NUF4107FC Four Channel EMI Pi−Filter Array with Full USB Filter This device is a four−channel EMI filter array for data lines. Greater than −35 dB attenuation is obtained at frequencies from 800 MHz to 2.2 GHz. It also offers USB filtering circuitry with speed detection. This includes the inline resistors for impedance matching and EMI filtering. ESD protection is provided across all capacitors. Features • • • • • • • • • EMI Filtering and ESD Protection for Data Lines USB 1.1 Filtering Provided with Speed Detection Integration of 27 Discretes Offers Cost and Space Savings 350 mm Solder Spheres All TVS Protected Inputs Comply with IEC61000−4−2 (Level 4) 30 kV (Contact) 30 kV (Air) Low Profile Flip−Chip Packaging MSL 1 All Pins Exceed 2000 V Human Body Model (Note 1) Pb−Free Package is Available* http://onsemi.com CIRCUIT DESCRIPTION R1 A1 D11 A3 B3 C5 VPP DC Power per Resistor PR 100 mW DC Power per Package PT 600 mW Junction Temperature TJ 150 °C Operating Temperature Range Top −40 to +85 °C Storage Temperature Range Tstg −55 to +150 °C C4 C6 D6 C5 C8 C7 D8 R6 C9 D9 Unit D4 R5 A6 Value C3 C4 R4 A4 B5 ESD Discharge IEC61000−4−2 (Note 1) − Air Discharge, Contact Discharge Human Body Model Machine Model C6 D10 C10 kV 30 16 0.4 FLIP−CHIP−17 CASE 499AD Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. This does not include Pins B1, C1 and C2 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. March, 2006 − Rev. 3 C3 D3 D7 Symbol C2 R3 A5 Rating © Semiconductor Components Industries, LLC, 2006 B2 B4 MAXIMUM RATINGS (TA = 25°C) B1 C2 D2 D5 EMI and USB Filtering and ESD Protection for Data Lines Cell Phones Handheld Portables Notebook Computers MP3 Players R7 R2 A2 Typical Applications • • • • • C1 C1 D1 1 A1 È È MARKING DIAGRAM 4107 = Device Code A = Assembly Location 4107AYWW G Y = Year G WW = Work Week G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Device Package Shipping† NUF4107FCT1 Flip−Chip 3000 Tape & Reel NUF4107FCT1G Flip−Chip (Pb−Free) 3000 Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Publication Order Number: NUF4107FC/D NUF4107FC ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Symbol VBR IR = 1.0 mA Min Typ Max Unit 6.0 6.8 8.0 V IR VRM = 3.3 V per line − − 0.1 mA R3 − R6 EMI Filter Resistors 80 100 120 W R1, R2 USB Resistors; Impedance Matching 18 22 26 W 1250 1500 1750 W At 2.5 V Bias 48 60 72 pF C1, C2 At Pins A1 and A2; At 2.5 V Bias 29 36 43 pF Cpower At Pins B2; At 2.5 V Bias 54 68 82 pF R7 Cline USB Pull−up; Speed Detection Resistor http://onsemi.com 2 NUF4107FC TYPICAL CHARACTERISTICS 110 25 108 24 106 RESISTANCE RESISTANCE 23 22 21 104 102 100 98 96 94 20 92 19 −40 −20 0 20 40 60 90 −40 80 85 0 20 40 80 85 60 TEMPERATURE °C TEMPERATURE °C Figure 1. USB 1.1 Resistors (R1, R2) vs. Temperature Figure 2. Data Resistors (R3, R4, R5, R6) vs. Temperature 0 1600 1580 USB1 −10 1560 1540 RESISTANCE −20 S21 (dB) 1520 1500 1480 USB2 −30 −40 1460 1440 Test Conditions: Pins B1, B2 floating Vline = 0 V −50 1420 1400 −40 −20 0 20 40 60 −60 80 85 1 10 TEMPERATURE °C 0 0 −5 −10 −10 −25 −30 −40 USB1 − USB2 −50 USB2 − EMI3 −60 −35 Test Conditions: Pins B1, B2 floating Vline = 0 V −40 −45 −50 −30 S41 (dB) −20 1 10 EMI5 EMI4 EMI3 − EMI4 −70 EMI6 100 1000 FREQUENCY (MHz) 10,000 Test Conditions: Pins B1, B2 floating Vline = 0 V −20 EMI3 −15 100 1000 FREQUENCY (MHz) Figure 4. Insertion Loss Characteristic USB1, USB2 Figure 3. Pull−up Resistor (R7) vs. Temperature S21 (dB) −20 EMI5 − EMI6 −80 −90 10,000 EMI4 − EMI5 1 Figure 5. Insertion Loss Characteristic EMI3, EMI4, EMI5, EMI6 10 100 1000 FREQUENCY (MHz) Figure 6. Analog Crosstalk Curve EMI Filter http://onsemi.com 3 10,000 NUF4107FC Printed Circuit Board Recommendations 500 mm Pitch 300 mm Solder Ball Parameter PCB Pad Size 250 mm +25 250 mm −0 Pad Shape Round Pad Type NSMD Solder Mask Opening 350 mm ±25 Solder Stencil Thickness 125 mm Stencil Aperture 250 x 250 mm sq. Solder Flux Ratio 50/50 Solder Paste Type No Clean Type 3 or Finer Trace Finish OSP Cu Trace Width 150 mm Max Copper Solder Mask NSMD SMD Figure 7. Solder Mask versus Non−Solder Mask Definition − − − − − − − − − − − − − − − − − − − − − − − − − − − − Tp = (15−30 sec) Tp = 260°C − 5°C RAMP−UP tL (60−90 sec) RAMP−DOWN PRE−HEAT ZONE 0− 15 − 30 − 45 − 60 − 75 − 90 − 105 − 119 − 134 − 149 − 165 − 180 − 195 − 209 − 224 − 239 − 254 − 269 − 284 − 299 − 314 − 329 − 344 − 359 − 374 − 389 − 404 − 419 − 434 − 449 − 464 − 479 − 494 − TEMPERATURE (°C) 280 270 260 250 240 230 TL= 217 210 200 190 180 170 160 150 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0 TIME (seconds) Figure 8. Typical Pb−Free Solder Heating Profile http://onsemi.com 4 NUF4107FC PACKAGE DIMENSIONS FLIP−CHIP−17 CSP CASE 499AD−01 ISSUE A 4X 0.10 C TERMINAL A1 LOCATOR ÈÈ ÈÈ D A B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETER. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. E TOP VIEW A1 0.10 C A2 0.05 C SIDE VIEW C A DIM A A1 A2 D E b e e1 D1 E1 MILLIMETERS MIN MAX 0.740 −−− 0.250 0.310 0.380 0.430 2.960 BSC 1.330 BSC 0.350 0.410 0.500 BSC 0.435 BSC 2.500 BSC 0.870 BSC SEATING PLANE D1 e /2 e C 17 X b 0.05 C A B 0.03 C B e1 A 1 2 3 4 5 E1 6 BOTTOM VIEW ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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