Production Process TQHiP Power MESFET Foundry Service Features Air Bridge - 4um • • Metal 1 Metal 1 – 2 um NiCr MIM Metal Metal 0 N+ N+ Isolation Implant N-/P- Channel D MESFET MIM Capacitor • • • • NiCr Resistor Semi-Insulating GaAs Substrate • Power MESFET Process Interconnects: • 2 Global (one airbridge) • 1 Local High-Q Passives Bulk & Thin Film Resistors Backside Vias Optional High Volume Production Processes Validated Models and Design Support TQHiP Process Cross-Section Applications • • • • General Description TriQuint’s TQHiP process is our robust, high power density MESFET process. It provides a straight-forward, low cost process for a variety of circuits and applications. Its high operating and breakdown voltages make it ideal for wireless or wired infrastructure applications. A thick (4 µm) gold airbridge complements the 2 µm thick gold global metal and 0.5 µm thick gold surface layer for wiring flexibility and interconnect density. Precision NiCr resistors and high value MIM capacitors are included. TriQuint Semiconductor 2300 NE Brookwood Pkwy Hillsboro, Oregon 97124 Semiconductors for Communications www.triquint.com Page 1 of 4; Rev 2.1 4/30/02 • • Power Amplifiers Switches Frequencies thru X-Band Base Station Driver Amplifiers CATV Line Amplifiers Cellular Power Amps, Drivers, Switches Phone: 503-615-9000 Fax: 503-615-8905 Email: [email protected] Production Process TQHiP Power MESFET Foundry Service TQHiP Process Details TQHiP Process Details Element Value Units Vp -2.3 V Gate Length 0.5 um Idss 245 mA/mm Imax 370 mA/mm Ft @ 50% Idss 16.5 GHz 60 GHz 140 mS/mm BVgso, Typical 9 V BVgdo, Typical 14 V BVds, Typical 18 V Interconnect Metal Layers 3 MIM Caps Values Resistors D-FET Parameter Fmax Gm Inductors 600 pF/mm2 NiCr 50 Ohms/sq Bulk 800 Ohms/sq 25 @ 2 GHz Q Vias Yes Mask Layers Maximum Ratings No Vias 14 With Vias 16 Operating Temperature Range Capacitor Breakdown Voltage—Typ. Min. TriQuint Semiconductor 2300 NE Brookwood Pkwy Hillsboro, Oregon 97124 Semiconductors for Communications www.triquint.com Page 2 of 4; Rev 2.1 4/30/02 -65 to +150 ºC 40 V 25 V Phone: 503-615-9000 Fax: 503-615-8905 Email: [email protected] Production Process TQHiP Power MESFET Foundry Service Measured I-V Characteristic Curve 300 um Device; T=27degC 80.000 Id (mA) 60.000 40.000 20.000 0.000 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 Vd (V) H1SS_DC 70.0 60.0 50.0 40.0 Vgs=-2.0 Vgs=-1.5 Vgs=-1.0 Vgs=-0.5 Vgs=0.0 30.0 20.0 10.0 0.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 Vds (volts) Measured vs. Modeled DC Characteristics; H1SS - D1010 FET (Lg = 1.0mm, Lgs = Lgd = 1.0mm) Model Parameters; @ T=27°C. TriQuint Semiconductor 2300 NE Brookwood Pkwy Hillsboro, Oregon 97124 Semiconductors for Communications www.triquint.com Page 3 of 4; Rev 2.1 4/30/02 Phone: 503-615-9000 Fax: 503-615-8905 Email: [email protected] Production Process TQHiP Power MESFET Foundry Service • • • • • • • • • • Prototyping and Development Prototype Wafer Option (PWO): • Customer-specific Masks, Customer Schedule • 2 wafers delivered • Hot Lot Cycle Time • With thinning and sawing; optional backside vias Design Sensitivity Test Run (DST): • Yield Analysis • Design Sensitivity to Process Variation • 14 Wafer Start; Spread of Vp and Cgs values Design Tools Available Device Library of Circuit Elements: FET, Diodes, Thin Film and Implanted Resistors, Capacitors, Inductors Parameters for “TriQuint’s Own Model” (TOM) in Popular Simulators Agilent ADS Design Kit Available Now PSPICE Models Available Now Layout and Verification Kit for ICEditors Now Qualified Package Models for Supported Package Styles Training GaAs Design Classes: • Half Day Introduction; Upon Request • Four Day Technical Training; Fall & Spring at TriQuint Oregon facility For Training and Schedules please visit:: www.triquint.com/foundry • • • • • • • • Process Qualification Status TQHiP is a fully released and qualified process Reliability Reports • TQHiP Process Qualification • High Power Product Qualification • TQHiP Element Qualification Report For more information on Quality and Reliability, contact TriQuint or visit: www.triquint.com/ manufacturing/QR/bdy_qr-pubs.htm Applications Support Services • • • • Tiling of GDSII Stream Files including PCM Design Rule Check Services Layout versus Schematic Check Services Packaging Development Engineering Test Development Engineering: • On-Wafer • Packaged Parts Thermal Analysis Engineering Yield Enhancement Engineering Part Qualification Services Failure Analysis • • • • • • • • • Mask Making Production 150 Wafer Fab Wafer Thinning Wafer Sawing Substrate Vias DC Die Sort Testing RF On-Wafer Testing Plastic Packaging RF Packaged Part Testing Manufacturing Services Please contact your local TriQuint Semiconductor Representative/ Distributor or Foundry Services Division Marketing for Additional information: E-mail: [email protected]; Phone: (503) 615-9000 Fax: (503) 615-8905 TriQuint Semiconductor 2300 NE Brookwood Pkwy Hillsboro, Oregon 97124 Semiconductors for Communications www.triquint.com Page 4 of 4; Rev 2.1 4/30/02 Phone: 503-615-9000 Fax: 503-615-8905 Email: [email protected]