Switch, Single-Pole, Double-Throw 2.0—8.0 GHz MASWGM0003-DIE 903231 — Preliminary Information Features ♦ ♦ ♦ ♦ ♦ ♦ 2.0-8.0 GHz Operation 3 dB Insertion Loss Non-Reflective TTL Control Excellent Match on Off Port MSAG™ Process Description The MASWGM0003-DIE is a single-pole, double-throw switch that is fully matched to 50 ohms on both the input and output. Fabricated using M/A-COM’s repeatable, high performance and highly reliable GaAs Multifunction Self-Aligned Gate (MSAG™) Process, each device is 100% RF tested on wafer to ensure performance compliance. M/A-COM’s MSAG™ process features robust silicon-like manufacturing processes, planar processing of ion implanted transistors, multiple implant capability enabling power, low-noise, switch and digital FETs on a single chip, and polyimide scratch protection for ease of use with automated manufacturing processes. The use of refractory metals and the absence of platinum in the gate metal formulation prevents hydrogen poisoning when employed in hermetic packaging. Primary Applications ♦ ♦ ♦ ♦ ♦ Test Equipment and Instrumentation Electronic Warfare Weather and Military Radar Point to Point Communications VSAT Electrical Characteristics: TB = 25°C1, Z0 = 50Ω, VEE = -5V Parameter Symbol Typical Units Bandwidth f 2.0-8.0 GHz Insertion Loss @ 4 GHz IL 1.6 dB Insertion Loss @ 8 GHz IL 3.0 dB Isolation ISO > 45 dB Input VSWR VSWR 1.6:1 Output VSWR (On) VSWR 1.7:1 Output VSWR (Off) VSWR 1.7:1 Input Third Order Intercept ITOI 35 dBm Input 1-dB Compression Point P1dB 26 dBm 1. TB = MMIC Base Temperature 1 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. Switch, Single-Pole, Double-Throw 2.0—8.0 GHz MASWGM0003-DIE 903231 — Preliminary Information Maximum Operating Conditions 2 Parameter Symbol Absolute Maximum Units Input Power PIN 31 dBm Digital Driver Voltage VEE -6.0 V Junction Temperature TJ 180 °C Storage Temperature TSTG -55 to +150 °C 2. Operation outside of these ranges may reduce product reliability. Operation at other than the typical values may result in performance outside the guaranteed limits. Recommended Operating Conditions Characteristic Symbol Min Typ Max Unit Digital Driver Voltage VEE -5.2 -5 -4.8 V Digital Driver Current IEE 3 5 10 mA TTL Path Selection3 Logic Level Characteristic (@ Pad A) Min Typ Max Unit Com-Out1 Logic High 3.0 5.0 5.0 V Com-Out2 Logic Low 0 0 0.4 V 3. Voltage Levels valid from –55ºC to +150º Base Temperature for VEE=-5V. Operating Instructions This device is static and light sensitive. Digital circuitry operation can be impaired under high intensity light, e.g. microscope light. Please handle with care. To operate the device, follow these steps. 1. Power Up: Apply VEE = -5 V. 2. Apply Logic Voltages to control Circuits as listed in Recommended Operating Conditions 3. Power Down: Set VEE = 0 2 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. Switch, Single-Pole, Double-Throw 2.0—8.0 GHz MASWGM0003-DIE 903231 — Preliminary Information 6 10 80 Insertion Loss Isolation Input VSWR On 9 Output VSWR On Output VSWR Off 5 8 70 7 4 6 60 5 3 4 50 3 2 2 40 1 0 1 2 3 4 5 6 7 Frequency (GHz) Figure 1. Input and Output VSWR vs. Frequency 8 30 2 3 4 5 6 7 8 Frequency (GHz) Figure 2. Insertion Loss and Isolation vs. Frequency 3 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. Switch, Single-Pole, Double-Throw 2.0—8.0 GHz MASWGM0003-DIE 903231 — Preliminary Information Mechanical Information Chip Size: 2.054 x 1.294 x 0.075 mm (81 x 51 x 3) 2.054mm. 1.919mm. 1.030mm. 0.825mm. 0.149mm. 1.294mm. 1.148mm. A VEE OUT 2 OUT 1 0.747mm. 0.155mm. 0.747mm. COM 0 1.030mm. 0 Figure 3. Die Layout Bond Pad Dimensions Pad Size (μm) Size (mils) RF: COMMON, OUT1, OUT2 125 x 125 5x5 Digital Driver Voltage VEE 125 x 125 5x5 A (TTL Control) 125 x 125 5x5 4 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. Switch, Single-Pole, Double-Throw 2.0—8.0 GHz MASWGM0003-DIE 903231 — Preliminary Information Assembly and Bonding Diagram VEE 0.1 μF 100 pF TTL VEE A OUT 1 OUT 2 COM Figure 4. Recommended bonding diagram for pedestal mount. Support circuitry typical of MMIC characterization. Assembly Instructions: Die attach: Low thermal conductivity silver epoxies are acceptable for die attach of this MMIC. Follow the manufacturer’s instructions. If solder is employed, use AuSn (80/20) 1 mil preform solder. Limit time @ 300 °C to less than 5 minutes. Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques. For DC and RF pad connections, use either ball or wedge bonds. For best performance, especially above 10 GHz, wedge bonds of shortest length employed on the RF interconnects is preferred over ball bonds. 5 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information.