a full-scale
input level with VIN+ positive with respect to VIN− will produce an output code of all ones, a full-scale input level with
VIN− positive with respect to VIN+ will produce an output
code of all zeros and when VIN+ and VIN− are equal, the
output code will vary between codes 127 and 128.
20193254
FIGURE 15. Non-Spiking Power Supply
2.6 POWER CONSIDERATIONS
A/D converters draw sufficient transient current to corrupt
their own power supplies if not adequately bypassed. A 33
µF capacitor should be placed within an inch (2.5 cm) of the
A/D converter power pins. A 0.1 µF capacitor should be
placed as close as possible to each VA pin, preferably within
one-half centimeter. Leadless chip capacitors are preferred
because they have low lead inductance.
The VA and VDR supply pins should be isolated from each
other to prevent any digital noise from being coupled into the
analog portions of the ADC. A ferrite choke, such as the JW
Miller FB20009-3B, is recommended between these supply
lines when a common source is used for them.
As is the case with all high speed converters, the
ADC083000 should be assumed to have little power supply
noise rejection. Any power supply used for digital circuitry in
a system where a lot of digital power is being consumed
should not be used to supply power to the ADC083000. The
ADC supplies should be the same supply used for other
analog circuitry, if not a dedicated supply.
The output drivers should have a supply voltage, VDR, that is
within the range specified in the Operating Ratings table.
This voltage should not exceed the VA supply voltage.
If the power is applied to the device without an input clock
signal present, the current drawn by the device might be
below 200 mA. This is because the ADC083000 gets reset
through clocked logic and its initial state is unknown. If the
reset logic comes up in the "on" state, it will cause most of
the analog circuitry to be powered down, resulting in less
than 100 mA of current draw. This current is greater than the
power down current because not all of the ADC is powered
down. The device current will be normal after the input clock
is established.
2.6.2 Thermal Management
The ADC083000 is capable of impressive speeds and performance at very low power levels for its speed. However,
the power consumption is still high enough to require attention to thermal management. For reliability reasons, the die
temperature should be kept to a maximum of 130˚C. That is,
TA (ambient temperature) plus ADC power consumption
times θJA (junction to ambient thermal resistance) should not
exceed 130˚C. This is not a problem if the ambient temperature is kept to a maximum of +85˚C as specified in the
Operating Ratings section.
2.6.1 Supply Voltage
The ADC083000 is specified to operate with a supply voltage
of 1.9V ± 0.1V. It is very important to note that, while this
device will function with slightly higher supply voltages,
these higher supply voltages may reduce product lifetime.
No pin should ever have a voltage on it that is in excess of
the supply voltage or below ground by more than 150 mV,
not even on a transient basis. This can be a problem upon
application of power and power shut-down. Be sure that the
supplies to circuits driving any of the input pins, analog or
digital, do not come up any faster than does the voltage at
the ADC083000 power pins.
The Absolute Maximum Ratings should be strictly observed,
even during power up and power down. A power supply that
produces a voltage spike at turn-on and/or turn-off of power
can destroy the ADC083000. The circuit of Figure 15 will
provide supply overshoot protection.
Many linear regulators will produce output spiking at
power-on unless there is a minimum load provided. Active
devices draw very little current until their supply voltages
reach a few hundred millivolts. The result can be a turn-on
spike that can destroy the ADC083000, unless a minimum
load is provided for the supply. The 100Ω resistor at the
regulator output provides a minimum output current during
power-up to ensure there is no turn-on spiking.
In the circuit of Figure 15, an LM317 linear regulator is
satisfactory if its input supply voltage is 4V to 5V . If a 3.3V
supply is used, an LM1086 linear regulator is recommended.
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Please note that the following are general recommendations
for mounting exposed pad devices onto a PCB. This should
be considered the starting point in PCB and assembly process development. It is recommended that the process be
developed based upon past experience in package mounting.
The package of the ADC083000 has an exposed pad on its
back that provides the primary heat removal path as well as
excellent electrical grounding to the printed circuit board.
The land pattern design for lead attachment to the PCB
should be the same as for a conventional LQFP, but the
exposed pad must be attached to the board to remove the
maximum amount of heat from the package, as well as to
ensure best product parametric performance.
To maximize the removal of heat from the package, a thermal land pattern must be incorporated on the PC board
within the footprint of the package. The exposed pad of the
device must be soldered down to ensure adequate heat
conduction out of the package. The land pattern for this
exposed pad should be at least as large as the 5 x 5 mm of
the exposed pad of the package and be located such that the
exposed pad of the device is entirely over that thermal land
pattern. This thermal land pattern should be electrically connected to ground. A clearance of at least 0.5 mm should
separate this land pattern from the mounting pads for the
package pins.
30
ground plane copper weight will have little effect upon the
logic-generated noise. Total surface area is more important
than is total ground plane volume. Coupling between the
typically noisy digital circuitry and the sensitive analog circuitry can lead to poor performance that may seem impossible to isolate and remedy. The solution is to keep the
analog circuitry well separated from the digital circuitry.
High power digital components should not be located on or
near any linear component or power supply trace or plane
that services analog or mixed signal components as the
resulting common return current path could cause fluctuation
in the analog input “ground” return of the ADC, causing
excessive noise in the conversion result.
Generally, we assume that analog and digital lines should
cross each other at 90˚ to avoid getting digital noise into the
analog path. In high frequency systems, however, avoid
crossing analog and digital lines altogether. The input clock
lines should be isolated from ALL other lines, analog AND
digital. The generally accepted 90˚ crossing should be
avoided as even a little coupling can cause problems at high
frequencies. Best performance at high frequencies is obtained with a straight signal path.
(Continued)
20193221
FIGURE 16. Recommended Package Land Pattern
Since a large aperture opening may result in poor release,
the aperture opening should be subdivided into an array of
smaller openings, similar to the land pattern of Figure 16.
To minimize junction temperature, it is recommended that a
simple heat sink be built into the PCB. This is done by
including a copper area of about 2 square inches (6.5 square
cm) on the opposite side of the PCB. This copper area may
be plated or solder coated to prevent corrosion, but should
not have a conformal coating, which could provide some
thermal insulation. Thermal vias should be used to connect
these top and bottom copper areas. These thermal vias act
as "heat pipes" to carry the thermal energy from the device
side of the board to the opposite side of the board where it
can be more effectively dissipated. The use of 9 to 16
thermal vias is recommended.
The thermal vias should be placed on a 1.2 mm grid spacing
and have a diameter of 0.30 to 0.33 mm. These vias should
be barrel plated to avoid solder wicking into the vias during
the soldering process as this wicking could cause voids in
the solder between the package exposed pad and the thermal land on the PCB. Such voids could increase the thermal
resistance between the device and the thermal land on the
board, which would cause the device to run hotter.
If it is desired to monitor die temperature, a temperature
sensor may be mounted on the heat sink area of the board
near the thermal vias. .Allow for a thermal gradient between
the temperature sensor and the ADC083000 die of θJ-PAD
times typical power consumption = 2.8 x 1.9 = 5.3˚C. Allowing for 6.3˚C, including some margin for temperature drop
from the pad to the temperature sensor, then, would mean
that maintaining a maximum pad temperature reading of
123.7˚C will ensure that the die temperature does not exceed 130˚C, assuming that the exposed pad of the
ADC083000 is properly soldered down and the thermal vias
are adequate. (The inaccuracy of the temperature sensor is
addtional to the above calculation).
The analog input should be isolated from noisy signal traces
to avoid coupling of spurious signals into the input. This is
especially important with the low level drive required of the
ADC083000. Any external component (e.g., a filter capacitor) connected between the converter’s input and ground
should be connected to a very clean point in the analog
ground plane. All analog circuitry (input amplifiers, filters,
etc.) should be separated from any digital components.
2.8 DYNAMIC PERFORMANCE
The ADC083000 is a.c. tested and its dynamic performance
is guaranteed. To meet the published specifications and
avoid jitter-induced noise, the clock source driving the CLK
input must exhibit low rms jitter. The allowable jitter is a
function of the input frequency and the input signal level, as
described in Section 2.3.
It is good practice to keep the ADC input clock line as short
as possible, to keep it well away from any other signals and
to treat it as a transmission line. Other signals can introduce
jitter into the input clock signal. The clock signal can also
introduce noise into the analog path if not isolated from that
path.
Best dynamic performance is obtained when the exposed
pad at the back of the package has a good connection to
ground. This is because this path from the die to ground is a
lower impedance than offered by the package pins.
2.9 USING THE SERIAL INTERFACE
The ADC083000 may be operated in the non-extended control (non-Serial Interface) mode or in the extended control
mode. Table 8 and Table 9 describe the functions of pins 3,
4, 14 and 127 in the non-extended control mode and the
extended control mode, respectively.
2.9.1 Non-Extended Control Mode Operation
Non-extended control mode operation means that the Serial
Interface is not active and all controllable functions are controlled with various pin settings. That is, the full-scale range,
single-ended or differential input and input coupling (a.c. or
d.c.) are all controlled with pin settings. The non-extended
control mode is used by setting pin 14 high or low, as
opposed to letting it float. Table 8 indicates the pin functions
of the ADC083000 in the non-extended control mode.
2.7 LAYOUT AND GROUNDING
Proper grounding and proper routing of all signals are essential to ensure accurate conversion. A single ground plane
should be used, instead of splitting the ground plane into
analog and digital areas.
Since digital switching transients are composed largely of
high frequency components, the skin effect tells us that total
31
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ADC083000
2.0 Applications Information
ADC083000
2.0 Applications Information
volt below ground. Controlling the impedance of high speed
lines and terminating these lines in their characteristic impedance should control overshoot.
(Continued)
Care should be taken not to overdrive the inputs of the
ADC083000. Such practice may lead to conversion inaccuracies and even to device damage.
Incorrect analog input common mode voltage in the d.c.
coupled mode. As discussed in section 1.1.4 and 2.2, the
Input common mode voltage must remain within 50 mV of
the VCMO output , which has a variability with temperature
that must also be tracked. Distortion performance will be
degraded if the input common mode voltage is more than 50
mV from VCMO .
TABLE 8. Non-Extended Control Mode Operation (Pin
14 High or Low)
Pin
Low
High
Floating
3
0.50 VP-P
Output
0.70 VP-P
Output
n/a
4
OutEdge =
Neg
OutEdge =
Pos
DDR
14
650 mVP-P
input range
870 mVP-P
input range
Extended
Control
Mode
Using an inadequate amplifier to drive the analog input.
Use care when choosing a high frequency amplifier to drive
the ADC083000 as many high speed amplifiers will have
higher distortion than will the ADC083000, resulting in overall system performance degradation.
Driving the VBG pin to change the reference voltage. As
mentioned in Section 2.1, the reference voltage is intended
to be fixed to provide one of two different full-scale values
(650 mVP-P and 870 mVP-P). Over driving this pin will not
change the full scale value, but can be used to change the
LVDS common mode voltage from 0.8V to 1.2V by tying the
VBG pin to VA.
Driving the clock input with an excessively high level
signal. The ADC input clock level should not exceed the
level described in the Operating Ratings Table or the input
offset could change.
Inadequate input clock levels. As described in Section 2.3,
insufficient input clock levels can result in poor performance.
Excessive input clock levels could result in the introduction
of an input offset.
Using a clock source with excessive jitter, using an
excessively long input clock signal trace, or having
other signals coupled to the input clock signal trace.
This will cause the sampling interval to vary, causing excessive output noise and a reduction in SNR performance.
Failure to provide adequate heat removal. As described in
Section 2.6.2, it is important to provide adequate heat removal to ensure device reliability. This can either be done
with adequate air flow or the use of a simple heat sink built
into the board. The backside pad should be grounded for
best performance.
Pin 3 can be either high or low in the non-extended control
mode. Pin 14 must not be left floating to select this mode.
See Section 1.2 for more information.
Pin 4 can be high or low or can be left floating in the
non-extended control mode. In the non-extended control
mode, pin 4 high or low defines the edge at which the output
data transitions. See Section 2.4.3 for more information. If
this pin is floating, the output clock (DCLK) is a DDR (Double
Data Rate) clock (see Section 1.1.5.3) and the output edge
synchronization is irrelevant since data is clocked out on
both DCLK edges.
TABLE 9. Extended Control Mode Operation (Pin 14
Floating)
Pin
Function
3
SCLK (Serial Clock)
4
SDATA (Serial Data)
127
SCS (Serial Interface Chip Select)
2.10 COMMON APPLICATION PITFALLS
Driving the inputs (analog or digital) beyond the power
supply rails. For device reliability, no input should go more
than 150 mV below the ground pins or 150 mV above the
supply pins. Exceeding these limits on even a transient basis
may not only cause faulty or erratic operation, but may
impair device reliability. It is not uncommon for high speed
digital circuits to exhibit undershoot that goes more than a
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32
inches (millimeters) unless otherwise noted
NOTES: UNLESS OTHERWISE SPECIFIED
REFERENCE JEDEC REGISTRATION MS-026, VARIATION BFB.
128-Lead Exposed Pad LQFP
NS Package Number VNX128A
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves
the right at any time without notice to change said circuitry and specifications.
For the most current product information visit us at www.national.com.
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properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to result
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device or system whose failure to perform can be reasonably
expected to cause the failure of the life support device or
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ADC083000 High Performance, Low Power, 8-Bit, 3 GSPS A/D Converter
Physical Dimensions