TB6559FG
TOSHIBA Bi-CD Integrated Circuit Silicon Monolithic
TB6559FG
Full-Bridge DC Motor Driver IC
The TB6559FG is a full-bridge DC motor driver with LDMOS
output transistors.
It uses P-channel MOSFETs on the high side and N-channel
MOSFETs on the low side, eliminating the need for a charge
pump. The TB6559FG achieves high thermal efficiency.
Four operating modes are selectable via IN1 and IN2: clockwise
(CW), counterclockwise (CCW), short brake and stop.
Features
Weight: 0.50 g (typ.)
•
Power supply voltage: 50 V (max)
•
Output current: 2.5 A (max)
•
Low-ON resistance (upper and lower sum): 1.3 Ω (typ.)
•
Constant-current or direct PWM
•
Standby mode
•
Clockwise (CW), counterclockwise (CCW), short brake and stop
•
Overcurrent protection
•
Thermal shutdown
The TB6559FG uses Sn-Ag plating free of lead.
About solderability, following conditions were confirmed
(1) Use of Sn-37Pb solder Bath
· solder bath temperature = 230°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
· solder bath temperature = 245°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
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TB6559FG
Block Diagram
VREG
ALERT
VCC
15
11
5
REG
Overcurrent Protection
Thermal Shutdown
IN1 1
7 OUT1
IN2 16
9 OUT2
Decoder
SB 2
Timing Logic
OSC/PWM 14
OSC/PWM
4/12/13
3
SGND
Vref
2
8
RSA
10
PGND
2007-06-12
TB6559FG
Pin Functions
Pin No
Pin Name
Functional Description
Remarks
1
IN1
Control signal input 1
Apply either a 0-V or 5-V signal.
2
SB
Standby pin
H: Start, L: Standby
3
Vref
Supply voltage pin for current control
0 to 3 V: constant-current control
4.5 V to VREG: PWM control
4
S-GND
5
VCC
Power supply pin
6
(NC)
No connection
7
OUT1
Output pin 1
8
RSA
9
OUT2
Output pin 2
10
P-GND
Power ground
11
ALERT
Protective operation alert output
12
S-GND
Ground
⎯
13
S-GND
Ground
⎯
14
OSC/PWM
15
VREG
16
Fin
⎯
Ground
VCC (ope) = 10 to 27 V
⎯
Connect OUT1 to a motor coil pin.
Connection pin for an output current
detection resistor
⎯
Connect OUT2 to a motor coil pin.
⎯
5 V: Protective operation
0 V: Normal
Connection pin for an external
capacitor/PWM input
Vref=0 to 3V
:Connect a capacitor for oscillation
5-V output pin
Connect a capacitor between VREG and S-GND.
IN2
Control signal input 2
Apply either a 0-V or 5-V signal.
Fin
Ground
Connect Fin to S-GND
Vref=4.5V to Vreg : Input PWM signal
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Supply voltage
Output current
Symbol
Rating
Unit
VCC
50
V
IO (Peak)
IO (Ave)
2.5 (Note 1)
A
1.0
Power dissipation
PD
1.4 (Note 2)
W
Operating temperature
Topr
−30 to 85
°C
Storage temperature
Tstg
−55 to 150
°C
Note 1: The maximum ratings are the limits that must not be exceeded, even for an instant, under worst possible
conditions.
Note 2: Measured on a 60 × 30 × 1.6 mm PCB with a 50% dissipating copper surface.
Operating Ranges (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Supply voltage
VCC
10 to 30
V
PWM frequency
fCLK
up to 100
kHz
OSC frequency
fosc
up to 500
kHz
VREGout
up to 1
mA
VREG output current
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TB6559FG
Electrical Characteristics (VCC = 24 V, Ta = 25°C, unless otherwise specified)
Characteristics
Test
Circuit
Min
Typ.
Max
Stop mode
⎯
4
8
CW and CCW modes
⎯
4
8
ICC3
Short brake mode
⎯
4
8
ICC4
Standby mode
⎯
1
2
2
⎯
VREG
−0.2
⎯
0.8
(Design target only. Not tested
in production.)
⎯
0.1
⎯
VIN = 5 V
⎯
50
75
VIN = 0 V
⎯
⎯
2
2
⎯
VREG
−0.2
⎯
0.8
(Design target only. Not tested
in production.)
⎯
0.5
⎯
VPWM = 5 V
⎯
55
75
VPWM = 0 V
⎯
⎯
2
Duty cycle = 50%
⎯
⎯
100
kHz
2
⎯
⎯
μs
2
⎯
VREG
−0.2
⎯
0.8
0.1
⎯
Symbol
ICC1
ICC2
Supply current
Input voltage
VINH
1
Test Condition
2
VINL
Control circuit
Hysteresis voltage
Input current
VIN (HYS)
IINH
⎯
1
IINL
Input voltage
VPWMH
3
VPWML
Hysteresis voltage
OSC/PWM input
circuit
Input current
VPWM(HYS)
IPWMH
⎯
3
IPWML
PWM frequency
Minimum clock
pulse width
Input voltage
fPWM
3
tw(PWM)
VINSH
2
VINSL
Standby circuit
Hysteresis voltage
VIN (HYS)
⎯
VIN = 5 V
⎯
50
75
VIN = 0 V
⎯
⎯
2
Vosc
0
―
3.0
PWM control
VPWM
4.5
Input current
Iref
Input current
IINSH
1
IINSL
Constant current
control
Vref input circuit
Output ON-resistance
Output leakage current
Ron (U + L)
IL (U)
Diode forward voltage
VF (U)
mA
V
μA
V
μA
V
μA
V
4
5
IL (L)
6
VF (L)
―
VREG
IIN = VREG
⎯
1
3
Io = 0.2 A
⎯
1.3
1.8
Io = 1.5 A
⎯
1.3
1.8
VCC = 30 V
⎯
0.1
10
VCC = 30 V
⎯
0.1
10
Io = 1.5 A
⎯
1.3
1.7
Io = 1.5 A
⎯
1.3
1.7
μA
Ω
μA
V
VREG
4
VREGout = 1 mA
4.5
5
5.5
V
TSD
⎯
(Design target only. Not tested
in production.)
⎯
160
⎯
°C
ΔTSD
(Design target only. Not tested
in production.)
⎯
40
⎯
°C
Charge current
Iosc(+)
Vosc/pwm = 1.5 V (sink current)
-1.05
⎯
-0.65
Discharge current
Iosc(−)
Vosc/pwm = 3.2 V (source
current)
3.8
⎯
6.0
Internal reference voltage
Thermal shutdown temperature
Thermal shutdown hysteresis
OSC frequency
ALERT voltage
(Design target only. Not tested
in production.)
Unit
mA
VALERT(H)
IALERT = −1 mA
VREG
−1
⎯
⎯
VALERT(L)
IALERT = 1 mA
⎯
⎯
0.5
4
V
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TB6559FG
Functional Descriptions
Control and PWM Input Pins
VREG
VREG
IN1
(IN2, OSC/PWM, SB)
100 kΩ
•
The input voltage ranges of the IN1, IN2, OSC/PWM and SB inputs must be as follows. These inputs are
CMOS- and TTL-compatible, and have a hysteresis of 0.2 V (typ.).
VINH: 2 to VREG V
VINL: GND to 0.8 V
•
The PWM input frequency should be 100 kHz or less.
•
In Standby mode, all circuits are turned off, except the standby and 5-V circuits.
•
To bring the device out of Standby mode, IN1 and IN2 must be set Low once (Stop mode); for a operating
mode must be selected after the power supply becomes stable.
OSC/PWM Input Pin
VREG
VREG
SW1
OSC/PWM
SW2
100 kΩ
Either constant-current or direct PWM is selectable according to the voltage of the Vref input (See the “Pin
Functions” table). SW1 and SW2 in the above diagram are controlled by the Vref voltage.
•
Constant current PWM
For constant-current PWM, Vref must be between 0 V and 3 V (SW1: ON, SW2: OFF) and a capacitor must
be connected between OSC/PWM and ground.
•
Direct PWM
For direct PWM, Vref must be between 4.5 V and VREG (SW1: OFF, SW2: ON).
When a PWM signal with an amplitude between 0 V and 5 V is applied to the OSC/PWM input, the OUT1
and OUT2 levels change accordingly, resulting in an alternating sequence of CW/CCW and short brake.
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TB6559FG
Input/Output Functions
Input
Vref
Output
IN1
IN2
SB
PWM/OSC
IO (100%)
(typ.)
OUT1
OUT2
Mode
H
H
H
Capacitor
⎯
L
L
Short brake
Constant-current
chopping
PWM
OSC
L
H
H
Vref
6 ⋅ RS
Capacitor
CCW
L
Short brake
Constant-current
chopping
0 to 3 V
4.5 V to
VREG
L
H
L
H
Capacitor
Vref
6 ⋅ RS
L
L
H
Capacitor
⎯
X
X
L
Capacitor
⎯
H
H
H
L
H
H
H
L
H
L
L
H
X
X
L
H
L
CW
L
Short brake
OFF
Stop
(Hi-Z)
OFF
Standby
(Hi-Z)
L
L
H
L
H
CCW
L
L
L
Short brake
H
H
L
CW
L
L
L
Short brake
L
H
OFF
L
(Hi-Z)
H
OFF
L
(Hi-Z)
Short brake
Stop
Standby
Note: X = Don’t care
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2007-06-12
TB6559FG
Output Operation
•
Control mode selection
Either constant-current or direct PWM control can be selected by the Vref input voltage as follows:
Constant-current PWM control: Vref = 0 to 3 V
Direct PWM control: Vref = 4.5 V to VREG
The constant-current feature is disabled in direct PWM mode.
In either mode, the motor operating mode changes between CW/CCW and short brake alternately.
To eliminate shoot-through current that flows from supply to ground due to the simultaneous conduction of
high-side and low-side transistors in the bridge output, a dead time of 300 ns (design target value) is generated
in the IC when transistors switch from on to off, or vice versa.
The shoot-through protection permits a synchronous rectification PWM operation without controlling the dead
time externally. A dead time is also provided internally when the motor operation mode switches between CW
and CCW, and between CW (CCW) and short brake, thereby eliminating the need for external dead time
insertion.
VCC
OUT1
VCC
M
OUT1
VCC
M
OUT1
RS
M
RS
RS
PWM ON → OFF
t2 = 300 ns (typ.)
PWM ON
t1
PWM OFF
t3
VCC
VCC
M
OUT1
OUT1
M
RS
RS
PWM OFF → ON
t4 = 300 ns (typ.)
PWM ON
t5
VCC
Output voltage
waveform
(OUT1)
t5
t1
t3
GND
t4
t2
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TB6559FG
Constant-Current Regulation
When the Vref voltage is kept constant, the constant current regulator keeps the output current constant by
using a peak current detection technique.
(1)
Constant-current chopping
When VRS reaches the reference voltage (Vref), the regulator enters Discharge mode.
After four cycles of CK, an internal clock generated by OSC, the regulator moves from Discharge mode
to Charge mode.
Coil current
Vref/6
VRS
OSC
Internal clock
Vref/6
Coil current
VRS
Discharge
Charge
Discharge
GND
(2)
Changing the predefined current (during deceleration)
When VRS reaches the reference voltage (Vref/6), the regulator enters Discharge mode. Four CK cycles
later, the regulator exits Discharge mode and enters Charge mode. If VRS > Vref/6 when it enters
Charge mode, however, it then reenters Discharge mode. Four CK cycles later, VRS is again compared
against Vref/6. If VRS < Vref/6, the regulator enters and remains in Charge mode until VRS reaches
Vref/6.
OSC
Internal clock
Vref/6
VRS
Discharge
Discharge
Charge
Charge
GND
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TB6559FG
(3)
Changing the predefined current (during acceleration)
Even when the reference voltage is increased, the regulator remains in Discharge mode for four CK
cycles and then it enters Charge mode.
OSC
Internal clock
Vref/6
Coil current
VRS
Discharge
Charge
Discharge
GND
The average current value becomes lower than the set current value because of the peak current detection
method. It should be noted that the average current value changes, depending on the motor characteristics.
Calculation of the Internal Oscillation Frequency
The OSC oscillation frequency can be calculated by the following equation:
fosc = 1/{0.523 × (Cosc [F] × 3700 + Cosc [F] × 600)} [Hz]
Reference Voltage Generator
In constant-current mode, the peak current is determined by the Vref voltage, as follows:
IO = Vref/RS × 1/6 [A]
VCC
Control circuit
OUT1
M
OUT2
IO
Vref
1/6
RS
IO
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TB6559FG
Internal Constant-Voltage (5 V) Circuit
VCC
VCC
VREG
•
The TB6559FG includes a 5-V power supply for control circuit biasing.
•
For oscillation prevention, a capacitor should be connected between VREG and S-GND.
Although VRGE can be used to control the inputs to the TB6559FG, the maximum load current should be
limited to 1 mA.
•
The TB6559FG has power monitoring circuitry that turns off the output when VREG falls below 6.0 V
(design target value). With a hysteresis of 0.3 V (design target value), the output is turned back on when
VREG reaches 6.3 V (design target value) again.
Output Circuit
VCC
OUT1
(OUT2)
P-GND
•
The TB6559FG uses P-channel MOS transistors on the high side and N-channel MOS transistors on the
low side.
•
The output ON-resistance (Ron) is 1.3 Ω (high-side and low-side sum)
•
The switching characteristics of the output transistors are shown below.
PWM input
tpLH
Output voltage
(OUT1, OUT2)
tpHL
90%
90%
50%
50%
10%
10%
tr
tf
Switching Characteristics
Item
Typical Value
tpLH
750
tpHL
1000
tr
100
tf
150
Dead time
700
Unit
ns
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TB6559FG
VCC Power Supply
•
VCC supplies a voltage to the output circuit and the internal 5-V circuit.
•
The operating voltage range is:
VCC (opr.) = 10 to 30 V
•
IN1, IN2, and SB should be set Low at power-on. (In direct PWM mode, OSC and PWM should also be set
Low.)
GND Section
•
The TB6559FG has two separate grounds: S-GND for the control circuitry and P-GND for the output
circuitry. S-GND and P-GND should be short-circuited at a location as close to the TB6559FG as possible.
ALERT Circuit
•
When either the thermal shutdown or overcurrent protection circuit is activated, the ALERT output goes
High (CMOS output). ALERT may be initially unstable causing chattering or noise pulses. To avoid such
instability, it is recommended to insert an RC filter to the output line.
Normal: Low
Protective operation: High
Thermal Shutdown (TSD) Circuit
The TB6559FG incorporates a thermal shutdown circuit. When the junction temperature (Tj) exceeds
160°C (typ.), the output transistors are turned off.
The output transistors are automatically turned on when the junction temperature cools past the shutdown
threshold, which is lowered by a hysteresis of 40°C.
The IC has 40°C of temperature hysteresis.
TSD = 160°C (target spec)
ΔTSD = 40°C (target spec)
<Thermal Shutdown>
160°C (typ.)
120°C (typ.)
Chip temperature
TSD
H
ALERT output
L
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TB6559FG
Overcurrent Protection Circuit (ISD)
<Overcurrent Protection>
ILIM
Output current
0
10 μs
(typ.)
OFF
OFF
50 μs
(typ.)
50 μs
(typ.)
Not detected
10 μs
(typ.)
H
ALERT output
L
The TB6559FG allows for the sensing of the current that flows through each output transistor.
The currents through each of the output transistors are continually monitored. In the event of an overcurrent
in at least one of the transistors, the overcurrent protection circuitry turns all transistors off.
The overcurrent protection circuitry incorporates a timer to measure 50 μs (typ.) after the transistors are
turned off. After 50 μs, the protection circuitry turns the output transistors back on again automatically. If the
overcurrent persists, the device begins cycling into and out of thermal shutdown. To prevent false detection due
to glitches, the overcurrent protection circuitry turns off the transistors only when the current exceeds the
shutdown threshold for 10 μs or longer.
The design target value for current limiting is 5.0 A (typ.) but has variations between 4.0 to 6.0 A.
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TB6559FG
Typical Characteristics Graphs
TB6559FG
TB6559FG
External Components
Symbol
Use
Recommended Value
Remarks
C1
VREG oscillation prevention
0.1 μF to 1.0 μF
⎯
C2
Power noise absorption
0.001 μF to 1 μF
⎯
C3
Power noise absorption
50 μF to 100 μF
⎯
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TB6559FG
Typical Application Examples
Note 4
Direct-PWM Drive
5V
C1
Note 5
ALERT
14 OSC/PWM
PWM
C2
15
11
VDD
Fuse
1
PORT2
16 IN2
PORT3
2
C3
24 V
Note 1
VREG VCC
7
OUT1
IN1
PORT1
5
TB6559FG
M
9
OUT2
Note 2
GND
SB
Vref
RSA
S-GND
P-GND
8
4/12/13
10
3
Microcontroller
Note 3
5V
Constant-current PWM Drive
5V
Note 4
Fuse
C1
C2
Note 5
15
11
VDD
IN1 ALERT
PORT1
1
PORT2
16 IN2
PORT3
2
SB
PORT4
3
Vref
5
GND
24 V
Note 1
VREG VCC
OUT1
7
TB6559FG
M
OUT2
0 V to 3 V
C3
9
Note 2
OSC/PWM RSA
14
8
Microcontroller
S-GND
P-GND
4/12/13
10
Note 3
Note 1: A bypass capacitor should be connected between VCC and P-GND and placed as close as possible to the
TB6559FG.
Note 2: When a capacitor is connected between the motor pins to reduce noise, a resistor should also be inserted to
limit the charge current. This capacitor causes the switching loss to increase for PWM control; therefore, this
capacitor should not be used, if possible.
Note 3: S-GND and P-GND should be short-circuited at a location as close to the TB6559FG as possible. (Same for
Fin)
Note 4: The capacitor C1 should be connected to S-GND.
Note 5: If there is chattering or noise in the output signal, connect an RC filter to ALERT.
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TB6559FG
Usage Precautions
•
Although the TB6559FG contains overcurrent detection circuitry, a large current might abruptly flow through
the IC in case of a short-circuit to power supply, a short-circuit to ground or a short-circuit across the load,
damaging the device permanently. This possibility should be fully considered in the design of the output, VCC
and ground lines. If the device is damaged, a large current might continually flow through the device as a
secondary effect. Therefore, Toshiba recommends that a fuse be connected to the power supply line.
•
Install this IC properly. If not, (e.g., installing it in the wrong position), the IC might be broken.
•
If external components are shorted together, the IC might be broken.
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TB6559FG
Package Dimensions
Weight: 0.50 g (typ.)
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TB6559FG
Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough
evaluation is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of
application circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
IC Usage Considerations
Notes on Handling of ICs
(1)
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
(2)
Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case
of over current and/or IC failure. The IC will fully break down when used under conditions that exceed
its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise
occurs from the wiring or load, causing a large current to continuously flow and the breakdown can
lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown,
appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required.
(3)
If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF.
IC breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,
the protection function may not operate, causing IC breakdown. IC breakdown may cause injury,
smoke or ignition.
(4)
Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation or
incorrectly even just one time.
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TB6559FG
Points to Remember on Handling of ICs
(1)
Over Current Protection Circuit
Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs
under all circumstances. If the Over current protection circuits operate against the over current, clear
the over current status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings
can cause the over current protection circuit to not operate properly or IC breakdown before operation.
In addition, depending on the method of use and usage conditions, if over current continues to flow for
a long time after operation, the IC may generate heat resulting in breakdown.
(2)
Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal
shutdown circuits operate against the over temperature, clear the heat generation status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings
can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation.
(3)
Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the device
so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time
and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation
design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition,
please design the device taking into considerate the effect of IC heat radiation with peripheral
components.
(4)
Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the
motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply
is small, the device’s motor power supply and output pins might be exposed to conditions beyond
maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system
design.
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TB6559FG
RESTRICTIONS ON PRODUCT USE
070122EBA_R6
• The information contained herein is subject to change without notice. 021023_D
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety
in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such
TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc. 021023_A
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk. 021023_B
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q
• The information contained herein is presented only as a guide for the applications of our products. No responsibility
is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from
its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third
parties. 070122_C
• Please use this product in compliance with all applicable laws and regulations that regulate the inclusion or use of
controlled substances.
Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and
regulations. 060819_AF
• The products described in this document are subject to foreign exchange and foreign trade control laws. 060925_E
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2007-06-12