TI TRF4000

TRF4000
PCS RF DOWNCONVERTER
SLWS050 – MAY 1999
D
D
D
D
D
D
Downconverter for 1.9-GHz CDMA
Applications
0.5-Micron GaAs MESFET Technology
Operates from 2.7-V to 3.3-V Supply
High Third-Order Intercept Point Mixer
On-Chip Buffer Amplifier to Minimize Mixer
Drive Requirements
14-Pin Plastic Surface-Mount TSSOP
PowerPAD (PWP)
PWP PACKAGE
(TOP VIEW)
NC
NC
MIXERIN
VDD
LO_IN
NC
NC
1
2
3
4
5
6
7
14
13
12
11
10
9
8
NC
NC
IFOUT/VDD
NC
IFXOUT/VDD
VDD
NC
NC – No internal connection
description
The TRF4000 personal communications system (PCS) RF downconverter is a gallium arsenide (GaAs)
integrated circuit housed in a 14-pin plastic surface-mount, thin-shrink small outline package (TSSOP). It is
suitable for 1.9-GHz code-division multiple-access (CDMA) applications and is composed of a local oscillator
(LO) buffer amplifier, an RF preamplifier, a mixer, and a differential IF amplifier.
These devices have no built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the gates.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments Incorporated.
Copyright  1999, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
TRF4000
PCS RF DOWNCONVERTER
SLWS050 – MAY 1999
functional block diagram
Mixer
MIXERIN
12
3
RF
Preamplifier
VDD
LO_IN
IFOUT/VDD
10
IFXOUT/VDD
IF Amplifier
4
LO Buffer
Amplifier
5
application circuit
C3
L2
L1
MIXERIN
14
2
13
VDD
C4 C6
L5
C1
LO_IN
5
L4
C1 = .01 µF
C2 = .01 µF
C3 = .01 µF
C4 = 5 pF
C5 = 5 pF
C6 = 100 pF
C7 = 100 pF
C8 = 1.5 pF
C9 = 1.5 pF
C7
L3
10
6
9
7
8
C5
VDD
C2
B. Backside must be connected to ground.
POST OFFICE BOX 655303
C8
C9
L8
IFXOUT/VDD
L6
NOTES: A. All ports matched to 50 Ω
2
L7
IFOUT/VDD
12
TRF4000
11
4
3
VDD
L1 = 10 nH
L2 = 8.2 nH
L3 = 6.8 nH
L4 = 6.8 nH
L5 = 150 nH
L6 = 150 nH
L7 = 150 nH
L8 = 150 nH
1
• DALLAS, TEXAS 75265
TRF4000
PCS RF DOWNCONVERTER
SLWS050 – MAY 1999
Terminal Functions
TERMINAL
NAME
NO.
I/O
DESCRIPTION
MIXERIN
3
I
Mixer input
LO_IN
5
I
Local oscillator input
IFOUT/VDD
IFXOUT/VDD
12
I/O
Intermediate frequency in-phase output (+) and connection to VDD
10
I/O
Intermediate frequency quadrature output (–) and connection to VDD
1, 2, 6, 7,
8, 11, 13,
14
NC
VDD
4, 9
No internal connection
I
Supply Voltage
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.7 V to 5 V
Input power, MIXERIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 dBm
LO_IN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 dBm
Continuous power dissipation at or below TA = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150 mW
Operating free-air temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 30°C to 80°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
recommended operating conditions
Supply voltage, VDD
Operating free-air temperature, TA
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MIN
MAX
2.7
3.3
UNIT
V
– 30
80
°C
3
TRF4000
PCS RF DOWNCONVERTER
SLWS050 – MAY 1999
electrical characteristics over recommended operating free-air temperature range,
VDD = 2.7 V, fIF = 185 MHz
mixer
PARAMETER
TEST CONDITIONS
MIN
Input frequency range (MIXERIN)
1930
Local oscillator frequency range (LO_IN)
2115
Intermediate frequency (IFOUT, IFXOUT)
TYP†
MAX
UNIT
1990
MHz
2175
MHz
185
Gain
10.5
Noise figure
12
9.7
Input VSWR (MIXERIN) (see Note 1)
50 Ω
Differential output impedance (IFOUT, IFXOUT)
20 mA required to
achieve mixer current
Input 1-dB gain compression point (MIXERIN)
MHz
13.5
dB
10.7
dB
1.5:1
Ω
330
–11
fLO = 2145 MHz,
fRF = 1960 MHz
Input third-order intercept point (MIXERIN)
Input power (LO_IN)
dBm
– 2.1
0.5
– 12.5
– 10.5
Input VSWR (LO_IN) (see Note 1)
† Typical values are at TA = 25°C.
NOTE 1: VSWR = Voltage standing wave ratio
dBm
– 8.5
dBm
1.7:1
current consumption over recommended operating free-air temperature range and VDD = 2.7 V
MIN
Total current consumption
† Typical values are at TA = 25°C.
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TYP†
MAX
30
35
UNIT
mA
TRF4000
PCS RF DOWNCONVERTER
SLWS050 – MAY 1999
APPLICATION INFORMATION
NOISE FIGURE
vs
SUPPLY VOLTAGE
NOISE FIGURE
vs
LO FREQUENCY
11
11.5
80°C
10.5
11
2.7V VDD
–10.5 dBm LO Drive
NF – Noise Figure – dB
NF – Noise Figure – dB
80°C
10.5
10
25°C
9.5
9
–30°C
8.5
10
25°C
9.5
9
8
7.5
7
2.7
8
2145 MHz LO Frequency
–10.5 dBm LO Drive
3.0
VDD – Supply Voltage – V
7.5
7
2115
3.3
Figure 1
9
14.5
14
80°C
80°C
13.5
G – Gain – dB
NF – Noise Figure – dB
10
2175
GAIN
vs
SUPPLY VOLTAGE
2145 MHz LO Frequency
2.7V VDD
11
2145
fLO – LO Frequency – MHz
Figure 2
NOISE FIGURE
vs
LO DRIVE LEVEL
12
–30°C
8.5
25°C
–30°C
13
25°C
12.5
12
–30°C
11.5
11
8
10.5
7
–12.5
–10.5
PLO – LO Drive Level – dBm
–8.5
10
2.7
Figure 3
2145 MHz LO Frequency
–10.5 dBm LO Drive
3.0
VDD – Supply Voltage – V
3.3
Figure 4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
TRF4000
PCS RF DOWNCONVERTER
SLWS050 – MAY 1999
APPLICATION INFORMATION
GAIN
vs
LO DRIVE LEVEL
GAIN
vs
LO FREQUENCY
14
14
80°C
13.5
80°C
13
25°C
25°C
12.5
G – Gain – dB
G – Gain – dB
13
12
–30°C
11.5
12
–30°C
11
11
10
10.5
10
2115
2.7V VDD
–10.5dBm LO Drive
2145
fLO – LO Frequency – MHz
2145 MHz LO Frequency
2.7V VDD
2175
9
–12.5
Figure 5
6
–10.5
PLO – LO Drive Level – dBm
Figure 6
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• DALLAS, TEXAS 75265
–8.5
TRF4000
PCS RF DOWNCONVERTER
SLWS050 – MAY 1999
MECHANICAL DATA
PWP (R-PDSO-G**)
PowerPAD PLASTIC SMALL-OUTLINE PACKAGE
20-PIN SHOWN
0,30
0,19
0,65
20
0,10 M
11
Thermal Pad
(See Note C)
4,50
4,30
0,15 NOM
6,60
6,20
Gage Plane
1
10
0,25
A
0°– 8°
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
14
16
20
24
28
A MAX
5,10
5,10
6,60
7,90
9,80
A MIN
4,90
4,90
6,40
7,70
9,60
DIM
4073225/E 03/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane. This solderable pad
is electrically and thermally connected to the backside of the die and possibly selected leads. The maximum pad size on the printed
circult board should be equal to the package body size – 2,0mm.
PowerPAD is a trademark of Texas Instruments Incorporated.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
IMPORTANT NOTICE
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright  1999, Texas Instruments Incorporated