Unity Opto Technology Co., Ltd. Technical Data µSideLEDs MSL-510HB PRELIMINARY 09/09/2003 Features l Package : white micro-sideview PLCC-2 package with clear silicon. l Feature of the device : extremely wide viewing angle ideal for backlighting and coupling in light guides l Wavelength : Typical : 470nm l Viewing angle : Lambertian Emitter (X : 120o / Y : 120o) l Technology : InGaN on SiC with clear silicon l Grouping parameter : luminous intensity , Chromaticity l Assembly methods : suitable for all SMT assembly methods l Soldering methods : IR reflow soldering l Preconditioning : acc. to JEDEC Level 3 l Taping : 8-mm tape with 3500/reel, φ180mm Applications l Backlighting : LCD Display, Key pads 1 Package Dimensions Unit : mm (inch) Notes : 1. All dimensions are in millimeters (inches) 2. Tolerance is ±0.1 unless other specified Recommended Solder Patterns Method of Taping / Polarity and Orientation Packing unit 3500/reel Notes : 1. All dimensions are in millimeters (inches) 2. Tolerance is ±0.1 unless other specified 2 Selection Guide Luminous Intensity Viewing Angle 2θ θ 1/2 (Degrees) x y Typ. Typ. Wavelength Part Number MSL-510HB Bin Q Min. 52 R S T U 75 104 150 213 Device Type Min. MSL-510HB mcd Typ. - Forward Voltage VF (Volts) @IF = 20mA Typ. 3.1 nm Max. 75 104 150 213 300 Max Min. Typ. Max. 460 470 475 Reverse Current IR (uA) @ VR = 5V Min. Typ. Max 4.0 50 Maximum Ratings Parameter Value Unit o -30 ~ +85 C o -40 ~ +100 C 30 mA Forward current mA 100 Peak forward current 5 V Reverse Voltage 120 mW Power dissipation o C, for 10 sec Tsid Reflow Soldering : 260 Soldering Temperature Hand Soldering : 350oC, for 3 sec IFP Conditions : Pulse Width <10msec and Duty < 1/10 Operating Temp. range Storage Temp. range Symbol T OP T stg IF I FM VR P tot 3 120 Thermal Resistance o Rθ J-S ( C/W) Max 50 120 Relative Spectrum Emission Irel = f (l), TA = 25oC, IF = 20mA V(l) = Standard eye response curve Relative Luminous Intensity 1 0.5 0 380 450 520 590 660 Wavelength (nm) FIG.1 RELATIVE LUMINOUS INTERSITY VS. WAVELENGTH Forward Current IF = f (VF) Relative Luminous Intensity IV/IV (20mA) = f (IF) o TA = 25oC TA = 25 C (mA) IF 30 2.0 1.8 25 IV 1.6 1.4 20 1.2 15 1.0 0.8 10 0.6 5 0.4 0.2 0 0 1 2 3 0.0 4 0 VF Ambient Temperature VS. Allowable Forward IF 20 30 40 IF 50 (mA) Forward Current IF (mA) FIG.3 RELATIVE LUMINOUS INTENSITY VS. FORWARD CURRENT Forward Voltage (V) FIG.2 FORWARD CURRENT VS. FORWARD VOLTAGE (mA) 10 (V) Radiation Characteristic Irel = f (q) 0o 40 10o Y X 20o 30o 30 40o 20 1.0 50o 0.9 60o 0.8 70o 80o 90o 10 TA temp. ambient 0 0 20 40 60 80 T 0.7 100 (oC) 0.5 0.3 0.1 0.2 0.4 0.6 FIG.5 RADIATION DIAGRAM Ambient Temperature TA (oC) FIG.4 FORWARD CURRENT VS. AMBIENT TEMPERATURE 4 X Y IR Reflow Soldering Profile Lead Solder Temp 2-5oC / sec. Pre heating 120-150oC 240oC Max. 10sec. Max. 2-5oC / sec. 60sec. Max. Above 200oC 120sec. Max. Time 5 Unity µSideLEDs Bin Codes Category Code T B Luminous Intensity Group MSL-510SB Q 52-75 R 75-104 S 104-150 T 150-213 U 213-300 Luminous intensity is tested at a current pulse duration of 25 ms and an accuracy of +/- 11% Dominant Wavelength (in nanometers) @ IF=20mA B C BIN A P/N minimum maximum minimum maximum minimum maximum HB 460 465 465 470 470 475 Wavelength groups are tested at a current pulse duration of 25 ms and an accuracy of ± 1nm 6 Tape Dimensions REEL Dimensions Items Leader Cover Tape Specifications Remarks Cover tape shall be longer than 400mm without carrier tape Carrier Tape There shall be more than 40 empties Trailer The end of the carrier tape shall be adhered on the cover tape The orientation of tape shall be as shown There shall be more than 40 empties The end of the tape shall be inserted into a slit of the hub 7 Surface Mount Moisture Sensitivity Specifications 1. Controlling Moisture Unity Opto Technology, in its design of packing materials and packing methods, takes into consideration the susceptibility of some Unity packages to moisture induced damage. The risk of this damage is caused when the LED lens plastic encapsulation material is exposed to increases or decreases in the Relative Humidity of the surrounding environment. Such damage may include delamination between the die and the LED lens plastic encapsulation material, which may result in open connections due to broken wire bonds. Moisture in the package having reached a critical level will fracture the package in order to escape when exposed to peak temperature conditions, typical in soldering practices. Therefore, the control of moisture levels in the LED package is critical to reduce the risk of moisture-induced failures. Please follow JEDEC-STD-033A standards for handling moisture sensitive devices. 2. Packaging SMD devices: Unity packages all SMD devices into dry pack bags (moisture barrier bags). Unity includes a desiccant pouch in each bag. Testing confirms that the desiccant pouch greatly reduces the presence of moisture by maintaining the environment in the bag, thus protecting the devices during shipment and storage. 3. Handling Dry Packed Parts Upon receipt, the bags should be inspected for damage to ensure that the bag’s integrity has been maintained. Inspection should verify that there are no holes, gouges, tears, or punctures of any kind that may expose the contents of the bag. To open the bag, simply cut across the top of the bag as close to the original seal as possible being careful not to damage the contents. Once open the desired quantity of units should be removed and the bag resealed. If the bag is left open longer than 2 hours, the desiccant pouch should be replaced with a dry desiccant and the bag should be sealed immediately to avoid moisture damage. 8