TQM713019 Data Sheet 3V HBT GaAs CDMA 4x4mm Power Amplifier Module Features Functional Block Diagram Vref 1 10 GND 9 GND Vmode 2 GND 3 8 RFout RFin 4 7 GND Vcc1 5 6 Vcc2 1 Bit Bias Control • • • • • • • • • • • Product Description The TQM713019 is a 3V, 2 stage GaAs HBT Power Amplifier Module designed for use in mobile phones. Its extremely small 4x4mm package makes it ideal for today’s compact data enabled phones. Its RF performance meets the requirements for products designed to IS-95/98 standards. The TQM713019 is designed on TriQuint’s advanced InGaP HBT GaAs technology offering state of the art reliability, temperature stability, and ruggedness. Selectable bias mode and a shutdown mode with low leakage current improves talk and standby time. The output match, realized within the module package, optimizes efficiency/linearity at maximum rated output power. The module is a 4x4mm land grid array with backside ground. The TQM713019 is footprint compatible with industry standard 4x4mm CDMA PA modules. InGaP HBT Technology High Efficiency: 41% CDMA Low Leakage Current: < 1uA Low Icq = 55mA Supports new chipsets with Vref @ 2.6V Capable of running as 0-bit PA in low bias mode to 28dBm Optimized for 50Ω system Small 10 pin 4x4mm module Excellent Rx band noise performance CDMA 1XRTT, 1XEV-DO compliant Full ESD protection Applications • • IS-95 / CDMA2000 Single mode, dual mode, and tri mode CDMA/AMPS phones Package Style 4mm x 4mm LGA package Electrical Specifications Parameter Min Frequency CDMA mode maximum Typ 824 Pout1 Max Units 849 MHz 28 dBm Gain 29 dB CDMA ACPR 50 dBc CDMA ALTR 65 dBc Power Supply Current @ 28dBm 450 mA IREF 2.0 mA Rx Band Noise -140 dBm/Hz Note 1 : CDMA Mode: VCC1=3.4VDC, VCC2=3.4VDC, VREF =2.85VDC, Tc=25°C Data Sheet: Subject to change without notice For additional information and latest specifications, see our website: www.triquint.com Rev. D, March 2005 1 TQM713019 Data Sheet 3V HBT GaAs CDMA 4x4mm Power Amplifier Module Absolute Maximum Ratings Symbol Parameter Absolute Maximum Value Units PIN RF Input Power 10 dBm VCC Supply Voltage 0.0 to 5.0 VDC VREF Reference Voltage 0.0 to 3.5 VDC VMODE Vmode (1 bit Bias Control) 0.0 to 3.5 VDC TCASE Case Operating Temperature -40 to +100 °C TSTORE Storage Temperature -55 to +150 °C Note: The part may not survive all maximums applied simultaneously. Recommended Operating Conditions Symbol Parameter Min. Typ/Nom Max. Units VCC Supply Voltage 3.2 3.4 4.2 VDC VREF Reference Voltage PA On 2.70 2.85 2.95 VDC PA Off 0 <0.5 - VDC High Bias Mode 0 - 0.5 VDC Low Bias Mode 2.5 2.85 3.0 VDC -30 25 +85 ºC VMODE TCASE Vmode (1 bit Bias Control) Case Operating Temperature Power Range Truth Table Parameter VREF VMODE Range High Power 2.85 V Low 16 dBm – 28 dBm Low Power 2.85 V High < 16 dBm Shut Down 0.0 V Low - Data Sheet: Subject to change without notice For additional information and latest specifications, see our website: www.triquint.com Rev. D, March 2005 2 TQM713019 Data Sheet 3V HBT GaAs CDMA 4x4mm Power Amplifier Module CDMA (IS-98C) Electrical Characteristics1 Parameter Conditions RF Frequency Typ/Nom 824 Large Signal Gain Max. Units 849 MHz 33 dB VCC = 3.2 to 4.2V; VREF = 2.85V; -30 ºC < Temp < 85ºC Pout = +28 dBm Pout = +16 dBm Adjacent Channel Power Min. (ACPR1)2 25 29 23 27 dB VCC = 3.2 to 4.2V; VREF = 2.85V; -30 ºC < Temp < 85ºC +16dBm ≤ Pout ≤ +28dBm -50 -45 dBc Pout ≤ +16dBm -52 -45 dBc +16dBm ≤ Pout ≤ +28dBm -60 -57 dBc Pout ≤ +16dBm -65 -57 dBc Adjacent Channel Power (ACPR2)2 VCC = 3.2 to 4.2V; VREF = 2.85V; -30 ºC < Temp < 85ºC Quiescent Current VCC = 3.4V; VREF = 2.85V; VMODE = 2.85V ; Temp = 25 ºC 55 IREF Pout = +28dBm; VCC = 3.4V; VREF = 2.85V; VMODE = 0V; 2 mA 3 mA 75 uA Temp = 25ºC IMODE All Conditions PAE Pout = +28dBm; VCC = 3.4V; VRE F = 2.85V; VMODE = 0V; 41 % 9.5 % Temp = 25ºC PAE Pout = +16dBm; VCC = 3.4V; VRE F = 2.85V; VMODE = 2.85V; Temp = 25ºC Input VSWR All Terminals 1.5 :1 2.0 :1 Harmonics Pout ≤ +28dBm 2fo -50 -40 dBc 3fo -65 -40 dBc -65 dBc -135 dBm/Hz Spurious / Stability Pout ≤ +28dBm; 10:1 VSWR; VCC = 3.2 to 4.2V; -30 ºC < Temp < 85ºC Ruggedness 10:1 VSWR; Pin = +10dBm; -30 ºC < Temp < 85ºC Noise Power in Rx Band Pout = +28dBm, IS-95 Standard Note 1: Test Conditions: VCC=3.4VDC , VREF=2.85VDC, TC = 25°C unless otherwise specified; TriQuint Test Board Note 2: ACPR1 Measured @ ± 885kHz Offset; ACPR2 Measured @ ± 1.98MHz Data Sheet: Subject to change without notice For additional information and latest specifications, see our website: www.triquint.com Rev. D, March 2005 No degradation -140 3 TQM713019 Data Sheet 3V HBT GaAs CDMA 4x4mm Power Amplifier Module cdma2000 (IS-98D) Electrical Characteristics1,3 Parameter Conditions RF Frequency Typ/Nom 824 Large Signal Gain Max. Units 849 MHz VCC = 3.2 to 4.2V; VREF = 2.85V; -30 ºC < Temp < 85ºC Pout = +27.5 dBm Pout = +16 dBm Adjacent Channel Power Min. (ACPR1)2 25 28.5 dB 23 27 dB VCC = 3.2 to 4.2V; VREF = 2.85V; -30 ºC < Temp < 85ºC +16dBm ≤ Pout ≤ +27.5dBm -50 -45 dBc Pout ≤ +16dBm -55 -45 dBc +16dBm ≤ Pout ≤ +27.5dBm -60 -57 dBc Pout ≤ +16dBm -65 -57 dBc Adjacent Channel Power (ACPR2)2 VCC = 3.2 to 4.2V; VREF = 2.85V; -30 ºC < Temp < 85ºC Quiescent Current VCC = 3.4V; VREF = 2.85V; VMODE = 2.85V ; Temp = 25 ºC 55 IREF Pout = +27.5dBm; VCC = 3.4V; VREF = 2.85V; VMODE = 0V; 2 mA 3 mA 75 uA Temp = 25ºC IMODE All Conditions PAE Pout = +27.5dBm; VCC = 3.4V; VRE F = 2.85V; VMODE = 0V; 40 % 9.5 % Temp = 25ºC PAE Pout = +16dBm; VCC = 3.4V; VRE F = 2.85V; VMODE = 2.85V; Temp = 25ºC Input VSWR All Terminals 1.5 :1 2.0 :1 Noise Power in Rx Band Pout = +28dBm, IS-95 Standard -140 -135 dBm/Hz Typ/Nom Max. Units 849 MHz Note 1: Test Conditions: VCC=3.4VDC , VREF=2.85VDC, TC = 25°C unless otherwise specified; TriQuint Test Board Note 2: Note 3: ACPR1 Measured @ ± 885kHz Offset; ACPR2 Measured @ ± 1.98MHz 9600 bps Fundamental and Supplemental Traffic Channels (0 dB), peak-to-average ratio (CCDF=1%) = 4.5dB AMPS Mode Electrical Characteristics1 Parameter Conditions RF Frequency Min. 824 High Power Output, Pout 31.5 dBm Large Signal Gain 27.5 dB 57 % PAE Note 1: Pout = 31.5dBm; VCC = 3.4V; Temp = 25ºC 50 Test Conditions: VCC=3.4VDC , VREF=2.85VDC, TC = 25°C unless otherwise specified; TriQuint Test Board Data Sheet: Subject to change without notice For additional information and latest specifications, see our website: www.triquint.com Rev. D, March 2005 4 TQM713019 Data Sheet 3V HBT GaAs CDMA 4x4mm Power Amplifier Module Pin Out and Assignments Vref 1 Vmode 2 GND 10 GND 9 GND 3 8 RFout RFin 4 7 GND Vcc1 5 6 Vcc2 1 Bit Bias Control Pin Symbol Description 1 VREF Regulated voltage for bias setting. VREF is set to 0VDC to power off the TQM713019 2 VMODE 1 step bias control 3 GND Ground 4 RFIN RF input. The RF circuit is DC grounded internally2. 50 Ohm RF impedance. 5 VCC1 Collector voltage for input stage 6 VCC2 Collector voltage for output stage 7 GND Ground 8 RFOUT RF output. The RF circuit is DC blocked internally. 50 Ohm RF impedance 9 GND Ground 10 GND Ground Paddle1 GND Device ground and thermal path for heat removal Note 1: TriQuint recommends the use of several via holes to the backside ground under the paddle Note2: Internal DC ground for RFIN RFin Data Sheet: Subject to change without notice For additional information and latest specifications, see our website: www.triquint.com Rev. D, March 2005 5 TQM713019 Data Sheet 3V HBT GaAs CDMA 4x4mm Power Amplifier Module Typical Performance Test Conditions (Unless Otherwise Specified): VCC=3.4VDC, VREF=2.85VDC, VMODE= 0 or 2.85VDC, POUT=28.0 or 16dBm PAE @ 836MHz (IS-95 CDMA) Icc @ 836MHz (IS-95 CDMA) 600 50.0 500 40.0 - 30C 25C 85C 300 - 30C PAE (%) Icc (mA) 400 25C 30.0 85C 20.0 200 10.0 100 0.0 0 0 2 4 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 Pout (dBm ) ALTR @ 836MHz (IS-95 CDMA) ACPR @ 836MHz (IS-95 CDMA) -50 -40 -55 - 30C -45 - 30C ALTR (dBc) 25C ACPR (dBc) 6 8 10 12 14 16 18 20 22 24 26 28 Pout (dBm ) 85C -50 -55 -60 25C -60 85C -65 -70 -75 -65 -80 -70 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 Pout (dBm ) Data Sheet: Subject to change without notice For additional information and latest specifications, see our website: www.triquint.com Rev. D, March 2005 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 Pout (dBm ) 6 TQM713019 Data Sheet 3V HBT GaAs CDMA 4x4mm Power Amplifier Module Typical Performance (Continued) PAE @ Pout = 28dBm (IS-95 CDMA) Gain @ 836MHz (IS-95 CDMA) 30 50.0 500 48.0 475 28 -30C 25C 85C 22 20 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 Pout (dBm ) 44.0 42.0 400 40.0 375 38.0 824 6.0 120 85C 4.0 110 25C -30C 2.0 824 829 834 839 Freq (MHz) 844 Data Sheet: Subject to change without notice 100 849 For additional information and latest specifications, see our website: www.triquint.com Rev. D, March 2005 ACPR (dBc) 130 Icc (mA) PAE (%) 140 8.0 829 834 839 Freq (MHz) 844 350 849 ACPR and ALTR @ Pout = 28dBm (IS-95 CDMA) 150 10.0 425 -30C PAE @ Pout = 16dBm (IS-95 CDMA) 12.0 25C -44 -50 -46 -52 -48 -54 -50 -56 -52 -58 -54 -60 -56 -62 -58 -64 -30C -60 85C -66 -62 25C -68 -64 824 829 834 839 Freq (MHz) 844 ALTR (dBc) 24 450 85C Icc (mA) PAE (%) Gain (dB) 46.0 26 -70 849 7 TQM713019 Data Sheet 3V HBT GaAs CDMA 4x4mm Power Amplifier Module -60 -46 -62 31 34 -48 -64 30 33 -50 -66 -52 -68 -54 -70 -56 -72 -58 -74 -30C High Power Gain (dB) -44 Gain @ Pout = 16dBm and 28dBm (IS-95 CDMA) 35 32 ALTR (dBc) ACPR (dBc) ACPR and ALTR @ Pout = 16dBm (IS-95 CDMA) 32 29 31 28 27 85C 30 26 25C 29 -30C 25 28 -60 85C -76 24 27 -62 25C -78 23 26 -64 824 829 834 839 Freq (MHz) 844 Data Sheet: Subject to change without notice -80 849 For additional information and latest specifications, see our website: www.triquint.com Rev. D, March 2005 22 824 829 834 839 Freq (MHz) 844 25 849 8 Low Power Gain (dB) Typical Performance (Continued) TQM713019 Data Sheet 3V HBT GaAs CDMA 4x4mm Power Amplifier Module Application Information; tuning procedures; board layout precautions TriQuint offers our customers the below evaluation board as a means for testing and analysis of TQM713019. The evaluation board schematic and picture are provided for preliminary analysis and design. Figure 1 shows the TriQuint application board, while Figure 2 shows the schematic of the board. 1 10 Pin # Function 1 No Connect 2 Vmode, High/low Bias Mode 3 Vref, Reference Voltage 4 Vcc1, 1st Stage Collector Voltage 5 GND, DC Ground 6 7 Vcc2, 8 Vcc2, 2nd Stage Collector Voltage 9 GND, DC Ground 10 GND, DC Ground OUT IN GND, DC Ground 2nd Stage Collector Voltage Figure 1: Evaluation Board Vref Vref Vmode Vmode 10000 pF GND RFin RFin Vcc1 Vcc1 100000 pF TQM713019 10000 pF GND GND RFout RFout GND Vcc2 Vcc2 10uF 100000 pF 10uF GND @ PADDLE Figure 2: Evaluation Board Schematic Data Sheet: Subject to change without notice For additional information and latest specifications, see our website: www.triquint.com Rev. D, March 2005 9 TQM713019 Data Sheet 3V HBT GaAs CDMA 4x4mm Power Amplifier Module PC Board Layout Recommendations T J U K D S N M E DIMENSION D E J K M N S T U MM 3.85 4.30 0.68 0.45 0.85 1.90 3.80 2.00 1.00 Note1: Only ground signal traces are allowed directly under the package Note 2: Primary dimensions are in millimeters alternate dimensions are in inches. Data Sheet: Subject to change without notice For additional information and latest specifications, see our website: www.triquint.com Rev. D, March 2005 10 TQM713019 Data Sheet 3V HBT GaAs CDMA 4x4mm Power Amplifier Module Packaging and Ordering Information Package Type: 10 Pin Plastic Module Package Pin 1 10 2 9 3 8 4 7 5 6 Top View Side View DESIGNATION DESCRIPTION DIMENSION A OVERALL HEIGHT 1.5 +/-0.12 mm D PACKAGE LENGTH 4.0 +/-0.1 mm E PACKAGE WIDTH 4.0 +/-0.1 mm J SOLDER MASK OPENING LENGTH AND 0.575 +/-0.075 mm WIDTH 5 6 4 7 3 8 2 9 1 10 K METAL PAD LENGTH AND WIDTH 0.40 +/-0.05 mm P DISTANCE BETWEEN METAL PAD AND PACKAGE EDGE 0.10 +/-0.025 mm T S R GND SOLDER MASK OPENING WIDTH GND SOLDER MASK OPENING LENGTH DISTANCE BETWEEN GND SOLDER MASK OPENING AND PACKAGE EDGE 2.00 3.80 0.10 +/-0.05 mm +/-0.05 mm +/-0.1 mm Q DISTANCE BETWEEN GND SOLDER MASK OPENING AND PACKAGE EDGE 1.00 +/-0.1 mm e TERMINAL PITCH FOR TERMINAL 1-10, 2-9, 3-8, 4-7 AND 5-6 3.400 mm e1 TERMINAL PITCH FOR TERMINAL 1-2-3- 0.850 4-5 AND 6-7-8-9-10 mm Note: GND SOLDER MASK OPENING IS NOT CENTERED ON THE PACKAGE Bottom View Data Sheet: Subject to change without notice For additional information and latest specifications, see our website: www.triquint.com Rev. D, March 2005 11 TQM713019 Data Sheet 3V HBT GaAs CDMA 4x4mm Power Amplifier Module Package Marking 713019 YYWW XXXX Top View 10 1 9 2 8 3 7 4 6 5 Bottom View WHITE INK OR LASER MARK Line 1: Part Number: 713019 Line 2: YYWW = Year and Work Week Line 3: XXXX = TriQuint assembly lot number Data Sheet: Subject to change without notice For additional information and latest specifications, see our website: www.triquint.com Rev. D, March 2005 12 TQM713019 Data Sheet 3V HBT GaAs CDMA 4x4mm Power Amplifier Module Tape & Reel PART CAVITY DISTANCE BETWEEN CENTERLINE COVER TAPE CARRIER TAPE FEATURE LENGTH WIDTH DEPTH PITCH CAVITY TO PERFORATION LENGTH DIRECTION CAVITY TO PERFORATION WIDTH DIRECTION WIDTH WIDTH Data Sheet: Subject to change without notice For additional information and latest specifications, see our website: www.triquint.com Rev. D, March 2005 SYMBOL A0 B0 K0 P1 P2 SIZE (in) SIZE (mm) 0.171 4.35 0.171 4.35 0.071 1.80 0.315 8.00 0.079 2.00 F 0.217 5.50 C W 0.362 0.472 9.20 12.00 13 TQM713019 Data Sheet 3V HBT GaAs CDMA 4x4mm Power Amplifier Module SOIC-8, QSOP 16, MSOP 08 & 10, TSSOP 16, HP VFQFP-N 4X4 & 5X5, VQFN-24, VQFN-20. Modules 4X4 13" REEL FEATURE PART FLANGE DIAMETER SIZE (in) SIZE (mm) 12.992 330 0.717 18.2 0.504 12.8 4.016 102.0 0.512 13.0 0.079 2.0 0.787 20.0 HUB THICKNESS SPACE BETWEEN FLANGE OUTER DIAMETER ARBOR HOLE DIAMETER KEY SLIT WIDTH KEY SLIT DIAMETER SYMBOL A W2 W1 N C B D MODULE 4X4 User Direction of Feed Reel Quantity = 2500 units Data Sheet: Subject to change without notice For additional information and latest specifications, see our website: www.triquint.com Rev. D, March 2005 14 TQM713019 Data Sheet 3V HBT GaAs CDMA 4x4mm Power Amplifier Module Additional Information 1T 1 For latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint: Web: Hwww.triquint.comH Tel: (503) 615-9000 Email: [email protected] Fax: (503) 615-8902 For technical questions and additional information on specific applications: Email: [email protected] The information provided herein is believed to be reliable; TriQuint assumes no liability for inaccuracies or omissions. TriQuint assumes no responsibility for the use of this information, and all such information shall be entirely at the user's own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. TriQuint does not authorize or warrant any TriQuint product for use in life-support devices and/or systems. Copyright © 2004 TriQuint Semiconductor, Inc. All rights reserved. Data Sheet: Subject to change without notice For additional information and latest specifications, see our website: www.triquint.com Rev. D, March 2005 15