SKYWORKS SKY77176

ADVANCE DATA SHEET
SKY77176 AutoSmart™ Dual-Band Power Amplifier Module
for CDMA/PCS (824–849 MHz and 1850–1910 MHz)
Applications
Description
• Digital cellular (CDMA)
The SKY77176 AutoSmart™ Power Amplifier Module (PAM) is a fully matched, 12-pin surface mount
module developed for Code Division Multiple Access (CDMA) / Personal Communications Services
(PCS) and Wireless Local Loop (WLL) applications.
• Personal Communications
Services (PCS)
• Wireless local loop (WLL)
Features
• Low voltage positive bias
supply
- 3.2 V to 4.2 V
• Low VREF
- 2.85 V, nominal
• Low IREF
- less than 1 mA
• Good linearity
• High efficiency
• Large dynamic range
• 12-pin package
- 3 mm x 5 mm x 1.0 mm
• Power down control
• InGaP
• IS95/CDMA2000/EVDO
AutoSmart™ power amplifier technology internally adjusts the RF transistor bias level throughout the
dynamic operating range to minimize battery current consumption and ensure sufficient linear
performance to meet CDMA system requirements. The result is a significant savings in average
battery current without the complications of a system-supplied mode function signal or analog bias
control. AutoSmart™ response time is more than adequate for RF access probe and discontinuous
transmission operation. Mode control is included to permit high-bias operation (disable AutoSmart™)
during high data transmission using CDMA2000 or 1xEVDO.
This small and efficient module packs full coverage of the 824–849 MHz and 1850–1910 MHz
bandwidths into a single compact package. The device meets the stringent IS95 CDMA linearity
requirements up to and exceeding 28 dBm output power. The single Gallium Arsenide (GaAs)
Microwave Monolithic Integrated Circuit (MMIC) contains all active circuitry in the module. The MMIC
contains on-board bias circuitry, as well as input and interstage matching circuits. Output match to a
50-ohm load is realized off-chip and within the module package to optimize efficiency and power
performance.
The SKY77176 AutoSmart™ PAM is manufactured with Skyworks’ GaAs Heterojunction Bipolar
Transistor (HBT) process that provides for all positive voltage DC supply operation while maintaining
high efficiency and good linearity. Primary bias to the SKY77176 is supplied directly from a three-cell
Ni-Cd, a single-cell Li-Ion, or other suitable battery with an output in the 3.2 to 4.2 volt range. Power
down is accomplished by setting the voltage on the low current reference pin to zero volts. No
external supply side switch is needed as typical “off” leakage is a few microamperes with full primary
voltage supplied from the battery.
Figure 1. Functional Block Diagram
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200409A • Skyworks Proprietary and Confidential information. • Products and product information are subject to change without notice. • November 17, 2007
1
PRELIMINARY DATA SHEET • SKY77176
AUTOSMART™ DUAL-BAND POWER AMPLIFIER MODULE
FOR CDMA/PCS (824–849 MHZ AND 1850–1910 MHZ)
Electrical Specifications
The following tables list the electrical characteristics of the
SKY77176 Power Amplifier. Table 1 lists the absolute maximum
ratings, while Table 2 lists the recommended operating conditions
for achieving the electrical performance listed in Table 4 (CDMA
Cellular) and Table 5 (CDMA PCS). Table 3 presents a truth table
for disable and band selection.
Table 1. Absolute Maximum Ratings 1
Parameter
Symbol
Minimum
Nominal
Maximum
Unit
CW RF Input Power
PIN
—
0.0
7.0
dBm
Supply Voltage
VCC
—
3.4
6.0
Volts
Digital Control Voltage
VMODE
0
2.5
3.0
Volts
VREF
—
2.85
3.0
Volts
TC
TSTG
–30
–55
25
—
+110
+125
°C
Unit
Reference Voltage
Operating
Storage
Case Temperature 2
1
No damage assuming only one parameter is set at limit at a time with all other parameters set at nominal value.
2
Case Operating Temperature refers to the temperature of the GROUND PAD at the underside of the package.
Table 2. Recommended Operating Conditions
Parameter
Symbol
CDMA Cell
Output Power
PO
CDMA PCS
Operating Frequency
CDMA Cell
VMODE Control Range
Data Mode
Nominal
Maximum
—
—
28.0
—
—
28.5
824.0
836.5
849.0
1850.0
1880.0
1910.0
VCC 1
3.2
3.4
4.2
VMODE
3.2
3.4
4.2
—
0.0
0.5
2.5
3.0
—
FO
CDMA PCS
Supply Voltage
Minimum
VMODE
Autobias
dBm
MHz
Volts
Volts
Reference Voltages
VREF_CELL
VREF_PCS
2.75
2.85
2.95
Volts
Case Operating Temperature
TO
–30
+25
+85
°C
1
Recommended minimum VCC for maximum output power is indicated. VCC down to 0.5 V may be used for backed-off output when using DC/DC converter to conserve battery current.
Table 3. Band Select Truth Table
Band Selection
VREF_CELL
VREF_PCS
Cellular
2.85 V
0.0 V
PCS
0.0 V
2.85 V
Power Down (disable)
0.0 V
0.0 V
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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November 17, 2007 • Skyworks Proprietary and Confidential information. • Products and product information are subject to change without notice. • 200409A
AUTOSMART™ DUAL-BAND POWER AMPLIFIER MODULE
FOR CDMA/PCS (824–849 MHZ AND 1850–1910 MHZ)
PRELIMINARY DATA SHEET • SKY77176
Table 4. Electrical Specifications for CDMA Cell Nominal Operating Conditions 1
Characteristics
Symbol
Condition
Minimum
Typical
Maximum
Unit
GLOW
PO_D ≤ 0 dBm
—
21.0
—
GHIGH
PO_D = 28 dBm
—
28.0
—
GP
PO_A = 31 dBm
—
27.0
—
PAED_LOW
PO_D = 16 dBm
—
9
—
PAED_HIGH
PO_D = 28 dBm
—
40
—
PAEa
PO_A = 31 dBm
—
55
—
ICC_LOW
PO_D = 16 dBm
—
130
—
ICC_HIGH
PO_D = 28 dBm
—
450
—
Total Supply Current in Power-down Mode
IPD
VCC = 3.4 V
VREF = 0 V
—
2.0
—
μA
Quiescent Current
ICQ
—
20
—
mA
mA
Digital Mode
Gain Conditions
Analog Mode
Power Added Efficiency
(VCC = 3.4 V)
Digital Mode
Analog Mode
Total Supply Current
Reference Current
Adjacent Channel Power 2,3
Harmonic Suppression
mA
IREF
—
1.0
—
ACP1
—
–49
—
1.98 MHz offset
ACP2
—
–60
—
—
–35
—
—
–55
—
—
–139
—
dBm/Hz
—
4.0
—
dB
Second
f02
Third
f03
RxBN
Noise Figure
NF
Input Voltage Standing Wave Ratio
VSWR
PO_D ≤ 28 dBm
PO_D ≤ 31 dBm
PO_D ≤ 28 dBm
—
Stability (Spurious output)
S
5:1 VSWR
all phases
Ruggedness—No damage 4
Ru
PO_D ≤ 28 dBm
Turn Off Time 5
%
885 kHz offset
Noise Power in RX Band 869-894 MHz
Turn On Time 5
dB
dBc
dBc
2.0:1
—
—
–70.0
dBc
10:1
—
—
VSWR
DC
TONDC
—
40
—
RF
TONRF
—
5
—
DC
TOFFDC
—
40
—
RF
TOFFRF
—
5
—
μs
μs
1
Per Table 2 over dynamic range up to 28 dBm output power, unless otherwise specified.
2
ACP is specified per IS95 as the ratio of the total in-band power (1.23 MHz BW) to adjacent power in a 30 kHz BW.
3
For CDMA2000 test configured as [PCH @ –3.75 dB, DCCH–9600 bps @ 0 dB; SCHO–9600 bps @ 0 dB] and other test configurations that yield a peak-to-average up to 4.5 dB for CCDF = 1%,
up to 1. dB power back off from the maximum listed for IS95 may be required to meet specified maximum ACP performance under worst-case conditions.
4
All phases, time = 10 seconds.
5
TONDC is time required to reach stable quiescent bias (±10%) after VREF is switched high.
TOFFDC is time required for battery to decrease to < 100 μA after VREF is switched low.
After ICQ is stable, The TONRF is time to reach final output power (±1 dB) once RF input is applied.
TOFFRF is time required for PO to drop 30 dB once RF input is removed.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200409A • Skyworks Proprietary and Confidential information. • Products and product information are subject to change without notice. • November 17, 2007
3
PRELIMINARY DATA SHEET • SKY77176
AUTOSMART™ DUAL-BAND POWER AMPLIFIER MODULE
FOR CDMA/PCS (824–849 MHZ AND 1850–1910 MHZ)
Table 5. Electrical Specifications for CDMA PCS Nominal Operating Conditions 1
Characteristics
Gain Conditions
Power Added Efficiency (VCC = 3.4 V)
Total Supply Current
Total Supply Current in Power-down Mode
Symbol
Condition
Minimum
Typical
Maximum
GLOW
PO ≤ 0 dBm
—
23.0
—
GHIGH
PO = 28 dBm
—
28.0
—
PAED_LOW
PO = 16 dBm
—
10
—
PAED_HIGH
PO = 28 dBm
—
40
—
ICC_LOW
PO = 16 dBm
—
120
—
ICC_HIGH
PO = 28 dBm
—
470
—
IPD
VCC = 3.4 V
VREF = 0 V
—
2.0
—
Unit
dB
%
mA
μA
Quiescent Current
ICQ
—
20
—
mA
Reference Current
IREF
—
1.0
—
mA
Adjacent Channel Power
Harmonic Suppression
1.25 MHz offset
ACP1
—
—
–50
—
1.98 MHz offset
ACP2
—
—
–55
—
Second
f02
—
–55
—
Third
f03
—
–45
—
PO ≤ 28 dBm
PO ≤ 28 dBm
dBc
dBc
Noise Power in RX Band 1930-1990 MHz
RxBN
—
–139
—
dBm/Hz
Noise Figure
NF
—
4.0
—
dB
Input Voltage Standing Wave Ratio
VSWR
—
Stability (Spurious output)
S
5:1 VSWR
all phases
Ruggedness—No damage 2
Ru
PO ≤ 28 dBm
Turn On Time 3
Turn Off Time 3
2.0:1
—
—
–70.0
dBc
10:1
—
—
VSWR
DC
TONDC
—
—
40
—
RF
TONRF
—
—
5
—
DC
TOFFDC
—
—
40
—
RF
TOFFRF
—
—
5
—
1
Per Table 2 over dynamic range up to 28 dBm output power, unless otherwise specified.
2
All phases, time = 10 seconds.
3
TONDC is time required to reach stable quiescent bias (±10%) after VREF is switched high.
TOFFDC is time required for battery to decrease to < 100 μA after VREF is switched low.
After ICQ is stable, The TONRF is time to reach final output power (±1 dB) once RF input is applied.
TOFFRF is time required for PO to drop 30 dB once RF input is removed.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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November 17, 2007 • Skyworks Proprietary and Confidential information. • Products and product information are subject to change without notice. • 200409A
μs
μs
AUTOSMART™ DUAL-BAND POWER AMPLIFIER MODULE
FOR CDMA/PCS (824–849 MHZ AND 1850–1910 MHZ)
PRELIMINARY DATA SHEET • SKY77176
Evaluation Board Description
The evaluation board is a platform for testing and interfacing
design circuitry. To accommodate the interface testing of the
SKY77176, the evaluation board schematic and evaluation board
assembly diagram are included for preliminary analysis and
design. Figure 2 shows the basic schematic diagram of the
Evaluation Board Assembly for the 824 to 849 MHz and the 1850
to 1910 MHz ranges shown in Figure 3.
Figure 2. Evaluation Board Schematic
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200409A • Skyworks Proprietary and Confidential information. • Products and product information are subject to change without notice. • November 17, 2007
5
PRELIMINARY DATA SHEET • SKY77176
AUTOSMART™ DUAL-BAND POWER AMPLIFIER MODULE
FOR CDMA/PCS (824–849 MHZ AND 1850–1910 MHZ)
Figure 3. Evaluation Board Assembly Diagram
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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November 17, 2007 • Skyworks Proprietary and Confidential information. • Products and product information are subject to change without notice. • 200409A
AUTOSMART™ DUAL-BAND POWER AMPLIFIER MODULE
FOR CDMA/PCS (824–849 MHZ AND 1850–1910 MHZ)
PRELIMINARY DATA SHEET • SKY77176
Package Dimensions and Pad Descriptions
The SKY77176 is a multi-layer laminate base, overmold
encapsulated modular package designed for surface mount
solder attachment to a printed circuit board. Figure 4 is a
mechanical drawing of the pin layout for this package. Figure 5
provides a recommended phone board layout footprint for the
PAM to help the designer attain optimum thermal conductivity,
good grounding, and minimum RF discontinuity for the 50-ohm
terminals. Figure 6 shows the pin names and the pin numbering
convention, which starts with pin 1 in the upper left and
increments counter-clockwise around the package. Figure 7
illustrates typical case markings.
0.58 ±0.05
3
C
B
PIN 1
INDICATOR
0.48 ±0.1
(0.1)
METAL PAD EDGE
(0.05)
0.48 ±0.05
DETAIL A
PAD
SCALE: 2X
4X THIS ROTATION
4X ROTATED 180˚
0.48 ±0.1
5
2X 0.075
(0.1)
0
(0.05)
0.15 A B C
0.44 ±0.05
TOP VIEW
(0.1)
DETAIL
0
12X 1.4
DETAIL B
PAD
SCALE: 2X
1X THIS ROTATION
1X ROTATED 180˚
1X ROTATED 90˚ CW
1X ROTATED 90˚ CCW
C
2X 2.325
0.59 ±0.05
PIN 1 INDICATOR
(0.2 X 45˚)
PIN 12
PIN 1
2X 2.18
A
2X 1.49
C
2X 0.35
0
2X 0.45
2X 1.32
B
A
4X 2.4
1 MAX
0.1
SIDE VIEW
2X 0.675
2X 2.18
12X SMT PAD
0.15 A B C
SOLDER MASK OPENINGS
0.2 A B C
BOTTOM VIEW
200409_004
Figure 4. SKY77176 Package Dimensional Drawing (All Views)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200409A • Skyworks Proprietary and Confidential information. • Products and product information are subject to change without notice. • November 17, 2007
7
PRELIMINARY DATA SHEET • SKY77176
AUTOSMART™ DUAL-BAND POWER AMPLIFIER MODULE
FOR CDMA/PCS (824–849 MHZ AND 1850–1910 MHZ)
3.3
PIN 1 INDICATOR
12X 0.73
1.35
2X 2.33
A
C
A
2X 2.18
8X 0.48
C
8X 0.58
2X 2.18
2X 1.49
2X 1.49
2X 0.35
2X 0.35
0
0
4.65
2X 0.08
2X 0.45
2X 0.45
2X 1.32
4X 0.44
(Marked A)
2X 2.18
A
Package
Outline
2X 1.32
4X 0.54
(Marked C)
2X 2.18
C
A
Package
Outline
0.25 TYP
2X 0.68
C
0.2 TYP
12X 0.83
3.4
STENCIL APERTURE
SOLDER MASK OPENING
TOP VIEW
Stencil aperture size for Center Ground Pad should be 80%-100%
(by area) of the Solder Mask Opening package.
TOP VIEW
3.3
Common Ground Pad represents the merger of the
module Center Ground Pad and two individual I/O Ground pads.
Therefore the number of places dimensioned is reduced.
0.25 TYP
B
2.18
7X 0.48
2X 1.49
Thermal Via Array Ø0.3 mm on 0.6 mm Pitch
Additional vias will improve thermal performance.
NOTE: Thermal Vias should be tented and filled with
solder mask 30–35 μm Cu plating recommended
2X 0.35
0
0.6
2X 0.45
1.32
3X 0.44
(Marked B)
2X 2.18
B
Package
Outline
B
0.3
12X 0.73
0.6
METALLIZATION
TOP VIEW
All dimensions are in millimeters.
200409_005
Figure 5. Phone PCB Layout Footprint for 3 x 5, 12-Pad Package – SKY77176
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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November 17, 2007 • Skyworks Proprietary and Confidential information. • Products and product information are subject to change without notice. • 200409A
AUTOSMART™ DUAL-BAND PA MODULE FOR CDMA/PCS
(824–849 MHZ AND 1850–1910 MHZ)
PRELIMINARY DATA SHEET • SKY77176
should not exceed 250 °C. If the part is manually attached,
precaution should be taken to insure that the part is not subjected
to temperatures exceeding 250 °C for more than 10 seconds. For
details on both attachment techniques, precautions, and handling
procedures recommended by Skyworks, please refer to Skyworks
Application Note: PCB Design and SMT Assembly/Rework,
Document Number 101752. Additional information on standard
SMT reflow profiles can also be found in the JEDEC Standard
J-STD–020.
Production quantities of this product are shipped in the standard
tape-and-reel format. For packaging details, refer to Skyworks
Application Note: Tape and Reel Information – RF Modules,
Document Number 101568.
Electrostatic Discharge Sensitivity
Figure 6. SKY77176 Pad Configuration and Pad Names
(Top View)
The SKY77176 is a Class 1C device. Figure 8 lists the
Electrostatic Discharge (ESD) immunity level for each pin of the
SKY77176 product. The numbers in Figure 8 specify the ESD
threshold level for each pin where the I-V curve between the pin
and ground starts to show degradation.
The ESD testing was performed in compliance with
MIL-STD-883E Method 3015.7 using the Human Body Model. If
ESD damage threshold magnitude is found to consistently exceed
2000 volts on a given pin, this so is indicated. If ESD damage
threshold below 2000 volts is measured for either polarity,
numbers are indicated that represent worst case values observed
in product characterization.
Figure 7. Typical Case Markings
Package and Handling Information
Because of its sensitivity to moisture absorption, this device
package is baked and vacuum-packed prior to shipment.
Instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken,
otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The SKY77176 is capable of withstanding an MSL3/250 °C solder
reflow. Care must be taken when attaching this product, whether
it is done manually or in a production solder reflow environment.
If the part is attached in a reflow oven, the temperature ramp rate
should not exceed 3 °C per second; maximum temperature
Figure 8. SKY77176 ESD Sensitivity Areas (Top View)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200409A • Skyworks Proprietary and Confidential information. • Products and product information are subject to change without notice. • November 17, 2007
9
PRELIMINARY DATA SHEET • SKY77176
Various failure criteria can be utilized when performing ESD
testing. Many vendors employ relaxed ESD failure standards,
which fail devices only after “the pin fails the electrical
specification limits” or “the pin becomes completely nonfunctional”. Skyworks employs most stringent criteria and fails
• Personnel Grounding
- Wrist Straps
- Conductive Smocks, Gloves and Finger Cots
- Antistatic ID Badges
• Protective Workstation
- Dissipative Table Top
- Protective Test Equipment (Properly Grounded)
- Grounded Tip Soldering Irons
- Solder Conductive Suckers
- Static Sensors
AUTOSMART™ DUAL-BAND POWER AMPLIFIER MODULE
FOR CDMA/PCS (824–849 MHZ AND 1850–1910 MHZ)
devices as soon as the pin begins to show any degradation on a
curve tracer.
To avoid ESD damage, both latent and visible, it is very important
that the product assembly and test areas follow the Class-1 ESD
handling precautions listed below.
• Facility
- Relative Humidity Control and Air Ionizers
- Dissipative Floors (less than 109 Ω to GND)
• Protective Packaging and Transportation
- Bags and Pouches (Faraday Shield)
- Protective Tote Boxes (Conductive Static Shielding)
- Protective Trays
- Grounded Carts
- Protective Work Order Holders
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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November 17, 2007 • Skyworks Proprietary and Confidential information. • Products and product information are subject to change without notice. • 200409A
Ordering Information
Model Number
Manufacturing Part Number
SKY77176
SKY77176
Product Revision
Package
Operating Temperature
–30 °C to +85 °C
Revision History
Revision
Level
A
Date
November 17, 2007
Description
Initial Issue – Preliminary Information
References
Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752.
Application Note: Tape and Reel Information – RF Modules Document Number 101568
JEDEC Standard J–STD–020
Copyright © 2005-2006, Skyworks Solutions, Inc. All Rights Reserved.
Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products. These materials are provided by Skyworks as a service to its customers and may be
used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials. Skyworks may make changes to its documentation, products,
specifications and product descriptions at any time, without notice. Skyworks makes no commitment to update the information and shall have no responsibility whatsoever for conflicts,
incompatibilities, or other difficulties arising from future changes to its documentation, products, specifications and product descriptions.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by or under this document. Except as may be provided in Skyworks’ Terms and Conditions of
Sale for such products, Skyworks assumes no liability whatsoever in association with its documentation, products, specifications and product descriptions.
THESE MATERIALS ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED OR OTHERWISE, RELATING TO SALE AND/OR USE OF SKYWORKS PRODUCTS
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