ZTX614 ZTX614 NPN Darlington Transistor • These device is designed for applications requiring extremely high gain at collector currents to 0.5A and high breakdown voltage. • Sourced from process 06. C BE TO-226 Absolute Maximum Ratings* TA=25°C unless otherwise noted Symbol VCEO Parameter Collector-Emitter Voltage Value 100 Units V VCBO VEBO Collector-Base Voltage 120 V Emitter-Base Voltage 10 IC Collector Current V 800 mA TJ, TSTG Operating and Storage Junction Temperature Range -55 ~ +150 °C - Continuous * These ratings are limiting values above which the serviceability of any semiconductor device may be impaired. NOTES: 1) These ratings are based on a maximum junction temperature of 150°C. 2) These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations. Electrical Characteristics TC=25°C unless otherwise noted Symbol Parameter Off Characteristics Collector-Emitter Breakdown Voltage* V(BR)CEO Test Condition Min. Typ. Max. Units IC = 10mA, IB = 0 100 V V(BR)CBO Collector-Emitter Breakdown Voltage IC = 100µA, IE = 0 120 V V(BR)EBO Emitter-Base Breakdown Voltage IE = 100µA, IC = 0 10 ICBO Collector Cutoff Current VCB = 60V, IE = 0 0.1 µA IEBO Emitter Cutoff Current VEB = 8V, IC = 0 0.1 µA On Characteristics* hFE DC Current Gain IC = 100mA, VCE = 5V IC = 500mA, VCE = 5V VCE(sat) Collector-Emitter Saturation Voltage IC = 800mA, IB = 8mA 1.25 V VBE(on) Base-Emitter On Voltage IC = 800mA, VBE = 5V 1.8 V 5000 10000 * Pulse Test: Pulse Width ≤ 300µs, Duty Cycle ≤ 1.0% Thermal Characteristics TA=25°C unless otherwise noted PD Symbol Parameter Total Device Dissipation Derate above 25°C Max. 1000 8 Units mW mW/°C RθJC RθJA Thermal Resistance, Junction to Case 50 °C/W Thermal Resistance, Junction to Ambient 125 °C/W ©2002 Fairchild Semiconductor Corporation Rev. A1, November 2002 ZTX614 Package Dimensions TO-226 S4.70-4.32; S1.52-1.02; 2" TYP S7.73-7.10; S7.87-7.37; 2" TYP S1.65-1.27; 0.51 S0.760.36; S15.61-14.47; S0.51-0.36; S0.48-0.30; S1.40-1.14; PIN S1.40-1.14; 99 95 1 E E 2 B C 3 C B S4.45-3.81; 5" TYP 1 2 3 TO-226AE (95,99) S2.41-2.13; For leadformed option ordering, refer to Tape & Reel data information. Dimensions in Millimeters ©2002 Fairchild Semiconductor Corporation Rev. A1, November 2002 TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx™ FACT™ ActiveArray™ FACT Quiet series™ Bottomless™ FAST® FASTr™ CoolFET™ CROSSVOLT™ FRFET™ GlobalOptoisolator™ DOME™ EcoSPARK™ GTO™ E2CMOS™ HiSeC™ EnSigna™ I2C™ Across the board. Around the world.™ The Power Franchise™ Programmable Active Droop™ ImpliedDisconnect™ ISOPLANAR™ LittleFET™ MicroFET™ MicroPak™ MICROWIRE™ MSX™ MSXPro™ OCX™ OCXPro™ OPTOLOGIC® OPTOPLANAR™ PACMAN™ POP™ Power247™ PowerTrench® QFET™ QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ RapidConnect™ SILENT SWITCHER® SMART START™ SPM™ Stealth™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TinyLogic™ TruTranslation™ UHC™ UltraFET® VCX™ DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. ©2002 Fairchild Semiconductor Corporation Rev. I1