PHILIPS TEA1533AP

INTEGRATED CIRCUITS
DATA SHEET
TEA1533P; TEA1533AP
GreenChipTMII SMPS control IC
Product specification
Supersedes data of 2002 May 31
2002 Aug 23
Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
TEA1533P; TEA1533AP
FEATURES
APPLICATIONS
Distinctive features
Besides typical application areas, i.e. adapters and
chargers, the device can be used in TV and monitor
supplies and all applications that demand an efficient and
cost-effective solution up to 250 W.
• Universal mains supply operation (70 to 276 V AC)
• High level of integration, giving a very low external
component count.
Green features
• Valley or zero voltage switching for minimum switching
losses
• Efficient quasi-resonant operation at high power levels
• Frequency reduction at low power standby for improved
system efficiency (<3 W)
• Cycle skipping mode at very low loads. Pi <300 mW at
no-load operation for a typical adapter application
1
8
2
7
3
6
4
5
TEA1533P
TEA1533AP
• On-chip start-up current source.
Protection features
• Safe restart mode for system fault conditions
• Continuous mode protection by means of
demagnetization detection (zero switch-on current)
• Accurate and adjustable overvoltage protection (latched
in TEA1533P, safe restart in TEA1533AP)
• Short winding protection
• Undervoltage protection (foldback during overload)
• Overtemperature protection (latched in TEA1533P, safe
restart in TEA1533AP)
• Low and adjustable overcurrent protection trip level
• Soft (re)start
• Mains voltage-dependent operation enabling level.
MGU505
Fig.1 Basic application diagram.
2002 Aug 23
2
Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
TEA1533P; TEA1533AP
The proprietary high voltage BCD800 process makes
direct start-up possible from the rectified mains voltage in
an effective and green way. A second low voltage
BICMOS IC is used for accurate, high-speed protection
functions and control.
GENERAL DESCRIPTION
GreenChip(1)II
is the second generation of green
The
Switched Mode Power Supply (SMPS) control ICs
operating directly from the rectified universal mains. A high
level of integration leads to a cost effective power supply
with a very low number of external components.
Highly efficient and reliable supplies can easily be
designed using the GreenChipII control IC.
The special built-in green functions allow the efficiency to
be optimum at all power levels. This holds for
quasi-resonant operation at high power levels, as well as
fixed frequency operation with valley switching at medium
power levels. At low power (standby) levels, the system
operates at a reduced frequency and with valley detection.
(1) GreenChip is a trademark of Koninklijke Philips
Electronics N.V.
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
TEA1533P
DIP8
DESCRIPTION
plastic dual in-line package; 8 leads (300 mil)
TEA1533AP
2002 Aug 23
3
VERSION
SOT97-1
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in
_white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in
white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ...
GND
2
S1
M-level
Iprot(DEM)
OCP
DEMAG
SHORT
PROTECTION
UVLO start
VALLEY
clamp
7
4
VOLTAGE
CONTROLLED
OSCILLATOR
DRAIN
LOGIC
HVS
n.c.
DEM
50
mV
100
mV
UP/DOWN
COUNTER
FREQUENCY
CONTROL
LOGIC
Iprot(CTRL)
4
CTRL
3
OVERVOLTAGE
PROTECTION
6
DRIVER
DRIVER
Iss
−1
LEB
POWER-ON
RESET
S
soft
start
S2
Q
blank
UVLO
2.5 V
R
0.5 V
Q
5
OCP
OVERTEMPERATURE
PROTECTION
VCC < 4.5 V
or UVLO
(TEA1533AP)
S
Q
R
Q
short
winding
0.88 V
OVERPOWER
PROTECTION
MGU506
Fig.2 Block diagram.
Product specification
MAXIMUM
ON-TIME
PROTECTION
Isense
TEA1533P; TEA1533AP
burst
detect
TEA1533P
TEA1533AP
Philips Semiconductors
internal
supply
8
START-UP
CURRENT SOURCE
GreenChipTMII SMPS control IC
SUPPLY
MANAGEMENT
BLOCK DIAGRAM
1
book, full pagewidth
2002 Aug 23
VCC
Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
TEA1533P; TEA1533AP
PINNING
FUNCTIONAL DESCRIPTION
SYMBOL PIN
The TEA1533 is the controller of a compact flyback
converter, and is situated at the primary side. An auxiliary
winding of the transformer provides demagnetization
detection and powers the IC after start-up.
DESCRIPTION
VCC
1
supply voltage
GND
2
ground
CTRL
3
control input
DEM
4
input from auxiliary winding for
demagnetization timing, overvoltage
and overpower protection
Isense
5
programmable current sense input
DRIVER
6
gate driver output
HVS
7
high voltage safety spacer, not
connected
DRAIN
8
drain of external MOS switch, input for
start-up current and valley sensing
The TEA1533 can operate in multi modes (see Fig.4).
f
MGU508
handbook, halfpage
(kHz)
VCO
fixed
quasi resonant
175
25
P (W)
Fig.4 Multi modes operation.
The next converter stroke is started only after
demagnetization of the transformer current (zero current
switching), while the drain voltage has reached the lowest
voltage to prevent switching losses (green function). The
primary resonant circuit of the primary inductance and
drain capacitor ensures this quasi-resonant operation. The
design can be optimized in such a way that zero voltage
switching can be reached over almost the universal mains
range.
handbook, halfpage
VCC 1
8 DRAIN
GND 2
7 HVS
DEM 4
5 Isense
TEA1533P
TEA1533AP
CTRL 3
6 DRIVER
MGU507
To prevent very high frequency operation at lower loads,
the quasi-resonant operation changes smoothly in fixed
frequency PWM control.
At very low power (standby) levels, the frequency is
controlled down, via the VCO, to a minimum frequency of
approximately 25 kHz.
Fig.3 Pin configuration.
Start-up, mains enabling operation level and
undervoltage lock-out
Initially, the IC is self supplying from the rectified mains
voltage via pin DRAIN (see Figs 11 and 12). Supply
capacitor CVCC is charged by the internal start-up current
source to approximately 4 V or higher, depending on the
voltage on pin DRAIN.
2002 Aug 23
5
Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
TEA1533P; TEA1533AP
Once the drain voltage exceeds the M-level
(mains-dependent operation-enabling level), the start-up
current source will continue charging capacitor CVCC
(switch S1 will be opened); see Fig.2. The IC will activate
the converter as soon as the voltage on pin VCC passes
the VCC(start) level.
MGU233
V
sense(max)
handbook, halfpage
0.52 V
The IC supply is taken over by the auxiliary winding as
soon as the output voltage reaches its intended level and
the IC supply from the mains voltage is subsequently
stopped for high efficiency operation (green function).
1V
(typ)
The moment the voltage on pin VCC drops below the
undervoltage lock-out level, the IC stops switching and
enters a safe restart from the rectified mains voltage.
Inhibiting the auxiliary supply by external means causes
the converter to operate in a stable, well defined burst
mode.
1.5 V
(typ)
VCTRL
Fig.5 Vsense(max) voltage as function of VCTRL.
Supply management
MGU509
f
(kHz)
All (internal) reference voltages are derived from a
temperature compensated, on-chip band gap circuit.
handbook, halfpage
175 kHz
175
Current mode control
Current mode control is used for its good line regulation
behaviour.
25
The ‘on-time’ is controlled by the internally inverted control
voltage, which is compared with the primary current
information. The primary current is sensed across an
external resistor. The driver output is latched in the logic,
preventing multiple switch-on.
VCO2
VCO1
level
level
Vsense(max) (V)
Fig.6 VCO frequency as function of Vsense(max)
Cycle skipping
The internal control voltage is inversely proportional to the
external control pin voltage, with an offset of 1.5 V. This
means that a voltage range from 1 to 1.5 V on pin CTRL
will result in an internal control voltage range from
0.5 to 0 V (a high external control voltage results in a low
duty cycle).
At very low power levels, a cycle skipping mode will be
activated. A high control voltage will reduce the switching
frequency to a minimum of 25 kHz. If the voltage on the
control pin is raised even more, switch-on of the external
power MOSFET will be inhibited until the voltage on the
control pin has dropped to a lower value again (see Fig.7).
Oscillator
For system accuracy, it is not the absolute voltage on the
control pin that will trigger the cycle skipping mode, but a
signal derived from the internal VCO will be used.
The maximum fixed frequency of the oscillator is set by an
internal current source and capacitor. The maximum
frequency is reduced once the control voltage enters the
VCO control window. Then, the maximum frequency
changes linearly with the control voltage until the minimum
frequency is reached (see Figs 5 and 6).
Remark 1: If the no-load requirement of the system is such
that the output voltage can be regulated to its intended
level at a switching frequency of 25 kHz or above, the
cycle skipping mode will not be activated.
Remark 2: As switching will stop when the voltage on the
control pin is raised above a certain level, the burst mode
has to be activated by a microcontroller or any other circuit
sending a 30 µs, 16 mA pulse to the control input
(pin CTRL) of the IC.
2002 Aug 23
6
Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
TEA1533P; TEA1533AP
fosc
handbook, full pagewidth
1.5 V − VCTRL
current
comparator
CTRL
fmax
DRIVER
DRIVER
fmin
Isense
X2
dV2
Vx
dV1
cycle
skipping
V
I
150
Vx (mV)
OSCILLATOR
150 mV
1
0
Vx (mV)
MGU510
The voltage levels dV1 and dV2 are fixed in the IC to 50 mV (typical) and 18 mV (typical) respectively.
Fig.7 The cycle skipping circuitry.
Demagnetization
Minimum and maximum ‘on-time’
The system will be in discontinuous conduction mode all
the time. The oscillator will not start a new primary stroke
until the secondary stroke has ended.
The minimum ‘on-time’ of the SMPS is determined by the
Leading Edge Blanking (LEB) time. The IC limits the
‘on-time’ to 50 µs. When the system desires an ‘on-time’
longer than 50 µs, a fault condition is assumed (e.g.
removed Ci in Fig.11), the IC will stop switching and enter
the safe restart mode.
Demagnetization features a cycle-by-cycle output
short-circuit protection by immediately lowering the
frequency (longer off-time), thereby reducing the power
level.
Demagnetization recognition is suppressed during the first
tsuppr time. This suppression may be necessary in
applications where the transformer has a large leakage
inductance, at low output voltages and at start-up.
If pin DEM is open-circuit or not connected, a fault
condition is assumed and the converter will stop operating
immediately. Operation will recommence as soon as the
fault condition is removed.
If pin DEM is shorted to ground, again a fault condition is
assumed and the converter will stop operating after the
first stroke. The converter will subsequently enter the safe
restart mode. This situation will persist until the
short-circuit is removed.
2002 Aug 23
7
Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
TEA1533P; TEA1533AP
OverVoltage Protection (OVP)
Valley switching
An OVP mode is implemented in the GreenChip series.
This works for the TEA1533 by sensing the auxiliary
voltage via the current flowing into pin DEM during the
secondary stroke. The auxiliary winding voltage is a
well-defined replica of the output voltage. Any voltage
spikes are averaged by an internal filter.
A new cycle starts when the power MOSFET is switched
on (see Fig.8). After the ‘on-time’ (which is determined by
the ‘sense’ voltage and the internal control voltage), the
switch is opened and the secondary stroke starts. After the
secondary stroke, the drain voltage shows an oscillation
1
with a frequency of approximately ----------------------------------------------2 × π × ( Lp × Cd )
If the output voltage exceeds the OVP trip level, an internal
counter starts counting subsequent OVP events. The
counter has been added to prevent incorrect OVP
detections which might occur during ESD or lightning
events. If the output voltage exceeds the OVP trip level a
few times and not again in a subsequent cycle, the internal
counter will count down with twice the speed compared
with counting-up. However, when typical 10 cycles of
subsequent OVP events are detected, the IC assumes a
true OVP and the OVP circuit switches the power
MOSFET off. Next, the controller waits until the UVLO
level is reached on pin VCC. When VCC drops to UVLO,
capacitor CVCC will be recharged to the Vstart level.
where Lp is the primary self inductance of the transformer
and Cd is the capacitance on the drain node.
As soon as the oscillator voltage is high again and the
secondary stroke has ended, the circuit waits for the
lowest drain voltage before starting a new primary stroke.
This method is called valley detection. Figure 8 shows the
drain voltage together with the valley signal, the signal
indicating the secondary stroke and the oscillator signal.
In an optimum design, the reflected secondary voltage on
the primary side will force the drain voltage to zero. Thus,
zero voltage switching is very possible, preventing large
Regarding the TEA1533P, this IC will not start switching
again. Subsequently, VCC will drop again to the UVLO
level, etc. Operation only recommences when the VCC
voltage drops below a level of approximately 4.5 V
(practically when Vmains has been disconnected for a short
period).
1
2
capacitive switching losses  P = --- × C × V × f and


2
allowing high frequency operation, which results in small
and cost effective inductors.
Regarding the TEA1533AP, switching starts again (safe
restart mode) when the Vstart level is reached. This
process is repeated as long as the OVP condition exists.
The output voltage Vo(OVP) at which the OVP function trips,
can be set by the demagnetization resistor, RDEM:
V o ( OVP ) =
Ns
----------- { I (OVP)(DEM) × R DEM + V clamp(DEM)(pos) }
N aux
where Ns is the number of secondary turns and Naux is the
number of auxiliary turns of the transformer.
Current I(OVP)(DEM) is internally trimmed.
The value of RDEM can be adjusted to the turns ratio of the
transformer, thus making an accurate OVP possible.
2002 Aug 23
8
Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
primary
stroke
handbook, full pagewidth
TEA1533P; TEA1533AP
secondary
ringing
secondary
stroke
drain
valley
secondary
stroke
B
A
oscillator
MGU235
A: Start of new cycle at lowest drain voltage.
B: Start of new cycle in a classical PWM system at high drain voltage.
Fig.8 Signals for valley switching.
OverCurrent Protection (OCP)
N aux
where: N = ----------Np
The cycle-by-cycle peak drain current limit circuit uses the
external source resistor to measure the current accurately.
This allows optimum size determination of the transformer
core (cost issue). The circuit is activated after the leading
edge blanking time, tleb. The OCP circuit limits the ‘sense’
voltage to an internal level.
The current information is used to adjust the peak drain
current, which is measured via pin Isense. The internal
compensation is such that an almost mains independent
maximum output power can be realized.
The OPP curve is given in Fig.9.
OverPower Protection (OPP)
During the primary stroke, the rectified mains input voltage
is measured by sensing the current drawn from pin DEM.
This current is dependent on the mains voltage, according
V aux N × V mains
to the following formula: I DEM ≈ --------------- ≈ -------------------------R DEM
R DEM
2002 Aug 23
9
Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
TEA1533P; TEA1533AP
Control pin protection
If pin CTRL is open-circuit or not connected, a fault
condition is assumed and the converter will stop switching.
Operation will recommence as soon as the fault condition
is removed.
MGU236
handbook, halfpage
Vsense(max)
0.52 V
(typ)
Burst mode standby
0.3 V
(typ)
−100 µA
(typ)
IDEM
Pin CTRL is also used to implement the burst mode
standby. In burst mode standby, the power supply enters
a special low dissipation state. Figure 11 shows a flyback
converter using the burst mode standby function. The
system enters burst mode standby when the
microcontroller activates NPN transistor T1 on the
secondary side.
−24 µA
(typ)
Fig.9 OPP correction curve.
When the voltage on Cmicro exceeds a certain voltage
measured by the microcontroller, the opto-coupler is
activated by T1, sending a large current signal to
pin CTRL. In response to this signal, the IC stops
switching and enters a ‘hiccup’ mode. This burst activation
signal should be present for longer than the ‘burst blank’
period (typically 30 µs): the blanking time prevents false
burst triggering due to spikes. Figure 12 shows the burst
mode standby signals. The hiccup mode during burst
mode standby operation does not differ from the hiccup
mode at safe restart during a system fault condition (e.g.
output short-circuit). The power is reduced during soft
restart mode.
Short winding protection
After the leading edge blanking time, the short winding
protection circuit is activated. If the ‘sense’ voltage
exceeds the short winding protection voltage Vswp, the
converter will stop switching. Once VCC drops below the
UVLO level, capacitor CVCC will be recharged and the
supply will restart again. This cycle will be repeated until
the short-circuit is removed (safe restart mode).
The short winding protection will also protect in case of a
secondary diode short-circuit.
Burst mode standby operation continues until the
microcontroller stops activating transistor T1. The system
then enters the start-up sequence and begins normal
switching behaviour.
OverTemperature Protection (OTP)
An accurate temperature protection is provided in the
circuit. When the junction temperature exceeds the
thermal shutdown temperature, the IC will stop switching.
When VCC drops to UVLO, capacitor CVCC will be
recharged to the Vstart level.
V th
I burstmode = ---------------+I
R CTRL th(on)
Regarding the TEA1533P, this IC will not start switching
again. Subsequently, VCC will drop again to the UVLO
level, etc. Operation only recommences when the VCC
voltage drops below a level of approximately 4.5 V
(practically when the Vmains has been disconnected for a
short period).
Regarding the TEA1533AP, when the Vstart level is
reached, switching starts again (safe restart mode). This
process is repeated as long as the OTP condition exists.
2002 Aug 23
10
Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
TEA1533P; TEA1533AP
Soft start-up
Driver
To prevent transformer rattle during hiccup, the
transformer peak current is slowly increased by the soft
start function. This can be achieved by inserting a resistor
and a capacitor between pin Isense and the sense resistor
(see Fig.10). An internal current source charges the
capacitor to V = ISS × RSS, with a maximum of
approximately 0.5 V.
The driver circuit to the gate of the power MOSFET has a
current sourcing capability of 170 mA typical and a current
sink capability of 700 mA typical. This permits fast turn-on
and turn-off of the power MOSFET for efficient operation.
A low driver source current has been chosen to limit the
∆V/∆t at switch-on. This reduces Electro Magnetic
Interference (EMI) and also limits the current spikes
across Rsense.
The start level and the time constant of the increasing
primary current level can be adjusted externally by
changing the values of RSS and CSS.
V ocp – ( I SS × R SS )
I primary(max) = ---------------------------------------------R sense
τ = R SS × C SS
The charging current ISS will flow as long as the voltage on
pin Isense is below approximately 0.5 V. If the voltage on
pin Isense exceeds 0.5 V, the soft start current source will
start limiting the current ISS. At the VCC(start) level, the ISS
current source is completely switched off.
Since the soft start current ISS is subtracted from pin VCC
charging current, the RSS value will affect the VCC charging
current level by a maximum of 60 µA (typical value).
handbook, halfpage
ISS
0.5 V
start-up
5 Isense
Vocp
RSS
CSS
Rsense
MGU237
Fig.10 Soft start.
2002 Aug 23
11
Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
TEA1533P; TEA1533AP
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); note 1.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
Voltages
continuous
−0.4
VCC
supply voltage
+20
V
VCTRL
voltage on pin CTRL
−0.4
+5
V
VDEM
voltage on pin DEM
current limited
−0.4
−
V
Vsense
voltage on pin Isense
current limited
−0.4
−
V
VDRAIN
voltage on pin DRAIN
−0.4
+650
V
Currents
ICTRL
current on pin CTRL
−
50
mA
IDEM
current on pin DEM
−250
+250
µA
Isense
current on pin Isense
−1
+10
mA
IDRIVER
current on pin DRIVER
−0.8
+2
A
IDRAIN
current on pin DRAIN
−
5
mA
d < 10%
d < 10%
General
Ptot
total power dissipation
−
0.75
W
Tstg
storage temperature
Tamb < 70 °C
−55
+150
°C
Tj
operating junction temperature
−20
+145
°C
Vesd
electrostatic discharge voltage
pins 1 to 6
HBM class 1; note 2
−
2000
V
pin DRAIN
HBM class 1; note 2
−
1500
V
any pin
note 3
−
400
V
Notes
1. All voltages are measured with respect to ground; positive currents flow into the IC; pin VCC may not be current
driven. The voltage ratings are valid provided other ratings are not violated; current ratings are valid provided the
maximum power rating is not violated.
2. Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ resistor.
3. Equivalent to discharging a 200 pF capacitor through a 0.75 µH coil and a 10 Ω resistor.
THERMAL CHARACTERISTICS
SYMBOL
Rth(j-a)
PARAMETER
CONDITIONS
thermal resistance from junction to ambient in free air; note 1
Note
1. With pin GND connected to sufficient copper area on the printed-circuit board.
QUALITY SPECIFICATION
In accordance with ‘SNW-FQ-611-D’.
2002 Aug 23
12
VALUE
UNIT
100
K/W
Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
TEA1533P; TEA1533AP
CHARACTERISTICS
Tamb = 25 °C; VCC = 15 V; all voltages are measured with respect to ground; currents are positive when flowing into
the IC; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Start-up current source (pin DRAIN)
IDRAIN
supply current drawn from
pin DRAIN
VCC = 0 V; VDRAIN > 100 V
1.0
1.2
1.4
mA
with auxiliary supply;
VDRAIN > 100 V
−
100
300
µA
BVDSS
breakdown voltage
650
−
−
V
M-level
mains-dependent operation
enabling level
60
−
100
V
Supply voltage management (pin VCC)
VCC(start)
start-up voltage on VCC
10.3
11
11.7
V
VCC(UVLO)
undervoltage lock-out on VCC
8.1
8.7
9.3
V
VCC(hys)
hysteresis voltage on VCC
VCC(start) − VCC(UVLO)
2.0
2.3
2.6
V
ICC(h)
pin VCC charging current, high
VDRAIN > 100 V; VCC < 3 V
−1.2
−1
−0.8
mA
ICC(l)
pin VCC charging current, low
VDRAIN > 100 V;
3 V < VCC < VCC(UVLO)
−1.2
−0.75
−0.45
mA
ICC(restart)
pin VCC restart current
VDRAIN > 100 V;
−650
VCC(UVLO) < VCC < VCC(start)
−550
−450
µA
ICC(oper)
supply current under normal
operation
no load on pin DRIVER
1.1
1.3
1.5
mA
ICC(burstmode)
supply current while not switching
−
0.85
−
mA
50
100
150
mV
VDEM = 50 mV
−50(1)
−
−10
nA
Vclamp(DEM)(neg) negative clamp voltage on
pin DEM
IDEM = −150 µA
−0.5
−0.25
−0.05
V
Vclamp(DEM)(pos) positive clamp voltage on
pin DEM
IDEM = 250 µA
0.5
0.7
0.9
V
1.1
1.5
1.9
µs
−
tleb
−
ns
40
50
60
µs
Demagnetization management (pin DEM)
Vth(DEM)
demagnetization comparator
threshold voltage on pin DEM
Iprot(DEM)
protection current on pin DEM
tsuppr
suppression of transformer
ringing at start of secondary
stroke
Pulse width modulator
ton(min)
minimum on-time
ton(max)
maximum on-time
latched
Oscillator
fosc(l)
oscillator low fixed frequency
VCTRL > 1.5 V
20
25
30
kHz
fosc(h)
oscillator high fixed frequency
VCTRL < 1 V
145
175
205
kHz
Vvco(start)
peak voltage on pin Isense, where
frequency reduction starts
see Figs 6 and 7
−
VCO1
−
mV
2002 Aug 23
13
Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
SYMBOL
Vvco(max)
TEA1533P; TEA1533AP
PARAMETER
CONDITIONS
peak voltage on pin Isense, where
the frequency is equal to fosc(l)
MIN.
TYP.
MAX.
−
VCO1 − 25 −
UNIT
mV
Duty cycle control (pin CTRL)
VCTRL(min)
minimum voltage on pin CTRL for
maximum duty cycle
−
1.0
−
V
VCTRL(max)
maximum voltage on pin CTRL for
minimum duty cycle
−
1.5
−
V
Iprot(CTRL)
protection current on pin CTRL
VCTRL = 1.5 V
−1 (1)
−0.8
−0.5
µA
Iburst = 6 mA
3.3
3.8
4.3
V
Burst mode standby (pin CTRL)
Vth(burst)(on)
burst mode standby active
threshold voltage
Ith(burst)(on)
burst mode standby active current
16
−
−
mA
Ith(burst)(off)
burst mode standby inactive
current
−
−
6
mA
t(burst-blank)
burst mode standby blanking time
25
30
35
µs
Valley switch (pin DRAIN)
∆V/∆tvalley
valley recognition voltage change
−85
−
+85
V/µs
tvalley-swon
delay from valley recognition to
switch-on
−
150(1)
−
ns
Overcurrent and short winding protection (pin Isense)
Vsense(max)
maximum source voltage OCP
∆V/∆t = 0.1 V/µs
0.48
0.52
0.56
V
tPD
propagating delay from detecting
Vsense(max) to switch-off
∆V/∆t = 0.5 V/µs
−
140
185
ns
Vswp
short winding protection voltage
0.83
0.88
0.96
V
tleb
blanking time for current and
short winding protection
300
370
440
ns
ISS
soft start current
Vsense < 0.5 V
45
60
75
µA
set by resistor RDEM, see
Section “OverVoltage
Protection (OVP)”
54
60
66
µA
set by resistor RDEM, see
Section “OverPower
Protection (OPP)”
−
−24
−
µA
−
−100
−
µA
Overvoltage protection (pin DEM)
IOVP(DEM)
OVP level on pin DEM
Overpower protection (pin DEM)
IOPP(DEM)
OPP current on pin DEM to start
OPP correction
IOPP50%(DEM)
OPP current on pin DEM, where
maximum source voltage is
limited to 0.3 V
2002 Aug 23
14
Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
SYMBOL
PARAMETER
TEA1533P; TEA1533AP
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Driver (pin DRIVER)
Isource
source current capability of driver
VCC = 9.5 V; VDRIVER = 2 V −
−170
−88
mA
Isink
sink current capability of driver
VCC= 9.5 V; VDRIVER = 2 V
−
300
−
mA
VCC = 9.5 V;
VDRIVER = 9.5 V
400
700
−
mA
VCC > 12 V
−
11.5
12
V
Vo(max)
maximum output voltage of the
driver
Temperature protection
Tprot(max)
maximum temperature protection
level
130
140
150
°C
Tprot(hys)
hysteresis for the temperature
protection level
−
8(1)
−
°C
Note
1. Guaranteed by design.
2002 Aug 23
15
Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
TEA1533P; TEA1533AP
APPLICATION INFORMATION
A converter with the TEA1533 consists of an input filter, a transformer with a third winding (auxiliary), and an output stage
with a feedback circuit.
Capacitor CVCC (at pin VCC) buffers the supply voltage of the IC, which is powered via the high voltage rectified mains
during start-up and via the auxiliary winding during operation.
A sense resistor converts the primary current into a voltage at pin Isense. The value of this sense resistor defines the
maximum primary peak current.
V
mains
handbook, full pagewidth
Do
Vi
Vo
Ci
Np
VCC
CVCC
CCTRL
RCTRL
GND
CTRL
DEM
3
Co
8 DRAIN
1
2
Ns
TEA1533P
TEA1533AP
7
6
5
4
HVS
n.c.
power
MOSFET
DRIVER
Isense
RSS
CSS
Rsense
Dmicro
VµC
RDEM
Naux
Cmicro
MICROCONTROLLER
standby
pulse
Rreg1
Rreg2
T1
MGU511
Fig.11 Flyback configuration with secondary sensing using the burst mode standby.
2002 Aug 23
16
Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
TEA1533P; TEA1533AP
handbook, full pagewidth
Vi
VD
(power
MOSFET)
Vi
Vo
VCC
Vgate
M-level
burst mode
VµC
start-up
sequence
normal
operation
overvoltage
protection
(TEA1533AP)
output
short-circuit
Fig.12 Typical waveforms.
2002 Aug 23
17
burst mode standby
normal
operation
MGU512
Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
TEA1533P; TEA1533AP
PACKAGE OUTLINE
DIP8: plastic dual in-line package; 8 leads (300 mil)
SOT97-1
ME
seating plane
D
A2
A
A1
L
c
Z
w M
b1
e
(e 1)
b
MH
b2
5
8
pin 1 index
E
1
4
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
b2
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73
1.14
0.53
0.38
1.07
0.89
0.36
0.23
9.8
9.2
6.48
6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
1.15
inches
0.17
0.020
0.13
0.068
0.045
0.021
0.015
0.042
0.035
0.014
0.009
0.39
0.36
0.26
0.24
0.10
0.30
0.14
0.12
0.32
0.31
0.39
0.33
0.01
0.045
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
EIAJ
SOT97-1
050G01
MO-001
SC-504-8
2002 Aug 23
18
EUROPEAN
PROJECTION
ISSUE DATE
95-02-04
99-12-27
Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
TEA1533P; TEA1533AP
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
SOLDERING
Introduction to soldering through-hole mount
packages
This text gives a brief insight to wave, dip and manual
soldering. A more in-depth account of soldering ICs can be
found in our “Data Handbook IC26; Integrated Circuit
Packages” (document order number 9398 652 90011).
Manual soldering
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.
The total contact time of successive solder waves must not
exceed 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods
SOLDERING METHOD
PACKAGE
DIPPING
DBS, DIP, HDIP, SDIP, SIL
WAVE
suitable(1)
suitable
Note
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
2002 Aug 23
19
Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
TEA1533P; TEA1533AP
DATA SHEET STATUS
DATA SHEET STATUS(1)
PRODUCT
STATUS(2)
DEFINITIONS
Objective data
Development
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Preliminary data
Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
DEFINITIONS
DISCLAIMERS
Short-form specification  The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes  Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2002 Aug 23
20
Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
TEA1533P; TEA1533AP
NOTES
2002 Aug 23
21
Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
TEA1533P; TEA1533AP
NOTES
2002 Aug 23
22
Philips Semiconductors
Product specification
GreenChipTMII SMPS control IC
TEA1533P; TEA1533AP
NOTES
2002 Aug 23
23
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: [email protected].
SCA74
© Koninklijke Philips Electronics N.V. 2002
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613502/02/pp24
Date of release: 2002
Aug 23
Document order number:
9397 750 10261