DS3900H2 General Description The DS3900H2 evaluation kit (EV kit) component provides bidirectional communication with I2C- and SPI-compatible devices using a PC’s USB port. In addition, the EV kit can also be used as a general-purpose digital I/O interface with 11 I/O signals that can evaluate a variety of ICs. The DS3900H2 IC is a small form-factor module that requires appropriate headers to pass communication signals to the device under test. The IC is intended to interface with approved HID-compliant PC software designed by Maxim Integrated. The IC is intended for evaluation purposes only. Ev Kit Contents ● Assembled DS3900H2 Circuit Board ● Mini-USB Cable USB HID Communications Module for Evaluation Kits Features ● Communicates from PCs to ICs Through a USB Port Using the Human Interface Device (HID) Class ● Fast Communication to I2C- and SPI-Compatible Devices ● 11 Total General-Purpose Digital I/O Pins, Including All Communication Protocol Pins ● Built-In Pullup Resistors for SDA and SCL Minimize Required External Hardware ● Connection to Standard Prototyping Boards Possible Using Header Connectors ● Operates from +2.5V to +5.5V ● USB HID Interface for Windows XP®-, Windows Vista®-, and Windows® 7-Compatible Software ● RoHS Compliant ● Fully Assembled and Tested Proven PCB Layout Ordering Information appears at end of data sheet. DS3900H2 EV Kit Photo Windows, Windows XP, and Windows Vista are registered trademarks and registered service marks of Microsoft Corporation. 19-6733; Rev 0; 6/13 DS3900H2 USB HID Communications Module for Evaluation Kits Component List DESIGNATION QTY DESCRIPTION C1, C6, C7, C13 4 1.0µF ceramic capacitors (0603) TDK CGJ3E2X7R0J105K R1, R2 2 25Ω ±1% resistors (0603) Vishay CRCW060324R9FKEA C2, C5, C15 3 4.7µF ceramic capacitors (0603) TDK C1608X5R0J475K R3, R8, R9 3 330Ω ±1% resistors (0603) Vishay CRCW0603330RFKEA C3, C8, C10, C11, C14, C16 6 0.1µF ceramic capacitors (0603) TDK C1608X7R1E104K R4, R5 2 10kΩ ±1% resistors (0603) Vishay CRCW060310K0FKEA C4, C9 2 0.01µF ceramic capacitors (0603) TDK CGJ3E2X7R1C103K R6 1 100kΩ ±1% resistor (0603) Vishay CRCW0603100KFKEA R7, R11, R12 3 1 220nF ceramic capacitor (0603) TDK C1608X7R1A224K 4.7 kΩ ±1% resistors (0603) Vishay CRCW06034K70FKEA R10 1 D1 1 Red LED (1206) Kingbright APTR3216EC 2.2kΩ ±1% resistor (0603) Vishay CRCW06032K20FKEA U1 1 Microchip PIC18LF2550-I/SO D2 1 Red/green dual LEDs Kingbright APHB M2012SURKCGKC U2 1 FXMA108 Fairchild FXMA108BQX U3 1 1 Schottky diode ROHM Semi RB060M-30TR USB transceiver (16 TSSOP) Maxim MAX3344EEUE+ U4 1 J1 1 5-pin Mini-USB female connector Molex 54819-0519 Linear regulator (5 SOT23) Maxim MAX8868EUK33+ J2 0 Do not populate, 2-pin header U5 1 Current-limit switch (5 SOT70) Maxim MAX4787EXK+ J3, J4 2 Create a solder bridge across the two pads U6 2 16-pin (2 x 8) header (HDR2X8) Sullins PPTC082LFBN-RC Q1 0 Do not populate, n-channel MOSFET ON Semi NTS4001NT1G X1 1 4-pin CMOS oscillator AVX KC3225A48.0000C30E00 C12 D3 DESIGNATION QTY DESCRIPTION Component Suppliers SUPPLIER PHONE WEBSITE AVX North America 864-967-2150 www.avx.com Fairchild Semiconductor 888-522-5372 www.fairchildsemi.com Kingbright Corporation 909-468-0500 www.kingbrightusa.com Molex 800-786-6539 www.molex.com ON Semiconductor 602-244-6600 www.onsemi.com ROHM Co., Ltd. 858-625-3630 www.rohm.com Sullins Electronics Corp. 760-744-0125 www.sullinselectronics.com TDK Corp. 847-803-6100 www.component.tdk.com Vishay 402-563-6866 www.vishay.com Note: Indicate that you are using the DS3900H2 when contacting these component suppliers. www.maximintegrated.com Maxim Integrated │ 2 DS3900H2 USB HID Communications Module for Evaluation Kits Quick Start by using its full-speed-compatible USB serial interface engine. The USB interface of the IC hardware is configured as an HID device and therefore does not require a unique/custom device driver. Once powered and properly connected to a PC through a USB cable, Windows should automatically begin installing the necessary device driver. Once the driver installation is complete, a Windows message appears near the System Icon menu indicating that the hardware is ready to use. After the hardware is ready to use, open an approved HID-compliant graphical user interface (GUI) designed by Maxim Integrated. The GUI then sends commands of various lengths over the USB connection. This provides instruction and data for the IC to communicate with the I2C- and SPI-compatible devices, or to read or write a specific pin of the IC. All of the pins, with the exception of P3, have three-state drivers. Since the IC is rated to work with supply voltages ranging from +2.5V to +5.5V, the EV kit operates from the same voltage supply as the IC that it is controlling. Required Equipment ● DS3900H2 EV kit hardware (included) ● Mini-USB cable (included) ● User-supplied Windows XP, Windows Vista, or Windows 7 PC with a spare USB port ● User-supplied +2.5V to +5.5V power supply (300mA minimum) ● Approved previously designed HID-compliant GUI designed by Maxim Integrated ● DS3900H2 breakout board or a previously purchased compatible Maxim Integrated Ev kit Setup Procedure The EV kit communicates with ICs using a PC’s USB port. It utilizes a MAX3344E USB transceiver (U3) to convert logic-level signals to USB signals, and USB signals to logic-level signals acceptable for the microprocessor. The microprocessor is then able to communicate to the PC Detailed Description of Hardware VDUT VUSB MAX4787 CURRENT SWITCH MAX8868 3V3 LDO 3V3 DS3900H2 USB MODULE D1 FAULT 3800Ω 3V3 USB PC EXTERNAL GND POWER GND SUPPLY GND REQUIRED VDUT VDUT HID CLASS DS900H2 PINS VCC MINI-USB CABLE D+, D- 3V3 8 MAX3344E USB TRANSCEIVER 48MHz OSCILLATOR 3V3 VDUT BIDIRECTIONAL LEVEL TRANSLATOR 9 D2 GREEN PULSE D2 RED COM MICROPROCESSOR P3-PULSE HB/P3 VDUT VDUT R12 4.7kΩ R11 P11-(SDA) P11 P10-(SCL) P1, P2 P4-P9 MCLR P10 8 P1 P2 P6 P7 P4 P5 P8 P9 MCLR Figure 1. DS3900H2 Functional Diagram www.maximintegrated.com Maxim Integrated │ 3 DS3900H2 USB HID Communications Module for Evaluation Kits Table 1. Recommended Operating Conditions (Typical values are at VCC = 3.3V, TA = +25°C, unless otherwise noted.) (Notes 1 and 2) PARAMETER SYMBOL Supply Voltage CONDITIONS VCC MIN TYP +2.5 MAX +5.5 Supply Current 30 V mA 0.15 x VCC Input Low Voltage VIL I/O Pins P1–P11 Input High Voltage VIH I/O Pins P1–P11 0.25 x VCC + 0.8V Output High Voltage VOH I/O Pins P1–P11, IOH = -3.0mA VCC - 0.7 Output Low Voltage VOL I/O Pins P1–P11, IOL = 8.5mA Ambient Temperature UNITS TA V V V +0.6 V -40 +85 °C I2C Clock Frequency 100 400 kHz SPI Clock Frequency 186 3000 kHz 750 Note 1: All voltages listed are with respect to ground. Note 2: Devices are only functionally tested; parameters listed not guaranteed. Table 2. Pin Description PIN I2C FUNCTION SPI P1, P2, P4, P5, P7, P8 HB/P3 General-purpose bit I/O with three-state I/O pin (input, push-pull output driver). Pulse or general-purpose bit I/O with open-drain I/O pin (input, open drain) output driver. P6 — General-purpose bit I/O with three-state I/O pin (input, push-pull output driver). — P6 CE (push-pull output driver when used as CE) or general-purpose bit I/O with three-state I/O pin (input, push-pull output driver). P9 — General-purpose bit I/O with three-state I/O pin (input, push-pull output driver). — P9 MOSI (push-pull output driver when used as MOSI) or general-purpose bit I/O with three-state I/O pin (input, push-pull output driver). P10 — SCL (open-drain output when used as SCL) or general-purpose bit I/O with three-state I/O pin (input, push-pull output driver). P11 — SDA (open-drain output or input when used as SDA) or general-purpose bit I/O with three-state I/O pin (input, push-pull output driver). — P10 SCK (push-pull output driver when used as SCK) remove built-in pullup resistor R12 or generalpurpose bit I/O with three-state I/O pin (input, push-pull output driver). — P11 MISO (input when used as MISO) remove built-in pullup resistor R11 or general-purpose bit I/O with three-state I/O pin (input, push-pull output driver). MCLR Do not connect (reset for microprocessor). GND Ground Terminals. All three ground terminals must be connected to ground for operation. VCC Power-Supply Terminal. External power supply (VDUT) required. www.maximintegrated.com Maxim Integrated │ 4 DS3900H2 USB HID Communications Module for Evaluation Kits P1 P11 P2 P10 HB/P3 GND MCLR VCC GND P9 P4 P8 P5 P7 GND P6 Figure 2. DS3900H2 Pin Configuration Designing Hardware to Utilize the Built-In Support for I2C Devices The IC has custom firmware that utilizes either a master synchronous serial port (MSSP) of the microcontroller configured in I2C mode, or several bit-banging routines with clock-stretching support. These two modes of operation are configured through the evaluation software. To utilize the I2C firmware, connect the SCL bus to P10 and the SDA bus to P11, as shown in Figure 3. The IC has built-in pullup resistors (R11, R12) that connect 4.7kΩ resistors to both I2C buses. Upon initial power-up, the IC configures itself in I2C mode using the MSSP block of the microcontroller at SCL clock speed of 400kHz. Note that most evaluation software www.maximintegrated.com configures the IC to the desired communication protocol upon initial software execution and during all USB reconnects of the IC. For designs that only use the IC to communicate to I2C devices, the following items must be accounted for in the hardware design: ● Place the mating connectors on the circuit board (see Figure 5). ● Connect VCC and all three GND ground terminals. ● Connect the SCL bus to pin P10, and the SDA bus to P11 of the IC. ● Drive the IC with evaluation software provided by Maxim Integrated. Maxim Integrated │ 5 DS3900H2 USB HID Communications Module for Evaluation Kits HID CLASS VDUT* MINI-USB CABLE GND USB PC P1 HB/P3 MCLR GND VCC VCC P2 R12 VCC R11 USB MODULE DS3900H2 SCL I 2C DEVICE #2 SDA P11-SDA I2C BUS P10-SCL GND VCC P9 P4 P8 P5 P7 GND P6 VCC GND SCL I2C DEVICE #1 SDA * VDUT AND GND MUST BE PROVIDED FROM EXTERNAL SUPPLY. Figure 3. DS3900H2 Typical I2C Operating Circuit Designing Hardware to Utilize the Built-In Support for SPI Devices The IC has custom firmware that utilizes a master synchronous serial port (MSSP) of the microcontroller configured in SPI mode, which allows fast communication to SPI devices. To utilize this firmware, connect CE to P6, the MISO bus to P11, the MOSI bus to P9, and the SCK bus to P10, as shown in Figure 3. The IC has built-in pullup resistors (R11, R12) that connect 4.7kΩ resistors to both MISO and SCK; this is not applicable for SPI communication and must be removed. For designs that only use the IC to communicate to SPI devices, the following items must be accounted for in the hardware design: ● Place the mating connectors on the circuit board (see Figure 5). ● Connect VCC and all three GND ground terminals. ● Connect CE to P6, the MISO bus to P11, the MOSI bus to P9, and the SCK bus to P10 of the IC. Designing Hardware to Utilize the GeneralPurpose Bit I/O Signals Utilizing the IC for general-purpose bit I/O is equally simple as using it for I2C and SPI applications. All the I/O pins with the exception of P3 have three-state outputs. These signals can be written to a 0 or a 1 and can be read as inputs. P3 has an open-drain output and can be read as an input pin as well; however, its default function is a system pulse that provides a visual indication, through the attached LED, that the IC is operating properly (see Figure 7). The P3 pin defaults to a slow-pulsing output that can be disabled, but designs using P3 for I/O should be conscious that the IC could attempt to blink P3 before the pulse function is disabled. As long as the IC connected to P3 is tolerant of this behavior, P3 can be used as an additional I/O. When using P3 as an I/O pin with the attached LED, writing it to a 1 turns off the pulldown transistor, which turns the LED off, and writing it to a 0 turns the pulldown and the LED on. ● Remove the built-in pullup resistors (R11, R12). ● Drive the IC with evaluation software provided by Maxim Integrated. www.maximintegrated.com Maxim Integrated │ 6 DS3900H2 USB HID Communications Module for Evaluation Kits HID CLASS * VDUT AND GND MUST BE PROVIDED FROM EXTERNAL SUPPLY MINI-USB CABLE ** PULLUPS R12 AND R11 MUST BE REMOVED FOR SPI USB PC VDUT* ** P1 HB/P3 MCLR GND USB MODULE VCC VCC P2 R12 R11 DS3900H2 P4 P5 GND P11-MISO MISO P10-SCK SCK GND VCC MOSI CE VCC SPI DEVICE GND P9-MOSI P8 P7 P6-CE Figure 4. DS3900H2 Typical SPI Operating Circuit Additionally, designs using P10 and P11 as general I/O should be conscious of the built-in pullup resistors intended for use with I2C devices (see Figure 7). ● If the application is using I2C devices in addition to the remaining bit I/O signals, make sure to reserve P10 and P11 for the I2C application. The general procedure for connecting the IC for bit I/O applications is as follows: ● If the application is using SPI devices in addition to the remaining bit I/O signals, make sure to reserve P6, P9–P11 for the SPI application. ● Place the mating connectors on the circuit board (see Figure 5). ● Connect VCC and all three GND ground terminals. ● Connect P1 through P11 to the application. www.maximintegrated.com ● Use P3 only if the application is able to tolerate the pulse function until it is disabled. ● Drive the IC with evaluation software provided by Maxim Integrated. Maxim Integrated │ 7 DS3900H2 USB HID Communications Module for Evaluation Kits 0.100in 0.025in, 16 PLACES 0.025in 16 PLACES 0.100in 8 PLACES 0.240in,16 PLACES 1.200in Figure 5. Recommended PCB Connection for DS3900H2 www.maximintegrated.com Maxim Integrated │ 8 DS3900H2 USB HID Communications Module for Evaluation Kits 1.370in TOP 1.300in 1.329in 0.57in 0.57in 0.400in 0.305in 0.335in 0.400in 0.335in 0.100in 0.025in 1.22in 1.147in 0.155in 0.100in 0.025in 1.200in 0.815in SIDE FRONT Figure 6. DS3900H2 Dimensions Note: The IC mates with standard 2.54mm (0.100in) 2 x 8 male header connectors. These connectors do not come standard with the board. Table 3. Description of LEDs LED COLOR D1 (FAULT) Red USB Power Fault: A fault occurred due to overvoltage limit, current limit, or thermal limit. Red Communication: After the software has initialized the hardware, the LED flashes red when a command from the PC is received. D2 (COM) Red and flashing orange www.maximintegrated.com DESCRIPTION Waiting: Hardware is powered on and waiting for the software to be opened. Maxim Integrated │ 9 DS3900H2 USB HID Communications Module for Evaluation Kits Troubleshooting All efforts have been made to ensure that the IC works on the first try, right out of the box. In the rare occasion that a problem is suspected, see Table 4 to help troubleshoot the issue. Table 4. Troubleshooting SYMPTOM Windows does not detect hardware www.maximintegrated.com CHECK SOLUTION Is the LED labeled D1 on the DS3900H2 red? If yes, then the electronic fuse is in a fault state. Inspect for electrical shorts on the PCB and make sure that the PCB is not sitting on a conductive surface. USB cable and port Try connecting the USB cable to a different USB port on the PC and wait for a Windows message that indicates that the hardware is ready to use. If the device is not detected, unplug the USB cable and reboot the PC. Connect the USB cable. Are any of the LEDs illuminated? If not, then the PCB may not be getting power. Make sure bias is applied to VCC and all three GND terminals are connected to system ground. Verify that the USB cable is connected to a PC. Maxim Integrated │ 10 J2 2 1 4.7k R7 GND GND 3.3V D2A VDUT J3 1 2 3 4 5 6 7 8 C1 MAX3344E RCV USB_DET VP O VL MODE VTRM VMO D+ OE DSUSP GND VP I VCC VMI ENUM GND 1.0uF 5 4 330 R9 330 R10 2.2k VP P HB COM D3 C12 P4 OE VDUT CL K VDUT P1 P2 RCV VDUT P6 GND 220nF J4 D2B FL AG GND OUT L ED D1 3 2 1 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PICfor DS3900 MCL R P3,HB COM_L ED,BOOT P1 P2 RCV P6, CS GND OSC1 OSC2 P4 UOE PS_VAR VUSB U1 ENUM 3V3 VTRM D+ D- USB_DET 3V3 100mA current limiting switch. OUT BP P9 ENUM VDUT VP I VDUT VMI VDUT C4 OUT GND C14 0.1uF C13 1.0uF GND 3 4 3.3V 4.7uF C5 3.3V 48MHz Oscillator OSC_CMOS_4pin GND VCC 0.01uF INH X1 4 5 VDUT GND 2 1 MAX8868EUK 33-T SHDN GND IN U4 3.3V Linear Regulator, 150mA max 1 2 3 P8 P7 P5 USB_DET VDUT VP O VDUT VMO VDUT SCL SDA 0.1uF C8 3.3V 28 27 26 25 24 23 22 21 20 19 18 17 16 15 1.0uF GND C7 1.0uF GND 0.1uF C3 C6 5V 4.7uF C2 5V P8,1W_P U P7,1W_DQ P5 USB_DET VP O VMO P10,SCK ,SCL P11,SDI ,SDA VDD GND P9,SDO ENUM D+,VP D-,VM MAX4787 MAX4787EXK +TCT- ND IN ON U5 R3 USB Transceiver. Converts USB signals to logical signals. The high level for the logical signals is 3.3V. R8 330 VDUT VP I 3V3 VMI 3V3 VMO 3V3 OE 3V3 RCV 3V3 VP O 3V3 R ed U3 G reen GND J1 VBUS 1 Vbus 2 R1 25 DD3 R2 25 D+ D+ 4 I.D. 5 GND USB_5P IN 1 www.maximintegrated.com 2 GND C9 P4 P5 P1 P2 HB VP P GND 0.01uF 1 2 3 4 5 6 7 8 GND FXMA108 P11 P10 GND VCC P9 P8 P7 P6 DS3900 Headers - Pinout DS3900 P1 P2 HB/P 3 MCL R GND P4 P5 GND U6 GND 0.1uF C11 20 VCCA VCCB 19 A0 B0 18 A1 B1 17 A2 B2 16 A3 B3 15 A4 B4 14 A5 B5 13 A6 B6 12 A7 B7 11 VDUT GND VP OOE U2 0.1uF C10 16 15 14 13 12 11 10 9 P9 P8 P7 P6 SDA SCL 4.7k R11 R12 GND C16 0.1uF C15 4.7k VDUT RCV VDUT CL K VDUT 4.7uF VDUT GND Q1 NMOS ENUM VDUT VMI VDUT VP I VDUT OE VDUT VMO VDUT VDUT 8-Channel, Bi-Directional Level Translator. USB side has a fixed 3.3V reference. PIC side reference is the varying VDUT reference. 1 ENUM 3V3 2 VMI 3V3 3 VP I 3V3 4 OE 3V3 5 VMO 3V3 6 VP O 3V3 7 RCV 3V3 8 CL K 3V3 9 10 3.3V R5 10k USB_DET 3V3 R6 100k VDUT External Power must be supplied to VDUT GND R4 10k USB_DET VDUT DS3900H2 USB HID Communications Module for Evaluation Kits Figure 7. DS3900H2 EV Kit Communications Module Schematic Maxim Integrated │ 11 DS3900H2 Figure 8. DS3900H2 EV Kit Communications Module PCB Layout—Top DS3900H2 Revisions Revisions yielding significant changes and/or improvements are tracked in firmware and displayed in most evaluation software provided by Maxim Integrated. Revisions are broken up into a major and minor revision. For example, if the DS3900H2’s revision is 3.2, it returns a major revision of 3 and a minor revision of 2. Knowing the revision allows the software to both utilize new functions that are not available in previous versions of the DS3900H2’s firmware and to avoid using commands that are not present in prior versions. Although there are no plans to change the firmware at this time, Maxim Integrated reserves the right to change the firmware at any time without notice. www.maximintegrated.com USB HID Communications Module for Evaluation Kits Figure 9. DS3900H2 EV Kit Communications Module PCB Layout—Bottom Intended Use The DS3900H2 module is intended only to be used to evaluate Maxim Integrated’s circuits. All hardware, firmware, and any relative software is provided “as is,” without warranty of any kind, express or implied, including but not limited to the warranties of merchantability, fitness for a particular purpose, and noninfringement. In no event shall Maxim Integrated be liable for any claim, damages or other liability, whether in an action of contract, tort or otherwise, arising from, out of, or in connection with the hardware, firmware, and any relative software or the use or other dealings in the hardware, firmware, and any relative software. Maxim Integrated │ 12 DS3900H2 USB HID Communications Module for Evaluation Kits Ordering Information PART DS3900H2EVKIT# TYPE EV Kit Communications Module #Denotes an RoHS-compliant device that may include lead(Pb), which is exempt under the RoHS requirements. www.maximintegrated.com Maxim Integrated │ 13 DS3900H2 USB HID Communications Module for Evaluation Kits Revision History REVISION REVISION NUMBER DATE 0 6/13 DESCRIPTION Initial release PAGES CHANGED — For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim Integrated’s website at www.maximintegrated.com. Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc. © 2013 Maxim Integrated Products, Inc. │ 14