RFMD SIW1721BFIG-T13

SiW1721B
BLUETOOTH® RADIO MODEM
0
Features
• Integrated RF transceiver and
modem for Bluetooth wireless
technology.
SiW1721B Radio Modem
• Manufactured using low-power
0.18-micron CMOS process
technology.
• Digital baseband interface connects
directly to an integrated Bluetooth
controller.
• Direct conversion RF architecture
improves receiver-blocking
performance.
Single-ended LNA
ADC
and Downconverter
GFSK
Demodulator
Single-ended Driver
DAC
and Upconverter
GFSK
Modulator
Reference
PLL
Modem
Clock
Generator
CLK Circuit
Analog
Regulator
Mobile Phone
Chip Set
Modem I/F
& Data
Radio
Programming
and Control
Integrated
Bluetooth
Baseband
SPI
• Low out-of-band spurious emissions
minimize interference with mobile
phone operations.
Reference
Clock
Digital
Regulator
Ext
Power
• Hardware AGC dynamically adjusts
receiver performance in changing
environments.
Bluetooth Subsystem Using the SiW1721B Radio Modem
• 50 Ω RF I/O does not need additional
external impedance matching
components.
• On-chip voltage regulation simplifies
system design.
• -88 dBm receiver sensitivity and
+2 dBm transmitter power typical
performance specifications.
• Bluetooth Specification V2.0
qualified. Complies with Bluetooth
specifications V1.1, V1.2 and V2.0.
Applications
• Mobile phones with integrated
controller for Bluetooth wireless
technology.
Summary
The SiW1721B is a 2.4-GHz radio transceiver for Bluetooth wireless
technology. This highly integrated transceiver is specifically designed for use
with a third party Bluetooth baseband controller chipset requiring an
external Bluetooth RF transceiver. Due to its low power CMOS process, the
design minimizes current draw in both active and standby modes.
The SiW1721B combines a radio transceiver and Gaussian Frequency Shift
Keying (GFSK) modem with digital control and interface logic. The IC also
incorporates analog and digital voltage regulators and a reference Phase
Lock Loop (PLL) capable of accepting various reference clock frequencies.
The level of integration enables a low system cost with fewer external
components.
The SiW1721B is packaged in a 5-by-5-mm, Pb-free, 32-pin QFN package
that meets RoHS (Green) requirements. Operating temperature range is
guaranteed from -40°C to +85°C.
Ordering Information
SiW1721B
Bluetooth® Radio Modem
See page 12 for details.
Optimum Technology Matching® Applied
Si BJT
GaAs HBT
Si Bi-CMOS
SiGe HBT
GaInP/HBT
GaN HEMT
GaAs MESFET
9Si CMOS
SiGe Bi-CMOS
RF Micro Devices, Inc.
7628 Thorndike Road
Greensboro, NC 27409, USA
Tel (336) 664 1233
Fax (336) 664 0454
http://www.rfmd.com
60 0076 R00F SiW1721B Radio Modem IC DS
October 6, 2006
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SiW1721B
Description
The following figure shows the SiW1721B Radio Modem functional block diagram. During the receive process, the radio
signal is taken from the single-ended RF input pin that feeds into the low noise amplifier (LNA). The signal from the LNA is
directly down-converted to I/Q baseband, filtered with an anti-aliasing filter, and converted to a digital signal with a high
resolution analog-to-digital converter. The critical channel filtering is done in the digital domain for stable and repeatable
performance. The signal is then processed by a high performance GFSK demodulator. The IC has multiple internal selfcalibration circuits to maintain stable and repeatable performance from part-to-part as well as over the full temperature
range.
The IC has two fully integrated regulators: one for the radio (analog regulator) and one for the digital logic (digital
regulator). The digital regulator can be used to supply a Bluetooth baseband controller. Both regulators can be bypassed if
external regulation is desired.
Note:
When bypassing the analog regulator, the VBATT_ANA and VCC_OUT pins must be tied together and the external analog
voltage (1.8 V) should be applied to the VBATT_ANA pin. When bypassing the digital regulator, the VBATT_DIG pin should be
left unconnected and the external digital voltage (1.8 V) should be applied to the VBB_OUT pin.
The IC also provides power on reset and glitch-free clock start-up. A reference PLL can be enabled to support a number of
different reference frequencies.
PLL
Control
Clock Distribution
VDD_IO
VCC
RESET_N
VBB_OUT
VCC_OUT
VBATT_DIG
VBATT_ANA
BB_CLK
XTAL_P/CLK
CHG_PUMP
VTUNE
Digital control functions and a programming interface provide radio modem control and a flexible interface to external
Bluetooth link controllers.
Voltage Regulators and
Power Distribution
LNA
ADC
0
90
RF_IO
IDAC
Internal
50-Ohm
Match
Network
ADC
PLL
Synthesizer
GFSK
Modem
RX_TX_DATA
CD_TXEN
DAC
Power
Control
0
90
TX_BIAS
SPI_SS
SPI_TXD
SPI_RXD
SPI_CLK
DAC
Serial
Programming
Interface
(SPI)
ENABLE_RM
Register
File
System
Control
HOP_STROBE
TX_RX_SWITCH
SiW1721B Block Diagram
Radio Interface
An internal power control loop maintains a very stable RF_IO signal level over the full temperature range and from part to
part. This means predictable and repeatable range at any temperature.
Modem Interface
The modem interface transfers the Bluetooth data between the SiW1721B Radio Modem and the ASIC. For reference
purposes, the pin description table (Table 1) provides a brief description of typical interface modes.
Clock Signals
Multiple reference clock frequencies can be used as a reference for the RF circuits, to synthesize clocks for most of the
internal digital circuits, and to supply external processors with timing signals.
Serial Programming Interface (SPI)
The serial programming interface (SPI) is used to access the internal registers of the SiW1721B Radio Modem. The SPI is
a synchronous serial interface that can be clocked to a nominal speed of 8MHz.
Power
The SiW1721B Radio Modem includes both analog and digital voltage regulators. Input options are based on factors such
as voltage source, where internal regulators are used, and I/O voltage.
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60 0076 R00F SiW1721B Radio Modem IC DS
SiW1721B
Pin Description
The SiW1721B Radio Modem’s radio and modem interface (SPI), a single clock input, and supply voltage are required for
proper operation.
Name
Pad Type
Description
Radio Interface Signal Description
RF_IO
Analog
IDAC
Analog
TX_RX_SWITCH
CMOS output
TX_BIAS
Analog
Combined 50 Ω input and output pin in normal mode. Rx only in power class 1 mode.
Power control to external power amplifier. This output provides a variable current source that
can be used to control the external power amp. Leave unconnected if not used.
Output signal to indicate the current state of the radio. The polarity is programmable with the
default set as:
Low=Transmit mode.
High=Non-transmit mode.
Bias for the output driver in normal mode, transmit output in power class 1 mode.
Modem Interface Description
RX_TX_DATA
CMOS
bi-directional
CD_TXEN
CMOS
bi-directional
ENABLE_RM
CMOS input
HOP_STROBE
CMOS input
RESET_N
CMOS input
Received sliced-mode data from radio; or transmit data to radio.
Dual function carrier detect and transmit enable. This bi-directional signal can be enabled
through internal registers. During transmit, this pin can be used as an INPUT to indicate valid
transmit data (TXEN). During receive, this pin can be used as an OUTPUT to indicate carrier
detect (CD). Input only, output, or bi-directional.
Sleep/wake control signal from baseband controller. Used to command the SiW1721B Radio
Modem from idle to sleep mode, and to awaken the SiW1721B Radio Modem from sleep
mode.
Signal generated by the baseband to indicate the start of TX or RX ramp-up.
Reset for digital circuits only. State machines and internal registers reset to their default state.
This signal is an asynchronous input with a minimum pulse width requirement of 10 µs.
Clock Signals Description
XTAL_P/CLK
Analog
XTAL_N
Analog
BB_CLK
CMOS output
System clock crystal positive input or reference clock input. For additional information see the
“Crystal Requirements” and “External Reference Requirements” sections.
System clock crystal negative input. If a reference clock frequency is used, this pin should be
left unconnected.
Selectable clock output to external baseband controller. Five frequencies are supported (in
MHz): reference frequency, reference frequency/2, 12, 13, 16, 32, 48, and 52.
BB_CLK stops oscillating when ENABLE_RM is de-asserted (low).
Serial Programming Interface Description
SPI_TXD
SPI_RXD
SPI_CLK
SPI_SS
CMOS output
CMOS input
CMOS input
CMOS input
SPI data output from SiW1721B.
SPI data input to SiW1721B.
Clock input used for synchronous data transfer on the SPI bus.
SPI slave select that enables the SiW1721B Radio Modem as the target.
Power Signals Description
VBATT_ANA
VBATT_DIG
VCC_OUT
VBB_OUT
VCC
Power
Power
Power
Power
Power
VDD_IO
Power
VBB_RDY
CMOS output
Supply voltage to internal analog voltage regulator.
Supply voltage to internal digital voltage regulator.
Regulated output from internal analog regulator.
Regulated output from internal digital regulator.
Supply voltage to on-chip analog circuits.
Supply voltage to on-chip I/O interface.
I/O pins: BB_CLK, CD_TXEN, ENABLE_RM, HOP_STROBE, RESET_N, RX_TX_DATA,
SPI_CLK, SPI_RXD, SPI_SS, SPI_TXD, TX_RX_SWITCH.
This signal is used to indicate that the internal digital regulator is stable (VBB_OUT).
Other I/O Description
VREFP_CAP
VREFN_CAP
VTUNE
CHG_PUMP
Analog
Analog
Analog
Analog
Decoupling capacitor for voltage reference for the internal A/D converter.
Decoupling capacitor for voltage reference for the internal A/D converter.
Pin for reference PLL loop filter.
Pin for RF PLL loop filter.
Table 1. SiW1721B Radio Modem Pin List
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SiW1721B
System Specifications
Absolute Maximum Ratings
Parameter
Min
Max
Unit
Analog circuit supply voltage
-0.3
3.63
V
I/O supply voltage
-0.3
3.63
V
VBATT_ANA
Analog regulator supply voltage
-0.3
3.63
V
VBATT_DIG
Digital regulator supply voltage
-0.3
3.63
V
TST
Storage temperature
-55
+125
°C
RFMAX
Maximum RF input level
–
+5
dBm
VCC
VDD_IO
Description
Note: Absolute maximum ratings indicate limits beyond which the useful life of the device may be impaired or damage may occur.
Recommended Operating Conditions
Min
Max
Unit
TOP
Parameter
Operating temperature (industrial grade)
Description
-40
+85
°C
VBATT_ANA
Supply for internal analog voltage regulator
2.3
3.63
V
VBATT_DIG
Supply for internal digital voltage regulator
2.3
3.63
V
VCC
Analog supply voltage
1.71
1.89
V
VDD_IO
Digital interface I/O supply voltage
1.62
3.63
V
ESD Rating
Symbol
Description
Rating
1
ESD
2000 V
ESD protection - all pins
1
This device is a high performance RF integrated circuit with an ESD rating of 2,000 volts (HBM conditions per Mil-Std-883, Method 3015). Handling and
assembly of this device should only be done using appropriate ESD controlled processes.
Electrical Characteristics
DC Specification (TOP =+25°C, VDD_IO =3.0V)
Symbol
Description
VIL
Input low voltage
VIH
Input high voltage
VOL
Output low voltage
VOH
Output high voltage
Output high current
Output high current (pins 16, 19)
Output low current
Output low current (pins 16, 19)
Input leakage current
IOH
IOL
IILI
Min.
Typ.
Max.
Unit
GND-0.1
0.7*VDD_IO
–
0.3*VDD_IO
V
–
VDD_IO
V
GND
0.8*VDD_IO
–
0.2*VDD_IO
V
–
500
4
500
4
<1
VDD_IO
–
–
–
–
1
V
µA
mA
µA
mA
µA
Typ.
Max.
Unit
–
–
–
–
30
16
24
13
ns
ns
ns
ns
–
–
–
–
–
AC Characteristics (TOP =+25°C, VDD_IO =3.0V, CLOAD =15pF)
Symbol
Description
Min.
tr
tf
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Rise time
Rise time (pins 16, 19)
Fall time
Fall time (pins 16, 19)
–
–
–
–
60 0076 R00F SiW1721B Radio Modem IC DS
SiW1721B
Current Consumption (TOP =+25°C, VBATT_ANA, VBATT_DIG = 3.3 V)
Min.
Typ.
Max.
IDD_SLEEP
Symbol
Current during sleep mode
Description
–
15
25
Unit
µA
IDD_IDLE
Current during idle, synthesizer not running
–
2
–
mA
IDD_TRANSMIT
Current during continuous transmit
–
41
45
mA
IDD_RECEIVE
Current during continuous receive
–
41
45
mA
Min
Typ
Max
Unit
2402
–
2480
MHz
–
55
100
µs
Radio Specification
Parameter
VCO operating
range
PLL lock time
Description
Frequency
–
Receiver Specification1
(VBATT_ANA, VBATT_DIG =3.3V, VCC =int. analog reg. output, and nominal2 Bluetooth test conditions)
Parameter
Receiver
sensitivity
Maximum usable
signal
C/I co-channel
(0.1% BER)
C/I 1MHz
(0.1% BER)
C/I 2MHz
(0.1% BER)
C/I ≥3MHz
(0.1% BER)
Out-of-band
blocking3
Intermodulation
Receiver spurious
emission
Description
Min
Typ
Max
Unit
Measured based on BER<0.1%
–
-88
-82
dBm
Measured based on BER<0.1%
-10
+5
–
dBm
Co-channel selectivity
–
8.0
11.0
dB
Adjacent channel selectivity
–
-4.0
0
dB
2nd adjacent channel selectivity
–
-38.0
-35.0
dB
3rd adjacent channel selectivity
–
-43
-40
dB
-10
-27
-27
-10
–
–
–
–
–
–
–
–
dBm
dBm
dBm
dBm
-39
-36
–
dBm
–
–
–
–
-57
-47
dBm
dBm
30 MHz to 2000 MHz
2000 MHz to 2399 MHz
2498 MHz to 3000 MHz
3000 MHz to 12.75 GHz
Max interferer level to maintain 0.1% BER,
interference signals at 3 MHz and 6 MHz offset.
30MHz to 1GHz
1 GHz to 12.75 GHz
1
Measured into the chip with a 50 Ω source and no band pass filter.
2
Nominal and extreme Bluetooth test conditions as defined by the Bluetooth Test Specification.
3
Out-of-band blocking guaranteed by design.
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SiW1721B
Transmitter Specification1
(VBATT_ANA, VBATT_DIG = 3.3 V, VCC = int. analog reg. output, and nominal Bluetooth test conditions)
Parameter
Output RF
transmit power
Description
At maximum power output level
Min
Typ
Max
Units
-2
+2
+6
dBm
kHz
Modulation
characteristics2
Δf1avg
140
155
175
Δf2max (For at least 99.9% of all Δf2max)
115
–
–
kHz
Δf1avg/Δf2avg
0.8
–
–
kHz
Initial carrier
frequency
accuracy
–
-75.0
–
+75.0
kHz
Carrier frequency
drift
One slot packet
Two slot packet
Five slot packet
Max drift rate
-25.0
-40.0
-40.0
–
–
–
–
–
+25.0
+40.0
+40.0
400
kHz
kHz
kHz
Hz/μs
Bluetooth specification
–
900
1000
kHz
2 MHz offset
>3 MHz offset
30 MHz to 1 GHz, operating mode
–
–
–
-74
-74
-70
-55.0
-55.0
-55.0
dBm
dBm
dBm
1 GHz to 12.75 GHz, operating mode3
1.8 GHz to 1.9 GHz
5.15 GHz to 5.3 GHz
–
-70
-50.0
dBm
–
–
–
–
-62.0
-47.0
dBm
dBm
Min
Typ
Max
Unit
Measured based on BER<0.1%
–
-88
-78
dBm
At maximum power output level
-4
+2
+6
dBm
kHz
20 dB occupied
bandwidth
In-band spurious
emission
Out-of-band
spurious
emission
1Measured
2The
3
into the chip with a 50 Ω source and no band pass filter.
modulation characteristic is measured as per test TRM/CA/07/C defined in the Bluetooth Test Specification.
Except transmit harmonics.
Industrial Temperature Performance1
(VBATT_ANA, VBATT_DIG =3.3V and extreme Bluetooth test conditions)
Parameter
Receiver
sensitivity
Output RF transmit
power
Description
Modulation
characteristics2
Δf1avg
140
155
175
Δf2max (For at least 99.9% of all Δf2max)
115
–
–
kHz
Δf1avg/Δf2avg
0.8
–
–
kHz
Initial carrier
frequency accuracy
–
-75.0
–
+75.0
kHz
Carrier frequency
drift
One slot packet
Two slot packet
Five slot packet
Max drift rate
-25.0
-40.0
-40.0
–
–
–
–
–
+25.0
+40.0
+40.0
+400
kHz
kHz
kHz
Hz/µs
Bluetooth specification
–
900
1000
kHz
2MHz offset
>3MHz offset
30MHz to 1GHz, operating mode
–
–
–
-74
-74
-70
-40.0
-55.0
-55.0
dBm
dBm
dBm
1GHz to 12.75GHz, operating mode3
1.8GHz to 1.9GHz
5.15GHz to 5.3GHz
–
-70
-40.0
dBm
–
–
–
–
-62.0
-47.0
dBm
dBm
20 dB occupied
bandwidth
In-band spurious
emission
Out-of-band
spurious
emission
1
Measured into the chip with a 50 Ω source and no band pass filter.
2
The modulation characteristic is measured as per test TRM/CA/07/C defined in the Bluetooth Test Specification.
3
Except transmit harmonics.
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60 0076 R00F SiW1721B Radio Modem IC DS
SiW1721B
External Reference Requirements
It is possible to provide a number of reference frequencies that are typical on most cellular phones directly into pin 26
(XTAL_P/CLK) of the SiW1721BFIG. The following reference frequencies (in MHz) can be used: 3.84, 9.6, 12, 12.8, 13,
14.4, 15.36, 16, 16.8, 19.2, 19.68, 19.8, 26, 32, 38.4, and 48. For other frequencies, please contact applications support.
Parameter
Phase noise
Drive level
Description
100 kHz offset
1 kHz offset
10 kHz offset
AC coupled amplitude
DC coupled low peak voltage
DC coupled high peak voltage
60 0076 R00F SiW1721B Radio Modem IC DS
Min
Max
Unit
–
–
–
0.5
0
VCC - 0.3
-100
-120
-140
VCC
dBc/Hz
dBc/Hz
dBc/Hz
VP-P
0.3
VCC
V
V
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SiW1721B
Pin Out
(Top View)
VCC
RF_IO
TX_BIAS
VCC
VTUNE
VCC
XTAL_P/CLK
XTAL_N
SiW1721BFIG (32-pin QFN)
32
31
30
29
28
27
26
25
IDAC
1
24 NC
VREFP_CAP
2
23 HOP_STROBE
VREFN_CAP
3
22 SPI_SS
VCC_OUT
4
21 CD_TXEN
SiW1721B
VBATT_ANA
5
20 VBB_READY
VCC
6
19 RX_TX_DATA
VCC
7
18 VBATT_DIG
CHG_PUMP
8
17 VBB_OUT
16
BB_CLK
15
VDD_IO
14
SPI_TXD
13
SPI_CLK
12
SPI_RXD
11
RESET_N
ENABLE_RM
10
TX_RX_SWITCH
9
GROUND PAD
ON BOTTOM
Note: NC indicates "no connect" or unused pins.
Pin Assignments
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Note:
8 of 12
Pin Name
IDAC
VREFP_CAP
VREFN_CAP
VCC_OUT
VBATT_ANA
VCC
VCC
CHG_PUMP
ENABLE_RM
TX_RX_SWITCH
RESET_N
SPI_RXD
SPI_CLK
SPI_TXD
VDD_IO
BB_CLK
Pin
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
Pin Name
VBB_OUT
VBATT_DIG
RX_TX_DATA
VBB_READY
CD_TXEN
SPI_SS
HOP_STROBE
NC
XTAL_N
XTAL_P/CLK
VCC
VTUNE
VCC
TX_BIAS
RF_IO
VCC
NC indicates no connect.
60 0076 R00F SiW1721B Radio Modem IC DS
SiW1721B
Radio Modem Application Circuit for Plastic QFN Package
(SiW1721BFIG)
C1
Place L1 close to pin 30
of the SiW1721B. Place
C1 as close as possible
to L1 and ensure the
ground of C1 is as close
as possible to the paddle
of the SiW1721B.
ANTENNA
8.2pF
L1
2.7nH
3
Y1
OSC, CRYSTAL 32MHz
1
FL1
4
OUT
IN
C2
18pF
2
C3
18pF
C6
0.1uF
2
C7
0.1uF
3
4
VDD_A
5
6
25
XTAL_N
26
27
VCC
28
VTUNE
29
VCC
30
IDAC
XTAL_P/CLK
1
L2
2.2nH
TX_BIAS
U1
31
C5
2.7pF
RF_IO
C4
1uF
VCC
C4 and C9 must have
1 ohm < ESR < 10 ohms.
32
LFB312G45SG2A509
NC
VREFP_CAP
HOP_STROBE
VREFN_CAP
SPI_SS
SiW1721B
5 mm x 5 mm
VCC_OUT
VBATT_ANA
Keep the traces
from C2 and C3 to
pins 25 and 26 of
the SiW1721B short.
CD_TXEN
VBB_READY
VCC
RX_TX_DATA
VCC
VBATT_DIG
24
23
HOP_STROBE
22
SPI_SS
21
CD_TXEN
20
VBB_READY
19
RX_BB/TX_BB
BB_CLK
18
17
C9
1uF
C4 and C9 must have
1 ohm < ESR < 10 ohms.
16
SPI_TXD
SPI_CLK
VDD_IO
15
14
13
SPI_RXD
RESET_N
VBB_OUT
12
11
C10
22pF
CHG_PUMP
10
8
ENABLE_
RM
C8
1pF
9
The ground for C10
needs to be as
close as possible
to the paddle of
the SiW1721B. Keep
the traces from R2
and C10 to pin 8 of
the SiW1721B short.
TX_RX_SWITCH
VDD_D
7
CLK_REF
C11
180pF
R2
47K
SPI_MIS0
SPI_CLK
SPI_MOSI
RESET_N
ENABLE_RM
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SiW1721B
Packaging and Product Marking
Package Drawing
32-Pin QFN Drawing and Dimensions
NOTES:
1. SHADED AREA INDICATES PIN 1 LOCATION.
2. ALL UNITS ARE IN MILLIMETERS.
3. TOLERANCES: .XX = ± AS SHOW N
.XXX = ± AS SHOW N
2 PLCS
.10 C A
-A-
.05 C
.90
.85
.70
.65
5.00 SQ.
2.50 TYP
.10
.60
.24
TYP
.05
.00
3
.10 C B
2 PLCS
PIN 1 ID
R.20
12°
MAX
3.65 SQ.
3.35
.10 C B
2 PLCS
.50
.30
-B-C2.37 TYP
C A B
.30 2
.18
.50
SEATING
PLANE
4.75 SQ.
.10 C A
2 PLCS
Product Marking
32-Pin QFN Drawing
5 x 5 mm, 32-Pin QFN
1721BFIG
YYWW
Trace Code
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60 0076 R00F SiW1721B Radio Modem IC DS
SiW1721B
Carriers
Tape and Reel
SiW1721BFIG, 5 X 5 mm, 32-Pin QFN, Tape and Reel Details
Carrier tape basic dimensions are based on EIA 481. The pocket is designed to hold the part for shipping and loading onto
SMT manufacturing equipment, while protecting the body and the solder terminals from damaging stresses. The individual
pocket design can vary from vendor to vendor, but width and pitch will be consistent.
Carrier tape is wound or placed onto a shipping reel either 330 mm (13 inches) in diameter or 178 mm (7 inches) in
diameter. The center hub design is large enough to ensure the radius formed by the carrier tape around it does not put
unnecessary stress on the parts.
Prior to shipping, moisture sensitive parts (MSL level 2a-5a) are baked and placed into the pockets of the carrier tape. A
cover tape is sealed over the top of the entire length of the carrier tape. The reel is sealed in a moisture barrier ESD bag,
which is placed in a cardboard shipping box. It is important to note that unused moisture sensitive parts need to be
resealed in the moisture barrier bag. If the reels exceed the exposure limit and need to be baked, most carrier tape and
shipping reels are not rated as bakeable at 125°C. If baking is required, devices may be baked according to section 4,
table 4-1, column 8, of the Joint Industry Standard IPC/JEDEC J-STD-033A.
The following tables provide useful information for carrier tape and reels used for shipping the devices described in this
document.
RFMD Part Number
Reel
Diameter
Inch (mm)
Hub
Diameter
Inch (mm)
Width (mm)
Pocket Pitch
(mm)
Feed
Units
13 (330)
7 (178)
4 (102)
2.4 (61)
12
12
8
8
Single
Single
2500/reel
100/reel
SiW1721BFIG-TR13
SiW1721BFIGSR
Peel Test
10–50 grams
Peel Angle
Cover Tape
Leader
Trailer
Peel Speed
165-180º
RS Standard
(anti-static)
500 mm
(minimum 400 mm)
250 mm
(minimum 160 mm)
300 mm/minute
Notes:
1. All dimensions are in millimeters (mm).
2. Unless otherwise specified, all dimension tolerances per EIA-481.
Ao = 5.30 ±.10
Bo = 5.30 ±.10
F = 5.50 ±.05
Ko = 1.83 ±.10
P = 8.00 ±.10
W = 12.00 +.30/-.10
4.00 ±.10
2.00 ±.05
Ø1.50±.10
0.330±.020
1.75 ±.10
15-inch Trailer
Sprocket holes toward
rear of reel
Top View
15-inch Leader
Pin 1
Location
F
Part Number
YYWW
Trace Code
Part Number
YYWW
Trace Code
P
Part Number
YYWW
Trace Code
Part Number
YYWW
Trace Code
Ao
Part Number
YYWW
Trace Code
W
Bo
Ko
Direction of Feed
60 0076 R00F SiW1721B Radio Modem IC DS
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SiW1721B
Ordering Information
Part Number
Operational Temperature Range1
Package
Ordering Quantity
Industrial
Industrial
Industrial
Industrial
32-pin QFN
32-pin QFN
32-pin QFN
32-pin QFN
2500/reel
100/reel
25/sample bag
5/sample bag
SiW1721BFIG-T13
SiW1721BFIGSR
SiW1721BFIG
SiW1721BFIGSB
1
Industrial temperature range: -40°C to +85°C.
The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed
by RF Micro Devices for its use, nor for any infringement of patents, or other rights of third parties, resulting from
its use. No license is granted by implication or otherwise under any patent or patent rights of RF Micro Devices,
Inc. RF Micro Devices reserves the right to change component circuitry, recommended application circuitry and
specifications at any time without prior notice.
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™,
UltimateBlue™, and the SiW product name prefix are trademarks of RFMD, LLC. BLUETOOTH is a trademark
owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RF Micro Devices, Inc. All other trade names,
trademarks and registered trademarks are the property of their respective owners.
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60 0076 R00F SiW1721B Radio Modem IC DS