TEA1530AT GreenChipII SMPS control IC Rev. 01 — 18 May 2005 Objective data sheet 1. General description The GreenChip™II is the second generation of green Switched Mode Power Supply (SMPS) controller ICs. Its high level of integration allows the design of a cost effective power supply with a very low number of external components. The TEA1530AT can be used in Fixed Frequency converter designs for low voltage, high current applications. At low power (standby) levels, the system operates in cycle skipping mode which minimizes the switching losses during standby. The proprietary high voltage BCD800 process makes direct start-up possible from the rectified universal mains voltage in an effective and green way. A second low voltage BICMOS IC is used for accurate, high speed protection functions and control. The TEA1530AT enables highly efficient and reliable supplies to be designed easily. 2. Features 2.1 Distinctive features ■ Universal mains supply operation (70 V to 276 V AC) ■ High level of integration, resulting in a very low external component count ■ Fixed frequency operation 2.2 Green features ■ Cycle skipping mode at very low loads; input power < 300 mW at no-load operation for a typical adapter application ■ On-chip start-up current source. 2.3 Protection features ■ ■ ■ ■ ■ ■ ■ Safe restart mode for system fault conditions Undervoltage protection (foldback during overload) IC OverTemperature Protection (OTP) (latched) Low and adjustable OverCurrent Protection (OCP) trip level Soft (re)start Mains voltage-dependent operation-enabling level General purpose input for latched or safe restart protection and timing, e.g. to be used for overvoltage protection (OVP), output short-circuit protection or system OTP. TEA1530AT Philips Semiconductors GreenChipII SMPS control IC 3. Applications ■ Printer & LCD adapters / chargers / supplies. The device can however also be used in all applications that demand an efficient and cost-effective solution up to 65 W. 4. Ordering information Table 1: Ordering information Type number TEA1530AT Package Name Description Version SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 5. Block diagram Fig 1. Block diagram © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Objective data sheet Rev. 01 — 18 May 2005 2 of 22 TEA1530AT Philips Semiconductors GreenChipII SMPS control IC 6. Pinning information 6.1 Pinning Fig 2. Pin configuration: TEA1530AT (SOT96-1) 6.2 Pin description Table 2: Pin description Symbol Pin Description VCC 1 supply voltage GND 2 ground PROTECT 3 protection and timing input CTRL 4 control input SENSE 5 programmable current sense input DRIVER 6 MOSFET gate driver output HVS 7 High Voltage Spacer DRAIN 8 drain of the external MOS switch, input for start-up current 7. Functional description The TEA1530AT is the controller of a compact flyback converter, with the IC situated at the primary side. An auxiliary winding of the transformer powers the IC after start-up; see Figure 3. © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Objective data sheet Rev. 01 — 18 May 2005 3 of 22 TEA1530AT Philips Semiconductors GreenChipII SMPS control IC Fig 3. Typical configuration The TEA1530AT operates in multi modes; see Figure 4. Fig 4. FF-CCM operation Because of the fixed frequency mode, the internal oscillator determines the start of the next converter stroke. A cycle skipping mode is activated at very low power (standby) levels. © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Objective data sheet Rev. 01 — 18 May 2005 4 of 22 TEA1530AT Philips Semiconductors GreenChipII SMPS control IC 7.1 Start-up, mains enabling operation level and undervoltage lock out Refer to Figure 8 and Figure 9. Initially, the IC is self supplying from the rectified mains voltage via pin DRAIN. Supply capacitor CVCC (at pin 1) is charged by the internal start-up current source to a level of about 4 V or higher, depending on the drain voltage. Once the drain voltage exceeds the Vm (mains-dependent operation-enabling level), the start-up current source will continue charging capacitor CVCC (switch S1 will be opened); see Figure 1. The IC will activate the power converter as soon as the voltage on pin VCC passes the Vstart level. At this moment the IC supply from the high voltage pin is stopped (green function). The IC supply is taken over by the auxiliary winding of the flyback converter. The moment the voltage on pin VCC drops below VUVLO (undervoltage lock out), the IC stops switching and performs a safe restart from the rectified mains voltage. In the safe restart mode the driver output is disabled and pin VCC voltage is recharged via pin DRAIN. 7.2 Supply management All (internal) reference voltages are derived from a temperature compensated, on-chip band gap circuit. 7.3 Current control mode Current control mode is used for its good line regulation behavior. The primary current is sensed across an external resistor and compared with the internal control voltage. The driver output is latched in the logic, preventing multiple switch-on. The internal control voltage is inversely proportional to the external pin CTRL voltage, with an offset of 1.5 V. This means that a voltage range from 1 V to approximately 1.5 V on pin CTRL will result in an internal control voltage range from 0.5 V to 0 V (a high external control voltage results in a low duty cycle). coa016 Vsense(max) (V) 0.52 V Cycle skip active 25 mV 1V (typ) 1.5 V (typ) VCTRL (V) Fig 5. The Vsense(max) voltage as a function of VCTRL 7.4 Oscillator The fixed frequency of the oscillator is set by an internal current source and capacitor. © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Objective data sheet Rev. 01 — 18 May 2005 5 of 22 TEA1530AT Philips Semiconductors GreenChipII SMPS control IC 7.5 Cycle skipping At very low power levels, a cycle skipping mode activates. An internal control voltage (Vsense(max)) lower than 25 mV will inhibit switch-on of the external power MOSFET until this voltage increases to a higher value; see Figure 5. 7.6 Continuous Conduction Mode (CCM) The IC operates in the so-called Fixed Frequency Continuous Conduction Mode (FF CCM). Pin DRAIN should be connected to the rectified Vi voltage; see Figure 8. 7.7 OverCurrent Protection (OCP) The primary peak-current in the transformer is measured accurately cycle-by-cycle using the external sense resistor Rsense. The OCP circuit limits the voltage on pin “Sense” to an internal level equal to 1.5V - Vctrl (also see section 7.3). The OCP detection is suppressed during the leading edge blanking period tleb , to prevent false triggering caused by the switch-on spikes. 7.8 Control pin protection If pin CTRL becomes open-circuit or is disconnected, a fault condition is assumed and the converter will stop switching immediately. Operation recommences when the fault condition is removed. 7.9 Adjustable slope compensation A slope compensation function has been added at pin CTRL; see Figure 6. The slope compensation function prevents sub-harmonic oscillation in CCM at duty cycles over 50 %. The CTRL voltage is modulated by sourcing a (non-constant) current out of pin CTRL and by adding externally a series resistor Rslopecomp. This increases the CTRL voltage proportionally with the on-time, which therefore limits the OCP level. A longer on-time results in a higher CTRL voltage, this increase in CTRL voltage will decrease the on-time. Slope compensation can be adjusted by changing the value of Rslopecomp. Slope compensation prevents modulation of the on-time (duty cycle) while operating in FF CCM. A possible drawback of sub-harmonic oscillation can be output voltage ripple. © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Objective data sheet Rev. 01 — 18 May 2005 6 of 22 TEA1530AT Philips Semiconductors GreenChipII SMPS control IC Slope compensation current Rslopecomp RCTRL CTRL 4 −1 5.6 V control detect 0.63 V 001aaa830 Fig 6. Slope compensation 7.10 Minimum and maximum on-time The minimum on-time of the SMPS is determined by the LEB time (typical 400 ns). The IC limits the on-time to a maximum time by limiting the driver duty cycle to 70 %. So the maximum on-time is correlated to the oscillator time which results in an accurate limit of the minimum input voltage of the flyback converter 7.11 PROTECT and timing input The PROTECT input (pin 3) is a multi-purpose (high-impedance) input, which can be used to switch off the IC and create a relatively long timing function. As soon as the voltage on this pin rises above 2.5 V, switching stops immediately. For the timing function, a current of typically 50 µA flows out of pin PROTECT and charges an external capacitor until the activation level of 2.5 V is reached. This current source is only activated when the converter is not in regulation, which is detected by the voltage on pin CTRL (VCTRL < 0.63 V). A (small) discharge current is also implemented to ensure that the capacitor is not charged, for example, by spikes. A MOSFET switch is added to discharge the external capacitor and ensure a defined start situation. The voltage on pin CTRL determines whether the IC enters latched protection mode, or safe restart protection mode: • When the voltage on pin CTRL is below 0.63 V, the IC is assumed to be out of regulation (e.g. the control loop is open). In this case activating pin PROTECT (VPROTECT > 2.5 V) will cause the converter to stop switching. Once VCC drops below VUVLO, capacitor CVCC will be recharged and the supply will restart. This cycle will be repeated until the fault condition is removed (safe restart mode). • When the voltage on pin CTRL is above 0.63 V, the output is assumed to be in regulation. In this case activating pin PROTECT (VPROTECT > 2.5 V), by external means, will activate the latch protection of the IC: The voltage on pin VCC will cycle between Vstart and VUVLO, but the IC will not start switching again until the latch © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Objective data sheet Rev. 01 — 18 May 2005 7 of 22 TEA1530AT Philips Semiconductors GreenChipII SMPS control IC protection is reset. The latch is reset as soon as VCC drops below 4.5 V (typical value) (this only occurs when the mains has been disconnected). The internal overtemperature protection will also trigger this latch; see also Figure 1. A voltage higher than 3 V on pin PROTECT will always latch the IC. This is independent of the state of the IC. 7.12 OverTemperature protection (OTP) The IC provides accurate OTP. The IC will stop switching when the junction temperature exceeds the thermal shutdown temperature. When VCC drops to VUVLO, capacitor CVCC will be recharged to the Vstart level, however switching will not restart. Subsequently, VCC will drop again to VUVLO, etc. Operation only recommences when VCC drops below a level of about 4.5 V (typically, when Vmains is disconnected for a short period). 7.13 Soft start-up (pin SENSE) To prevent transformer rattle at start-up or during hiccup, the transformer peak current is slowly increased by the soft start function. This can be achieved by inserting a resistor and a capacitor between pin SENSE (pin 6) and sense resistor Rsense. An internal current source charges the capacitor to Vsense = Iss × Rss (about 0.5 V maximum). The start level and the time constant of the increasing primary current level can be adjusted externally by changing the values of Rss and Css. V ocp – ( I ss × R ss ) I primary(max) = -----------------------------------------R sense τ = R ss × C ss During the start-up phase, the charging current Iss will flow as long as the voltage on pin SENSE is below approximately 0.5 V. If the voltage on pin SENSE exceeds 0.5 V, the soft start current source will start limiting current Iss. At Vstart, the Iss current source is completely switched off; see Figure 7. Since the soft start current Iss is subtracted from pin VCC charging current, the Rss value will affect VCC charging current level by a maximum of 60 µA (typical). © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Objective data sheet Rev. 01 — 18 May 2005 8 of 22 TEA1530AT Philips Semiconductors GreenChipII SMPS control IC Iss 0.5 V start-up 6 SENSE Rss Css Vocp Rsense mgu237 Fig 7. Soft start-up 7.14 Driver The driver circuit to the gate of the power MOSFET has a current sourcing capability of typically 150 mA and a current sink capability of typically 500 mA at VCC of 9.5 V. At VCC = 15 V, the current sourcing capability is typically 250 mA and the current sink capability typically 0.7 A. This permits fast turn-on and turn-off of the power MOSFET for efficient operation. A low driver source current has been chosen to limit the ∆V/∆t at switch-on. This reduces Electro Magnetic Interference (EMI) and also limits the current spikes across Rsense. 8. Limiting values Table 3: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are measured with respect to ground (pin 2); positive currents flow into the chip; pin VCC may not be current driven. The voltage ratings are valid provided other ratings are not violated; current ratings are valid provided the maximum power rating is not violated. Symbol Parameter Conditions Min Max Unit VCC supply voltage continuous −0.4 +20 V VPROTECT voltage on pin PROTECT continuous −0.4 +5 V VCTRL voltage on pin CTRL −0.4 +5 V VSENSE voltage on pin SENSE −0.4 - V VDRAIN voltage on pin DRAIN −0.4 +650 V - 50 mA −1 +10 mA −0.8 +2 A - 5 mA - 0.5 W Voltages current limited Currents ICTRL current on pin CTRL ISENSE current on pin SENSE IDRIVER current on pin DRIVER IDRAIN current on pin DRAIN d < 10 % d < 10 % General Ptot total power dissipation Tamb < 70 °C SO8 package © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Objective data sheet Rev. 01 — 18 May 2005 9 of 22 TEA1530AT Philips Semiconductors GreenChipII SMPS control IC Table 3: Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are measured with respect to ground (pin 2); positive currents flow into the chip; pin VCC may not be current driven. The voltage ratings are valid provided other ratings are not violated; current ratings are valid provided the maximum power rating is not violated. Symbol Parameter Min Max Unit Tstg storage temperature Conditions −55 +150 °C Tj junction temperature −20 +145 °C ESD VESD electrostatic discharge voltage class 1 human body model pins 1 to 6 [1] - 2000 V pin 8 (DRAIN) [1] - 1500 V [2] - 200 V machine model [1] Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor. [2] Equivalent to discharging a 200 pF capacitor through a 0.75 µH coil and a 10 Ω resistor. 9. Thermal characteristics Table 4: Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-a) thermal resistance from junction to ambient in free air; SO8 package 150 K/W 10. Characteristics Table 5: Characteristics Tamb = 25 °C; VCC = 15 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into the IC; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VCC = 0 V 1.0 1.2 1.4 mA with auxiliary supply - 100 300 µA Start-up current source (pin DRAIN) IDRAIN supply current drawn from pin DRAIN VDRAIN > 100 V VB breakdown voltage 650 - - V Vm mains-dependent operation-enabling level 60 - 100 V 10.3 11 11.7 V Supply voltage management (pin VCC) Vstart start-up voltage VUVLO lock-out undervoltage 8.1 8.7 9.3 V Vhys hysteresis voltage Vstart − VUVLO 2.0 2.3 2.6 V Ich(h) high charging current VDRAIN > 100 V; VCC < 3 V −1.2 −1 −0.8 mA Ich(l) low charging current VDRAIN > 100 V; 3 V < VCC < VUVLO −1.2 −0.75 −0.45 mA Irestart restart current VDRAIN > 100 V; VUVLO < VCC < Vstart −650 −550 −450 µA © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Objective data sheet Rev. 01 — 18 May 2005 10 of 22 TEA1530AT Philips Semiconductors GreenChipII SMPS control IC Table 5: Characteristics …continued Tamb = 25 °C; VCC = 15 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into the IC; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Ioper supply current under normal operation no load on pin DRIVER 1.1 1.3 1.5 mA Pulse width modulator ton(min) minimum on-time - tleb - ns ton(max) maximum on-time 20 25 30 µs δmax maximum duty-cycle 67 70 73 % 50 63 75 kHz Oscillator fosc oscillator frequency (fixed frequency) VCTRL < 1 V Duty cycle control (pin CTRL) Vmin minimum voltage for maximum duty cycle - 1.0 - V Vmax maximum voltage for minimum duty cycle - 1.5 - V ∆Islopecomp/∆t slope compensation current −1.2 −1 −0.8 µA/µs VCTRL(detect) Control detect level 0.56 0.63 0.70 V Protection and timing input (pin PROTECT) Vtrip trip level Vtrip(latch) trip level for latch VCC(latch)(reset) voltage level on pin VCC which resets the latch Icharge charge current Idischarge discharge current [1] 2.37 2.5 2.63 V 2.85 3 3.15 V VCC(latch) < 2.3 V - 4.5 - V VCTRL < 0.63 V −57 −50 −43 µA - 100 - nA Overcurrent and winding short-circuit protection (pin SENSE) Vsense(max) maximum source voltage for OCP ∆V/∆t = 0.1 V/µs 0.48 0.52 0.56 V tPD propagation delay from detecting Vsense(max) to switch-off ∆V/∆t = 0.5 V/µs - 140 185 ns tleb blanking time for current and winding short-circuit protection 330 400 470 ns Iss soft start current Vsense < 0.5 V 45 60 75 µA - −150 −88 mA VDRIVER = 2 V - 250 - mA VDRIVER = 9.5 V 300 500 - mA - 11.5 12 V Driver (pin DRIVER) Isource source current VCC = 9.5 V; VDRIVER = 2 V Isink sink current VCC = 9.5 V Vo(max) maximum output voltage VCC > 12 V © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Objective data sheet Rev. 01 — 18 May 2005 11 of 22 TEA1530AT Philips Semiconductors GreenChipII SMPS control IC Table 5: Characteristics …continued Tamb = 25 °C; VCC = 15 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into the IC; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit 130 140 150 °C - 8 - °C Temperature protection Tprot(max) maximum temperature protection level Tprot(hyst) hysteresis for the temperature protection level [1] safe restart [2] Valid for VCC > 2 V. [2] 11. Application information A converter with the TEA1530AT consists of an input filter, a transformer with a third winding (auxiliary), and an output stage with a feedback circuit. Capacitor CVCC buffers the IC supply voltage, which is powered via the internal current source, that is connected to the rectified mains, during start-up and via the auxiliary winding during operation. A sense resistor Rsense converts the primary current into a voltage at pin SENSE. The value of Rsense defines the maximum primary peak current. Figure 8 shows a typical Continuous Conduction Mode flyback configuration. Pin PROTECT is used in this example for external overtemperature protection and open loop or output short-circuit protection. © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Objective data sheet Rev. 01 — 18 May 2005 12 of 22 TEA1530AT Philips Semiconductors GreenChipII SMPS control IC (1) Pin PROTECT is used in this example for external OTP and open loop or output short-circuit protection. Slope compensation is determined by the value of Rslopecomp. Fig 8. Flyback configuration using the continuous conduction mode © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Objective data sheet Rev. 01 — 18 May 2005 13 of 22 TEA1530AT Philips Semiconductors GreenChipII SMPS control IC Fig 9. Typical waveforms 1 © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Objective data sheet Rev. 01 — 18 May 2005 14 of 22 TEA1530AT Philips Semiconductors GreenChipII SMPS control IC Vi Vi VDRAIN VO Vstart VCC VUVLO VDRIVER 3V V 2.5 VPROTECT(1) Start-up sequence Normal operation Protection active(2) 001aaa841 (1) When VPROTECT is forced above 3 V, the protection is always latched. So the IC is not started at Vstart unless the VCC voltage drops below the VCC(reset) level. This is the same action used for external OTP compensation described in Section 7.12. Fig 10. Typical waveforms 2 12. Test information 12.1 Quality information The General Quality Specification for Integrated Circuits, SNW-FQ-611 is applicable. © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Objective data sheet Rev. 01 — 18 May 2005 15 of 22 TEA1530AT Philips Semiconductors GreenChipII SMPS control IC 13. Package outline SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 inches 0.069 0.010 0.057 0.004 0.049 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 0.05 0.01 0.01 0.004 0.028 0.012 0.244 0.039 0.028 0.041 0.228 0.016 0.024 θ 8o o 0 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03 MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18 Fig 11. Package outline SOT96-1 (SO8) © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Objective data sheet Rev. 01 — 18 May 2005 16 of 22 TEA1530AT Philips Semiconductors GreenChipII SMPS control IC 14. Soldering 14.1 Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. 14.2 Through-hole mount packages 14.2.1 Soldering by dipping or by solder wave Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 14.2.2 Manual soldering Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 °C and 400 °C, contact may be up to 5 seconds. 14.3 Surface mount packages 14.3.1 Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 °C to 270 °C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: • below 225 °C (SnPb process) or below 245 °C (Pb-free process) – for all BGA, HTSSON..T and SSOP..T packages © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Objective data sheet Rev. 01 — 18 May 2005 17 of 22 TEA1530AT Philips Semiconductors GreenChipII SMPS control IC – for packages with a thickness ≥ 2.5 mm – for packages with a thickness < 2.5 mm and a volume ≥ 350 mm3 so called thick/large packages. • below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. 14.3.2 Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 14.3.3 Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 °C and 320 °C. © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Objective data sheet Rev. 01 — 18 May 2005 18 of 22 TEA1530AT Philips Semiconductors GreenChipII SMPS control IC 14.4 Package related soldering information Table 6: Suitability of IC packages for wave, reflow and dipping soldering methods Mounting Through-hole mount Package [1] Soldering method Wave Reflow [2] Dipping CPGA, HCPGA suitable − − DBS, DIP, HDIP, RDBS, SDIP, SIL suitable [3] − suitable Through-hole-surface mount PMFP [4] not suitable not suitable − Surface mount BGA, HTSSON..T [5], LBGA, LFBGA, SQFP, SSOP..T [5], TFBGA, VFBGA, XSON not suitable suitable − DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS not suitable [6] suitable − PLCC [7], SO, SOJ suitable suitable − not recommended [7] [8] suitable − SSOP, TSSOP, VSO, VSSOP not recommended [9] suitable − CWQCCN..L [10], WQCCN..L [10] not suitable not suitable − LQFP, QFP, TQFP [1] For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. [2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. [3] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. [4] Hot bar soldering or manual soldering is suitable for PMFP packages. [5] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. [6] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. [7] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. [8] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. [9] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. [10] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Objective data sheet Rev. 01 — 18 May 2005 19 of 22 TEA1530AT Philips Semiconductors GreenChipII SMPS control IC 15. Revision history Table 7: Revision history Document ID Release date Data sheet status Change notice Doc. number TEA1530_1 20050510 Objective data sheet - 9397 xxx xxxxx Modifications: Supersedes • © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Objective data sheet Rev. 01 — 18 May 2005 20 of 22 TEA1530AT Philips Semiconductors GreenChipII SMPS control IC 16. Data sheet status Level Data sheet status [1] Product status [2] [3] Definition I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 17. Definitions Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 18. Disclaimers Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 19. Trademarks GreenChip — is a trademark of Koninklijke Philips Electronics N.V. 20. Contact information For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: [email protected] © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Objective data sheet Rev. 01 — 18 May 2005 21 of 22 TEA1530AT Philips Semiconductors GreenChipII SMPS control IC 21. Contents 1 2 2.1 2.2 2.3 3 4 5 6 6.1 6.2 7 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 7.9 7.10 7.11 7.12 7.13 7.14 8 9 10 11 12 12.1 13 14 14.1 14.2 14.2.1 14.2.2 14.3 14.3.1 14.3.2 14.3.3 14.4 15 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Distinctive features . . . . . . . . . . . . . . . . . . . . . . 1 Green features . . . . . . . . . . . . . . . . . . . . . . . . . 1 Protection features . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Start-up, mains enabling operation level and undervoltage lock out . . . . . . . . . . . . . . . . . . . . 5 Supply management. . . . . . . . . . . . . . . . . . . . . 5 Current control mode . . . . . . . . . . . . . . . . . . . . 5 Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Cycle skipping. . . . . . . . . . . . . . . . . . . . . . . . . . 6 Continuous Conduction Mode (CCM). . . . . . . . 6 OverCurrent Protection (OCP) . . . . . . . . . . . . . 6 Control pin protection . . . . . . . . . . . . . . . . . . . . 6 Adjustable slope compensation . . . . . . . . . . . . 6 Minimum and maximum on-time. . . . . . . . . . . . 7 PROTECT and timing input . . . . . . . . . . . . . . . 7 OverTemperature protection (OTP) . . . . . . . . . 8 Soft start-up (pin SENSE). . . . . . . . . . . . . . . . . 8 Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9 Thermal characteristics. . . . . . . . . . . . . . . . . . 10 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 10 Application information. . . . . . . . . . . . . . . . . . 12 Test information . . . . . . . . . . . . . . . . . . . . . . . . 15 Quality information . . . . . . . . . . . . . . . . . . . . . 15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Through-hole mount packages . . . . . . . . . . . . 17 Soldering by dipping or by solder wave . . . . . 17 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 17 Surface mount packages . . . . . . . . . . . . . . . . 17 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 17 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 18 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 18 Package related soldering information . . . . . . 19 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 20 16 17 18 19 20 Data sheet status. . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . 21 21 21 21 21 © Koninklijke Philips Electronics N.V. 2005 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 18 May 2005 Document number: 9397 xxx xxxxx Published in The Netherlands