TRIQUINT TGA2925-SG

Advance Product Information
Aug 16, 2005
5.6 Watt 3.5GHz Packaged HPA
TGA2925-SG
Key Features
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•
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•
•
•
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3.5 GHz Application Frequency Range
11 dB Nominal Gain
2.5%EVM @29dBm OFDM signal at 3.5GHz
37.5 dBm Nominal Psat
Internally Partially Matched
IMD3 -50 dBc @ 24 dBm SCL, Typical
Bias Conditions: 8 V @ 0.75 A (Quiescent)
0.5 µm HFET Technology
2 lead Cu-alloy base package
Primary Applications
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•
The TGA2925-SG HPA provides 11
dB of gain, 5.6 W of output power
at 3.5 GHz and 2.5% EVM at 29
dBm output power. The device is
ideally suited for high linearity, high
power wireless data applications
such as 802.16 and WiMax. The
package has a high thermal
conductivity copper alloy base.
Internal partial matching simplifies
system board layout by requiring a
minimum of external components.
TGA2925 Fixture Measured Performance
Bias Conditions: Vd = 8 V, Idq =0.75 A
Performance data taken in a 3.5 GHz application circuit
15
S11
10
S-parameter (dB)
Product Description
802.16 and WiMax
S-Band Power Amplifiers
S21
5
S22
0
-5
-10
-15
-20
2.5
2.7
2.9
3.1
3.3
3.5
3.7
3.9
4.1
4.3
4.5
Frequency (GHz)
Lead-Free & RoHS compliant.
39
37
Evaluation Boards are available.
Pout (dBm)
35
33
3.4GHz
31
3.45GHz
29
3.5GHz
3.55GHz
27
3.6GHz
25
18
20
22
24
26
28
30
32
34
Pin (dBm)
Note: This device is early in the characterization process prior to finalizing all electrical specifications. Specifications are subject to
change without notice.
1
TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com
Advance Product Information
Aug 16, 2005
TGA2925-SG
TABLE I
MAXIMUM RATINGS 1/
Symbol
Parameter
Value
Notes
10 V
2/
Vd
Drain Supply Voltage
Vg
Gate Supply Voltage Range
Idq
Drain Supply Current (Quiescent)
2.1 A
| Ig |
Gate Current
30 mA
PIN
Input Continuous Wave Power
PD
Power Dissipation
35 dBm
8.2 W
2/, 3/
TCH
Operating Channel Temperature
175 °C
4/
TM
Mounting Temperature (6-10 Seconds)
260 °C
TSTG
Storage Temperature
-0.5 V to -5 V
2/
2/
-65 to 150 °C
1/
These ratings represent the maximum operable values for this device.
2/
Combinations of supply voltage, supply current, input power, and output power shall not
exceed PD.
3/
When operated at this bias condition with a base plate temperature of 70 °C, the MTTF life is 2E+8
hours.
4/
Junction operating temperature will directly affect the device median time to failure (T M).
For maximum life, it is recommended that junction temperatures be maintained at the lowest
possible levels.
2
TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com
Advance Product Information
Aug 16, 2005
TGA2925-SG
TABLE II
RF CHARACTERIZATION TABLE
(TA = 25qC, Nominal)
(Vd = 8 V, Idq = 0.75 A)
SYMBOL
PARAMETER
TEST
CONDITION
TYPICAL
UNITS
Gain
Small Signal Gain
f = 3.5 GHz
11
dB
IRL
Input Return Loss
f = 3.5 GHz
10
dB
ORL
Output Return Loss
f = 3.5 GHz
8
dB
Psat
Saturated Output Power
37.5
dBm
TABLE III
THERMAL INFORMATION
Parameter
RθJC Thermal
Resistance
(channel to backside
of package)
Test Conditions
Vd = 8 V
ID = 0.75 A
Pdiss = 6 W
TCH
(oC)
RTJC
(qC/W)
TM
(HRS)
143
12.2
1.2E+9
Note: Package backside SnPb soldered to carrier at 70°C baseplate temperature.
At saturated output power, the DC power consumption is 13.2W with 5.6W RF
power delivered to the load and 7.6W dissipated.
3
TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com
Advance Product Information
Aug 16, 2005
TGA2925-SG
TGA2925 Measured Fixtured Data
Application Circuit tuned to 3.5 GHz
Bias Conditions: Vd = 8 V, Idq = 0.75 A
15
S11
S-parameter (dB)
10
S21
5
S22
0
-5
-10
-15
-20
2.5
2.7
2.9
3.1
3.3
3.5
3.7
3.9
4.1
4.3
4.5
Frequency (GHz)
39
37
Pout (dBm)
35
33
3.4GHz
31
3.45GHz
29
3.5GHz
3.55GHz
27
3.6GHz
25
18
20
22
24
26
28
30
32
34
Pin (dBm)
4
TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com
Advance Product Information
Aug 16, 2005
TGA2925-SG
TGA2925 Measured Fixtured Data
Application Circuit tuned to 3.5 GHz
Bias Conditions: Vd = 8 V, Idq = 0.75 A
OFDM 64QAM
EVM (%)
7
6
3.45GHz
5
3.5GHz
3.55GHz
4
3.6GHz
3
3.65GHz
2
1
0
15
17
19
21
23
25
27
29
31
33
Output Power (dBm)
5
TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com
Advance Product Information
Aug 16, 2005
TGA2925-SG
TGA2925 Measured Fixtured Data
Application Circuit tuned to 3.5 GHz
Bias Conditions: Vd = 8 V, Idq = 0.75 A
2
3.4GHz
Id (A)
1.8
3.45GHz
1.6
3.5GHz
1.4
3.55GHz
3.6GHz
1.2
1
0.8
0.6
18
20
22
24
26
28
30
32
34
Pin (dBm)
70
IMD3 (dBc)
60
50
3.4GHz
40
3.45GHz
30
3.5GHz
20
3.55GHz
10
3.6GHz
0
16
18
20
22
24
26
28
30
Output Power/ Tone (dBm)
6
TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com
Advance Product Information
Aug 16, 2005
TGA2925-SG
Mechanical Drawing TGA2925-SG
0.068
Note: All dimensions are in inches with ±5 mil tolerance
7
TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com
Advance Product Information
Aug 16, 2005
TGA2925-SG
3.5 GHz Application Circuit Schematic
PCB is 20 mil thick Rogers 4003 substrate
Bias Procedure
1.
2.
3.
4.
5.
Ensure no RF power is applied to the device.
Pinch off device by setting Vg to –3V.
Increase Vd to 8.0V while monitoring drain current.
Increase Vg until drain current reaches 0.75A
Apply RF power.
8
TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com
Advance Product Information
Aug 16, 2005
TGA2925-SG
Typical Evaluation Board Layout *
C3
R1
C5
C4
675 mil
493 mil
C1
C2
518 mil
207 mil
*The layout is a general purpose drawing that needs to be tuned for the specific application.
PCB is RO4003 20 mil thickness, 0.5 oz standard copper cladding, with εr = 3.38.
External Component Listing
Part Type
Reference
Description
Capacitor
C1
AVX 06035J5R6BBT, 2.7 pF
Capacitor
C2
AVX 06035J5R6BBT, 2.7 pF
Capacitor
C3
4.7uF
Capacitor
C4
AVX 06035J8R2BBT, 8.2 pF
Capacitor
C5
0.01 uF
Resistor
R1
0805, 50 Ω
Contact TriQuint Applications Engineering for additional info
9
TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com
Advance Product Information
Aug 16, 2005
TGA2925-SG
Recommended Surface Mount Package Assembly
Proper ESD precautions must be followed while handling packages.
Clean the board with acetone. Rinse with alcohol. Allow the circuit to fully dry.
TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow oven
vendors’ recommendations when developing a solder reflow profile. Typical solder reflow profiles are listed
in the table below.
Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot placement.
The volume of solder paste depends on PCB and component layout and should be well controlled to
ensure consistent mechanical and electrical performance.
Clean the assembly with alcohol.
Typical Solder Reflow Profiles
Reflow Profile
SnPb
Pb Free
Ramp-up Rate
3 °C/sec
3 °C/sec
Activation Time and
Temperature
60 – 120 sec @ 140 – 160 °C
60 – 180 sec @ 150 – 200 °C
Time above Melting Point
60 – 150 sec
60 – 150 sec
Max Peak Temperature
240 °C
260 °C
Time within 5 °C of Peak
Temperature
10 – 20 sec
10 – 20 sec
Ramp-down Rate
4 – 6 °C/sec
4 – 6 °C/sec
Ordering Information
Part
Package Style
TGA2925-SG
Gull Wing Leads
10
TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com