Datasheet DC Brushless Fan Motor Drivers Multifunction Single-phase Full-wave Fan Motor Driver BD61241FV General Description Key Specifications BD61241FV is a 1chip driver that is composed of H-bridge power DMOS FET. The pin is compatible with BD61240FV(rotation speed pulse signal output). Features Operating Voltage Range: 5.5V to 16V Operating Temperature Range: -40°C to +105°C Output Voltage (Total): 0.2V(Typ) at 0.2A W(Typ) x D(Typ) x H(Max) 5.00mm x 6.40mm x 1.35mm Package SSOP Small Package Driver Including Power DMOS FET Speed Controllable by DC / PWM Input I/O Duty Slope Adjust PWM Soft Switching Current Limit Start Duty Assist Lock Protection and Automatic Restart Quick Start Lock alarm signal (AL) output Applications Fan motors for general consumer equipment of desktop PC, Projector, etc. SSOP-B16 Typical Application Circuits SIG 1 AL GND 16 2 H- SLOPE 15 SIG H 1 AL GND 16 2 H- SLOPE 15 H 3 H+ SOFT 14 3 H+ SOFT 14 4 LA LZ 13 4 LA LZ 13 5 PWM MIN 12 5 PWM MIN 12 6 CS REF 11 6 CS REF 11 7 OUT2 VCC 10 7 OUT2 VCC 10 8 RNF OUT1 9 8 RNF OUT1 9 DC PWM M ＋ － Figure 1. Application of PWM Input 〇Product structure : Silicon monolithic integrated circuit www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 M ＋ － Figure 2. Application of DC Voltage Input 〇This product has no designed protection against radioactive rays 1/27 TSZ02201-0H1H0B101570-1-2 16.Oct.2015 Rev.001 Datasheet BD61241FV Pin Configuration Block Diagram (TOP VIEW) AL 1 16 GND H- 2 15 SLOPE 1 2 3 H+ 14 13 LZ PWM 5 12 MIN 11 OSC TSD GND 16 SLOPE 15 H- 3 4 6 SIGNAL OUTPUT SOFT LA CS AL COMP + H+ SOFT 14 INSIDE REG 4 LA LZ 13 INSIDE REG REF 5 CONTROL LOGIC MIN FILTER 12 PWM 7 OUT2 10 VCC VCC 6 8 RNF 9 CS VCL OUT1 7 8 OUT2 RNF COMP + PREDRIVER REFERENCE REF 11 VCC VCC 10 OUT1 9 Pin Description Pin No. 1 2 3 4 5 6 7 Pin Name Function AL Lock alarm signal output terminal H– Hall – input terminal H+ Hall + input terminal Lead angle function select LA terminal PWM PWM input duty terminal CS Output current detecting terminal OUT2 Motor output terminal 2 8 RNF 9 10 11 OUT1 VCC REF 12 MIN 13 14 15 16 LZ SOFT SLOPE GND Output current detecting resistor connecting terminal (motor ground) Motor output terminal 1 Power supply terminal Reference voltage output terminal Minimum output duty setting terminal Recirculate period setting terminal Soft switching setting terminal I/O duty slope setting terminal Ground terminal (signal ground) I/O Truth Table Hall Input H+ H– H L L H Driver Output OUT1 OUT2 L H H L H; High, L; Low Motor state Rotating Locking AL L Hi-Z AL output is open-drain type. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/27 TSZ02201-0H1H0B101570-1-2 16.Oct.2015 Rev.001 Datasheet BD61241FV Absolute Maximum Ratings Parameter Supply Voltage Power Dissipation Operating Temperature Range Storage Temperature Range Output Voltage Output Current Lock Alarm Signal (AL) Output Voltage Lock Alarm Signal (AL) Output Current Reference Voltage (REF) Output Current Input Voltage1 (H+,H–,MIN,CS,LA,SOFT,LZ,SLOPE) Input Voltage2 (PWM) Junction Temperature Symbol VCC Pd Topr Tstg VO IO VAL IAL IREF Limit 18 0.87 (Note 1) -40 to +105 -55 to +150 18 1.2 (Note 2) 18 10 10 Unit V W °C °C V A V mA mA VIN1 3.6 V VIN2 Tj 6.5 150 V °C (Note 1) Reduce by 7.0mW/°C when operating over Ta=25°C. (Mounted on 70.0mm×70.0mm×1.6mm glass epoxy board) (Note 2) Do not exceed Pd. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions Parameter Operating Supply Voltage Range Input Voltage Range1 (H+, H–, MIN, LA, SOFT, LZ, SLOPE) Input Voltage Range2 (CS) Input Voltage Range3 (PWM) PWM Input Duty Range PWM Input Frequency Range www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Symbol VCC Limit 5.5 to 16 Unit V VIN1 0 to VREF+0.3 V VIN2 VIN3 DPWM fPWM 0 to 1/2 x VREF 0 to 5 0 to 100 15 to 50 V V % kHz 3/27 TSZ02201-0H1H0B101570-1-2 16.Oct.2015 Rev.001 Datasheet BD61241FV Electrical Characteristics (Unless otherwise specified Ta=25°C, VCC=12V) Parameter Circuit Current Output Voltage Symbol ICC Limit Min 3.0 Typ 4.5 Max 6.5 Unit Conditions mA IOUT=±200mA, high and low side total VO - 0.2 0.35 V tON tOFF VHYS+ VHYS- 0.3 3.0 7 -5 0.5 5.0 12 -10 0.7 7.0 17 -15 s s mV mV VALL - - 0.30 V IAL=5mA IALL VPWMH VPWML IPWMH IPWML 2.5 0.0 -10 -50 0 -25 10 5.0 1.0 10 -12 μA V V μA μA VAL=16V Reference Voltage VREF 3.0 3.3 3.6 V IREF=-1mA Current Limit Setting Voltage LA Input High Level Voltage LA Input Low Level Voltage VCL VLAH VLAL ILAH ILAL ICS 235 2.5 0.0 -10 -0.47 -0.4 265 0 -0.33 - 295 3.3 1.0 10 -0.25 - mV V V μA mA μA VLA=REF VLA=0V VCS=0V Lock Detection ON Time Lock Detection OFF Time Hall Input Hysteresis Voltage+ Hall Input Hysteresis VoltageAL Output Low Voltage AL Output Leak Current PWM Input High Level Voltage PWM Input Low Level Voltage PWM Input Current LA Input Current CS Input Bias Current Reference Data Figure 3 Figure 4 to Figure 7 Figure 8 to Figure 10 Figure 11 VPWM=5V VPWM=0V Figure 12 to Figure 13 Figure 14 Figure 15 to Figure 16 Figure 17 to Figure 18 Figure 19 Figure 20 Figure 21 Figure 22 For parameters involving current, positive notation means inflow of current to IC while negative notation means outflow of current from IC. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/27 TSZ02201-0H1H0B101570-1-2 16.Oct.2015 Rev.001 Datasheet BD61241FV Typical Performance Curves (Reference Data) 0.0 Output High Voltage: VOH[V] Circuit Current: ICC[mA] 8 6 105°C 25°C –40°C 4 2 -0.3 –40°C -0.6 25°C 105°C -0.9 Operating Voltage Range 0 -1.2 0 5 10 15 0.0 20 Supply Voltage: VCC[V] 0.8 1.2 Output Source Current: IO[A] Figure 4. Output High Voltage vs Output Source Current (VCC=12V) Figure 3. Circuit Current vs Supply Voltage 0.0 1.2 -0.3 0.9 Output Low Voltage: VOL[V] Output High Voltage: VOH[V] 0.4 16V -0.6 12V 5.5V -0.9 -1.2 105°C 0.6 25°C –40°C 0.3 0.0 0.0 0.4 0.8 1.2 0.0 0.4 0.8 1.2 Output Source Current: IO[A] Output Sink Current: IO[A] Figure 5. Output High Voltage vs Output Source Current Figure 6. Output Low Voltage vs Output Sink Current (VCC=12V) www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/27 TSZ02201-0H1H0B101570-1-2 16.Oct.2015 Rev.001 Datasheet BD61241FV Typical Performance Curves (Reference Data) – continued 0.7 Lock Detection ON Time: tON[s] Output Low Voltage: VOL[V] 1.2 0.9 5.5V 0.6 12V 16V 0.3 0.6 0.5 -40℃ 25℃ 105℃ 0.4 Operating Voltage Range 0.3 0.0 0.0 0.4 0.8 0 1.2 5 15 20 Supply Voltage: Vcc[V] Output Sink Current: Io[A] Figure 7. Output Low Voltage vs Output Sink Current (Ta=25°C) Figure 8. Lock Detection ON Time vs Supply Voltage 7.0 12.0 Lock Detection OFF/ON Ratio: tRATIO[s/s] Lock Detection OFF Time: tOFF[s] 10 6.0 –40°C 25°C 105°C 5.0 4.0 Operating Voltage Range 11.0 –40°C 25°C 105°C 10.0 9.0 Operating Voltage Range 8.0 3.0 0 5 10 15 0 20 10 15 20 Supply Voltage: Vcc[V] Supply Voltage: Vcc[V] Figure 9. Lock Detection OFF Time vs Supply Voltage www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5 Figure 10. Lock Detection OFF/ON Ratio vs Supply Voltage 6/27 TSZ02201-0H1H0B101570-1-2 16.Oct.2015 Rev.001 Datasheet BD61241FV Typical Performance Curves (Reference Data) – continued 0.8 20 AL Output Low Voltage: VALL[V] Hall Input Hysteresis Voltage: VHYS[mV] 40 105°C 25°C –40°C 0 –40°C 25°C 105°C -20 Operating Voltage Range 0.6 0.4 105°C 0.2 25°C –40°C -40 0.0 0 5 10 15 20 0 2 4 8 10 AL Sink Current: IAL[mA] Supply Voltage: Vcc[V] Figure 12. AL Output Low Voltage vs FG Sink Current (VCC=12V) Figure 11. Hall Input Hysteresis Voltage vs Supply Voltage 0.8 8 0.6 0.4 5.5V 0.2 16V 12V AL Output Leak Current: IALL[uA] AL Output Low Voltage: VALL[V] 6 6 4 2 0 Operating Voltage Range 0.0 105°C 25°C –40°C -2 0 2 4 6 8 10 0 10 15 20 AL Voltage: VAL[V] AL Sink Current: IAL[mA] Figure 13. AL Output Voltage vs AL Sink Current (Ta=25°C) www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5 Figure 14. AL Output Leak Current vs AL Voltage 7/27 TSZ02201-0H1H0B101570-1-2 16.Oct.2015 Rev.001 Datasheet BD61241FV Typical Performance Curves (Reference Data) – continued 0 PWM Intput Low Current: IPWML[uA] PWM Intput Hi Current: IPWMH[uA] 8 6 4 2 105°C 25°C –40°C 0 Operating Voltage Range -10 –40°C -20 25°C -30 105°C -40 Operating Voltage Range -50 -2 0 5 10 15 0 20 10 15 20 Supply Voltage: VCC[V] Supply Voltage: VCC[V] Figure 15. PWM Input Hi Current vs Supply Voltage Figure 16. PWM Input Low Current vs Supply Voltage 4.0 3.5 –40°C 25°C 105°C 3.0 2.5 Reference Voltage: VREF[V] 4.0 Reference Voltage: VREF[V] 5 3.5 5.5V 12V 3.0 16V 2.5 Operating Voltage Range 2.0 2.0 0 5 10 15 0.0 20 5.0 7.5 10.0 REF Source Current: IREF[mA] Supply Voltage: VCC[V] Figure 17. Reference Voltage vs Supply Voltage (IREF=-1mA) www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2.5 Figure 18. Reference vs REF Source Current (VCC=12V) 8/27 TSZ02201-0H1H0B101570-1-2 16.Oct.2015 Rev.001 Datasheet BD61241FV Typical Performance Curves (Reference Data) – continued 8 LA Input Hi Current:ILAH [uA] Current Limit Setting Voltage: VCL[mV] 400 350 300 105°C 25°C –40°C 250 6 4 105°C 2 –40°C 25°C Operating Voltage Range Operating Voltage Range 200 0 0 5 10 15 20 0 5 15 20 Supply Voltage: VCC[V] Supply Voltage: VCC[V] Figure 19. Current Limit Setting Voltage vs Supply Voltage Figure 20. LA Input Hi Current vs Supply Voltage 0.0 1 16V 12V 5.5V 0 -0.2 CS Bias Current: ICS[uA] LA Input Low Current: ILAL[mA] 10 –40°C 25°C -0.4 105°C -0.6 -1 -2 -3 Operating Voltage Range Operating Voltage Range -4 -0.8 0 5 10 15 20 5 10 15 20 Supply Voltage: VCC[V] Supply Voltage: VCC[V] Figure 21. LA Input Low Current vs Supply Voltage www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 9/27 Figure 22. CS Input Bias Current vs Supply Voltage TSZ02201-0H1H0B101570-1-2 16.Oct.2015 Rev.001 Datasheet BD61241FV Application Information Application Circuit Examples (Constant Values are for Reference) 1. PWM Input Application This is an example of the application of inverting the external PWM input, and controlling the rotational speed. In this application, minimum rotational speed can be set. Protection for AL (open-drain) SIG 1 Hall bias is set according to the amplitude of hall element output and hall input voltage range. AL SIGNAL OUTPUT OSC TSD GND 16 I/O duty slope setting to 1kΩ 2 SLOPE 15 H- H Linearization correction resistance 3 Noise measures of substrate Soft switching setting COMP + H+ INSIDE REG Lead angle setting 5 14 1kΩ to 100kΩ INSIDE REG LA 4 PWM SOFT LZ 13 Recirculate setting CONTROL LOGIC MIN FILTER 12 Minimum duty setting PWM 6 Low-pass filter for rotation speed instruction input CS COMP Vcl + 7 To limit motor current, the current is detected. Note the power consumption of sense resistance. REFERENCE - REF 11 PREDRIVER 0.1μF to VCC OUT2 ＋ 10 1μF to 8 OUT1 9 RNF Stabilization of REF voltage Reverse Polarity Protection 0.22Ω to M Protection against back EMF － Maximum output voltage and current are 18V and 1.2A respectively. Connect bypass capacitor near VCC terminal as much as possible Figure 23. PWM Input Application Application Design Note (a) The bypass capacitor connected must be more than the recommended constant value because there is a possibility of the motor start-up failure etc. due to IC malfunction. Substrate Design Note (a) IC power (VCC), motor outputs (OUT1, 2), and motor ground lines are made as wide as possible. (b) IC ground (GND) line is common with the application ground except motor ground (i.e. hall ground etc.), and arranged near to (–) land. (c) The bypass capacitor and/or Zener diode are placed near to VCC pin. (d) H+ and H– lines are arranged side by side and made from the hall element to IC as short as possible, because it is easy for the noise to influence the hall lines. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/27 TSZ02201-0H1H0B101570-1-2 16.Oct.2015 Rev.001 Datasheet BD61241FV 2. DC Voltage Input Application This is an example application circuit for fixed rotation speed control by DC voltage. In this application, minimum rotational speed cannot be set. SIG 1 AL SIGNAL OUTPUT OSC TSD GND 16 to 1kΩ 2 H 3 COMP + H+ SOFT INSIDE REG LA 4 INSIDE REG 0Ω Pull-down PWM terminal to GND 1kΩ to 100kΩ SLOPE 15 H- 5 14 LZ 13 CONTROL LOGIC MIN FILTER DC 12 PWM 0Ω 6 CS VCL 7 REFERENCE COMP + PREDRIVER 0.1μF to VCC OUT2 Zener diode for MIN withstand voltage protection REF 11 10 ＋ 1μF to 8 OUT1 9 RNF 0.22Ω to M － Figure 24. DC Voltage Input Application www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/27 TSZ02201-0H1H0B101570-1-2 16.Oct.2015 Rev.001 Datasheet BD61241FV Functional Descriptions 1. Variable Speed Operation The rotational speed of the motor changes by the PWM duty of the motor outputs (OUT1 and OUT2 terminals). However, it provides for the motor's output not by the rotational speed but by the duty in the BD61241FV, because the rotational speed is not uniquely decided by the motor output duty. The changeable speed operation is controlled by these two input terminals. (1) (2) PWM Operation by Pulse Input in PWM Terminal PWM Operation by DC Input in MIN Terminal (Note) PWM frequency of output is 50kHz (Typ). Hence, input PWM frequency is not equal to PWM frequency of output. (1) PWM Operation by Pulse Input in PWM Terminal The PWM signal from the controller can be input directly to IC in Figure 25. The output duty is controlled by the input PWM duty (Figure 26). Refer to recommended operating conditions (P.3) and electrical characteristics (P.4) for the input condition. Internal power-supply voltage (INTERNAL REG; Typ 5.0V) is impressed when the PWM terminal is open, it becomes 100% input of the duty and equivalent, and a full torque is driven. There must be a pull-down resistance outside of IC to make it to torque 0 when the PWM terminal opens (However, only at the controller of the complimentary output type.). Insert the protective resistance and capacitor for noise removal if necessary. Controller Motor Unit Driver H– High H+ Low Inside 5.0V REG PWM INSIDE REG Protection Resistor 2.5V 1.0V PWM GND FILTER 0.0V PWM High OUT1 Low Complimen -tary Output Pull-down Resistor : High impedance Motor output ON Capacitor for Noise Removal High OUT2 Low Full Motor Torque Figure 25. PWM Input Application Zero Figure 26. PWM Input Operation Timing Chart Full torque (VPWM>2.5V) and zero torque (VPWM<1.0V) can recognize the DC voltage input of the PWM terminal. However, the variable speed control in the DC voltage between 0V and 5.0V should be not able to be done. (a) Setting of Minimum Output Duty (MIN) Minimum rotational speed can be set by MIN terminal in Figure 27. The resolution of the MIN terminal is 128 steps. MIN terminal should be shorted to GND when this function is not used. OUT1, 2 Outputs ON Duty [%] Output Minimum Duty [%] Minimum Output Duty Setting (128 Steps) 100 A 0 MIN Setting 100 PWM Input ON Duty [%] 100 30 5 0 0.1 1 REF MIN Input Voltage [V] Figure 27. Setting of Minimum Output Duty Figure 28. Relation of MIN Input Voltage and Output Duty Setting Voltage Division of Resistance (MIN enable) OK REF Setting of Resistance Pull-down (MIN disable) OK REF MIN MIN Setting of Resistance Pull-up (Full Torque) OK Open Setting (Prohibit Input) NG REF REF MIN MIN Figure 29. MIN Terminal Setting www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/27 TSZ02201-0H1H0B101570-1-2 16.Oct.2015 Rev.001 Datasheet BD61241FV (b) Setting of Slope of I/O Duty (SLOPE) Slope of output duty and the input duty to PWM terminal can be established by SLOPE setting in Figure 30. The resolution of MIN is 128 steps. But if the voltage of the SLOPE terminal is 0.4V to 0.825V (Typ), then the slope of the input and output duty is fixed to 0.5, and if it is less than 0.4V (Typ) the slope is fixed to 1 (Figure 31). SLOPE terminal should be shorted to GND when this function is not used. OUT1, 2 Outputs ON Duty [%] I/O Duty Slope Setting (128 Steps) 100 2 SLOPE SLOPE=0.5 A 1.5 1 0.5 SLOPE=2 0 100 SLOPE Setting PWM Input ON Duty [%] Figure 30. Adjust of Slope of I/O Duty Setting Voltage Division of Resistance (SLOPE enable) OK REF 0 0.825 1.65 2.5 SLOPE Input Voltage [V] 0.4 REF Figure 31. Relation of SLOPE Voltage and Slope of I/O Duty Setting of Resistance Pull-down (SLOPE = 1) OK REF SLOPE Setting of Resistance Pull-up (SLOPE=2) OK SLOPE Open Setting (Prohibit Input) NG REF SLOPE REF SLOPE Figure 32. SLOPE Terminal Setting (2) PWM Operation by DC Input in MIN Terminal The output duty can be varied by inputting DC voltage into MIN terminal. PWM terminal should be shorted to GND when this function is used. Please refer to input voltage range 1(P.3) for the input condition of the MIN terminal. MIN Terminal voltage becomes unsettled when MIN terminal is in an open state. The voltage of the terminal becomes irregular if MIN terminal is open. Input voltages to MIN terminals when you turn ON IC power supply (VCC) in Figure 32. *In the case of DC voltage input, it cannot set the lowest output duty. INSIDE REG 200kΩ(Typ) H– High H+ Low REF 3.3V MIN FILTER PWM DC 0.0V GND High MIN OUT1 Low Motor Output ON : High Impedance 100% OUT2 Duty Zener diode for MIN withstand voltage protection 0% Full Motor Torque Zero Figure 34. DC Input Operation Timing Chart Figure 33. DC Input Application OUT1, 2 Outputs ON Duty [%] (a) Setting of Slope of I/O Duty (SLOPE) Slope of output duty and the input voltage to MIN terminal can be established by SLOPE setting in Figure 35. The resolution of SLOPE is 128 steps. But if the voltage of the SLOPE terminal is 0.4V to 0.825V (Typ), then the slope of the input and output duty is fixed to 0.5, and if it is less than 0.4V (Typ) the slope is fixed to 1 (Figure 31). SLOPE terminal should be shorted to GND when this function is not used. 100 SLOPE=0.5 A SLOPE=2 0 SLOPESetting REF MIN [V] Figure 35. Relation of MIN Input Voltage and Slope of I/O Duty www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/27 TSZ02201-0H1H0B101570-1-2 16.Oct.2015 Rev.001 Datasheet BD61241FV 2. About Setting of Phase Switching of Output The period of Soft Switching and Recirculate can be adjusted by SOFT and LZ setting. (1) Soft Switching Period Setting (SOFT) The soft switching section in the output can be set by SOFT terminal. By adjusting SOFT voltage, soft switching section can be set from 22.5° to 90° as one period of hall signal 360°. The resolution of SOFT is 128 steps in Figure 37. Timing chart is shown in Figure 36. *A soft switching period is the section where ON duty of the output changes from a target duty into 0% by 16 steps. Adjust a Soft Switching Period by SOFT Setting Setable Range：Min=22.5° to Max=90° H+ H– Angle[°] One period of hall signal 360° Set of Soft Switching Period (128 Steps) 90 High OUT1 Low High OUT2 Low Motor Current 67.5 45 22.5 0A 0 0.825 1.65 2.5 SOFT input voltage [V] Soft Switching Period (Max 90°) Figure 36. Soft Switching Period Setting Setting Voltage Division of Resistance (SOFT enable) OK REF SOFT Setting of Resistance Pull-down (SOFT Min 22.5°) OK REF REF Figure 37. Relation of SOFT Input Voltage and Soft Switching Period Setting of Resistance Pull-up (SOFT Max 90°) OK REF SOFT SOFT Open Setting (Prohibit Input) NG REF SOFT Figure 38. SOFT Terminal Setting www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/27 TSZ02201-0H1H0B101570-1-2 16.Oct.2015 Rev.001 Datasheet BD61241FV (2) Recirculate Period Setting (LZ) The recirculate period in fall of the output can be set by LZ terminal. By adjusting LZ voltage, recirculate period can be set from 0° to 90° as one period of hall signal 360° in Figure 40. The resolution of LZ is 128 steps. Timing chart is shown in Figure 39. About priority of SOFT and LZ setting, the setting priority of the period to recirculate than a soft switching period is high. For example, VSOFT=1.65V, VLZ = 0.825V Soft switching period = (1.65/3.3)*90° - (0.825/3.3)*90°=45°-22.5°=22.5° Recirculate period = (0.825/3.3)*90°=22.5° When you set a period to recirculate for longer than soft switching period, a soft switching section for 5.6° (Typ) enters. * A recirculate period is a current recirculate period before phase switching of output. In the recirculate period, the logic of the output transistor is decided by the hall input logic. The phase of output Hi becomes the high impedance, and the phase of output Low is Low. Adjust a Re-Circulate Period by LZ Setting Setable Range：Min22.5° to Max90° H+ H– Set of Re-circulate Period (128 Steps) Angle[°] One period of hall signal 360° High 90 Low 67.5 OUT1 High OUT2 45 Low Motor Current 22.5 0A Soft Switching Period Re-circulate Period(Max 90°) 0 LZ 1.65 LZ input voltage [V] REF 2.5 Figure 40. Relation of LZ Input Voltage and Recirculate Period Figure 39. Recirculate Period Setting Setting Voltage Division of Resistance (LZ enable) OK REF 0.825 Setting of Resistance Pull-down (LZ Min 0°) OK REF Setting of Resistance Pull-up (LZ Max 90°) OK LZ REF LZ Open Setting (Prohibit Input) NG REF LZ Figure 41. LZ Terminal Setting www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 15/27 TSZ02201-0H1H0B101570-1-2 16.Oct.2015 Rev.001 Datasheet BD61241FV (3) Function of Lead Angle Setting (LA) This function automatically detects a current phase gap, and an aspect change point is revised to lead angle. When a current phase is delayed for a hall phase, output phase can be changed up to 22.5° automatically. When you use the Lead Angle function, Please set the LA terminal open. When you are not using the Lead Angle function, please connect LA terminal to GND. Timing chart is shown in Figure 42 and 43. Set of soft switching period; 40° Set of soft switching period; 40° Kickback restraint; None Kickback restraint; Available Set of re-circulate period; 0° Set of re-circulate period; 0° H+ H– One period of hall signal 360° One period of hall signal 360° High OUT1 Low High OUT2 Low Motor Current 0A Lead Angle None Lead Angle Max 22.5° Figure 42. Lead Angle Function Disable Figure 43. Lead Angle Function Enable Setting of Resistance Pull-down (Lead angle Function Disable) OK REF Open setting (Lead angle Function Enable) OK REF LA LA Figure 44. LA Terminal Setting www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 16/27 TSZ02201-0H1H0B101570-1-2 16.Oct.2015 Rev.001 Datasheet BD61241FV 3. Current Limit The current limit circuit turns OFF the output when the current that flows to the motor coil is detected exceeding a set value. The current value that current limit operates is determined by internal setting voltage and CS terminal. In Figure 46, IOUT is the current flowed to the motor coil, RNF is the resistance detecting the current, and PRMAX is the power Io[A] = VCL[V] / RNF[Ω] = 265[mV] / 0.33[Ω] = 0.803[A] OUT1 PRMAX[W] = VCL[V] x Io[A] = 265[mV] x 0.803[A] = 0.213[W] M OUT2 RNF Setting of Resistance Pull-down (Current Limit Disable) Connect to RNF (Current Limit Enable) OK Open Setting (Prohibit Input). NG Vcl Io OK RNF GND CS CS CURRENT LIMIT COMP CS RNF RNF CS IC Signal ground line Motor ground line － Figure 46. Setting of Current Limit and Ground Lines Figure 45. CS Terminal Setting When you use the current limit function, please connect the CS terminal and the RNF terminal. When you are not using the current limit function, please connect the CS terminal to GND. 4. Lock Protection and Automatic Restart Motor rotation is detected by hall signal, and the IC internal counter set lock detection ON time (tON) and OFF time (tOFF). Timing chart is shown in Figure 47. Motor Idling High H– Low H+ tON (Typ 0.5s) tOFF (Typ 5.0s) tOFF tON tON tOFF High OUT1 Low High OUT2 Low High AL Low Instruction Torque Motor Output ON Duty 0% Motor Lock Lock Detection Motor Lock Release : High Impedance Figure 47. Lock Protection (Incorporated Counter System) Timing Chart www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 17/27 TSZ02201-0H1H0B101570-1-2 16.Oct.2015 Rev.001 Datasheet BD61241FV 5. Quick Start When torque OFF logic is input by the control signal over a fixed time, the lock protection function is disabled. The motor can restart quickly once the control signal is applied. Motor Idling H– High H+ Low High PWM Low Lock Protection Signal Enable Disable Under 5ms(Typ) PWM or MIN torque 0% Quick start standby mode Motor Output ON Duty Torque OFF Motor Stop Torque ON Figure 48. Quick Start Timing Chart (PWM Input Application) 6. Start Duty Assist Start Duty Assist can secure a constant starting torque even at low duty. The IC is driven by a constant output duty (DOHL; Typ 50%) within detection of motor rotation. When Output ON duty is less than 50% (Typ), Start Duty Assist function operates under the following conditions: (1) (2) (3) (4) Power ON Lock Release Quick Start Thermal Shut Down(TSD) Release POH Motor Output ON Duty[%] 100 50 DOHL; Typ 50% 0 50 100 PWM Duty [%] Figure 49. I/O Duty Characteristic in Start Duty Assist ON Power DOHL (Typ 50%) Motor Output ON Duty OFF PWM or MIN torque 100% Duty assist 0% Power ON Detect of Motor Rotation 150°C DOHL (Typ 50%) Motor Output ON Duty PWM or MIN torque 100% Duty assist 0% TSD ON :Start Duty Assist OFF Detect of Motor Rotation :Start Duty Assist Figure 50. Timing Chart of Power ON www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 175°C Junction Temperature Figure 51. Timing Chart of TSD Release 18/27 TSZ02201-0H1H0B101570-1-2 16.Oct.2015 Rev.001 Datasheet BD61241FV 7. Hall Input Setting Hall input voltage range is shown in operating conditions (P.3). Adjust the value of hall element bias resistor R1,R2 in Figure 53 so that the input voltage of a hall amplifier is input in "Input Voltage Range 1"(P.3) including signal amplitude. R2 is resistance to correct the temperature characteristic of the hall element. Hall Input Upper Limit H– REFE- REF RENCE VREF+0.3V C1 Hall Bias Current; IH[A] = VREF[V] / (R1+R2//RH)[Ω] H+ COMP + H– H+ Hall Input Lower Limit R1 H– Operating Hall Input Voltage Range VH Figure 52. Hall Input Voltage Range Hall RH H+ C2 0V IH R2 Hall Bias Voltage; VH[V] = VREF[V] x (R2//RH) / (R1+R2//RH)[Ω] Figure 53. Hall Input Application Reducing the Noise of Hall Signal VCC noise or the like depending on the wiring pattern of board may affect Hall element. In this case, place a capacitor like C1 in Figure 56. In addition, when wiring from the hall element output to IC hall input is long, noise may be induced on wiring. In this case, place a capacitor like C2. 8. High-speed Detection Protection High-speed detection protection begins lock protection action when it detects that the hall input signal is in an abnormal state (more than Typ 2.5kHz). Noise may be induced on wiring. In this case, place a capacitor like C2 in Figure 53. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 19/27 TSZ02201-0H1H0B101570-1-2 16.Oct.2015 Rev.001 Datasheet BD61241FV Safety Measure 1. Reverse Connection Protection Diode Reverse connection of power results in IC destruction as shown in Figure 54. When reverse connection is possible, reverse connection protection diode must be added between power supply and VCC. After reverse connection In normal energization Reverse power connection VCC destruction prevention VCC Circuit VCC Circuit I/O Block Circuit I/O Block GND GND Internal circuit impedance is high Amperage small I/O Block GND Large current flows Thermal destruction No destruction Figure 54. Flow of Current When Power is Connected Reversely 2. Protection against VCC Voltage Rise by Back Electromotive Force Back electromotive force (Back EMF) generates regenerative current to power supply. However, when reverse connection protection diode is connected, VCC voltage rises because the diode prevents current flow to power supply. ON Phase Switching ON ON ON Figure 55. VCC Voltage Rise by Back Electromotive Force When the absolute maximum rated voltage may be exceeded due to voltage rise by back electromotive force, place (A) Capacitor or (B) Zener diode between VCC and GND. If necessary, add both (C). (A) Capacitor (B) Zenner diode (C) Capacitor & Zenner diode ON ON ON ON ON ON Figure 56. Measure against VCC and Motor Driving Outputs Voltage 3. Problem of GND line PWM Switching Do not perform PWM switching of GND line because GND terminal potential cannot be kept to a minimum. 4. Lock Alarm Signal (AL) Open-Drain Output AL output is an open drain and requires pull-up resistor. Adding resistor can protect the IC. Exceeding the absolute maximum rating, when AL terminal is directly connected to power supply, could damage the IC. Motor Unit VCC Controller Motor Driver Driver M AL Protection Resistor Pull-up Resistor SIG Connector GND PWM Input Prohibit Figure 57. GND Line PWM Switching Prohibited www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 20/27 Figure 58. Protection of AL Terminal TSZ02201-0H1H0B101570-1-2 16.Oct.2015 Rev.001 Datasheet BD61241FV Power Consumption 1. Current Pathway The current pathways that relates to driver IC are the following. (1) Circuit Current (ICC) (2) Motor Current (IM) (3) Reference Bias Current to the Resistors (IREF) (4) AL Output Sink Current (IAL) SIG 1 AL SIGNAL OUTPUT OSC TSD GND 16 IAL 2 SLOPE 15 H- H 3 COMP + H+ SOFT LA LZ 13 4 INSIDE REG PWM 5 CONTROL LOGIC MIN FILTER PWM 6 CS 12 IREF REFERENCE VCL 7 14 INSIDE REG COMP + REF 11 PREDRIVER ICC VCC OUT2 ＋ 10 IM 8 OUT1 9 RNF M － Figure 59. Current Pathway of IC 2. Calculation of Power Consumption (1) Circuit Current (ICC) PWa[W] = VCC[V] x ICC[A] (ICC current doesn’t include IM,IREF) (ex.) VCC = 11.3[V], ICC = 4.5[mA] PWa[W] = 11.3[V] x 4.5[mA] = 50.85 [mW] (2) Motor Driving Current (IM) VOH is the output saturation voltage of OUT1 or OUT2 high side, VOL is the other low side voltage, PWb[W] = (VOH[V] + VOL[V]) x IM[A] (ex.) VOH = 0.10[V], VOL = 0.10[V], IM = 200[mA] PWb[W] = (0.10[V] + 0.10[V]) x 200[mA] = 40.0[mW] (3) Reference Bias Current to the LPF and Resistors (IREF) PWc[W] = (VCC[V] – VREF[V]) x IREF[A] (ex.) IREF = 6.0[mA] PWc[W] = (11.3[V] – 3.3[V]) x 6.0[mA] = 48.0[mW] (4) AL Output Sink Current (IAL) PWd[W] = VAL[V] x IAL[A] (ex.) VAL = 0.10[V], IAL = 5.0[mA] PWd[W] = 0.10[V] x 5.0[mA] = 0.5[mW] Total power consumption of driver IC becomes the following by the above (1) to (4). PWttl[W] = PWa[W] + PWb[W] + PWc[W] + PWd[W] (ex.) PWttl[W] = 50.85[mW] + 40.0[mW] + 48.0[mW] + 0.5[mW] = 139.35[mW] Refer to next page when you calculate the chip surface temperature (Tj) and the package surface temperature (Tc) by using the power consumption value. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 21/27 TSZ02201-0H1H0B101570-1-2 16.Oct.2015 Rev.001 Datasheet BD61241FV Power Dissipation 1. Power Dissipation Power dissipation (total loss) indicates the power that can be consumed by IC at Ta=25°C (normal temperature). IC is heated when it consumes power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that can be accepted by IC chip into the package, that is junction temperature of the absolute maximum rating, depends on circuit configuration, manufacturing process, etc. Power dissipation is determined by this maximum joint temperature, the thermal resistance in the state of the substrate mounting, and the ambient temperature. Therefore, when a power dissipation that provides by the absolute maximum rating is exceeded, the operating temperature range is not a guarantee. The maximum junction temperature is in general equal to the maximum value in the storage temperature range. θja = (Tj - Ta) / P [°C/W] 2. Thermal Resistance Heat generated by consumed power of IC is radiated from the mold resin or lead frame of package. The parameter which indicates this heat dissipation capability (hardness of heat release) is called thermal resistance. In the state of the substrate mounting, thermal resistances from the chip junction to the ambience and to the package surface are shown respectively with θja [°C/W] and θjc [°C/W]. Thermal resistance is classified into the package part and the substrate part, and thermal resistance in the package part depends on the composition materials such as the mold resins and the lead frames. On the other hand, thermal resistance in the substrate part depends on the substrate heat dissipation capability of the material, the size, and the copper foil area etc. Therefore, thermal resistance can be decreased by the heat radiation measures like installing a heat sink etc. in the mounting substrate. The thermal resistance model and calculations are shown in Figure 61. Pd[W] θja = (Tj – Ta) / P [°C/W] 0.87 0.75 Ambient temperature Ta[°C] Package surface temperature Tc[°C] θja=142.9 [°C/W] 0.50 0.25 105 0 Chip surface temperature Tj[°C] Power consumption P[W] 50 75 100 125 150 Ta[°C] (Note) Reduce by 7.0mW/°C when operating over Ta=25°C (Mounted on 70.0mm x 70.0mm x 1.6mm glass epoxy board) Figure 60. Thermal Resistance Model of Surface Mount www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 25 Figure 61. Power Dissipation vs Ambient Temperature 22/27 TSZ02201-0H1H0B101570-1-2 16.Oct.2015 Rev.001 Datasheet BD61241FV I/O Equivalent Circuit (Resistance Values are Typical) 1. Power supply terminal 2. PWM input duty terminal round terminal INSIDE REG Vcc 3. Output current detecting terminal 4. Hall +/- input terminal Vcc Vcc INSIDE REG 200kΩ(Typ) H+ H– PWM 5. Reference voltage output terminal 1kΩ REF GND CS 6. Lead angle function select terminal 7. I/O duty slope setting terminal 8. Motor output 9. Lock alarm signal minimum output duty setting terminal 1/2 output terminal terminal, recirculate period setting terminal and soft switching setting terminal Output current detecting resistor connecting terminal INSIDE REG 10kΩ(Typ) LA Vcc SLOPE LZ SOFT MIN OUT1 OUT2 AL RNF www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 23/27 TSZ02201-0H1H0B101570-1-2 16.Oct.2015 Rev.001 Datasheet BD61241FV Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However, pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the power dissipation stated in this datasheet is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to raise heat dissipation capability. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, width of power and ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. The IC’s power supply should always be turned OFF completely before connecting or removing it from the test setup during the inspection process. 10. Mounting Errors and Inter-pin Short Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 24/27 TSZ02201-0H1H0B101570-1-2 16.Oct.2015 Rev.001 Datasheet BD61241FV Operational Notes – continued 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. Especially, if it is not expressed on the datasheet, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Figure 62. Example of Monolithic IC Structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). 15. Thermal Shutdown (TSD) Circuit This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature will rise which will activate the TSD circuit that will turn OFF all output pins. When the junction temperature falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 25/27 TSZ02201-0H1H0B101570-1-2 16.Oct.2015 Rev.001 Datasheet BD61241FV Physical Dimension, Tape and Reel Information Package Name SSOP-B16 <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand 1pin Reel www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 ) Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. 26/27 TSZ02201-0H1H0B101570-1-2 16.Oct.2015 Rev.001 Datasheet BD61241FV Ordering Information B D 6 1 2 Part Number 4 1 F V - G E 2 Packaging and forming specification ･G: Halogen free ･E2: Embossed tape and reel Package ･FV; SSOP-B16 Marking Diagram SSOP-B16 (TOP VIEW) 6 1 2 4 1 Part Number LOT Number 1PIN Mark Revision History Date Revision 16.Oct.2015 Rev.001 Changes New Release www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 27/27 TSZ02201-0H1H0B101570-1-2 16.Oct.2015 Rev.001 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001