19-4057; Rev 0; 3/08 50MHz to 1000MHz High-Linearity, Serial/Parallel-Controlled Digital VGA The MAX2066 high-linearity digital variable-gain amplifier (VGA) is a monolithic SiGe BiCMOS attenuator and amplifier designed to interface with 50Ω systems operating in the 50MHz to 1000MHz frequency range (See the Typical Application Circuit). The digital attenuator is controlled as a slave peripheral using either the SPI™compatible interface or a parallel bus with 31dB total adjustment range in 1dB steps. An added feature allows “rapid-fire” gain selection between each of four steps, preprogrammed by the user through the SPIcompatible interface. The 2-pin control allows the user to quickly access any one of four customized attenuation states without reprogramming the SPI bus. Because each stage has its own RF input and RF output, this component can be configured to either optimize NF (amplifier configured first), or OIP3 (amplifier last). The device’s performance features include 22dB amplifier gain (amplifier only), 5.2dB NF at maximum gain (includes attenuator insertion loss), and a high OIP3 level of +42.4dBm. Each of these features makes the MAX2066 an ideal VGA for numerous receiver and transmitter applications. In addition, the MAX2066 operates from a single +5V supply with full performance, or a single +3.3V supply with slightly reduced performance, and has an adjustable bias to trade current consumption for linearity performance. This device is available in a compact 40pin thin QFN package (6mm x 6mm) with an exposed pad. Electrical performance is guaranteed over the extended temperature range (TC = -40°C to +85°C). Applications IF and RF Gain Stages Cellular Band WCDMA and cdma2000® Base Stations GSM 850/GSM 900 EDGE Base Stations WiMAX and LTE Base Stations and Customer Premise Equipment Fixed Broadband Wireless Access Wireless Local Loop Military Systems Video-on-Demand (VOD) and DOCSIS®Compliant EDGE QAM Modulation Cable Modem Termination Systems (CMTS) RFID Handheld and Portal Readers Features ♦ 50MHz to 1000MHz RF Frequency Range ♦ Pin-Compatible Family Includes MAX2065 (Analog/Digital VGA) MAX2067 (Analog VGA) ♦ 20.5dB (typ) Maximum Gain ♦ 0.4dB Gain Flatness Over 100MHz Bandwidth ♦ 31dB Gain Range ♦ Supports Four “Rapid-Fire” Preprogrammed Attenuator States Quickly Access Any One of Four Customized Attenuation States Without Reprogramming the SPI Bus Ideal for Fast-Attack, High-Level Blocker Protection Prevents ADC Overdrive Condition ♦ Excellent Linearity (Configured with Amplifier Last) +42.4dBm OIP3 +65dBm OIP2 +19dBm Output 1dB Compression Point -68dBc HD2 -88dBc HD3 ♦ 5.2dB Typical Noise Figure (NF) ♦ Fast, 25ns Digital Switching ♦ Very Low Digital VGA Amplitude Overshoot/ Undershoot ♦ Single +5V Supply (Optional +3.3V Operation) ♦ External Current-Setting Resistors Provide Option for Operating Device in Reduced-Power/ Reduced-Performance Mode Ordering Information TEMP RANGE PINPACKAGE MAX2066ETL+ -40°C to +85°C 40 Thin QFN-EP* MAX2066ETL+T -40°C to +85°C 40 Thin QFN-EP* PART +Denotes a lead-free package. *EP = Exposed pad. T = Tape and reel. Pin Configuration appears at end of data sheet. cdma2000 is a registered trademark of Telecommunications Industry Association. SPI is a trademark of Motorola, Inc. DOCSIS and CableLabs are registered trademarks of Cable Television Laboratories, Inc. (CableLabs®). ________________________________________________________________ Maxim Integrated Products For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. 1 MAX2066 General Description MAX2066 50MHz to 1000MHz High-Linearity, Serial/Parallel-Controlled Digital VGA ABSOLUTE MAXIMUM RATINGS VCC_ to GND ........................................................-0.3V to +5.5V VDD_LOGIC, DATA, CS, CLK, SER/PAR..............................................-0.3V to (VCC_ + 0.3V) STATE_A, STATE_B, D0–D4 ....................-0.3V to (VCC_ + 0.3V) AMP_IN, AMP_OUT .................................-0.3V to (VCC_ + 0.3V) ATTEN_IN, ATTEN_OUT........................................-1.2V to +1.2V RSET to GND.........................................................-0.3V to +1.2V RF Input Power (ATTEN_IN, ATTEN_OUT).....................+20dBm RF Input Power (AMP_IN)...............................................+18dBm Continuous Power Dissipation (Note 1) ...............................6.5W θJA (Notes 2, 3)..............................................................+38°C/W θJC (Note 3) ...................................................................+10°C/W Operating Temperature Range (Note 4) .....TC = -40°C to +85°C Maximum Junction Temperature .....................................+150°C Storage Temperature Range .............................-65°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C Note 1: Based on junction temperature TJ = TC + (θJC x VCC x ICC). This formula can be used when the temperature of the exposed pad is known while the device is soldered down to a printed-circuit board (PCB). See the Applications Information section for details. The junction temperature must not exceed +150°C. Note 2: Junction temperature TJ = TA + (θJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is known. The junction temperature must not exceed +150°C. Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a 4-layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. Note 4: TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. +3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS (Typical Application Circuit, high-current (HC) mode, VCC = VDD = +3.0V to +3.6V, TC = -40°C to +85°C. Typical values are at VCC = VDD = +3.3V and TC = +25°C, unless otherwise noted.) PARAMETER SYMBOL Supply Voltage VCC Supply Current ICC CONDITIONS (Note 5) MIN TYP MAX UNITS 3.0 3.3 3.6 V 58 80 mA LOGIC INPUTS (DATA, CS, CLK, SER/PAR, STATE_A, STATE_B, D0–D4) Input High Voltage VIH 2 V Input Low Voltage VIL 0.8 V +5V SUPPLY DC ELECTRICAL CHARACTERISTICS (Typical Application Circuit, VCC = VDD = +4.75V to +5.25V, TC = -40°C to +85°C. Typical values are at VCC = VDD = +5V and TC = +25°C, unless otherwise noted.) PARAMETER Supply Voltage Supply Current SYMBOL CONDITIONS MIN TYP MAX UNITS 4.75 5 5.25 V Low-current (LC) mode 70 90 High-current (HC) mode 121 144 VCC ICC mA LOGIC INPUTS (DATA, CS, CLK, SER/PAR, STATE_A, STATE_B, D0–D4) Input High Voltage VIH Input Low Voltage VIL 0.8 V Input Current Logic-High IIH -1 +1 µA Input Current Logic-Low IIL -1 +1 µA 2 3 _______________________________________________________________________________________ V 50MHz to 1000MHz High-Linearity, Serial/Parallel-Controlled Digital VGA (Typical Application Circuit, VCC = VDD = +3.0V to +3.6V, TC = -40°C to +85°C. Typical values are at VCC = VDD = +3.3V, HC mode with attenuator set for maximum gain, PIN = -20dBm, fRF = 200MHz, and TC = +25°C, unless otherwise noted.) (Note 6) PARAMETER SYMBOL RF Frequency Range fRF Small-Signal Gain G Output Third-Order Intercept Point Noise Figure OIP3 NF CONDITIONS (Notes 5, 7) MIN TYP 50 MAX UNITS 1000 MHz 20 dB POUT = 0dBm/tone, maximum gain setting 38 dBm Maximum gain setting 5.6 dB 31 dB Total Attenuation Range +5V SUPPLY AC ELECTRICAL CHARACTERISTICS (Typical Application Circuit, VCC = VDD = +4.75 to +5.25V, HC mode with attenuator set for maximum gain, 50MHz ≤ fRF ≤ 1000MHz, TC = -40°C to +85°C. Typical values are at VCC = VDD = +5.0V, HC mode, PIN = -20dBm, fRF = 200MHz, and TC = +25°C, unless otherwise noted.) (Note 6) PARAMETER RF Frequency Range SYMBOL fRF CONDITIONS (Notes 5, 7) MIN 50 200MHz G 18.6 Noise Figure NF 19.5 750MHz 18.1 900MHz 17.4 OIP2 OIP3 1000 MHz 21.1 dB -0.004 dB/°C 0.4 dB 200MHz 5.2 350MHz, TC = +25°C (Note 5) 5.5 450MHz 5.6 750MHz 6.2 900MHz 6.4 POUT = 0dBm/tone, Δf = 1MHz, f1 + f2 6.6 dB 31 dB 65 dBm 200MHz 42.4 350MHz 40.4 450MHz 39.5 750MHz 37.3 900MHz 36.2 200MHz 40 350MHz POUT = 0dBm/tone, 450MHz LC mode, Δf = 1MHz 750MHz 38 900MHz 33 POUT = 0dBm/tone, HC mode, Δf = 1MHz Output Third-Order Intercept Point UNITS Any 100MHz frequency band from 50MHz to 500MHz Total Attenuation Range Output Second-Order Intercept Point 19.9 450MHz Gain Variation vs. Temperature Gain Flatness vs. Frequency MAX 20.5 350MHz, TC = +25°C Small-Signal Gain TYP dBm 37 35 _______________________________________________________________________________________ 3 MAX2066 +3.3V SUPPLY AC ELECTRICAL CHARACTERISTICS MAX2066 50MHz to 1000MHz High-Linearity, Serial/Parallel-Controlled Digital VGA +5V SUPPLY AC ELECTRICAL CHARACTERISTICS (continued) (Typical Application Circuit, VCC = VDD = +4.75 to +5.25V, HC mode with attenuator set for maximum gain, 50MHz ≤ fRF ≤ 1000MHz, TC = -40°C to +85°C. Typical values are at VCC = VDD = +5.0V, HC mode, PIN = -20dBm, fRF = 200MHz, and TC = +25°C, unless otherwise noted.) (Note 6) PARAMETER MIN TYP fRF = 350MHz, TC = +25°C (Note 5, 8) 17 18.7 dBm Second Harmonic POUT = +3dBm, fIN = 200MHz, TC = +25°C (Note 5) -60 -68 dBc Third Harmonic POUT = +3dBm, fIN = 200MHz, TC = +25°C (Note 5) -72 -88 dBc Output -1dB Compression Point SYMBOL P1dB CONDITIONS MAX UNITS Group Delay Includes EV kit PCB trace delay 0.8 ns Input Return Loss 50Ω source, maximum gain setting 23 dB Output Return Loss 50Ω load, maximum gain setting 18 dB 2.5 dB 52 dBm DIGITAL ATTENUATOR Insertion Loss Input Second-Order Intercept Point IIP2 PRF1 = 0dBm, PRF2 = 0dBm, Δf = 1MHz, f1 + f2 Input Third-Order Intercept Point IIP3 PRF1 = 0dBm, PRF2 = 0dBm, Δf = 1MHz Attenuation Range Step Size 41 dBm 31.2 dB 1 dB Relative Step Accuracy 0.2 dB Absolute Step Accuracy 0.45 dB 0dB to 16dB Insertion Phase Step fRF = 170MHz 4.8 24dB 8 31dB 10.8 degrees Amplitude Overshoot/Undershoot Between any two states ET = 15ns 1.0 ET = 40ns 0.05 Switching Speed RF settled to within ±0.1dB 31dB to 0dB 25 0dB to 31dB 21 Input Return Loss 50Ω source, maximum gain setting 19 dB Output Return Loss 50Ω load, maximum gain setting 19 dB 20 MHz ns dB ns SERIAL PERIPHERAL INTERFACE (SPI) Maximum Clock Speed fCLK Data-to-Clock Setup Time tCS 2 Data-to-Clock Hold Time tCH 2.5 ns Clock-to-CS Setup Time tES 3 ns ns CS Positive Pulse Width tEW 7 CS Setup Time tEWS 3.5 ns Clock Pulse Width tCW 5 ns Note 5: Guaranteed by design and characterization. Note 6: All limits include external component losses. Output measurements are performed at RF output port of the Typical Application Circuit. Note 7: Operating outside this range is possible, but with degraded performance of some parameters. Note 8: It is advisable not to continuously operate the VGA RF input above +15dBm. 4 _______________________________________________________________________________________ 50MHz to 1000MHz High-Linearity, Serial/Parallel-Controlled Digital VGA 22 20 19 18 TC = +85°C 5.000 5.125 17 16 16 15 50 250 450 650 850 50 1050 250 450 650 850 VCC (V) RF FREQUENCY (MHz) RF FREQUENCY (MHz) GAIN OVER ATTENUATOR SETTING vs. RF FREQUENCY ATTENUATOR RELATIVE ERROR vs. RF FREQUENCY ATTENUATOR ABSOLUTE ERROR vs. RF FREQUENCY 5 0.50 0.25 0 -0.25 -0.50 450 650 850 50 1050 -0.25 -0.50 -0.75 -1.00 -1.25 -1.75 -2.00 -1.00 250 0.25 0 -1.50 -0.75 -25 MAX2066 toc06 0.50 ABSOLUTE ERROR (dB) RELATIVE ERROR (dB) 0.75 1050 1.00 0.75 MAX2066 toc05 MAX2066 toc04 1.00 -15 250 450 650 850 50 1050 250 450 650 850 1050 RF FREQUENCY (MHz) RF FREQUENCY (MHz) RF FREQUENCY (MHz) INPUT MATCH OVER ATTENUATOR SETTING vs. RF FREQUENCY OUTPUT MATCH OVER ATTENUATOR SETTING vs. RF FREQUENCY REVERSE ISOLATION OVER ATTENUATOR SETTING vs. RF FREQUENCY 0dB, 1dB, 2dB, 4dB 8dB -20 -30 REVERSE ISOLATION (dB) 1dB -5 OUTPUT MATCH (dB) 0dB 8dB -10 -15 -20 16dB, 31dB -40 MAX2066 toc09 16dB -30 MAX2066 toc08 0 MAX2066 toc07 0 INPUT MATCH (dB) 19 17 5.250 15 -10 20 18 TC = +85°C 15 4.875 25 50 VCC = 4.75V, 5.00V, 5.25V 21 GAIN (dB) 120 100 4.750 MAX2066 toc03 MAX2066 toc03 TC = -40°C TC = +25°C TC = +25°C 130 GAIN (dB) SUPPLY CURRENT (mA) 22 23 21 110 GAIN (dB) 23 MAX2066 toc01 TC = -40°C 140 GAIN vs. RF FREQUENCY GAIN vs. RF FREQUENCY SUPPLY CURRENT vs. SUPPLY VOLTAGE 150 -40 ATTENUATOR 0dB -50 ATTENUATOR 31dB -60 -25 4dB 31dB 2dB -70 -30 -50 50 250 450 650 RF FREQUENCY (MHz) 850 1050 50 250 450 650 RF FREQUENCY (MHz) 850 1050 50 250 450 650 850 1050 RF FREQUENCY (MHz) _______________________________________________________________________________________ 5 MAX2066 Typical Operating Characteristics (VCC = VDD = +5.0V, HC mode, digital attenuator set for maximum gain, PIN = -20dBm, fRF = 200MHz, and TC = +25°C, unless otherwise noted.) Typical Operating Characteristics (continued) (VCC = VDD = +5.0V, HC mode, digital attenuator set for maximum gain, PIN = -20dBm, fRF = 200MHz, and TC = +25°C, unless otherwise noted.) 20 10 -10 MAX2066 toc11 7 8 VCC = 4.75V, 5.00V, 5.25V 6 5 TC = +25°C 50 250 450 650 TC = -40°C 3 REFERENCED TO HIGH GAIN STATE POSITIVE PHASE = ELECTRICALLY SHORTER 250 450 650 50 1050 850 250 OUTPUT P1dB vs. RF FREQUENCY 21 MAX2066 toc13 TC = +85°C 20 VCC = 5.25V TC = -40°C 19 VCC = 5.00V 18 17 16 16 15 15 1050 POUT = 0dBm/TONE 50 OUTPUT IP3 (dBm) OUTPUT P1dB (dBm) 18 850 55 TC = +25°C 19 650 OUTPUT IP3 vs. RF FREQUENCY OUTPUT P1dB vs. RF FREQUENCY 20 450 RF FREQUENCY (MHz) RF FREQUENCY (MHz) 21 OUTPUT P1dB (dBm) 5 2 50 RF FREQUENCY (MHz) 17 6 3 2 1050 850 7 4 4 MAX2066 toc14 0 TC = +85°C MAX2066 toc15 30 9 NOISE FIGURE (dB) 40 8 NOISE FIGURE (dB) S21 PHASE CHANGE (DEG) 50 NOISE FIGURE vs. RF FREQUENCY NOISE FIGURE vs. RF FREQUENCY 9 MAX2066 toc10 60 MAX2066 toc12 ATTENUATOR PHASE CHANGE BETWEEN STATES vs. RF FREQUENCY 45 TC = +25°C 40 VCC = 4.75V TC = -40°C 35 TC = +85°C 450 650 850 1050 50 250 450 RF FREQUENCY (MHz) OUTPUT IP3 vs. RF FREQUENCY VCC = 5.00V 40 VCC = 4.75V 650 850 1050 650 850 1050 2nd HARMONIC vs. RF FREQUENCY 43 42 POUT = 3dBm TC = -40°C 70 TC = +85°C 60 TC = +25°C 50 TC = -40°C, +25°C, +85°C, LSB, USB 40 450 RF FREQUENCY (MHz) 6 44 41 30 450 80 2nd HARMONIC (dBc) VCC = 5.25V 250 250 RF FREQUENCY (MHz) POUT = 0dBm/TONE fRF = 200MHz OUTPUT IP3 (dBm) 50 50 50 1050 45 MAX2066 toc16 POUT = 0dBm/TONE 35 850 OUTPUT IP3 vs. ATTENUATOR STATE 55 45 650 RF FREQUENCY (MHz) MAX2066 toc18 250 30 MAX2066 toc17 50 OUTPUT IP3 (dBm) MAX2066 50MHz to 1000MHz High-Linearity, Serial/Parallel-Controlled Digital VGA 40 0 4 8 12 16 20 24 ATTENUATOR STATE (dB) 28 32 50 250 450 650 RF FREQUENCY (MHz) _______________________________________________________________________________________ 850 1050 50MHz to 1000MHz High-Linearity, Serial/Parallel-Controlled Digital VGA 2nd HARMONIC vs. ATTENUATOR STATE VCC = 4.75V 50 69 68 TC = +25°C 67 100 65 40 450 650 850 4 8 24 28 32 50 TC = -40°C 85 TC = +25°C 55 50 TC = +85°C 45 40 0 1050 60 TC = +25°C 80 TC = -40°C 850 4 8 12 16 20 24 28 32 50 250 ATTENUATOR STATE (dB) RF FREQUENCY (MHz) MAX2066 toc25 68 VCC = 5.25V 60 55 POUT = 0dBm/TONE fRF = 200MHz TC = -40°C 66 OIP2 (dBm) VCC = 5.00V 650 850 1050 OIP2 vs. ATTENUATOR STATE POUT = 0dBm/TONE 70 450 RF FREQUENCY (MHz) OIP2 vs. RF FREQUENCY 75 65 1050 POUT = 0dBm/TONE 70 650 850 65 VCC = 5.00V 450 650 70 90 60 250 450 OIP2 vs. RF FREQUENCY 75 50 250 75 OIP2 (dBm) 80 TC = +85°C RF FREQUENCY (MHz) POUT = 3dBm fRF = 200MHz TC = +85°C 95 3rd HARMONIC (dBc) 90 OIP2 (dBm) 3rd HARMONIC (dBc) 20 100 MAX2066 toc22 POUT = 3dBm VCC = 5.25V 70 16 3rd HARMONIC vs. ATTENUATOR STATE 3rd HARMONIC vs. RF FREQUENCY 110 VCC = 4.75V 12 ATTENUATOR STATE (dB) RF FREQUENCY (MHz) 100 TC = -40°C 60 0 1050 MAX2066 toc23 250 80 70 66 50 TC = +25°C 90 TC = +85°C VCC = 5.00V MAX2066 toc21 MAX2066 toc20 TC = -40°C POUT = 3dBm MAX2066 toc24 60 POUT = 3dBm fRF = 200MHz 70 3rd HARMONIC vs. RF FREQUENCY 110 3rd HARMONIC (dBc) 70 2nd HARMONIC (dBc) 2nd HARMONIC (dBc) MAX2066 toc19 POUT = 3dBm VCC = 5.25V 71 MAX2066 toc26 2nd HARMONIC vs. RF FREQUENCY 80 64 TC = +25°C 62 TC = +85°C 50 60 VCC = 4.75V 45 40 58 50 250 450 650 RF FREQUENCY (MHz) 850 1050 0 4 8 12 16 20 24 28 32 ATTENUATOR STATE (dB) _______________________________________________________________________________________ 7 MAX2066 Typical Operating Characteristics (continued) (VCC = VDD = +5.0V, HC mode, digital attenuator set for maximum gain, PIN = -20dBm, fRF = 200MHz, and TC = +25°C, unless otherwise noted.) Typical Operating Characteristics (continued) (VCC = VDD = +5.0V, digital attenuator only, maximum gain, PIN = -20dBm and TC = +25°C, unless otherwise noted.) GAIN vs. RF FREQUENCY (ATTENUATOR ONLY) GAIN vs. RF FREQUENCY (ATTENUATOR ONLY) -1 MAX2066 toc28 0 MAX2066 toc27 0 -1 TC = -40°C -2 VCC = 4.75V, 5.00V, 5.25V TC = +25°C GAIN (dB) GAIN (dB) MAX2066 50MHz to 1000MHz High-Linearity, Serial/Parallel-Controlled Digital VGA -3 -4 -3 -4 TC = +85°C -5 -5 50 250 450 650 RF FREQUENCY (MHz) 8 -2 850 1050 50 250 450 650 850 1050 RF FREQUENCY (MHz) _______________________________________________________________________________________ 50MHz to 1000MHz High-Linearity, Serial/Parallel-Controlled Digital VGA 20 19 17 TC = +25°C 16 55 4.750 5.000 5.125 250 450 650 850 50 1050 250 450 650 INPUT MATCH OVER ATTENUATOR SETTING vs. RF FREQUENCY (LOW-CURRENT MODE) OUTPUT MATCH OVER ATTENUATOR SETTING vs. RF FREQUENCY (LOW-CURRENT MODE) NOISE FIGURE vs. RF FREQUENCY (LOW-CURRENT MODE) 0 0 0dB 8dB -20 -30 -40 9 0dB, 1dB, 2dB, 4dB -10 8dB -15 -20 -30 250 450 650 850 7 6 5 TC = -40°C 2 50 1050 250 450 650 850 RF FREQUENCY (MHz) RF FREQUENCY (MHz) NOISE FIGURE vs. RF FREQUENCY (LOW-CURRENT MODE) OUTPUT P1dB vs. RF FREQUENCY (LOW-CURRENT MODE) 5 4 3 TC = +25°C 16 15 450 650 850 1050 18 17 VCC = 5.25V VCC = 5.00V 16 15 VCC = 4.75V TC = +85°C 14 250 OUTPUT P1dB vs. RF FREQUENCY (LOW-CURRENT MODE) OUTPUT P1dB (dBm) OUTPUT P1dB (dBm) 6 TC = -40°C 17 50 MAX2066 toc36 VCC = 4.75V, 5.00V, 5.25V 7 1050 RF FREQUENCY (MHz) 18 MAX2066 toc35 9 8 8 3 2dB -50 50 TC = +25°C TC = +85°C 4 16dB, 31dB -25 MAX2066 toc34 10 MAX2066 toc37 4dB MAX2066 toc33 -5 1dB 11 NOISE FIGURE (dB) 31dB MAX2066 toc32 RF FREQUENCY (MHz) 16dB 1050 850 RF FREQUENCY (MHz) OUTPUT MATCH (dB) INPUT MATCH (dB) 15 50 5.250 VCC (V) -10 NOISE FIGURE (dB) 16 15 4.875 19 TC = +85°C 17 TC = +85°C 20 18 18 65 VCC = 4.75V, 5.00V, 5.25V 21 GAIN (dB) 75 22 TC = -40°C 21 MAX2066 toc31 22 TC = +25°C TC = -40°C 23 MAX2066 toc30 MAX2066 toc29 23 GAIN (dB) SUPPLY CURRENT (mA) 85 GAIN vs. RF FREQUENCY (LOW-CURRENT MODE) GAIN vs. RF FREQUENCY (LOW-CURRENT MODE) SUPPLY CURRENT vs. SUPPLY VOLTAGE (LOW-CURRENT MODE) 14 2 13 13 1 50 250 450 650 RF FREQUENCY (MHz) 850 1050 50 250 450 650 RF FREQUENCY (MHz) 850 1050 50 250 450 650 850 1050 RF FREQUENCY (MHz) _______________________________________________________________________________________ 9 MAX2066 Typical Operating Characteristics (continued) (VCC = VDD = +5.0V, LC mode, digital attenuator set for maximum gain, PIN = -20dBm, fRF = 200MHz, and TC = +25°C, unless otherwise noted.) Typical Operating Characteristics (continued) (VCC = VDD = +5.0V, LC mode, digital attenuator set for maximum gain, PIN = -20dBm, fRF = 200MHz, and TC = +25°C, unless otherwise noted.) VCC = 5.00V 40 OUTPUT IP3 (dBm) TC = -40°C 35 TC = +85°C 43 35 VCC = 4.75V 30 30 250 450 850 650 39 TC = +25°C USB TC = +85°C USB TC = +85°C LSB 250 450 650 850 0 1050 4 8 12 16 20 24 28 32 RF FREQUENCY (MHz) RF FREQUENCY (MHz) ATTENUATOR STATE (dB) 2nd HARMONIC vs. RF FREQUENCY (LOW-CURRENT MODE) 2nd HARMONIC vs. RF FREQUENCY (LOW-CURRENT MODE) 2nd HARMONIC vs. ATTENUATOR STATE (LOW-CURRENT MODE) TC = -40°C 60 TC = +25°C 50 VCC = 5.25V 70 73 VCC = 5.00V 60 VCC = 4.75V 40 850 650 TC = +25°C 71 70 TC = +85°C TC = -40°C 69 68 40 450 POUT = 3dBm fRF = 200MHz 72 50 TC = +85°C 250 MAX2066 toc43 POUT = 3dBm 2nd HARMONIC (dBc) 70 80 2nd HARMONIC (dBc) POUT = 3dBm MAX2066 toc42 80 67 50 1050 250 450 850 650 1050 0 4 8 12 16 20 24 28 32 RF FREQUENCY (MHz) ATTENUATOR STATE (dB) 3rd HARMONIC vs. RF FREQUENCY (LOW-CURRENT MODE) 3rd HARMONIC vs. RF FREQUENCY (LOW-CURRENT MODE) 3rd HARMONIC vs. ATTENUATOR STATE (LOW-CURRENT MODE) POUT = 3dBm 100 POUT = 3dBm 100 3rd HARMONIC (dBc) TC = -40°C 90 110 TC = +25°C 80 70 VCC = 5.00V 90 VCC = 5.25V 80 70 90 POUT = 3dBm fRF = 200MHz TC = +25°C 3rd HARMONIC (dBc) 110 MAX2066 toc46 RF FREQUENCY (MHz) MAX2066 toc44 50 TC = +25°C LSB 41 35 50 1050 MAX2066 toc41 50 TC = -40°C LSB TC = -40°C USB 37 25 25 2nd HARMONIC (dBc) VCC = 5.25V POUT = 0dBm/TONE fRF = 200MHz MAX2066 toc45 OUTPUT IP3 (dBm) 40 45 MAX2066 toc40 POUT = 0dBm/TONE OUTPUT IP3 (dBm) TC = +25°C 45 MAX2066 toc39 POUT = 0dBm/TONE MAX2066 toc38 45 OUTPUT IP3 vs. ATTENUATOR STATE (LOW-CURRENT MODE) OUTPUT IP3 vs. RF FREQUENCY (LOW-CURRENT MODE) OUTPUT IP3 vs. RF FREQUENCY (LOW-CURRENT MODE) 3rd HARMONIC (dBc) MAX2066 50MHz to 1000MHz High-Linearity, Serial/Parallel-Controlled Digital VGA TC = +85°C 85 80 TC = -40°C VCC = 4.75V TC = +85°C 60 60 50 250 450 650 RF FREQUENCY (MHz) 10 850 1050 75 50 250 450 650 RF FREQUENCY (MHz) 850 1050 0 4 8 12 16 20 24 ATTENUATOR STATE (dB) ______________________________________________________________________________________ 28 32 50MHz to 1000MHz High-Linearity, Serial/Parallel-Controlled Digital VGA OIP2 vs. RF FREQUENCY (LOW-CURRENT MODE) 70 75 POUT = 0dBm/TONE 70 POUT = 0dBm/TONE fRF = 200MHz TC = -40°C 68 65 TC = -40°C 60 TC = +25°C 55 50 VCC = 5.25V 60 VCC = 5.00V 55 66 64 VCC = 4.75V 50 TC = +85°C OIP2 (dBm) OIP2 (dBm) 65 OIP2 (dBm) 70 MAX2066 toc49 POUT = 0dBm/TONE MAX2066 toc47 75 OIP2 vs. ATTENUATOR STATE (LOW-CURRENT MODE) MAX2066 toc48 OIP2 vs. RF FREQUENCY (LOW-CURRENT MODE) TC = +25°C TC = +85°C 62 45 45 40 40 50 250 450 650 RF FREQUENCY (MHz) 850 1050 60 50 250 450 650 RF FREQUENCY (MHz) 850 1050 0 4 8 12 16 20 24 28 32 ATTENUATOR STATE (dB) ______________________________________________________________________________________ 11 MAX2066 Typical Operating Characteristics (continued) (VCC = VDD = +5.0V, LC mode, digital attenuator set for maximum gain, PIN = -20dBm, fRF = 200MHz, and TC = +25°C, unless otherwise noted.) Typical Operating Characteristics (continued) (VCC = VDD = +3.3V, HC mode, digital attenuator set for maximum gain, PIN = -20dBm, fRF = 200MHz, and TC = +25°C, unless otherwise noted.) SUPPLY CURRENT vs. SUPPLY VOLTAGE TC = -40°C 19 3.30 3.45 3.60 15 50 250 650 850 1050 VCC (V) RF FREQUENCY (MHz) INPUT MATCH OVER ATTENUATOR SETTING vs. RF FREQUENCY OUTPUT MATCH OVER ATTENUATOR SETTING vs. RF FREQUENCY 1dB 8dB 0dB -20 -30 -40 31dB -15 -20 16dB, 31dB -25 2dB 4dB 0dB, 1dB, 2dB, 4dB -10 VCC = 3.3V 450 650 850 250 450 650 850 TC = -40°C 1050 VCC = 3.3V 16 TC = -40°C OUTPUT P1dB (dBm) 6 5 VCC = 3.6V 3 2 250 450 650 RF FREQUENCY (MHz) 250 15 850 1050 650 850 17 16 TC = +25°C 14 13 12 450 1050 OUTPUT P1dB vs. RF FREQUENCY TC = +85°C VCC = 3.3V VCC = 3.6V 15 14 13 12 11 11 10 10 VCC = 3.0V 9 9 50 50 RF FREQUENCY (MHz) 17 MAX2066 toc56 VCC = 3.3V 7 4 TC = +25°C OUTPUT P1dB vs. RF FREQUENCY NOISE FIGURE vs. RF FREQUENCY 9 VCC = 3.0V 5 RF FREQUENCY (MHz) RF FREQUENCY (MHz) 8 6 2 50 1050 7 3 OUTPUT P1dB (dBm) 250 1050 4 8dB MAX2066 toc57 50 850 650 TC = +85°C 8 -30 -50 450 NOISE FIGURE vs. RF FREQUENCY NOISE FIGURE (dB) 16dB 250 9 MAX2066 toc54 -10 VCC = 3.3V -5 OUTPUT MATCH (dB) VCC = 3.3V 50 RF FREQUENCY (MHz) 0 MAX2066 toc53 0 12 450 MAX2066 toc55 3.15 VCC = 3.0V 16 15 3.00 VCC = 3.3V 19 17 16 40 20 18 TC = +85°C 17 TC = +85°C INPUT MATCH (dB) 20 18 50 VCC = 3.6V 21 TC = +25°C MAX2066 toc58 60 22 GAIN (dB) GAIN (dB) 21 MAX2066 toc52 VCC = 3.3V 22 TC = +25°C 70 GAIN vs. RF FREQUENCY 23 MAX2066 toc51 TC = -40°C SUPPLY CURRENT (mA) GAIN vs. RF FREQUENCY 23 MAX2066 toc50 80 NOISE FIGURE (dB) MAX2066 50MHz to 1000MHz High-Linearity, Serial/Parallel-Controlled Digital VGA 50 250 450 650 RF FREQUENCY (MHz) 850 1050 50 250 450 650 RF FREQUENCY (MHz) ______________________________________________________________________________________ 850 1050 50MHz to 1000MHz High-Linearity, Serial/Parallel-Controlled Digital VGA OUTPUT IP3 vs. RF FREQUENCY 30 40 VCC = 3.3V VCC = 3.6V 35 30 TC = +25°C LSB 39 38 37 36 TC = -40°C LSB TC = -40°C USB TC = +85°C USB VCC = 3.0V 25 TC = +85°C LSB 35 25 TC = +85°C 34 20 20 450 650 850 50 1050 250 2nd HARMONIC vs. RF FREQUENCY 1050 0 TC = +25°C 60 50 70 30 VCC = 3.6V 60 50 650 850 1050 28 32 VCC = 3.3V fRF = 200MHz POUT = 3dBm TC = +25°C 60 TC = -40°C 450 650 850 1050 0 4 8 RF FREQUENCY (MHz) 12 16 20 24 28 32 ATTENUATOR STATE (dB) 3rd HARMONIC vs. RF FREQUENCY 3rd HARMONIC vs. RF FREQUENCY 90 TC = +25°C 80 TC = +85°C 70 POUT = 3dBm 100 3rd HARMONIC (dBc) VCC = 3.3V POUT = 3dBm 110 MAX2066 toc65 110 3rd HARMONIC (dBc) 24 50 250 RF FREQUENCY (MHz) 60 20 55 50 100 16 TC = +85°C 65 VCC = 3.0V 30 450 12 70 VCC = 3.3V 40 TC = -40°C 250 8 2nd HARMONIC vs. ATTENUATOR STATE POUT = 3dBm 2nd HARMONIC (dBc) TC = +85°C 50 4 ATTENUATOR STATE (dB) 80 MAX2066 toc62 VCC = 3.3V POUT = 3dBm 2nd HARMONIC (dBc) 850 2nd HARMONIC vs. RF FREQUENCY 80 40 650 RF FREQUENCY (MHz) RF FREQUENCY (MHz) 70 450 2nd HARMONIC (dBc) 250 MAX2066 toc63 50 VCC = 3.3V fRF = 200MHz POUT = 0dBm/TONE MAX2066 toc64 TC = -40°C MAX2066 toc60 45 TC = +25°C USB 90 VCC = 3.3V VCC = 3.6V 80 70 60 TC = -40°C MAX2066 toc66 35 40 OUTPUT IP3 (dBm) TC = +25°C 40 POUT = 0dBm/TONE OUTPUT IP3 (dBm) OUTPUT IP3 (dBm) 45 MAX2066 toc59 VCC = 3.3V POUT = 0dBm/TONE OUTPUT IP3 vs. ATTENUATOR STATE 50 MAX2066 toc61 OUTPUT IP3 vs. RF FREQUENCY 50 VCC = 3.0V 50 50 50 250 450 650 RF FREQUENCY (MHz) 850 1050 50 250 450 650 850 1050 RF FREQUENCY (MHz) ______________________________________________________________________________________ 13 MAX2066 Typical Operating Characteristics (continued) (VCC = VDD = +3.3V, HC mode, digital attenuator set for maximum gain, PIN = -20dBm, fRF = 200MHz, and TC = +25°C, unless otherwise noted.) Typical Operating Characteristics (continued) (VCC = VDD = +3.3V, HC mode, digital attenuator set for maximum gain, PIN = -20dBm, fRF = 200MHz, and TC = +25°C, unless otherwise noted.) 3rd HARMONIC vs. ATTENUATOR STATE VCC = 3.3V POUT = 0dBm/TONE TC = +85°C 60 MAX2068 toc68 VCC = 3.3V fRF = 200MHz POUT = 3dBm 80 TC = +85°C TC = +25°C OIP2 (dBm) 50 75 TC = -40°C 40 TC = -40°C TC = +25°C 30 70 0 4 8 12 16 20 24 28 32 50 250 450 ATTENUATOR STATE (dB) OIP2 vs. RF FREQUENCY 850 1050 OIP2 vs. ATTENUATOR STATE POUT = 0dBm/TONE VCC = 3.3V 70 MAX2066 toc69 70 60 650 RF FREQUENCY (MHz) VCC = 3.3V fRF = 200MHz POUT = 0dBm/TONE TC = +85°C MAX2066 toc70 3rd HARMONIC (dBc) OIP2 vs. RF FREQUENCY 70 MAX2066 toc67 85 60 VCC = 3.6V OIP2 (dBm) OIP2 (dBm) MAX2066 50MHz to 1000MHz High-Linearity, Serial/Parallel-Controlled Digital VGA 50 50 TC = +25°C TC = -40°C 40 40 VCC = 3.0V 30 30 50 250 450 650 RF FREQUENCY (MHz) 14 850 1050 0 4 8 12 16 20 24 28 ATTENUATOR STATE (dB) ______________________________________________________________________________________ 32 50MHz to 1000MHz High-Linearity, Serial/Parallel-Controlled Digital VGA PIN NAME 1, 16, 19, 22, 24–28, 30, 31, 33–36 GND Ground 2, 3, 32, 37–40 GND Ground. See the Pin-Compatibility Considerations section. 4 DATA SPI Data Digital Input 5 CLK SPI Clock Digital Input 6 CS SPI Chip-Select Digital Input 7 VDD_LOGIC 8 SER/PAR 9 STATE_A 10 STATE_B DESCRIPTION Digital Logic Supply Input. Connect to the digital logic power supply, VDD. Bypass to GND with a 10nF capacitor as close as possible to the pin. Digital Attenuator SPI or Parallel Control Selection Logic Input. Logic 0 = parallel control, Logic 1 = serial control. Digital Attenuator Preprogrammed Attenuation State Logic Input State A State B Digital Attenuator Logic = 0 Logic = 0 Preprogrammed State 1 Logic = 1 Logic = 0 Preprogrammed State 2 Logic = 0 Logic = 1 Preprogrammed State 3 Logic = 1 Logic = 1 Preprogrammed State 4 11 D4 16dB Attenuator Logic Input. Logic 0 = disable, Logic 1 = enable. 12 D3 8dB Attenuator Logic Input. Logic 0 = disable, Logic 1 = enable. 13 D2 4dB Attenuator Logic Input. Logic 0 = disable, Logic 1 = enable. 14 D1 2dB Attenuator Logic Input. Logic 0 = disable, Logic 1 = enable. 15 D0 1dB Attenuator Logic Input. Logic 0 = disable, Logic 1 = enable. 17 AMP_OUT 18 RSET 20 AMP_IN 21 VCC_AMP 23 ATTEN_OUT 29 ATTEN_IN — EP Driver Amplifier Output (50Ω). See the Typical Application Circuit for details. Driver Amplifier Bias Setting. See the External Bias section. Driver Amplifier Input (50Ω). See the Typical Application Circuit for details. Driver Amplifier Supply Voltage Input. Connect to the VCC power supply. Bypass to GND with 1000pF and 10nF capacitors as close as possible to the pin with the smaller value capacitor closer to the part. 5-Bit Digital Attenuator Output (50Ω). Internally matched to 50Ω. Requires an external DC blocking capacitor. 5-Bit Digital Attenuator Input (50Ω). Internally matched to 50Ω. Requires an external DC blocking capacitor. Exposed Pad. Internally connected to GND. Connect EP to GND for proper RF performance and enhanced thermal dissipation. ______________________________________________________________________________________ 15 MAX2066 Pin Description MAX2066 50MHz to 1000MHz High-Linearity, Serial/Parallel-Controlled Digital VGA Detailed Description The MAX2066 high-linearity digital variable-gain amplifier is a general-purpose, high-performance amplifier designed to interface with 50Ω systems operating in the 50MHz to 1000MHz frequency range. The MAX2066 integrates a digital attenuator to provide 31dB of gain control, as well as a driver amplifier optimized to provide high gain, high IP3, low noise figure, and low power consumption. For applications that do not require high linearity, the bias current of the amplifier can be adjusted by an external resistor to further reduce power consumption. The attenuator is controlled as a slave peripheral using either the SPI-compatible interface or a parallel bus with 31dB total adjustment range in 1dB steps. An added feature allows “rapid-fire” gain selection between each of the four unique steps (preprogrammed by the user through the SPI-compatible interface). The 2-pin control allows the user to quickly access any one of four customized attenuation states without reprogramming the SPI bus. Because each stage has its own external RF input and RF output, this component can be configured to either optimize NF (amplifier configured first), or OIP3 (amplifier last). The device’s performance features include 22dB standalone amplifier gain (amplifier only), 5.2dB NF at maximum gain (includes attenuator insertion loss), and a high OIP3 level of +42.4dBm. Each of these features makes the MAX2066 an ideal VGA for numerous receiver and transmitter applications. In addition, the MAX2066 operates from a single +5V supply, or a single +3.3V supply with slightly reduced performance, and has adjustable bias to trade current consumption for linearity performance. 5-Bit Digital Attenuator Control The MAX2066 integrates a 5-bit digital attenuator to achieve a high level of dynamic range. The digital attenuator has a 31dB control range, a 1dB step size, and is programmed either through a dedicated 5-bit parallel bus or through the 3-wire SPI. See the Applications Information section and Table 1 for attenuator programming details. The attenuator can be used for both static and dynamic power control. Driver Amplifier The MAX2066 includes a high-performance driver with a fixed gain of 22dB. The driver amplifier circuit is optimized for high linearity for the 50MHz to 1000MHz frequency range. Applications Information SPI Interface and Attenuator Settings The attenuator can be programmed through the 3-wire SPI/MICROWIRE™-compatible serial interface using 5-bit words. Twenty-eight bits of data are shifted in MSB first and framed by CS. When CS is low, the clock is active and data is shifted on the rising edge of the clock. When CS transitions high, the data is latched and the attenuator setting changes (Figure 1). See Table 2 for details on the SPI data format. Table 1. Control Logic SER/PAR ATTENUATOR 0 Parallel controlled 1 SPI controlled MICROWIRE is a trademark of National Semiconductor Corp. 16 ______________________________________________________________________________________ 50MHz to 1000MHz High-Linearity, Serial/Parallel-Controlled Digital VGA MAX2066 MSB LSB DN DATA D(N - 1) D1 D0 CLOCK tCW tCS tCH CS tES tEWS tEW Figure 1. SPI Timing Diagram Table 2. SPI Data Format FUNCTION BIT D27 (MSB) Digital Attenuator State 4 DESCRIPTION 16dB step (MSB of the 5-bit word used to program the digital attenuator state 4) D26 8dB step D25 4dB step D24 2dB step D23 1dB step (LSB) D22 D21 Digital Attenuator State 3 D20 5-bit word used to program the digital attenuator state 3 (see the description for digital attenuator state 4) D19 D18 D17 D16 Digital Attenuator State 2 D15 5-bit word used to program the digital attenuator state 2 (see the description for digital attenuator state 4) D14 D13 D12 D11 Digital Attenuator State 1 D10 5-bit word used to program the digital attenuator state 1 (see the description for digital attenuator state 4) D9 D8 ______________________________________________________________________________________ 17 MAX2066 50MHz to 1000MHz High-Linearity, Serial/Parallel-Controlled Digital VGA Table 2. SPI Data Format (continued) FUNCTION BIT DESCRIPTION D7 D6 D5 Reserved D4 Bits D[7:0] are reserved. Set to logic 0. D3 D2 D1 D0 (LSB) Digital Attenuator Settings Using the Parallel Control Bus To capitalize on its fast 25ns switching capability, the MAX2066 offers a supplemental 5-bit parallel control interface. The digital logic attenuator-control pins (D0–D4) enable the attenuator stages (Table 3). Direct access to this 5-bit bus enables the user to avoid any programming delays associated with the SPI interface. One of the limitations of any SPI bus is the speed at which commands can be clocked into each peripheral device. By offering direct access to the 5-bit parallel interface, the user can quickly shift between digital attenuator states as needed for critical “fastattack” automatic gain-control (AGC) applications. “Rapid-Fire” Preprogrammed Attenuation States The MAX2066 has an added feature that provides “rapid-fire” gain selection between four prepro- grammed attenuation steps. As with the supplemental 5-bit bus mentioned above, this “rapid-fire” gain selection allows the user to quickly access any one of four customized digital attenuation states without incurring the delays associated with reprogramming the device through the SPI bus. The switching speed is comparable to that achieved using the supplemental 5-bit parallel bus. However, by employing this specific feature, the digital attenuator I/O is further reduced by a factor of either 5 or 2.5 (5 control bits vs. 1 or 2, respectively) depending on the number of states desired. The user can employ the STATE_A and STATE_B logicinput pins to apply each step as required (Table 4). Toggling just the STATE_A pin (one control bit) yields two preprogrammed attenuation states; toggling both the STATE_A and STATE_B pins together (two control bits) yields four preprogrammed attenuation states. Table 3. Digital Attenuator Settings (Parallel Control) INPUT 18 LOGIC = 0 (OR GROUND) LOGIC = 1 D0 Disable 1dB attenuator, or when SPI is default programmer Enable 1dB attenuator D1 Disable 2dB attenuator, or when SPI is default programmer Enable 2dB attenuator D2 Disable 4dB attenuator, or when SPI is default programmer Enable 4dB attenuator D3 Disable 8dB attenuator, or when SPI is default programmer Enable 8dB attenuator D4 Disable 16dB attenuator, or when SPI is default programmer Enable 16dB attenuator ______________________________________________________________________________________ 50MHz to 1000MHz High-Linearity, Serial/Parallel-Controlled Digital VGA Table 4. Preprogrammed Attenuation State Settings STATE_A STATE_B DIGITAL ATTENUATOR 0 0 Preprogrammed attenuation state 1 1 0 Preprogrammed attenuation state 2 0 1 Preprogrammed attenuation state 3 1 1 Preprogrammed attenuation state 4 Layout Considerations The pin configuration of the MAX2066 has been optimized to facilitate a very compact physical layout of the device and its associated discrete components. The exposed paddle (EP) of the MAX2066’s 40-pin thin QFN-EP package provides a low thermal-resistance path to the die. It is important that the PCB on which the MAX2066 is mounted be designed to conduct heat from the EP. In addition, provide the EP with a lowinductance path to electrical ground. The EP must be soldered to a ground plane on the PCB, either directly or through an array of plated via holes. External Bias Bias currents for the driver amplifier are set and optimized through external resistors. Resistors R1 and R1A connected to RSET (pin 18) set the bias current for the amplifier. The external biasing resistor values can be increased for reduced current operation at the expense of performance. See Tables 6 and 7 for details. Table 5. MAX2065/MAX2066 Pin Comparison PIN MAX2065 MAX2066 2 VREF_SELECT GND +5V and +3.3V Supply Voltage 3 VDAC_EN GND The MAX2066 features an optional +3.3V supply voltage operation with slightly reduced linearity performance. 32 ATTEN1_OUT GND 37 ATTEN1_IN GND Pin-Compatibility Considerations 38 VCC_ANALOG GND The MAX2066 is a simplified version of the MAX2065 analog/digital VGA. The MAX2066 does not contain an analog attenuator, on-chip DAC, or internal reference. The associated input/output pins are internally connected to ground (Table 5). Ground the unused input/output pins to optimize isolation. (See the Typical Application Circuit.) 39 ANALOG_VCTRL GND 40 VREF_IN GND ______________________________________________________________________________________ 19 MAX2066 As an example, assume that the AGC application requires a static attenuation adjustment to trim out gain inconsistencies within a receiver lineup. The same AGC circuit can also be called upon to dynamically attenuate an unwanted blocker signal that could de-sense the receiver and lead to an ADC overdrive condition. In this example, the MAX2066 would be preprogrammed (through the SPI bus) with two customized attenuation states—one to address the static gain trim adjustment, the second to counter the unwanted blocker condition. Toggling just the STATE_A control bit enables the user to switch quickly between the static and dynamic attenuation settings with only one I/O pin. If desired, the user can also program two additional attenuation states by using the STATE_B control bit as a second I/O pin. These two additional attenuation settings are useful for software-defined radio applications where multiple static gain settings may be needed to account for different frequencies of operation, or where multiple dynamic attenuation settings are needed to account for different blocker levels (as defined by multiple wireless standards). MAX2066 50MHz to 1000MHz High-Linearity, Serial/Parallel-Controlled Digital VGA Table 6. Typical Application Circuit Component Values (HC Mode) DESIGNATION VALUE SIZE VENDOR DESCRIPTION C1, C2, C7 10nF 0402 Murata Mfg. Co., Ltd. X7R C3, C4, C6, C8, C9 1000pF 0402 Murata Mfg. Co., Ltd. C0G ceramic capacitors L1 470nH 1008 Coilcraft, Inc. 1008CS-471XJLC R1, R1A 10Ω 0402 Vishay 1% R2 (+3.3V applications only) 1kΩ 0402 Panasonic Corp. 1% R3 (+3.3V applications only) 2kΩ 0402 Panasonic Corp. 1% U1 — 40-pin thin QFN-EP (6mm x 6mm) Maxim Integrated Products, Inc. MAX2066ETL+ Table 7. Typical Application Circuit Component Values (LC Mode) DESIGNATION VALUE SIZE VENDOR C1, C2, C7 10nF 0402 Murata Mfg. Co., Ltd. DESCRIPTION X7R C3, C4, C6, C8, C9 1000pF 0402 Murata Mfg. Co., Ltd. C0G ceramic capacitors 1008CS-471XJLC L1 470nH 1008 Coilcraft, Inc. R1 24Ω 0402 Vishay 1% R1A 0.01µF 0402 Murata Mfg. Co., Ltd. X7R R2 (+3.3V applications only) 1kΩ 0402 Panasonic Corp. 1% R3 (+3.3V applications only) 2kΩ 0402 Panasonic Corp. 1% U1 — 40-pin thin QFN-EP (6mm x 6mm) Maxim Integrated Products, Inc. MAX2066ETL+ Amplitude Overshoot Reduction To reduce amplitude overshoot during digital attenuator state change, connect a bandpass filter (parallel LC type) from ATTEN_OUT (pin 23) to ground. L = 18nH and C = 47pF are recommended for 169MHz operation (Figure 2). Contact the factory for recommended components for other operating frequencies. 26 25 GND GND L 24 23 22 C GND C8 ATTEN_OUT GND VCC 21 VCC_AMP C6 C7 Figure 2. Bandpass Filter to Reduce Amplitude Overshoot 20 ______________________________________________________________________________________ 50MHz to 1000MHz High-Linearity, Serial/Parallel-Controlled Digital VGA GND GND GND GND GND GND GND GND DIGITAL ATTENUATOR MAX2066 4 5 6 7 8 27 26 25 24 23 DRIVER AMP 9 22 10 21 12 13 14 15 16 17 18 19 GND ATTEN_IN C9 RF INPUT GND GND GND GND GND ATTEN_OUT C8 GND VCC VCC_AMP 20 AMP_IN 11 GND STATE_B 31 28 RSET STATE_A 32 3 AMP_OUT SER/PAR 33 29 D4 C1 34 GND VDD_LOGIC 35 2 D0 CS VDD 36 30 D1 CLK 37 EP D2 DATA 38 39 SPI INTERFACE GND 40 1 D3 GND GND GND + GND C6 C7 R2 R1 R3 VCC L1 C2 C3 R1A* C4 RF OUTPUT *IN LC MODE, R1A IS A 0.01μF CAPACITOR. SEE TABLE 7 FOR DETAILS. ______________________________________________________________________________________ 21 MAX2066 Typical Application Circuit 50MHz to 1000MHz High-Linearity, Serial/Parallel-Controlled Digital VGA MAX2066 Pin Configuration/Functional Block Diagram GND GND GND GND GND GND GND GND GND + GND TOP VIEW 40 39 38 37 36 35 34 33 32 31 GND 1 30 GND GND 2 29 ATTEN_IN GND 3 28 GND DATA 4 DIGITAL ATTENUATOR MAX2066 CLK 5 SPI INTERFACE CS 6 VDD_LOGIC 7 SER/PAR 8 27 GND 26 GND 25 GND 24 GND 23 ATTEN_OUT DRIVER AMP STATE_A 9 22 GND 15 16 17 18 19 20 AMP_OUT RSET GND AMP_IN D2 14 GND 13 D0 12 D1 11 D3 21 VCC_AMP D4 STATE_B 10 TQFN EXPOSED PAD ON BOTTOM. CONNECT EP TO GND. Chip Information PROCESS: SiGe BiCMOS 22 ______________________________________________________________________________________ 50MHz to 1000MHz High-Linearity, Serial/Parallel-Controlled Digital VGA MAX2066 Package Information For the latest package outline information, go to www.maxim-ic.com/packages. PACKAGE TYPE PACKAGE CODE DOCUMENT NO. 40 Thin QFN-EP T4066-3 21-0141 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 23 © 2008 Maxim Integrated Products is a registered trademark of Maxim Integrated Products, Inc.