UPGA301Ae3 Nanosecond SCR SWITCH SCOTTSDALE DIVISION KEY FEATURES DESCRIPTION Epoxy packaged, oxide passivated planar SCR chips with metallurgic bonds on both sides to achieve high reliability. Internal wire bond connection allows high current surge capability for narrow pulse applications. Very low thermal resistance package Efficient heat path with integral locking bottom metal tab Full metallic bottom eliminates flux entrapment RoHS Compliant with e3 suffix High speed switching capability Compatible with high-speed insertion Low profile height of 1 mm IMPORTANT: For the most current data, consult MICROSEMI’swebsite:http://www.microsemi.com ABSOLUTE MAXIMUM RATINGS AT 25º C (UNLESS OTHERWISE SPECIFIED) APPLICATIONS/BENEFITS Reference Microsemi MicroNote 601 Rating Symbol Value Unit Repetative peak Off-State Voltage VDRM 100 V Peak On-State Current for 50 ns (max) ITSM 100 A Peak Gate Current IGM 250 mA Reverse Gate Voltage VGR 5 V Storage Temperature Range Ts -50 to 150 ºC Operating Temperature Range TJ 0 to 125 ºC THERMAL CHARACTERISTICS (UNLESS OTHERWISE SPECIFIED) and 602 Nanosecond SCR switch for reliable high current pulse generators, modulators and photo-flash quenching Logic drive capability (0.8V, 200μA) Ideal for Laser Range finder and Camera Applications Ideal for Automotive Collision Avoidance Applications MECHANICAL & PACKAGING Thermal Resistance Junction-to-Case (Anode Bottom) Junction-to-Ambient (1) WWW . Microsemi .C OM The UPGA301Ae3 is Designed for high current narrow-pulse switching applications where size and current handling capability are critical. These devices may be triggered on using low power logic drivers from (+0.8 V at 200 μA). RθJC RθJA 4.0 65 ºC/Watt ºC/Watt (1)When mounted on 0.06’ thick FR4 board with 2 oz copper FR4 board with recommended footprint • CASE: Void-free transfer molded thermosetting epoxy compound meeting UL94V-0 • FINISH: Annealed matte-Tin plating over copper and readily solderable per MIL-STD-750 method 2026 (consult factory for Tin-Lead plating) • POLARITY: See figure (left) • MARKING: 301A• • WEIGHT: 0.072 gram (approx.) • Package dimensions on last page • Tape & Reel option: 16 mm tape per Standard EIA-481-B, 5000 on 13” reel Small foot print UPGA301A .190 X .270 inches 1:1 Actual size See mounting pad details on pg 3 Copyright © 2005 7-17-05, Rev D Microsemi 8700 E. Thomas Rd. PO Box 1390, Scottsdale Arizona 85252, 480-941-6300, Fax: 480-947-1503 Page 1 UPGA301Ae3 Nanosecond SCR SWITCH SCOTTSDALE DIVISION ELECTRICAL PARAMETERS@25°C (unless otherwise specified) Symbol Conditions ` On characteristics (up to 100 A w/ 100 ns pulse @ Duty Cycle = 0.0001% or less) IDRM Forward Blocking Current VDRM = 100 V, RGK = 1 kΩ IT = 1 A, Ig =10 mA On - State Voltage VT Gate Trigger Voltage VGT VD = 5 V, RGS = 100 Ω Gate Trigger Current IGT VD = 5 V, RGS = 10 kΩ IGR VGR = 5 V Reverse Gate Current IH Holding Current VD = 5 V, RGK = 1 kΩ IRRM Reverse Current (Note 1) VRRM = 30 V, RGK = 1 kΩ ` Switching characteristics (Tc = 25 °C) td Ig = 20 mA, IT = 1 A Delay Time VD = 60 V, IT =1 A, Ig =10 mA Rise Time tr dc < 1% IT = 1.0 A , IR = 1.0 A max, Circuit Commutated Turn—off tq Time RGK = 1 kΩ tpg(on) Ig = 10 mA, IT = 1 A Gate Trigger—on Pulse Width Critical Rate of Rise Off –State Voltage dv/dt VD = 30 V, RGK = 1 kΩ Min. 1.0 15 Typ. Max. Units 1.1 0.5 10 0.01 3.0 1 1.0 1.5 0.75 200 0.1 5.0 10 μA V V μA mA mA mA 20 30 ns 15 25 ns 0.3 0.5 μs 20 50 ns 30 WWW . Microsemi .C OM Parameter V/μs Note 1: Pulse Test intended to guarantee reverse anode voltage capability for pulse commutation. The device should not be operated in the reverse blocking mode on a continuous basic ELECTRICALS Copyright © 2005 7-17-05, Rev D Microsemi 8700 E. Thomas Rd. PO Box 1390, Scottsdale Arizona 85252, 480-941-6300, Fax: 480-947-1503 Page 2 UPGA301Ae3 Nanosecond SCR SWITCH SCOTTSDALE DIVISION WWW . Microsemi .C OM Case: Molded Epoxy Meets UL94V-O at 1/8 inch Weight: 72 milligrams Lead and Mounting Temperature: 260°C max for 10 seconds NOTE: All dimensions are in inches. PACKAGE DATA Copyright © 2005 7-17-05, Rev D Microsemi 8700 E. Thomas Rd. PO Box 1390, Scottsdale Arizona 85252, 480-941-6300, Fax: 480-947-1503 Page 3 UPGA301Ae3 Nanosecond SCR SWITCH SCOTTSDALE DIVISION WWW . Microsemi .C OM NOTES: NOTES Copyright © 2005 7-17-05, Rev D Microsemi 8700 E. Thomas Rd. PO Box 1390, Scottsdale Arizona 85252, 480-941-6300, Fax: 480-947-1503 Page 4