CYPRESS CY2309NZSXC-1HT

CY2309NZ
Nine-Output 3.3V Buffer
Features
Functional Description
■
One-input to nine-output buffer/driver
■
Supports two DIMMs or four SO-DIMMs with one additional
output for feedback to an external or chipset PLL
■
Low power consumption for mobile applications
❐ Less than 32 mA at 66.6 MHz with unloaded outputs
The CY2309NZ is a low-cost buffer designed to distribute
high-speed clocks in mobile PC systems and desktop PC
systems with SDRAM support. The part has nine outputs, eight
of which can be used to drive two DIMMs or four SO-DIMMs, and
the remaining can be used for external feedback to a PLL. The
device operates at 3.3V and outputs can run up to 133.33 MHz.
■
1-ns Input-Output delay
■
Buffers all frequencies from DC to 133.33 MHz
■
Output-output skew less than 250 ps
■
Multiple VDD and VSS pins for noise and electromagnetic interference (EMI) reduction
■
Space-saving 16-pin 150-mil SOIC package
■
3.3V operation
■
Industrial temperature available
The CY2309NZ is designed for low EMI and power optimization.
It has multiple VSS and VDD pins for noise optimization and
consumes less than 32 mA at 66.6 MHz, making it ideal for the
low-power requirements of mobile systems. It is available in an
ultra-compact 150-mil 16-pin SOIC package.
Logic Block Diagram
BUF_IN
OUTPUT1
OUTPUT2
OUTPUT3
OUTPUT4
OUTPUT5
OUTPUT6
OUTPUT7
OUTPUT8
OUTPUT9
Cypress Semiconductor Corporation
Document #: 38-07182 Rev. *E
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised September 23, 2008
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CY2309NZ
Pinouts
Figure 1. CY2309NZ - 16 SOIC-Top View
BUF_IN
OUTPUT1
1
16
2
15
OUTPUT2
VDD
3
14
4
13
GND
OUTPUT3
OUTPUT4
VDD
5
12
6
11
7
10
8
9
OUTPUT9
OUTPUT8
OUTPUT7
VDD
GND
OUTPUT6
OUTPUT5
GND
Table 1. Pin Description for CY2309NZ
Pin
Signal
Description
4, 8, 13
VDD
5, 9, 12
GND
Ground
1
BUF_IN
Input Clock
3.3V Digital Voltage Supply
2, 3, 6, 7, 10, OUTPUT [1:9]
11, 14, 15, 16
Outputs
Maximum Ratings
Supply Voltage to Ground Potential................–0.5V to +7.0V
Storage Temperature ................................. –65°C to +150°C
DC Input Voltage (Except REF) ............ –0.5V to VDD + 0.5V
Junction Temperature ................................................. 150°C
DC Input Voltage REF .........................................–0.5V to 7V
Static Discharge Voltage
(per MIL-STD-883, Method 3015) ............................ >2,000V
Operating Conditions for Commercial and Industrial Temperature Devices
Parameter
Description
VDD
Supply Voltage
TA
(Ambient Operating Temperature) Commercial
(Ambient Operating Temperature) Industrial
CL
CIN
Min
Max
Unit
3.0
3.6
V
0
70
–40
85
°C
°C
Load Capacitance, Fout < 100 MHz
30
pF
Load Capacitance,100 MHz < Fout < 133.33 MHz
15
pF
7
pF
BUF_IN, OUTPUT [1:9] Operating Frequency
Input Capacitance
DC
133.33
MHz
tPU
0.05
50
ms
Min
Max
Unit
0.8
V
Power up time for all VDDs to reach minimum specified
voltage (power ramps must be monotonic)
Electrical Characteristics for Commercial and Industrial Temperature Devices
Parameter
Description
Test Conditions
VIL
Input LOW Voltage[1]
VIH
Input HIGH
Voltage[1]
IIL
Input LOW Current
VIN = 0V
50.0
μA
IIH
Input HIGH Current
VIN = VDD
100.0
μA
0.4
V
Output LOW
Voltage[2]
VOH
Output HIGH
Voltage[2]
IDD
Supply Current
VOL
2.0
IOL = 8 mA
IOH = –8 mA
Unloaded outputs at 66.66 MHz
V
2.4
V
32
mA
Notes
1. BUF_IN input has a threshold voltage of VDD/2.
2. Parameter is guaranteed by design and characterization. It is not 100% tested in production.
Document #: 38-07182 Rev. *E
Page 2 of 6
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CY2309NZ
Switching Characteristics for Commercial and Industrial Temperature Devices[3]
Parameter
Name
Duty Cycle
t3
t4
[2]
Description
= t2 ÷ t1
Min
Typ.
Max
Unit
40.0
50.0
60.0
%
Measured between 0.8V and 2.0V
1.50
ns
Measured between 0.8V and 2.0V
1.50
ns
Measured at 1.4V
[2]
Rise Time
[2]
Fall Time
[2]
t5
Output to Output Skew
All outputs equally loaded
t6
Propagation Delay, BUF_IN
Rising Edge to OUTPUT
Rising Edge[2]
Measured at VDD/2
1
5
250
ps
9.2
ns
Switching Waveforms
Figure 2. Duty Cycle Timing
t1
t2
1.4V
1.4V
1.4V
Figure 3. All Outputs Rise/Fall Time
OUTPUT
2.0V
0.8V
2.0V
0.8V
t3
3.3V
0V
t4
Figure 4. Output-Output Skew
OUTPUT
1.4V
1.4V
OUTPUT
t5
Figure 5. Input-Output Propagation Delay
INPUT
VDD/2
VDD/2
OUTPUT
t6
Note
3. All parameters specified with loaded outputs.
Document #: 38-07182 Rev. *E
Page 3 of 6
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CY2309NZ
Test Circuits
VDD
CLK out
0.1 μF
OUTPUTS
C LOAD
VDD
0.1 μF
GND
GND
Ordering Information
Ordering Code
Package Type
Operating Range
CY2309NZSC–1H[4]
16-pin 150-mil SOIC
Commercial
CY2309NZSC–1HT[4]
16-pin 150-mil SOIC – Tape and Reel
Commercial
Pb-free
CY2309NZSXC–1H
16-pin 150-mil SOIC
Commercial
CY2309NZSXC–1HT
16-pin 150-mil SOIC – Tape and Reel
Commercial
CY2309NZSXI-1H
16-pin 150-mil SOIC
Industrial
CY2309NZSXI-1HT
16-pin 150-mil SOIC – Tape and Reel
Industrial
Package Diagram
Figure 6. 16-Pin (150-Mil) SOIC S16
16 Lead (150 Mil) SOIC
PIN 1 ID
8
1
DIMENSIONS IN INCHES[MM] MIN.
MAX.
REFERENCE JEDEC MS-012
PACKAGE WEIGHT 0.15gms
0.150[3.810]
0.157[3.987]
0.230[5.842]
0.244[6.197]
PART #
S16.15 STANDARD PKG.
SZ16.15 LEAD FREE PKG.
9
16
0.386[9.804]
0.393[9.982]
0.010[0.254]
0.016[0.406]
SEATING PLANE
X 45°
0.061[1.549]
0.068[1.727]
0.004[0.102]
0.050[1.270]
BSC
0°~8°
0.0138[0.350]
0.0192[0.487]
0.004[0.102]
0.0098[0.249]
0.016[0.406]
0.035[0.889]
0.0075[0.190]
0.0098[0.249]
51-85068-*B
Note
4. Not recommended for new designs.
Document #: 38-07182 Rev. *E
Page 4 of 6
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CY2309NZ
Document History Page
Document Title: CY2309NZ Nine-Output 3.3V Buffer
Document Number: 38-07182
ECN
Orig. of
Change
Submission
Date
**
111858
DSG
12/09/01
Change from Spec number: 38-00709 to 38-07182
*A
121834
RBI
12/14/02
Power-up requirements added to Operating Conditions Information
REV.
Description of Change
*B
130563
SDR
10/23/03
Added industrial operating temperature to operating conditions
*C
212991
RGL/GGK
03/30/04
Updated the propagation delay T6 spec to 9.2 ns in the Switching
Characteristics table
*D
270149
RGL
10/04/04
Added Lead-free devices
Replaced 8.7ns Input/Output Delay to 1ns Input/Output Delayin the features
section
*E
2568533
AESA
09/23/08
Updated template. Added Note “Not recommended for new designs.”
Changed "SDRAM [1:9]" to "OUTPUT [1:9]" in Operating Conditions table.
Removed part number CY2309NZSI–1H and CY2309NZSI–1HT.
Document #: 38-07182 Rev. *E
Page 5 of 6
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CY2309NZ
Sales, Solutions, and Legal Information
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© Cypress Semiconductor Corporation, 2001-2008. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of
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assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
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assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document #: 38-07182 Rev. *E
Revised September 23, 2008
Page 6 of 6
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