3.5-6.0 GHz Phase Shifter MAPCGM0002-DIE RO-P-DS-3050 A Preliminary Information Features ♦ ♦ ♦ ♦ 6 Bit Phase Shifter 360º Coverage, LSB = 5.6º TTL Control Inputs MSAG™ Process Description The MAPCGM0002-Die is a 6-bit Phase Shifter with Parallel TTL Input Control. This product is fully matched to 50 ohms on both the input and output. The part has 360º of phase coverage with LSB of 5.6º. Primary Applications Fabricated using M/A-COM’s repeatable, high performance and highly reliable GaAs Multifunction Self-Aligned Gate MESFET Process, each device is 100% RF tested on wafer to ensure performance compliance. ♦ Satellite Communication ♦ Phased Array Radar M/A-COM’s MSAG™ process features robust silicon-like manufacturing processes, planar processing of ion implanted transistors, multiple implant capability enabling power, low-noise, switch and digital FETs on a single chip, and polyimide scratch protection for ease of use with automated manufacturing processes. The use of refractory metals and the absence of platinum in the gate metal formulation prevents hydrogen poisoning when employed in hermetic packaging. Electrical Characteristics: TB = 40°C1, Z0 = 50Ω, VEE = -5V Parameter Symbol Typical Units Bandwidth f 3.5 - 6.0 GHz Insertion Loss, Reference State IL 6 dB Input VSWR, All States VSWR 1.5:1 Output VSWR, All States VSWR 1.7:1 RMS Phase Error φRMS 8 º RMS Phase Error, Calibrated φRMS 3 º Peak to Peak Gain Variation, All States ∆G <3 dB Current IEE < 10 mA Input Third Order Intercept ITOI 32 dBm Input 1-dB Compression Point P1dB 26 dBm 1. TB = MMIC Base Temperature 1 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. 3.5-6.0 GHz Phase Shifter MAPCGM0002-DIE RO-P-DS-3050 A Preliminary Information Maximum Operating Conditions 1 Parameter Symbol Absolute Maximum Units Input Power PIN 31 dBm Source Supply Voltage VEE -6.0 V Junction Temperature TJ 180 °C Storage Temperature TSTG -55 to +150 °C 1. Operation outside of these ranges may reduce product reliability. Operation at other than the typical values may result in performance outside the guaranteed limits. Recommended Operating Conditions Characteristic Symbol Min Typ Max Unit -5.2 -5 -4.8 V Logic High 3 5 5 V Logic Low 0 0 0.4 V Source Voltage VEE Control Voltage V control pads Operating Instructions This device is static and light sensitive. Digital circuit operation can be impaired under high intensity light, e.g. microscope light. Please handle with care. To operate the device, follow these steps. 1. Power Up: Apply VEE = -5 V. 2. Apply Logic Voltages to control Circuits as listed in Recommended Operating Conditions 3. Power Down: Set VEE = 0 2 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. 3.5-6.0 GHz Phase Shifter MAPCGM0002-DIE RO-P-DS-3050 A Preliminary Information 6 20 Insertion Loss 18 Input VSWR Output VSWR 5 14 12 4 VSWR Insertion Loss (dB) 16 10 8 3 6 4 2 2 0 1 3.5 4 4.5 5 5.5 6 Frequency (GHz) Figure 1. Reference State Insertion Loss, Input and Output VSWR vs. Frequency 30 Average Error 25 RMS Error 20 Phase Shifter Error (°) RMS Error, Calibrated 15 10 5 0 -5 -10 -15 -20 3.5 4 4.5 5 5.5 6 Frequency (GHz) 3 Figure 2. Phase Shifter Figures of Merit: Average Error vs Reference State, RMS Error and Calibrated RMS Error over All States M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. 3.5-6.0 GHz Phase Shifter MAPCGM0002-DIE RO-P-DS-3050 A Preliminary Information 0 -40 Relative Phase Shift (º) -80 -120 -160 -200 -240 -280 -320 -360 -400 3.5 4.0 4.5 5.0 5.5 6.0 Frequency (GHz) Figure 3. Relative Phase vs. Phase Shifter State 5 4 Gain Variation (dB) 3 2 1 0 -1 -2 -3 -4 -5 3.5 4.0 4.5 5.0 5.5 6.0 Frequency (GHz) Figure 4. Relative Gain Change vs. Phase Shifter State 4 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. 3.5-6.0 GHz Phase Shifter MAPCGM0002-DIE RO-P-DS-3050 A Preliminary Information 6 Input VSWR 5 4 3 2 1 3.5 4.0 4.5 5.0 5.5 6.0 5.5 6.0 Frequency (GHz) Figure 5. Input VSWR vs. Phase Shifter State 6 Output VSWR 5 4 3 2 1 3.5 4.0 4.5 5.0 Frequency (GHz) 5 Figure 6. Output VSWR vs. Phase Shifter State M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. 3.5-6.0 GHz Phase Shifter MAPCGM0002-DIE RO-P-DS-3050 A Preliminary Information Mechanical Information Chip Size: 3.816 x 1.354 x 0.075 mm (150 x 53 x 3 mils) 3.816mm. 3.674mm. 2.375mm. 2.194mm. 1.994mm. 1.781mm. 1.594mm. 1.394mm. 1.183mm. 0.139mm. 1.354mm. GND:G GND:G GND:G GND:G GND:G P180 P90 P45 VEE P22 G ND:G P11 P5P6 1.200mm. GND:G GND:G 8 = 8 10 96 W = = i S n 18 Le = r r Le = S n 18 W = = i = 8 1096 8 W=8 S= 8 Len = 320 r = 18i r = 18i Len = 320 S=8 W=8 r = 18i Len = 320 S=8 W=8 W=8 S=8 Len = 320 r = 18i G : D NG W=8 S=8 Len = 320 i r = 18 G: DNG W=8 S=8 Len = 320 r = 18i OUT IN 0.843mm. GND:G r = 18i Len = 3009 S=8 W=8 r Le = S n 25 W = = i = 8 1830 8 8 30 = 8 W = = 18i S n 25 Le = r W=8 S=8 Len = 3009 r = 18i GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G GND:G r = 12.5 i Len = 1479 S=8 W=8 W=8 S=8 Len = 3009 r = 18i r = 12.5 i Len = 3589 S=8 W=8 W=8 S=8 Len = 4175 r = 25i 8 = 8 975 W = = .5 S n 12 i Le = r r Le = i S n 12 W = = 97 .5 = 8 5 8 89 X 5. 79 Fp 68. 2 GND:G =8 W =8 79 S n = 14 i .5 Le 12 r = r = Le 12 i S n = 14.5 79 W =8 =8 2.86 pF 97.5 X 98 0.818mm. G : D NG G : D NG G: DNG G : D NG G: DNG G: DNG 0 0 Figure 7. Die Layout Bond Pad Dimensions Pad Size (µm) Size (mils) RF In and Out 100 x 200 4x8 DC Supply Voltage VEE 125 x 125 5x5 DC Control Voltage VC 125 x 125 5x5 6 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. 3.5-6.0 GHz Phase Shifter MAPCGM0002-DIE RO-P-DS-3050 A Preliminary Information VEE 0.1 µF 100 pF GND:G GND:G GND:G GND:G P90 P180 P45 VEE P11 P22 P5P6 GND:G GND:G GND:G W=8 S=8 Len = 320 r = i18 r = i18 Len = 320 S=8 W=8 Lr S en=i W = =1 2. = 8 975 8 5 8 75 = 8 9 .5 W = n =12 S Le =i r GND:G r = 18 i Len = 3009 S=8 W=8 30 30 8 = 8 18 W = n =i25 S Le = r GND:G GND:G GND:G GND:G W=8 S=8 Len = 3009 i r = 18 W=8 S=8 Len = 3009 r = 18 i r = i12.5 Len = 3589 S=8 W=8 W=8 S=8 Len = 4175 r = 25 i GND:G GND:G r = i12.5 Len = 1479 S=8 W=8 GND:G GND:G G : DNG GND:G 89 X 5. 79 Fp 68. 2 GND:G GND:G Lr S en= W = =i2 5 = 8 18 8 r = i18 Len = 320 S=8 W=8 W=8 S=8 Len = 320 r = i18 G : DNG W=8 S=8 Len = 320 r = i18 G : DNG 79 =8 W = 8= 14 S n i 12.5 Le = r r Le = S n i 12.5 W = 8= 14 =8 79 2.86 pF 97.5 X 98 RFOUT OUT IN W=8 S=8 Len = 320 r = i18 6 96 8 = 8 10 WS = =i18 = Len r Ler = WS = n =i18 = 8 1 09 8 RFIN GND:G CONTROL INPUTS G : DNG G : DNG G : DNG G : DNG G : DNG Figure 8. Recommended bonding diagram for pedestal mount. Support circuitry typical of MMIC characterization. Assembly Instructions: Die attach: Low thermal conductivity silver epoxies are acceptable for die attach of this MMIC. Follow the manufacturer’s instructions. If solder is employed , use AuSn (80/20) 1-2 mil preform solder. Limit time @ 300 °C to less than 5 minutes. Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques. For DC and RF pad connections, use either ball or wedge bonds. For best performance, especially above 10 GHz, wedge bonds of shortest length employed on the RF interconnects is preferred over ball bonds. 7 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information.