MICROSEMI 1N3064

FEATURES
1N3064
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•
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1N3064 AVAILABLE IN JAN, JANTX, AND JANTXV PER MIL-PRF-19500/144
SWITCHING DIODE
METALLURGICALLY BONDED
HERMETICALLY SEALED
DOUBLE PLUG CONSTRUCTION
MAXIMUM RATINGS AT 25 °C
Operating Temperature:
Storage Temperature:
Surge Current, Sine, 1uS:
Total Power Dissipation:
Operating Current:
-55°C to +175°C
-55°C to +175°C
2.0A
500mW
75mA, TA= +25°C
Derating Factor:
0.5mA/°C above TA= +25°C
D.C. Reverse Voltage (VRWM):
50V
DC ELECTRICAL CHARACTERISTICS
VF
DESIGN DATA
Case: Hermetically sealed glass package per MILPRF-19500/144 DO-7 outline
Lead Material: Copper clad steel
Lead Finish: Tin/Lead
Thermal Resistance (RθJL): 250°C/W maximum
at L=.375”
Thermal Impedance (ZθJX): 70°C/W maximum
Marking: Alpha numeric.
Polarity: Cathode end is banded.
Ambient
(°C)
IF
mA
25
150
10
10
IR
Min Max Ambient
V
V
(°C)
-
1.0
0.7
25
150
VBR
V (dc)
50
50
Min Max Ambient
µA
µA
(°C)
-
0.1
100
AC ELECTRICAL CHARACTERISTICS AT 25°C
Symbol
Capacitance @ 0V
TRR @ IF =IR=10mA,
IRec = 1mA.
TFR @ IF = 100mA
VFR @ IF = 100mA
pF
Min
-
Max
2.0
nsec
-
4.0
nsec
-
30
5
V(pk)
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25
-55
IR
µA
Min Max
V
V
5
10
75
75
-