CYPRESS CY2310ANZPVC-1T

1CY2310NZCY2310
NZCY2310ANZ
CY2310ANZ
3.3V SDRAM Buffer for Mobile PCs
with 4 SO-DIMMs
Features
Functional Description
• One input to 10 output buffer/driver
• Supports up to four SDRAM SO-DIMMs
• Two additional outputs for feedback
• Serial interface for output control
• Low skew outputs
• Up to 100-MHz operation
• Multiple VDD and VSS pins for noise reduction
• Dedicated OE pin for testing
• Space-saving 28-pin SSOP package
• 3.3V operation
The CY2310ANZ is a 3.3V buffer designed to distribute
high-speed clocks in mobile PC applications. The part has 10
outputs, 8 of which can be used to drive up to four SDRAM
SO-DIMMs, and the remaining can be used for external
feedback to a PLL. The device operates at 3.3V and outputs
can run up to 100 MHz, thus making it compatible with
Pentium II® processors. The CY2310ANZ can be used in
conjunction with the CY2281 or similar clock synthesizer for a
full Pentium II motherboard solution.
The CY2310ANZ also includes a serial interface which can
enable or disable each output clock. On power-up, all output
clocks are enabled. A separate Output Enable pin facilitates
testing on ATE.
Pin Configuration
Block Diagram
28-pin SSOP
Top View
BUF_IN
VDD
SDRAM0
SDRAM1
VSS
VDD
SDRAM2
SDRAM3
VSS
BUF_IN
VDD
SDRAM8
VSS
VDDIIC
SDATA
SDRAM0
SDRAM1
SDRAM2
SDRAM3
SDATA
Serial Interface
Decoding
SCLOCK
SDRAM4
SDRAM5
SDRAM6
SDRAM7
SDRAM8
SDRAM9
1
2
28
27
3
26
4
25
5
6
24
23
7
22
8
9
21
20
10
19
11
18
12
17
13
16
14
15
VDD
SDRAM7
SDRAM6
VSS
VDD
SDRAM5
SDRAM4
VSS
OE
VDD
SDRAM9
VSS
VSSIIC
SCLOCK
OE
Cypress Semiconductor Corporation
Document #: 38-07142 Rev. *B
•
3901 North First Street
•
San Jose, CA 95134
•
408-943-2600
Revised January 19, 2005
CY2310ANZ
Pin Summary
Name
Pins
Description
VDD
1, 5, 10, 19, 24, 28
3.3V Digital voltage supply
VSS
4, 8, 12, 17, 21, 25
Ground
VDDIIC
13
Serial interface voltage supply
VSSIIC
16
Ground for serial interface
BUF_IN
9
Input clock
OE
20
Output Enable, three-states outputs when LOW. Internal pull-up to VDD
SDATA
14
Serial data input, internal pull-up to VDD
SCLK
15
Serial clock input, internal pull-up to VDD
SDRAM [0–3]
2, 3, 6, 7
SDRAM byte 0 clock outputs
SDRAM [4–7]
22, 23, 26, 27
SDRAM byte 1 clock outputs
SDRAM [8–9]
11, 18
SDRAM byte 2 clock outputs
Device Functionality
OE
SDRAM [0–17]
0
High-Z
1
1 x BUF_IN
Serial Configuration Map
• The Serial bits will be read by the clock driver in the following
order:
Byte 0 - Bits 7, 6, 5, 4, 3, 2, 1, 0
Byte 1 - Bits 7, 6, 5, 4, 3, 2, 1, 0
Byte 1: SDRAM Active/Inactive Register
(1 = Active, 0 = Inactive), Default = Active
Bit
Pin #
Description
.
Bit 7
27
SDRAM7 (Active/Inactive)
Byte N - Bits 7, 6, 5, 4, 3, 2, 1, 0
Bit 6
26
SDRAM6 (Active/Inactive)
Bit 5
23
SDRAM5 (Active/Inactive)
Bit 4
22
SDRAM4 (Active/Inactive)
Bit 3
--
Initialize to 0
• Reserved and unused bits should be programmed to “0”.
• Serial interface address for the CY2310ANZ is:
A6
A5
A4
A3
A2
A1
A0
R/W
Bit 2
--
Initialize to 0
1
1
0
1
0
0
1
----
Bit 1
--
Initialize to 0
Bit 0
--
Initialize to 0
Byte 0:SDRAM Active/Inactive Register
(1 = Enable, 0 = Disable), Default = Enabled
Bit
Pin #
Description
Byte 2: SDRAM Active/Inactive Register
(1 = Active, 0 = Inactive), Default = Active
Bit
Pin #
Description
Bit 7 --
Initialize to 0
Bit 7
18
SDRAM9 (Active/Inactive)
Bit 6 --
Initialize to 0
Bit 6
11
SDRAM8 (Active/Inactive)
Bit 5 --
Initialize to 0
Bit 5
--
Reserved, drive to 0
Bit 4 --
Initialize to 0
Bit 4
--
Reserved, drive to 0
Bit 3 7
SDRAM3 (Active/Inactive)
Bit 3
--
Reserved, drive to 0
Bit 2 6
SDRAM2 (Active/Inactive)
Bit 2
--
Reserved, drive to 0
Bit 1 3
SDRAM1 (Active/Inactive)
Bit 1
--
Reserved, drive to 0
Bit 0 2
SDRAM0 (Active/Inactive)
Bit 0
--
Reserved, drive to 0
Document #: 38-07142 Rev. *B
Page 2 of 8
CY2310ANZ
Maximum Ratings
Supply Voltage to Ground Potential ............... –0.5V to +7.0V
Storage Temperature ................................. –65°C to +150°C
DC Input Voltage (Except BUF_IN)........–0.5V to VDD + 0.5V
Junction Temperature ................................................. 150°C
DC Input Voltage (BUF_IN)............................ –0.5V to +7.0V
Static Discharge Voltage
(per MIL-STD-883, Method 3015) ............................. >2000V
Operating Conditions
Parameter
Description
Min.
Max.
Unit
3.135
3.465
V
VDD
Supply Voltage
TA
Operating Temperature (Ambient Temperature)
0
70
°C
CL
Load Capacitance
20
30
pF
CIN
Input Capacitance
7
pF
tPU
Power-up time for all VDDs to reach minimum specified voltage
(power ramps must be monotonic)
0.05
50
ms
Min.
Max.
Unit
Electrical Characteristics
Parameter
Description
Voltage[1]
Test Conditions
VIL
Input LOW
VILiic
Input LOW Voltage
VIH
Input HIGH Voltage[1]
IIL
Input LOW Current
(BUF_IN input)
VIN = 0V
IIL
Input LOW Current
(Except BUF_IN Pin)
VIN = 0V
IIH
Input HIGH Current
VIN = VDD
VOL
VOH
Except serial interface pins
0.8
V
For serial interface pins only
0.7
V
2.0
Output LOW
Voltage[2]
IOL = 25 mA
Output HIGH
Voltage[2]
IOH = –36 mA
Current[2]
IDD
Supply
IDD
Supply Current
Current[2]
–10
–10
V
10
µA
100
µA
10
µA
0.4
V
2.4
V
Unloaded outputs, 100-MHz
200
mA
Loaded outputs, 100-MHz
360
mA
Unloaded outputs, 66.67-MHz
150
mA
IDD
Supply
IDD
Supply Current
Loaded outputs, 66.67-MHz
230
mA
IDDS
Supply Current
BUF_IN=VDD or VSS
All other inputs at VDD
500
µA
Notes:
1. BUF_IN input has a threshold voltage of VDD/2.
2. Parameter is guaranteed by design and characterization. Not 100% tested in production.
Document #: 38-07142 Rev. *B
Page 3 of 8
CY2310ANZ
Switching Characteristics[3]
Parameter
Name
Test Conditions
Min.
Typ.
Maximum Operating Frequency
Duty Cycle[2, 4] = t2 ÷ t1
MHz
Measured at 1.5V
45.0
50.0
55.0
%
Measured between 0.4V and 2.4V
0.9
1.5
4.0
V/ns
[2]
0.9
t4
Falling Edge Rate
Measured between 2.4V and 0.4V
t5
Output to Output Skew[2]
All outputs equally loaded
1.5
4.0
V/ns
150
250
ps
[2]
Input edge greater than 1 V/ns
1.0
3.5
5.0
ns
[2]
3.5
5.0
ns
SDRAM Buffer LH Prop. Delay
t6
Unit
100
[2]
Rising Edge Rate
t3
Max.
t7
SDRAM Buffer HL Prop. Delay
Input edge greater than 1 V/ns
1.0
t8
[2]
SDRAM Buffer Enable Delay
Input edge greater than 1 V/ns
1.0
5
12
ns
t9
SDRAM Buffer Disable Delay[2]
Input edge greater than 1 V/ns
1.0
20
30
ns
Switching Waveforms
Duty Cycle Timing
t1
t2
1.5V
1.5V
1.5V
All Outputs Rise/Fall Time
OUTPUT
2.4V
0.4V
2.4V
0.4V
3.3V
0V
t4
t3
Output-Output Skew
OUTPUT
1.5V
1.5V
OUTPUT
t5
Notes:
3. All parameters specified with loaded outputs.
4. Duty cycle of input clock is 50%. Rising and falling edge rate is greater than 1V/ns
Document #: 38-07142 Rev. *B
Page 4 of 8
CY2310ANZ
Switching Waveforms (continued)
SDRAM Buffer LH and HL Propagation Delay
INPUT
OUTPUT
t6
t7
SDRAM Buffer Enable and Disable Times
OE
Three-State
Active
OUTPUTS
t8
t9
Test Circuit
VDD
0.1 µF
OUTPUTS
CLK out
CLOAD
GND
Document #: 38-07142 Rev. *B
Page 5 of 8
CY2310ANZ
Application Information
Clock traces must be terminated with either series or parallel termination, as is normally done.
Summary
• Surface mount, low-ESR, ceramic capacitors should be used for filtering. Typically, these capacitors have a value of 0.1 µF.
In some cases, smaller value capacitors may be required.
• The value of the series terminating resistor satisfies the following equation, where Rtrace is the loaded characteristic impedance
of the trace, Rout is the output impedance of the buffer (typically 25Ω), and Rseries is the series terminating resistor.
Rseries > Rtrace – Rout
• Footprints must be laid out for optional EMI-reducing capacitors, which should be placed as close to the terminating resistor
as is physically possible. Typical values of these capacitors range from 4.7 pF to 22 pF.
• A Ferrite Bead may be used to isolate the Board VDD from the clock generator VDD island. Ensure that the Ferrite Bead offers
greater than 50Ω impedance at the clock frequency, under loaded DC conditions. Please refer to the application note “Layout
and Termination Techniques for Cypress Clock Generators” for more details.
• If a Ferrite Bead is used, a 10 µF–22 µF tantalum bypass capacitor should be placed close to the Ferrite Bead. This capacitor
prevents power supply droop during current surges.
Document #: 38-07142 Rev. *B
Page 6 of 8
CY2310ANZ
Ordering Information
Ordering Code
Operating
Range
Package Type
Standard
CY2310ANZPVC–1
28-pin SSOP
Commercial
CY2310ANZPVC–1T
28-pin SSOP - Tape and Reel
Commercial
CY2310ANZPVXC–1
28-pin SSOP
Commercial
CY2310ANZPVXC–1T
28-pin SSOP - Tape and Reel
Commercial
Lead-free
Package Diagram
28-Lead (5.3 mm) Shrunk Small Outline Package O28
51-85079-*C
Pentium II is a registered trademark of Intel Corporation. All products and company names mentioned in this document may be
the trademarks of their respective holders.
Document #: 38-07142 Rev. *B
Page 7 of 8
© Cypress Semiconductor Corporation, 2005. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
CY2310ANZ
Document History Page
Document Title: CY2310ANZ 3.3V SDRAM Buffer for Mobile PCs with 4 SO-DIMMs
Document Number: 38-07142
REV.
ECN NO.
Issue
Date
Orig. of
Change
Description of Change
**
110251
11/18/01
DSG
Change from Spec number: 38-00659 to 38-07142
*A
121829
12/14/02
RBI
Power up requirements added to Operating Conditions Information
*B
310555
See ECN
RGL
Added Lead-free Devices
Document #: 38-07142 Rev. *B
Page 8 of 8
© Cypress Semiconductor Corporation, 2005. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.