Advance Product Information Aug 16, 2005 5.6 Watt 3.5GHz Packaged HPA TGA2925-SG Key Features • • • • • • • • • 3.5 GHz Application Frequency Range 11 dB Nominal Gain 2.5%EVM @29dBm OFDM signal at 3.5GHz 37.5 dBm Nominal Psat Internally Partially Matched IMD3 -50 dBc @ 24 dBm SCL, Typical Bias Conditions: 8 V @ 0.75 A (Quiescent) 0.5 µm HFET Technology 2 lead Cu-alloy base package Primary Applications • • The TGA2925-SG HPA provides 11 dB of gain, 5.6 W of output power at 3.5 GHz and 2.5% EVM at 29 dBm output power. The device is ideally suited for high linearity, high power wireless data applications such as 802.16 and WiMax. The package has a high thermal conductivity copper alloy base. Internal partial matching simplifies system board layout by requiring a minimum of external components. TGA2925 Fixture Measured Performance Bias Conditions: Vd = 8 V, Idq =0.75 A Performance data taken in a 3.5 GHz application circuit 15 S11 10 S-parameter (dB) Product Description 802.16 and WiMax S-Band Power Amplifiers S21 5 S22 0 -5 -10 -15 -20 2.5 2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5 Frequency (GHz) Lead-Free & RoHS compliant. 39 37 Evaluation Boards are available. Pout (dBm) 35 33 3.4GHz 31 3.45GHz 29 3.5GHz 3.55GHz 27 3.6GHz 25 18 20 22 24 26 28 30 32 34 Pin (dBm) Note: This device is early in the characterization process prior to finalizing all electrical specifications. Specifications are subject to change without notice. 1 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com Advance Product Information Aug 16, 2005 TGA2925-SG TABLE I MAXIMUM RATINGS 1/ Symbol Parameter Value Notes 10 V 2/ Vd Drain Supply Voltage Vg Gate Supply Voltage Range Idq Drain Supply Current (Quiescent) 2.1 A | Ig | Gate Current 30 mA PIN Input Continuous Wave Power PD Power Dissipation 35 dBm 8.2 W 2/, 3/ TCH Operating Channel Temperature 175 °C 4/ TM Mounting Temperature (6-10 Seconds) 260 °C TSTG Storage Temperature -0.5 V to -5 V 2/ 2/ -65 to 150 °C 1/ These ratings represent the maximum operable values for this device. 2/ Combinations of supply voltage, supply current, input power, and output power shall not exceed PD. 3/ When operated at this bias condition with a base plate temperature of 70 °C, the MTTF life is 2E+8 hours. 4/ Junction operating temperature will directly affect the device median time to failure (T M). For maximum life, it is recommended that junction temperatures be maintained at the lowest possible levels. 2 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com Advance Product Information Aug 16, 2005 TGA2925-SG TABLE II RF CHARACTERIZATION TABLE (TA = 25qC, Nominal) (Vd = 8 V, Idq = 0.75 A) SYMBOL PARAMETER TEST CONDITION TYPICAL UNITS Gain Small Signal Gain f = 3.5 GHz 11 dB IRL Input Return Loss f = 3.5 GHz 10 dB ORL Output Return Loss f = 3.5 GHz 8 dB Psat Saturated Output Power 37.5 dBm TABLE III THERMAL INFORMATION Parameter RθJC Thermal Resistance (channel to backside of package) Test Conditions Vd = 8 V ID = 0.75 A Pdiss = 6 W TCH (oC) RTJC (qC/W) TM (HRS) 143 12.2 1.2E+9 Note: Package backside SnPb soldered to carrier at 70°C baseplate temperature. At saturated output power, the DC power consumption is 13.2W with 5.6W RF power delivered to the load and 7.6W dissipated. 3 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com Advance Product Information Aug 16, 2005 TGA2925-SG TGA2925 Measured Fixtured Data Application Circuit tuned to 3.5 GHz Bias Conditions: Vd = 8 V, Idq = 0.75 A 15 S11 S-parameter (dB) 10 S21 5 S22 0 -5 -10 -15 -20 2.5 2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5 Frequency (GHz) 39 37 Pout (dBm) 35 33 3.4GHz 31 3.45GHz 29 3.5GHz 3.55GHz 27 3.6GHz 25 18 20 22 24 26 28 30 32 34 Pin (dBm) 4 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com Advance Product Information Aug 16, 2005 TGA2925-SG TGA2925 Measured Fixtured Data Application Circuit tuned to 3.5 GHz Bias Conditions: Vd = 8 V, Idq = 0.75 A OFDM 64QAM EVM (%) 7 6 3.45GHz 5 3.5GHz 3.55GHz 4 3.6GHz 3 3.65GHz 2 1 0 15 17 19 21 23 25 27 29 31 33 Output Power (dBm) 5 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com Advance Product Information Aug 16, 2005 TGA2925-SG TGA2925 Measured Fixtured Data Application Circuit tuned to 3.5 GHz Bias Conditions: Vd = 8 V, Idq = 0.75 A 2 3.4GHz Id (A) 1.8 3.45GHz 1.6 3.5GHz 1.4 3.55GHz 3.6GHz 1.2 1 0.8 0.6 18 20 22 24 26 28 30 32 34 Pin (dBm) 70 IMD3 (dBc) 60 50 3.4GHz 40 3.45GHz 30 3.5GHz 20 3.55GHz 10 3.6GHz 0 16 18 20 22 24 26 28 30 Output Power/ Tone (dBm) 6 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com Advance Product Information Aug 16, 2005 TGA2925-SG Mechanical Drawing TGA2925-SG 0.068 Note: All dimensions are in inches with ±5 mil tolerance 7 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com Advance Product Information Aug 16, 2005 TGA2925-SG 3.5 GHz Application Circuit Schematic PCB is 20 mil thick Rogers 4003 substrate Bias Procedure 1. 2. 3. 4. 5. Ensure no RF power is applied to the device. Pinch off device by setting Vg to –3V. Increase Vd to 8.0V while monitoring drain current. Increase Vg until drain current reaches 0.75A Apply RF power. 8 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com Advance Product Information Aug 16, 2005 TGA2925-SG Typical Evaluation Board Layout * C3 R1 C5 C4 675 mil 493 mil C1 C2 518 mil 207 mil *The layout is a general purpose drawing that needs to be tuned for the specific application. PCB is RO4003 20 mil thickness, 0.5 oz standard copper cladding, with εr = 3.38. External Component Listing Part Type Reference Description Capacitor C1 AVX 06035J5R6BBT, 2.7 pF Capacitor C2 AVX 06035J5R6BBT, 2.7 pF Capacitor C3 4.7uF Capacitor C4 AVX 06035J8R2BBT, 8.2 pF Capacitor C5 0.01 uF Resistor R1 0805, 50 Ω Contact TriQuint Applications Engineering for additional info 9 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com Advance Product Information Aug 16, 2005 TGA2925-SG Recommended Surface Mount Package Assembly Proper ESD precautions must be followed while handling packages. Clean the board with acetone. Rinse with alcohol. Allow the circuit to fully dry. TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow oven vendors’ recommendations when developing a solder reflow profile. Typical solder reflow profiles are listed in the table below. Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot placement. The volume of solder paste depends on PCB and component layout and should be well controlled to ensure consistent mechanical and electrical performance. Clean the assembly with alcohol. Typical Solder Reflow Profiles Reflow Profile SnPb Pb Free Ramp-up Rate 3 °C/sec 3 °C/sec Activation Time and Temperature 60 – 120 sec @ 140 – 160 °C 60 – 180 sec @ 150 – 200 °C Time above Melting Point 60 – 150 sec 60 – 150 sec Max Peak Temperature 240 °C 260 °C Time within 5 °C of Peak Temperature 10 – 20 sec 10 – 20 sec Ramp-down Rate 4 – 6 °C/sec 4 – 6 °C/sec Ordering Information Part Package Style TGA2925-SG Gull Wing Leads 10 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com