SGM2014 Low Power, Low Dropout, 250mA, RF - Linear Regulators GENERAL DESCRIPTION FEATURES The SGM2014 series low-power, low-noise, low-dropout, CMOS linear voltage regulators operate from a 2.5V to 5.5V input and deliver up to 250mA. They are the perfect choice for low voltage, low power applications. An ultra low ground current（160µA at 250mA output ) makes these part attractive for battery operated power systems. The SGM2014 series also offer ultra low dropout voltage (250mV at 250mA output) to prolong battery life in portable electronics. Systems requiring a quiet voltage source, such as RF applications, will benefit from the SGM2014 series’ ultra low output noise (30µVRMS) and high PSRR. An external noise bypass capacitor connected to the device’s BP pin can further reduce the noise level. - Low Output Noise: 30µVRMS TYP(10Hz to 100kHz) - Ultra-Low Dropout Voltage: 250mV at 250mA Output - Low 85µA No-Load Supply Current - Low 160µA Operating Supply Current - at 250mA Output High PSRR (73dB at 1kHz) Quick Auto-Discharge in Shutdown Status Thermal-Overload Protection Output Current Limit 10nA Logic-Controlled Shutdown Available in Multiple Output Voltage Versions Fixed Outputs of 1.5V, 1.8V, 2.5V, 2.8V, 2.85V, 3.0V, 3.3V The output voltage is preset to voltages in the range of 1.5V to 3.3V. Other features include a 10nA logic-controlled shutdown mode, output current limit and thermal shut- down protection. Devices come in 5-pin SOT23 package. PIN CONFIGURATION（TOP VIEW） APPLICATIONS Cellular Telephones Cordless Telephones PHS Telephones PCMCIA Cards Modems MP3 Player Hand-Held Instruments Palmtop Computers Electronic Planners Portable/Battery-Powered Equipment SG Microelectronics Co, Ltd Tel: 86/10/51798160/80 www.sg-micro.com SGM2014 IN 1 GND 2 EN 3 5 OUT 4 BP SOT23-5 REV. A ORDERING INFORMATION VOUT(V) PINPACKAGE SPECIFIED TEMPERATURE RANGE ORDERING NUMBER PACKAGE MARKING PACKAGE OPTION SGM2014-1.5 1.5V SOT23-5 - 40°C to +85°C SGM2014-1.5YN5/TR YE15 Tape and Reel, 3000 SGM2014-1.8 1.8V SOT23-5 - 40°C to +85°C SGM2014-1.8YN5/TR YE18 Tape and Reel, 3000 SGM2014-2.5 2.5V SOT23-5 - 40°C to +85°C SGM2014-2.5YN5/TR YE25 Tape and Reel, 3000 MODEL SGM2014-2.8 2.8V SOT23-5 - 40°C to +85°C SGM2014-2.8YN5/TR YE28 Tape and Reel, 3000 SGM2014-2.85 2.85V SOT23-5 - 40°C to +85°C SGM2014-2.85YN5/TR YE2J Tape and Reel, 3000 SGM2014-3.0 3.0V SOT23-5 - 40°C to +85°C SGM2014-3.0YN5/TR YE30 Tape and Reel, 3000 SGM2014-3.3 3.3V SOT23-5 - 40°C to +85°C SGM2014-3.3YN5/TR YE33 Tape and Reel, 3000 ABSOLUTE MAXIMUM RATINGS Operating Temperature Range...........................- 40°C to +85°C Junction Temperature...........................................................+150°C Storage Temperature.............................................- 65°C to +150°C Lead Temperature (soldering, 10s).......................................260°C ESD Susceptibility HBM..........................................................................................4000V MM..............................................................................................400V IN to GND.....................................................................- 0.3V to +6V Output Short-Circuit Duration ...........................................Infinite EN to GND...................................................................- 0.3V to +6V OUT, BP to GND............................................- 0.3V to (VIN + 0.3V) Power Dissipation, PD @ TA = 25℃ SOT23-5 .....................................................................................0.4W Package Thermal Resistance SOT23-5, θJA....................................................................... 250℃/W Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. BLOCK DIAGRAM 2 SGM2014 ELECTRICAL CHARACTERISTICS VIN = VOUT (NOMINAL) + 1V, TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = + 25°C PARAMETER Input Voltage SYMBOL CONDITIONS VIN IOUT = 0.1mA, TA = +25°C Output Voltage Accuracy MIN TYP MAX UNITS 2.5 5.5 V -2 2 IOUT = 0.1mA to 250mA 2.6 TA = -40°C to +85°C Maximum Output Current Current Limit Ground Pin Current 250 ILIM IQ Dropout Voltage(Note1) Line Regulation ΔVLNR Load Regulation ΔVLDR Output Voltage Noise Power Supply Rejection Rate en PSRR 260 % mA 450 No load, EN =1.6V 85 mA 135 µA IOUT = 250mA, EN = 1.6V 160 IOUT = 1mA 1.2 IOUT = 250mA 250 400 0.015 0.15 %/V 0.001 0.003 %/mA VIN = 2.5V or (VOUT + 0.5V) to 5.5V IOUT = 1mA IOUT = 0.1mA to 250mA, COUT = 1µF f = 10Hz to 100kHz, CBP = 0.01µF, COUT = 10µF CBP = 0.1µF, ILOAD = 50mA, f = 100Hz f = 1kHz COUT = 1µF mV 30 µVRMS 76 dB 73 dB SHUTDOWN EN Input Threshold VIH VIL 1.6 VIN = 2.5V to 5.5V 0.4 TA = +25°C 0.01 TA = +125°C 0.01 TA = +25°C 0.01 TA = +125°C 0.01 TA = +25°C 30 µs TSHDN 160 ℃ ΔTSHDN 10 ℃ EN Input Bias Current IB(SHDN) EN = 0V and EN = 5.5V Shutdown Supply Current IQ(SHDN) EN = 0.4V CBP = 0.01µF Shutdown Exit Delay(Note2) COUT = 1µF, No load 1 V 1 µA µA THERMAL PROTECTION Thermal Shutdown Temperature Thermal Shutdown Hysteresis Specifications subject to change without notice. Note 1: The dropout voltage is defined as VIN - VOUT, when VOUT is 100mV below the value of VOUT for VIN = VOUT + 1V. (Only applicable for VOUT = +2.5V to +3.3V) Note 2: Time needed for VOUT to reach 95% of final value. 3 SGM2014 TYPICAL OPERATION CIRCUIT INPUT 2.5V TO 5.5V OUTPUT OUT IN C IN 1μF ON OFF C OUT 1μF SGM 2014 BP EN GND C BP 0.01μF PIN DESCRIPTION PIN NAME FUNCTION 1 IN 2 GND 3 EN Shutdown Input. A logic low reduces the supply current to 10nA. Connect to IN for normal operation. 4 BP Reference-Noise Bypass. Bypass with a low-leakage 0.01µF ceramic capacitor for reduced noise at the output. 5 OUT Regulator Input. Supply voltage can range from 2.5V to 5.5V. Bypass with a 1µF capacitor to GND. Ground. Regulator Output. 4 SGM2014 TYPICAL OPERATING CHARACTERISTICS VIN = VOUT(NOMINAL) + 1V or +2.5V (whichever is greater), CIN = 1µF, COUT = 1µF, CBP = 0.01µF, TA = +25℃, unless otherwise noted. Output Voltage vs.Load Current Output Voltage vs.Load Current 3.5 2.7 VOUT = 3.3V 2.6 Output Voltage(V) Output Voltage(V) VOUT = 2.5V 2.5 2.4 3.4 3.3 3.2 3.1 2.3 0 50 100 150 Load Current(mA) 200 0 250 200 250 Ground Pin Current vs.Input Voltage VOUT = 3.3V VOUT = 3.3V VOUT = 2.5V No Load 160 120 80 40 0 0 50 100 150 Load Current(mA) 200 250 0 1 2 3 4 Input Voltage(V) 5 6 Output Voltage vs.Input Voltage Ground Pin Current vs.Input Voltage 6 200 VOUT = 2.5V No Load 5 No Load 160 Output Voltage(V) Ground Pin Current(µA) 100 150 Load Current(mA) 200 Ground Pin Current(µA) Ground Pin Current(µA) Ground Pin Current vs.Load Current 200 190 180 170 160 150 140 130 120 110 100 90 80 70 50 120 80 40 VOUT = 3.3V 4 3 2 VOUT = 2.5V 1 0 0 0 1 2 3 4 Input Voltage(V) 5 0 6 5 1 2 3 4 Input Voltage(V) 5 6 SGM2014 TYPICAL OPERATING CHARACTERISTICS VIN = VOUT(NOMINAL) + 1V or +2.5V (whichever is greater), CIN = 1µF, COUT = 1µF, CBP = 0.01µF, TA = +25℃, unless otherwise noted. Output Voltage vs.Temperature Output Voltage vs.Temperature 2.7 3.5 ILOAD = 150mA 3.4 Output Voltage(V) 2.6 2.5 2.4 3.3 3.2 VOUT = 2.5V VOUT = 3.3V 2.3 3.1 -40 -15 10 35 Temperature(℃) 60 85 -40 -15 330 240 300 220 270 200 180 VOUT = 3.3V 160 140 120 VOUT = 2.5V 100 240 60 85 TA = +85℃ 210 TA = +25℃ 180 150 TA = -40℃ 120 90 60 ILOAD = 150mA 80 10 35 Temperature(℃) Dropout Voltage vs.Load Current 260 Dropout Voltage(mV) Ground Pin Current(μA) Ground Pin Current vs.Temperature VOUT = 2.5V 30 60 0 -40 -20 0 20 40 60 80 Temperature(℃) 100 120 140 0 Dropout Voltage vs.Load Current 1000 240 900 210 TA = +85℃ 180 TA = +25℃ 150 120 TA = -40℃ 90 60 50 75 100 125 150 175 200 225 250 Load Current(mA) 800 700 VOUT = 3.3V 600 500 400 VOUT = 2.5V 300 VOUT = 3.3V 30 25 Current limit vs.Temperature 270 Current limit(mA) Dropout Voltage(mV) Output Voltage(V) ILOAD = 150mA 200 0 100 0 25 50 75 100 125 150 175 200 225 250 Load Current(mA) -40 6 -15 10 35 Temperature(℃) 60 85 SGM2014 TYPICAL OPERATING CHARACTERISTICS VIN = VOUT(NOMINAL) + 1V or +2.5V (whichever is greater), CIN = 1µF, COUT = 1µF, CBP = 0.01µF, TA = +25℃, unless otherwise noted. 7 SGM2014 TYPICAL OPERATING CHARACTERISTICS VIN = VOUT(NOMINAL) + 1V or +2.5V (whichever is greater), CIN = 1µF, COUT = 1µF, CBP = 0.01µF, TA = +25℃, unless otherwise noted. Power-Supply Rejection Ratio vs.Frequency 100 10 80 Output Noise Spectral Density (μV/√Hz) CBP = 0.1μF ILOAD = 50mA VIN = VOUT+1V 90 PSRR(dB) Output Noise Spectral Density vs.Frequency 70 COUT = 10μF 60 50 1 COUT = 1μF 0.1 40 COUT = 1μF 30 20 0.01 CBP = 0.01μF ILOAD = 50mA 0.1 1 10 Frequency(kHz) 100 0.01 0.01 1000 COUT = 10μF 0.1 1 10 100 1000 Frequency(kHz) Output Noise vs.Load Current 50 Output Noise(µVRMS) 45 VOUT = 3.3V 40 35 30 25 VOUT = 2.8V 20 f = 10Hz to 100kHz CBP = 0.01μF COUT = 10μF 15 10 5 0 1 10 100 Load Current(mA) 1000 8 SGM2014 APPLICATION NOTES When LDO is used in handheld products, attention must be paid to voltage spikes which could damage SGM2014. In such applications, voltage spikes will be generated at changer interface and VBUS pin of USB interface when changer adapters and USB equipments are hot-plugged. Besides this, handheld products will be tested on the production line without battery. Test engineer will apply power from the connector pin which connects with positive pole of the battery. When external power supply is turned on suddenly, the voltage spikes will be generated at the battery connector. The voltage spikes will be very high, and it always exceeds the absolute maximum input voltage (6.0V) of LDO. In order to get robust design, design engineer needs to clear up this voltage spike. Zener diode is a cheap and effective solution to eliminate such voltage spike. For example, BZM55B5V6 is a 5.6V small package Zener diode which can be used to remove voltage spikes in cell phone designs. The schematic is shown below. 1 Vcc Input BZM55B5V6 1uF IN VOUT SGM2014 C1 EN 3 GND 2 5 VOUT C2 BP 4 4.7uF 0.01uF Control 9 SGM2014 PACKAGE OUTLINE DIMENSIONS SOT23-5 D θ b 0.20 Symbol L E E1 e C A1 e1 Min Max Min Max 1.250 0.041 0.049 A1 0.000 0.100 0.000 0.004 A2 1.050 1.150 0.041 0.045 b 0.300 0.400 0.012 0.016 c 0.100 0.200 0.004 0.008 D 2.820 3.020 0.111 0.119 E 1.500 1.700 0.059 0.067 E1 2.650 2.950 0.104 0.116 e1 L A A2 Dimensions In Inches 1.050 e 10 Dimensions In Millimeters A L 0 0.950TYP 1.800 2.000 0.700REF 0.037TYP 0.071 0.079 0.028REF L1 0.300 0.600 0.012 0.024 θ 0° 8° 0° 8° SGM2014 REVISION HISTORY Location Page 08/2007— Data Sheet REV. A SG Microelectronics Co., Ltd A2608, NO.72 North Road Xisanhuan, Haidian District, Beijing, China 100037 Tel: 86-10-51798160/80 Fax: 86-10-51798180-803 www.sg-micro.com 11 SGM2014