0 XCR3256XL 256 Macrocell CPLD R DS013 (v2.4) November 5, 2003 0 14 Product Specification Features Description • Low power 3.3V 256 macrocell CPLD • 7.5 ns pin-to-pin logic delays The XCR3256XL is a 3.3V, 256 macrocell CPLD targeted at power sensitive designs that require leading edge programmable logic solutions. A total of 16 function blocks provide 6,000 usable gates. Pin-to-pin propagation delays are 7.5 ns with a maximum system frequency of 154 MHz. System frequencies up to 154 MHz • 256 macrocells with 6,000 usable gates • Available in small footprint packages - 144-pin TQFP (120 user I/O pins) - 208-pin PQFP (164 user I/O) - 256-ball FBGA (164 user I/O) - 280-ball CS BGA (164 user I/O) TotalCMOS Design Technique for Fast Zero Power • Optimized for 3.3V systems - Ultra low power operation - 5V tolerant I/O pins with 3.3V core supply - Advanced 0.35 micron five layer metal EEPROM process - Fast Zero Power™ (FZP) CMOS design technology - 3.3V PCI electrical specification compatible outputs (no internal clamp diode on any input or I/O) • Advanced system features - In-system programming - Input registers - Predictable timing model - Up to 23 clocks available per function block - Excellent pin retention during design changes - Full IEEE Standard 1149.1 boundary-scan (JTAG) - Four global clocks - Eight product term control terms per function block • Fast ISP programming times • • Port Enable pin for additional I/O 2.7V to 3.6V supply voltage at industrial grade voltage range • Programmable slew rate control per output • • Security bit prevents unauthorized access Refer to XPLA3 family data sheet (DS012) for architecture description Xilinx offers a TotalCMOS CPLD, both in process technology and design technique. Xilinx employs a cascade of CMOS gates to implement its sum of products instead of the traditional sense amp approach. This CMOS gate implementation allows Xilinx to offer CPLDs that are both high performance and low power, breaking the paradigm that to have low power, you must have low performance. Refer to Figure 1 and Table 1 showing the ICC vs. Frequency of our XCR3256XL TotalCMOS CPLD (data taken with 16 resetable up/down, 16-bit counters at 3.3V, 25°C). 140 120 100 ICC (mA) • 80 60 40 20 0 0 20 40 60 80 100 120 140 160 Frequency (MHz) DS013_01_102302 Figure 1: XCR3256XL Typical ICC vs. Frequency at VCC = 3.3V, 25°C Table 1: Typical ICC vs. Frequency at VCC = 3.3V, 25°C Frequency (MHz) 0 1 10 20 40 60 80 100 120 140 Typical ICC (mA) 0.02 0.98 9.69 19.3 38.1 56.2 73.7 90.8 107.3 123.9 © 2003 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice. DS013 (v2.4) November 5, 2003 Product Specification www.xilinx.com 1-800-255-7778 1 XCR3256XL 256 Macrocell CPLD R DC Electrical Characteristics Over Recommended Operating Conditions(1) Symbol VOH(2) Parameter Test Conditions Output High voltage Min. Max. VCC = 3.0V to 3.6V, IOH = –8 mA 2.4 - VCC = 2.7V to 3.0V, IOH = –8 mA 2.0 - 90% VCC(3) - - 0.4 V IOH = –500 µA Unit VOL Output Low voltage for 3.3V outputs IOL = 8 mA IIL Input leakage current VIN = GND or VCC to 5.5V –10 10 µA IIH I/O High-Z leakage current VIN = GND o rVCC to 5.5V –10 10 µA ICCSB Standby current VCC = 3.6V - 100 µA ICC Dynamic current(4,5) f = 1 MHz - 2 mA f = 50 MHz - 60 mA CIN Input pin capacitance(6) f = 1 MHz - 8 pF CCLK Clock input capacitance(6) f = 1 MHz 5 12 pF CI/O I/O pin capacitance(6) f = 1 MHz - 10 pF Notes: 1. See XPLA3 family data sheet (DS012) for recommended operating conditions. 2. See Figure 2 for output drive characteristics of the XPLA3 family. 3. This parameter guaranteed by design and characterization, not by testing. 4. See Table 1, Figure 1 for typical values. 5. This parameter measured with a 16-bit, resetable up/down counter loaded into every function block, with all outputs disabled and unloaded. Inputs are tied to VCC or ground. This parameter guaranteed by design and characterization, not testing. 6. Typical values, not tested. 100 90 IOL (3.3V) 80 70 mA 60 50 IOH (3.3V) 40 30 IOH (2.7V) 20 10 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 Volts DS012_10_040402 Figure 2: Typical I/V Curve for the XPLA3 Family. 25°C 2 www.xilinx.com 1-800-255-7778 DS013 (v2.4) November 5, 2003 Product Specification XCR3256XL 256 Macrocell CPLD R AC Electrical Characteristics Over Recommended Operating Conditions(1,2) -7 Symbol Parameter -10 -12 Min. Max. Min. Max. Min. Max. Unit TPD1 Propagation delay time (single p-term) - 7.0 - 9.0 - 10.8 ns TPD2 Propagation delay time (OR array)(3) - 7.5 - 10.0 - 12.0 ns TCO Clock to output (global synchronous pin clock) - 4.5 - 5.8 - 6.9 ns Setup time (fast input register) 2.5 - 3.0 - 3.0 - ns Setup time (single p-term) 4.3 - 5.5 - 6.7 - ns Setup time (OR array) 4.8 - 6.5 - 7.9 - ns 0 - 0 - 0 - ns Global Clock pulse width (High or Low) 3.0 - 4.0 - 5.0 - ns P-term clock pulse width 4.5 - 6.0 - 7.5 - ns Input rise time - 20 - 20 - 20 ns Input fall time - 20 - 20 - 20 ns TSUF TSU1 (4) TSU2 TH(4) Hold time TWLH (4) TtPLH(4) TR(4) TL(4) fSYSTEM (4) - 154 - 105 - 88 MHz time(5) - 200 - 200 - 200 µs TINIT(4) ISP initialization time - 200 - 200 - 200 µs TPOE(4) P-term OE to output enabled - 9.0 - 11.0 - 13.0 ns - 9.0 - 11.0 - 13.0 ns TCONFIG (4) Maximum system frequency Configuration disabled(6) TPOD (4) P-term OE to output TPCO (4) P-term clock to output - 8.0 - 10.3 - 12.4 ns P-term set/reset to output valid - 9.0 - 11.0 - 13.0 ns TPAO(4) Notes: 1. Specifications measured with one output switching. 2. See XPLA3 family data sheet (DS012) for recommended operating conditions. 3. See Figure 4 for derating. 4. These parameters guaranteed by design and/or characterization, not testing. 5. Typical current draw during configuration is 10 mA at 3.6V. 6. Output CL = 5 pF. DS013 (v2.4) November 5, 2003 Product Specification www.xilinx.com 1-800-255-7778 3 XCR3256XL 256 Macrocell CPLD R Internal Timing Parameters(1,2) -7 Symbol Parameter -10 -12 Min. Max. Min. Max. Min. Max. Unit Buffer Delays TIN Input buffer delay - 2.5 - 3.3 - 4.0 ns TFIN Fast input buffer delay - 2.7 - 3.3 - 3.3 ns TGCK Global clock buffer delay - 1.0 - 1.3 - 1.5 ns TOUT Output buffer delay - 2.5 - 3.2 - 3.8 ns TEN Output buffer enable/disable delay - 4.5 - 5.2 - 6.0 ns - 1.3 - 1.6 - 2.0 ns Internal Register and Combinatorial Delays TLDI Latch transparent delay TSUI Register setup time 0.8 - 1.0 - 1.2 - ns THI Register hold time 0.3 - 0.5 - 0.7 - ns TECSU Register clock enable setup time 2.0 - 2.5 - 3.0 - ns TECHO Register clock enable hold time 3.0 - 4.5 - 5.5 - ns TCOI Register clock to output delay - 1.0 - 1.3 - 1.6 ns TAOI Register async. S/R to output delay - 2.0 - 2.0 - 2.2 ns TRAI Register async. recovery - 5.0 - 7.0 - 8.0 ns TPTCK Product term clock delay - 2.0 - 2.5 - 3.0 ns TLOGI1 Internal logic delay (single p-term) - 2.0 - 2.5 - 3.0 ns TLOGI2 Internal logic delay (PLA OR term) - 2.5 - 3.5 - 4.2 ns - 2.2 - 3.7 - 4.4 ns Feedback Delays TF ZIA delay Time Adders TLOGI3 Fold-back NAND delay - 2.0 - 2.5 - 3.0 ns TUDA Universal delay - 2.0 - 2.5 - 3.0 ns TSLEW Slew rate limited delay - 4.0 - 5.0 - 6.0 ns Notes: 1. These parameters guaranteed by design and/or characterization, not testing. 2. See XPLA3 family data sheet (DS012) for the timing model. 4 www.xilinx.com 1-800-255-7778 DS013 (v2.4) November 5, 2003 Product Specification XCR3256XL 256 Macrocell CPLD R Switching Characteristics VCC S1 Component R1 R2 C1 R1 Values 390Ω 390Ω 35 pF VIN VOUT R2 Measurement TPOE (High) TPOE (Low) TP C1 S1 Open Closed Closed S2 Closed Open Closed Note: For TPOD, C1 = 5 pF. Delay measured at output level of VOL + 300 mV, VOH – 300 mV. S2 DS013_03_102401 (ns) Figure 3: AC Load Circuit +3.0V 6.5 6.4 6.3 6.2 6.1 6.0 5.9 5.8 5.7 5.6 5.5 5.4 5.3 5.2 90% 10% 0V TR 1.5 ns TL 1.5 ns Measurements: All circuit delays are measured at the +1.5V level of inputs and outputs, unless otherwise specified. 1 2 4 8 16 DS017_05_042800 Number of Adjacent Outputs Switching DS013_04_042800 Figure 5: Voltage Waveform Figure 4: Derating Curve for TPD2 DS013 (v2.4) November 5, 2003 Product Specification www.xilinx.com 1-800-255-7778 5 XCR3256XL 256 Macrocell CPLD R Pin Descriptions Table 3: XCR3256XL I/O Pins (Continued) Function MacroBlock cell TQ144 PQ208 Table 2: XCR3256XL User I/O Pins Total User I/O Pins CS280 TQ144 PQ208 FT256 CS280 3 1 98 17 G15 H17 120 164 164 164 3 2 97 18 G13 H18 3 3 96 19 F16 H19 3 4 94 20 G14 J16 Table 3: XCR3256XL I/O Pins Function MacroBlock cell TQ144 PQ208 6 FT256 FT256 CS280 3 5 93 21 G16 J17 1 1 106 6 C16 E18 3 6 - - - - 1 2 - 7 F12 E19 3 7 - - - - 1 3 104(1) 8 D16 F15 3 8 - - - - 1 4 103 9 E14 F17 3 9 - - - - 1 5 102 10 E15 F18 3 10 - - - - 1 6 - - - - 3 11 - - - - 1 7 - - - - 3 12 92 22 H13 J18 1 8 - - - - 3 13 - 24 H12 K16 1 9 - - - - 3 14 91 25 H15 K17 1 10 - - - - 3 15 90 26 H14 K18 1 11 - - - - 3 16 - 27 H16 L16 1 12 101 11 F13 F19 4 1 114 197 D11 E14 1 13 100 12 E16 G16 4 2 116 196 A11 D14 1 14 99 13 F14 G17 4 3 117 195 E10 A14 1 15 - 15 F15 G19 4 4 - 194 B12 C13 1 16 - 16 G12 H16 4 5 118 193 C11 B13 2 1 107 4 E13 B19 4 6 - - - - 2 2 108 3 D15 B18 4 7 - - - - 2 3 - 206 C13 B17 4 8 - - - - 2 4 - 205 A14 A18 4 9 - - - - 2 5 109 204 E11 A17 4 10 - - - - 2 6 - - - - 4 11 - - - - 2 7 - - - - 4 12 119 192 B11 A13 2 8 - - - - 4 13 120 190 A10 A12 2 9 - - - - 4 14 121 189(1) C10(1) C12(1) 2 10 - - - - 4 15 - 188 A9 B12 2 11 - - - - 4 16 122 187 D9 D12 2 12 110 203 A13 C16 5 1 89(1) 28 J14 L17 2 13 111 202 D12 A16 5 2 - 29 J15 L18 J13(1) L19(1) 2 14 - 201 B13 E15 5 3 88 30(1) 2 15 112 199 C12 D15 5 4 87 31 J16 M16 2 16 113 198 A12 A15 5 5 86 33 L14 M18 www.xilinx.com 1-800-255-7778 DS013 (v2.4) November 5, 2003 Product Specification XCR3256XL 256 Macrocell CPLD R Table 3: XCR3256XL I/O Pins (Continued) Function MacroBlock cell TQ144 PQ208 Table 3: XCR3256XL I/O Pins (Continued) FT256 CS280 Function MacroBlock cell TQ144 PQ208 FT256 CS280 5 6 - - - - 7 11 - - - - 5 7 - - - - 7 12 77 45 M16 R17 5 8 - - - - 7 13 - 46 M14 R15 5 9 - - - - 7 14 75 47 N16 T17 5 10 - - - - 7 15 74 48 L12 T16 5 11 - - - - 7 16 - 49 P15 U19 5 12 84 34 K15 M17 8 1 66 65 T12 T13 5 13 - 35 K14 N16 8 2 67 64 R12 W14 5 14 83 36 K16 N19 8 3 68 62 N11 T14 5 15 82 37 K13 N18 8 4 69 61 T13 R14 5 16 - 38 L15 N17 8 5 - 60 P12 W15 6 1 - 78 R9 U10 8 6 - - - - 6 2 55 77 N9 T10 8 7 - - - - 6 3 56 76 T10 W11 8 8 - - - - 6 4 - 73 P10 U11 8 9 - - - - 6 5 60 71 R10 T11 8 10 - - - - 6 6 - - - - 8 11 - - - - 6 7 - - - - 8 12 70 59 R13 U15 6 8 - - - - 8 13 - 58 M11 V15 6 9 - - - - 8 14 71 57 T14 T15 6 10 - - - - 8 15 - 56 N12 V16 6 11 - - - - 8 16 72 55 R14 W17 6 12 61 70 T11 W12 9 1 2 153 D3 B1 6 13 62 69 N10 U12 9 2 1 154 C1 C3 6 14 63 68 P11 T12 9 3 - 159 B4 A4 6 15 - 67 M10 V13 9 4 - 160 E6 B5 6 16 65 66 R11 U13 9 5 143 161 A4 C5 7 1 81 39 K12 P16 9 6 - - - - 7 2 - 40 L16 P18 9 7 - - - - 7 3 80 42 M15 R19 9 8 - - - - 7 4 79 43 N15 R16 9 9 - - - - 7 5 78 44 L13 R18 9 10 - - - - 7 6 - - - - 9 11 - - - - 7 7 - - - - 9 12 - 162 C5 A5 7 8 - - - - 9 13 142 163 B5 E6 7 9 - - - - 9 14 141 164 D6 D6 7 10 - - - - 9 15 140 166 A5 B6 DS013 (v2.4) November 5, 2003 Product Specification www.xilinx.com 1-800-255-7778 7 XCR3256XL 256 Macrocell CPLD R Table 3: XCR3256XL I/O Pins (Continued) Function MacroBlock cell TQ144 PQ208 8 Table 3: XCR3256XL I/O Pins (Continued) FT256 CS280 Function MacroBlock cell TQ144 PQ208 FT256 CS280 9 16 139 167 C6 A6 12 5 15 136 H4 H3 10 1 4(1) 151 D1 D2 12 6 - - - - 10 2 - 150 E4 D1 12 7 - - - - 10 3 5 149 D2 E3 12 8 - - - - 10 4 6 148 E3 E2 12 9 - - - - 10 5 7 147 E1 E4 12 10 - - - - 10 6 - - - - 12 11 - - - - 10 7 - - - - 12 12 16 135 G2 H2 10 8 - - - - 12 13 - 133 J1 J2 10 9 - - - - 12 14 18 132 J3 J3 10 10 - - - - 12 15 19 131 H2 K2 10 11 - - - - 12 16 - 130 J5 K3 10 12 8 146 F4 E1 13 1 - 79 P9 W10 10 13 - 145 F1 F5 13 2 54 80 T9 T9 10 14 9 144 G5 F3 13 3 53 81 P8 U9 10 15 10 142 E2 F4 13 4 - 84 R8 T8 10 16 11 141 F3 G3 13 5 49 86 N8 T7 11 1 - 168 B6 D7 13 6 - - - - 11 2 - 169 E7 C7 13 7 - - - - 11 3 138 170 A6 B7 13 8 - - - - 11 4 - 171 D7 A7 13 9 - - - - 11 5 137 172 B7 C8 13 10 - - - - 11 6 - - - - 13 11 - - - - 11 7 - - - - 13 12 48 87 T8 W7 11 8 - - - - 13 13 47 88 P7 V7 11 9 - - - - 13 14 46 89 R7 U7 11 10 - - - - 13 15 - 90 P6 W6 11 11 - - - - 13 16 45 91 T7 T6 11 12 136 173 C7 B8 14 1 20(1) 129 J2 K4 11 13 134 175 C8 C9 14 2 - 128 J4 L1 A7(1) B9(1) 14 3 21 127(1) K1(1) L2(1) 11 14 133 176(1) 11 15 132 177 D8 D10 14 4 22 126 K3 L3 11 16 131 178 B8 C10 14 5 23 124 K2 M1 12 1 - 140 F2 G2 14 6 - - - - 12 2 - 139 G4 G1 14 7 - - - - 12 3 12 138 G1 G4 14 8 - - - - 12 4 14 137 H1 H1 14 9 - - - - www.xilinx.com 1-800-255-7778 DS013 (v2.4) November 5, 2003 Product Specification XCR3256XL 256 Macrocell CPLD R Table 3: XCR3256XL I/O Pins (Continued) Function MacroBlock cell TQ144 PQ208 Table 3: XCR3256XL I/O Pins (Continued) FT256 CS280 Function MacroBlock cell TQ144 PQ208 FT256 CS280 14 10 - - - - 16 15 35 109 N3 V1 14 11 - - - - 16 16 36 108 T1 U2 14 12 25 123 L1 M3 14 13 - 122 K4 M4 14 14 26 121 L3 N1 14 15 27 120 K5 N2 14 16 28 119 M1 N3 15 1 44 92 N7 V6 15 2 43 93 R6 U6 15 3 42 95 M7 R6 15 4 41 96 T5 W5 15 5 40 97 T6 T5 15 6 - - - - 15 7 - - - - 15 8 - - - - 15 9 - - - - 15 10 - - - - 15 11 - - - - 15 12 - 98 R5 V5 15 13 39 99 N6 U5 15 14 38 100 T4 W4 15 15 - 101 P5 U4 15 16 37 102 R4 W3 16 1 - 118 L2 P1 16 2 - 117 M2 P2 16 3 29 115 M3 P4 16 4 30 114 N2 R3 16 5 31 113 L5 R2 16 6 - - - - 16 7 - - - - 16 8 - - - - 16 9 - - - - 16 10 - - - - 16 11 - - - - 16 12 32 112 P1 R4 16 13 - 111 M4 T3 16 14 34 110 R1 U1 DS013 (v2.4) November 5, 2003 Product Specification Notes: 1. JTAG pins. www.xilinx.com 1-800-255-7778 9 XCR3256XL 256 Macrocell CPLD R Table 4: XCR3256XL Global, JTAG, Port Enable, Power, and No Connect Pins Pin Type TQ144 PQ208 FT256 CS280 IN0 / CLK0 128 181 B9 A10 IN1 / CLK1 127 182 A8 D11 IN2 / CLK2 126 183 C9 C11 IN3 / CLK3 125 184 B10 B11 TCK 89 30 J13 L19 TDI 4 176 A7 B9 TDO 104 189 C10 C12 TMS 20 127 K1 L2 PORT_EN 13(1) 116(1) N1(1) P3(1) Vcc 24, 50, 51, 58, 73, 76, 95, 115, 123, 130, 144 5, 23, 41, 63, 74, 83, 85, 107, 125, 143, 165, 179, 186, 191 A11, B10, C6, C14, E8, E9, F7, F8, F9, F10, G6, G11, H5, H6, H11, D13, D17, F2, J19, L4, J6, J11, J12, K6, K11, P15, T18, U8, U14, V2, V9, V11 L7, L8, L9, L10, M8, M9 GND 3, 17, 33, 52, 57, 59, 64, 85, 105, 124, 129, 135 14, 32, 50, 72, 75, 82, 94, 134, 152, 174, 180, 185, 200 E5, F6, F11, G7, G8, G9, G10, H7, H8, H9, H10, J7, J8, J9, J10, K7, K8, K9, K10, L6, L11 E5, E7, E8, E9, E10, E11, E12, E13, G5, G15, H5, H15, J5, J15, K5, K15, L5, L15, M5, M15, N5, N15, R7, R8, R9, R10, R11, R12, R13 No Connects - 1, 2, 51, 52, 53, 54, 103, 104, 105, 106, 155, 156, 157, 158, 207, 208 A1, A2, A3, A15, A16, B1, B2, B3, B14, B15, B16, C2, C3, C4, C14, C15, D4, D5, D10, D13, D14, E12, F5, G3, H3, L4, M5, M6, M12, M13, N4, N5, N13, N14, P2, P3, P4, P13, P14, P16, R2, R3, R15, R16, T2, T3, T15, T16 A1, A2, A3, A8, A9, A19, B2, B3, B4, B14, B15, B16, C1, C2, C4, C15, C17, C18, C19, D3, D4, D5, D8, D9, D16, D18, D19, E16, E17, F1, F16, G18, H4, J1, J4, K1, K19, M2, M19, N4, P5, P17, P19, R1, R5, T1, T2, T4, T19, U3, U16, U17, U18, V3, V4, V8, V10, V12, V14, V17, V18, V19, W1, W2, W8, W9, W13, W16, W18, W19 Notes: 1. Port Enable is brought High to enable JTAG pins when JTAG pins are used as I/O. See family data sheet (DS012) for full explanation. 10 www.xilinx.com 1-800-255-7778 DS013 (v2.4) November 5, 2003 Product Specification XCR3256XL 256 Macrocell CPLD R Device Part Marking and Ordering Combination Information R XCRxxxxXL TQ144 Device Type Package This line not related to device part number 7C Speed Operating Range 1 Sample package with part marking. Speed (pin-to-pin delay) Pkg. Symbol No. of Pins Package Type Operating Range(1) XCR3256XL-7TQ144C 7.5 ns TQ144 144-pin Thin Quad Flat Pack (TQFP) C XCR3256XL-7PQ208C 7.5 ns PQ208 208-pin Plastic Quad Flat Pack (PQFP) C XCR3256XL-7FT256C 7.5 ns FT256 256-ball Fine-Pitch BGA (FT) C XCR3256XL-7CS280C 7.5 ns CS280 280-ball Chip Scale Package (CSP) C XCR3256XL-10TQ144C 10 ns TQ144 144-pin Thin Quad Flat Pack (TQFP) C XCR3256XL-10PQ208C 10 ns PQ208 208-pin Plastic Quad Flat Pack (PQFP) C XCR3256XL-10FT256C 10 ns FT256 256-ball Fine-Pitch BGA (FT) C XCR3256XL-10CS280C 10 ns CS280 280-ball Chip Scale Package (CSP) C XCR3256XL-10TQ144I 10 ns TQ144 144-pin Thin Quad Flat Pack (TQFP) I XCR3256XL-10PQ208I 10 ns PQ208 208-pin Plastic Quad Flat Pack (PQFP) I XCR3256XL-10FT256I 10 ns FT256 256-ball Fine-Pitch BGA (FT) I XCR3256XL-10CS280I 10 ns CS280 280-ball Chip Scale Package (CSP) I XCR3256XL-12TQ144C 12 ns TQ144 144-pin Thin Quad Flat Pack (TQFP) C XCR3256XL-12PQ208C 12 ns PQ208 208-pin Plastic Quad Flat Pack (PQFP) C XCR3256XL-12FT256C 12 ns FT256 256-ball Fine-Pitch BGA (FT) C XCR3256XL-12CS280C 12 ns CS280 280-ball Chip Scale Package (CSP) C XCR3256XL-12TQ144I 12 ns TQ144 144-pin Thin Quad Flat Pack (TQFP) I XCR3256XL-12PQ208I 12 ns PQ208 208-pin Plastic Quad Flat Pack (PQFP) I XCR3256XL-12FT256I 12 ns FT256 256-ball Fine-Pitch BGA (FT) I XCR3256XL-12CS280I 12 ns CS280 280-ball Chip Scale Package (CSP) I Device Ordering and Part Marking Number Notes: 1. C = Commercial: TA = 0° to +70°C; I = Industrial: TA = –40° to +85°C DS013 (v2.4) November 5, 2003 Product Specification www.xilinx.com 1-800-255-7778 11 XCR3256XL 256 Macrocell CPLD R Revision History The following table shows the revision history for this document 12 Date Version Revision 01/21/00 1.0 Initial Xilinx release. 02/10/00 1.1 Updated Pinout table. 05/03/00 1.2 Minor updates and added Boundary Scan to pinout table. 11/20/00 1.3 Updated pinout tables; corrected note in Table 4 to read: "port enable pin is brought High". 12/11/00 1.4 Updated specifications and pinout tables. 01/17/01 1.5 Removed Timing Model. 03/05/01 1.6 Added 256-ball Fine-Pitch Ball Grid Array Package. 04/11/01 1.7 Added Typical I/V curve, Figure 2; added Table 2: Total User I/O; changed VOH spec. 04/19/01 1.8 Updated Typical I/V curve, Figure 2: added voltage levels. 01/08/02 1.9 Moved ICC vs Freq. Figure 1 and Table 1 to page 1. Added single p-term setup time (TSU1) to AC Table, renamed TSU to TSU2 for setup time through the OR array. Updated TSUF spec to match software timing. Added TINIT spec. Updated TCONFIG spec. Updated THI spec to correct a typo. Updated AC Load Circuit diagram to more closely resemble true test conditions, added note for TPOD delay measurement. 11/20/02 2.0 Updated TPCO (added TPTCK), TFIN, and TOUT to match timing model and software. Updated the following specs based on characterization of product after move to UMC fabrication: fSYSTEM, VOH,TCONFIG, TINIT, TLOGI3, TF. Updated Typical ICC vs. Freq. and Derating Curve for TPD2 (improved to 6.5 ns for 16 outputs switching) per new characterization data. Updated ordering information to new format. 01/27/03 2.1 Moved incorrect note for VOH to line 2 from line 3 in DC table. 07/15/03 2.2 Updated test conditions for IIL and IIH. 08/21/03 2.3 Updated Package Device Marking Pin 1 orientation. 11/5/03 2.4 Updated from Preliminary Product Specification to Product Specification. www.xilinx.com 1-800-255-7778 DS013 (v2.4) November 5, 2003 Product Specification