CYPRESS CY2037AWAF

CY2037
High - Accuracy EPROM Programmable
PLL Die for Crystal Oscillators
Features
Benefits
• EPROM-programmable die for in-package programming of
crystal oscillators
• High resolution PLL with 12-bit multiplier and 10-bit divider
• EPROM-programmable capacitor tuning array with Shadow
register
• Twice programmable die (CY2037A, CY2037B[1] and
CY2037-2).
• Simple 4-wire programming interface
• On-chip oscillator runs from 10–30 MHz fundamental tuned
crystal
• EPROM-selectable TTL or CMOS duty cycle levels
• Operating frequency
— 1–133 MHz at 5V
— 1–100 MHz at 3.3V
•
•
•
•
•
— 1–66.6 MHz at 2.7V
Sixteen selectable post-divide options, using either PLL or
reference oscillator output
Programmable power down (PD#) or OE pin (CY2037A,
CY2037B, and CY2037-2)
Frequency Select (CY2037-3)
Programmable asynchronous or synchronous OE and
power down (PD#) modes (CY2037A, CY2037B and
CY2037-2)
Low Jitter outputs typically
— < ± 100 ps (pk-pk) at 5V and f>33 MHz
— < ± 125 ps (pk-pk) at 3.3V and f>33 MHz
• 3.3V or 5V operation
• Small Die
• Controlled rise and fall times and output slew rate
• Enables quick turnaround of custom oscillators
• Lowers inventory costs through stocking of blank parts
• Enables synthesis of highly accurate and stable output clock
frequencies with zero or low PPM
• Enables fine-tuning of output clock frequency by adjusting
CLoad of the crystal
• Enables reprogramming of programmed part, to correct
errors, and control excess inventory
• Enables programming of output frequency after packaging
• Lowers cost of oscillator as PLL can be programmed to a
high frequency using a low-frequency, low-cost crystal
• Duty cycle centered at 1.4V or VDD/2
• Provides flexibility to service most TTL or CMOS applications
• Services most PC, networking, and consumer applications
• Provides flexibility in output configurations and testing
• Enables low-power operation or output enable function
• Enables two frequency options for meeting different industry
standards, i.e., PAL/NTSC
• Provides flexibility for system applications, through
selectable instantaneous or synchronous change in outputs
• Suitable for most PC, consumer, and networking applications
• Lowers inventory cost as same die services both applications
• Enables encapsulation in small-size, surface mount
packages
• Has lower EMI than oscillators
Table 1. Device Functionality: Output Frequencies
Parameter
Fo
Description
Output frequency
Condition
Min.
Max.
Unit
VDD = 4.5V–5.5V
1
133
MHz
VDD = 3.0V–3.6V
1
100
MHz
VDD = 2.7V–3.0V
1
66
MHz
Note
1. The CY2037A and CY2037B are identical. However, the CY2037B is recommended for all new designs
Cypress Semiconductor Corporation
Document #: 38-07354 Rev. *D
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised February 26, 2007
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CY2037
Logic Block Diagram
PD#/OE
or FS
XG
HIGH
ACCURACY
PLL
CRYSTAL
XD
CONFIGURATION
EPROM
OSCILLATOR
MUX
CLKOUT
/ 1, 2, 4, 8, 16, 32, 64, 128
Die Pad Description
H o r iz o n ta l s c r ib e
VDD
CLKO UT
N /C
VDD
XX
V e r tic a l s c r ib e
XD
Y
N /C
XR
XG
D e v ic e N a m e
VSS
P D # /O E o r F S
VSS
X
Note:
Active Die Size: X = 55.9 mils / 1420.1 μm
Scribe: X (horizontal)= 2.6 mils / 65.6 μm
Y (vertical)= 3.0 mils / 76.9 μm
Bond pad opening: 85 μm x 85 μm
Pad pitch: 125 μm x 125 μm
(Pad center to pad center)
Die Pad Summary
Die
Pad
Name
Description
VDD
1,2
Voltage supply
VSS
8,9
Ground
XD
4
Crystal connection.
[2]
X Coordinate
(μm)
Y Coordinate
(μm)
124.7
855.6 , 731
1291.35
99.6 , 225.2
124.7
481.8
XX
3
No Connect
124.7
606.4
XG
6
Crystal connection.
124.7
232.6
PD#/OE
or FS
7
CY2037A, CY2037B, and CY2037-2—EPROM programmable power
down or output enable pad. CY2037-3—Frequency Select.
Serves as VPP in programming mode for all devices.
124.7
108
CLKOUT
11
Clock output. Also serves as three-state input during programming.
1282.45
901.8
N/C
5,10
No Connect. (Do not bond to these pads)
124.7,1282.45
357.2, 769.4
Note
2. For Customers not bonding the XD or XG pad to external pins, an alternative bonding option would be shorting the Xx pad to the XD pad
Document #: 38-07354 Rev. *D
Page 2 of 10
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CY2037
Functional Description
The CY2037 is an EPROM programmable, high accuracy,
PLL-based die designed for the crystal oscillator market. The
die attaches directly to a low-cost 10–30 MHz crystal and can
be packaged into 4-pin through-hole or surface mount
packages. The oscillator devices can be stocked as blank
parts and custom frequencies programmed in-package at the
last stage before shipping. This enables fast-turn manufacture
of custom and standard crystal oscillators without the need for
dedicated, expensive crystals.
The CY2037 contains an on-chip oscillator and a unique oscillator tuning circuit for fine-tuning of the output frequency. The
crystal Cload can be selectively adjusted by programming a set
of seven EPROM bits. This feature can be used to
compensate for crystal variations or to obtain a more accurate
synthesized frequency.
The CY2037 uses EPROM programming with a simple 2-wire,
4-pin interface that includes VSS and VDD. Clock outputs can
be generated up to 133 MHz at 5V or up to 100 MHz at 3.3V.
The entire configuration can be reprogrammed one time,
allowing programmed inventory to be altered or reused.
The CY2037 PLL die has been designed for very high
resolution. It has a 12-bit feedback counter multiplier and a
10-bit reference counter divider. This enables the synthesis of
highly accurate and stable output clock frequencies with zero
or low PPM error. The clock can be further modified by eight
output divider options of 1, 2, 4, 8, 16, 32, 64, and 128. The
divider input can be selected as either the PLL or crystal oscillator output providing a total of sixteen separate output
options. For further flexibility, the ouput is selectable between
TTL and CMOS duty cycle levels.
The CY2037A, CY2037B and CY2037-2 also contain flexible
power management controls. These parts include both power
down (PD#) and OE features with integrated pull-up resistors.
The PD# and OE modes have an additional setting to
determine timing (asynchronous or synchronous) with respect
to the output signal. When PD# or OE modes are enabled,
CLKOUT is pulled low by a weak pull down. The weak pull
down is easily overdriven by another active CLKOUT for applications that require multiple CLKOUTs on a single signal path.
Controlled rise and fall times, unique output driver circuits, and
innovative circuit layout techniques enable the CY2037 to
have low jitter and accurate outputs, making it suitable for most
PC, networking, and consumer applications.
On the other hand, the CY2037-3 contains a frequency select
function in place of the power down and output enable modes.
For example, consumer products often require frequency
compatibility with different electrical standards around the
world. With this frequency select feature, a product that incorporates the CY2037-3 could be compatible with both NTSC for
North American and PAL for Europe simply by changing the
FS line. The twice programmable feature is also absent in the
Document #: 38-07354 Rev. *D
CY2037-3, because the second EPROM row is now being
used for the alternate frequency.
EPROM Configuration Block
Table 2 summarizes the features that are configurable by
EPROM. Please refer to the “7C8038x/7C8034X
Programming Specification” for further details. The specification can be obtained from your Cypress factory representative.
.
Table 2. EPROM Adjustable Features
Adjust
Frequency
Feedback counter value (P)
Reference counter value (Q)
Output divider selection
Oscillator Tuning (load capacitance values)
Duty cycle levels (TTL or CMOS)
Power management mode (OE or PD#)
Power management timing (synchronous or asynchronous)
PLL Output Frequency
The CY2037 contains a high-resolution PLL with 12-bit multiplier and 10-bit divider.The output frequency of the PLL is
determined by the following formula:
2 • (P + 5)
F PLL = --------------------------- • F REF
(Q + 2)
where P is the feedback counter value and Q is the reference
counter value. P and Q are EPROM programmable values.
Power Management Features (except
CY2037-3)
The CY2037 contains EPROM-programmable PD# and OE
functions. If Powerdown is selected, all active circuitry on the
chip is shut down when the control pin goes low. The oscillator
and PLL circuits must re-lock when the part leaves
Powerdown Mode. If Output Enable mode is selected, the
output is tri-stated and weakly pulled low when the Control pin
goes low. In this mode the oscillator and PLL circuits continue
to operate, allowing a rapid return to normal operation when
the Control input is deasserted.
In addition, the PD# and OE modes can be programmed to
occur synchronously or asynchronously with respect to the
output signal. When the asynchronous setting is used, the
power down or output disable occurs immediately (allowing for
logic delays) regardless of position in the clock cycle.
However, when the synchronous setting is used, the part waits
for a falling edge at the output before the power down or output
enable signal is initiated, thus preventing output glitches. In
either asynchronous or synchronous setting, the output is
always enabled synchronously by waiting for the next falling
edge of the output.
Page 3 of 10
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CY2037
Crystal Oscillator Tuning Circuit
The CY2037 contains a unique tuning circuit to fine-tune the
output frequency of the device. The tuning circuit consists of
an array of eleven load capacitors on both sides of the oscillator drive inverter. The capacitor load values are EPROM
programmable and can be increased in small increments. As
the capacitor load is increased the circuit is fine-tuned to a
lower frequency. The capacitor load values vary from 0.17 pF
to 8 pF for a 100:1 total control ratio. The tuning increments
are shown in the table below. Please refer to the
“7C8038x/7C8034x Programming Specification” for further
details.
Figure 1. Crystal Oscillator Tuning Circuit
Rf
External Crystal
CD6
C6
C5
C4
C3
C2
C1
CD5
CD4
CD3
CD2
CD1
CD0
C0
Cgo Cdo
C7
C8
C9
C10
CD3 CD4 CD5 CD6
CD = EPROM BIT
T = TRANSISTOR
C = LOAD CAPACITOR
Table 3. Crystal Oscillator Parameter Table.
Parameter
Rf
Description
Feedback resistor, VDD = 4.5–5.5V
Feedback resistor, VDD = 2.7–3.6V
Min.
Typ.
Max.
Unit
0.5
1.0
2
4
3.5
9.0
MΩ
MΩ
Capacitors have ± 20% Tolerance
Cg
Gate capacitor
Cd
Drain Capacitor
C0
Series Cap
C1
Series Cap
0.52
pF
C2
Series Cap
1.00
pF
C3
Series Cap
0.7
pF
C4
Series Cap
1.4
pF
C5
Series Cap
2.6
pF
C6
Series Cap
5.0
pF
C7
Series Cap
0.45
pF
C8
Series Cap
0.85
pF
C9
Series Cap
1.7
pF
C10
Series Cap
3.3
pF
Document #: 38-07354 Rev. *D
13
pF
9
pF
0.27
pF
Page 4 of 10
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CY2037
Difference Between CY2037A/CY2037B and
CY2037-2
Some production flows do not require the use of the shadow
register. If this is the case, then the CY2037-2 is the device of
choice. The CY2037-2 has a disabled shadow register.
The CY2037A/CY2037B contains a shadow register in
addition to the EPROM register. The shadow register is an
exact copy of the EPROM register and is the default register
when the Valid bit is not set. It is useful when the prototype or
production environment calls for measuring and adjusting the
CLKOUT frequency numerous times. Multiple adjustments
can be performed with the shadow register. Once the desired
frequency is achieved the EPROM register is permanently
programmed.
The CY2037-3 contains the shadow register.
Frequency Select Feature of CY2037-3
The CY2037-3 contains a frequency select function in place of
the powerdown and the output enable functions. With the
frequency select feature, customers can switch two different
frequencies that are configured in the two EPROM rows. The
definition of the Frequency Select pin (FS) is Table 4.
Table 4. Frequency Select Pin Decoding for CY2037-3
FS Pin
Output Frequency
0
From EPROM Row 0 Configuration
1
From EPROM Row 1 Configuration
.
Document #: 38-07354 Rev. *D
Page 5 of 10
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CY2037
Absolute Maximum Ratings[3]
Storage Temperature (Non-Condensing).... 55°C to +150°C
Supply Voltage ..................................................–0.5 to +7.0V
Input Voltage .............................................. –0.5V to VDD+0.5
Junction Temperature ................................. –40°C to +100°C
Static Discharge Voltage........................................... > 2000V
(per MIL-STD-883, Method 3015)
Operating Conditions
Parameter
Min.
Max.
Unit
VDD
Supply Voltage (3.3V)
Supply Voltage (5.0V)
Description
2.7
4.5
3.6
5.5
V
V
TAJ [4]
Operating Temperature, Junction
–10
+100
°C
CTTL
Max. Capacitive Load on outputs for TTL levels
VDD = 4.5–5.5V, Output frequency = 1–40 MHz
VDD = 4.5–5.5V, Output frequency = 40–133 MHz
50
25
pF
pF
CCMOS
Max. Capacitive Load on outputs for CMOS levels
VDD = 4.5–5.5V, Output frequency = 1–66.6MHz
VDD = 4.5–5.5V, Output frequency = 66.6–133MHz
VDD = 3.0–3.6V, Output frequency = 1–40 MHz
VDD = 3.0–3.6V, Output frequency = 40–100 MHz
VDD = 2.7–3.0V, Output frequency = 1–66 MHz
50
25
30
15
15
pF
pF
pF
pF
pF
XREF
Reference Frequency, input crystal. Fundamental tuned crystals only.
10
30
MHz
tPU
Power-up time for all VDDs to reach minimum specified voltage (power ramps
must be monotonic)
0.05
50
ms
Electrical Characteristics Over the Operating Range (Part was characterized in a 20-pin SOIC package with external
crystal, Electrical Characteristics may change with other package types.)
Parameter
Description
Test Conditions
Min.
Typ.
Max.
Unit
0.8
0.2VDD
V
V
VIL
Low-level Input Voltage
VDD = 4.5V–5.5V
VDD = 2.7V–3.6V
VIH
High-level Input Voltage
VDD = 4.5V–5.5V
VDD = 2.7V–3.6V
VOL
Low-level Output Voltage
VDD = 4.5V–5.5V, IOL= 16 mA
VDD = 2.7V–3.6V, IOL= 8 mA
VOHCMOS
High-level Output Voltage,
CMOS levels
VDD = 4.5V–5.5V, IOH = –16 mA
VDD = 2.7V–3.6V, IOH = –8 mA
VDD – 0.4
VDD – 0.4
V
V
VOHTTL
High-level Output Voltage,
TTL levels
VDD = 4.5V–5.5V, IOH = –8 mA
2.4
V
V
V
2.0
0.7VDD
0.4
0.4
V
V
IIL
Input Low Current
VIN = 0V
10
μA
IIH
Input High Current
VIN = VDD
5
μA
IDD
Power Supply Current,
Unloaded
VDD = 4.5V–5.5V, Output frequency <= 133MHz
VDD = 2.7V–3.6V, Output frequency <= 100 MHz
45
25
mA
mA
IDDS[5]
Stand-by current
VDD = 2.7V–3.6V
10
50
μA
RUP
Input Pull-up Resistor
VDD = 4.5V–5.5V, VIN = 0V
VDD = 4.5V–5.5V, VIN = 0.7VDD
3.0
100
8.0
200
MΩ
kΩ
IOE_CLKOUT CLKOUT Pull-down current VDD = 5.0
1.1
50
20
μA
Notes
3. Stresses greater than listed may impair the life of the device.
4. This product is sold in die form so operating conditions are specified for the die, or junction temperature
5. If external reference is used, it is required to stop the reference (set reference to LOW) during power down
Document #: 38-07354 Rev. *D
Page 6 of 10
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CY2037
Output Clock Switching Characteristics Over the Operating Range[6]
Parameter
Description
Test Conditions
Min.
Typ.
Max.
Unit
t1w
Output Duty Cycle at
1.4V, VDD = 4.5–5.5V
t1w = t1A ÷ t1B
1–40 MHz, CL <=50 pF
40–66 MHz, CL <=15 pF
66–125 MHz, CL <=25 pF
125–133 MHz, CL <=15 pF
45
45
40
40
55
55
60
60
%
%
%
%
t1x
Output Duty Cycle at
VDD/2, VDD = 4.5–5.5V
t1x = t1A ÷ t1B
1–66.6 MHz, CL <=25 pF
66.6–125 MHz, CL <=25 pF
125–133 MHz, CL <=15 pF
45
40
40
55
60
60
%
%
%
t1y
Output Duty Cycle at
VDD/2, VDD = 3.0–3.6
t1y = t1A ÷ t1B
1–40 MHz, CL <=30 pF
40–100 MHz, CL <=15 pF
45
40
55
60
%
%
t1z
Output Duty Cycle at
VDD/2, VDD = 2.7–3.0
t1y = t1A ÷ t1B
1–40 MHz, CL <=15 pF
40–66.6 MHz, CL <=10 pF
40
40
60
60
%
%
t2
Output Clock Rise Time Between 0.8V–2.0V, VDD = 4.5V–5.5V, CL = 50 pF
Between 0.8V–2.0V, VDD = 4.5V–5.5V, CL = 25 pF
Between 0.8V–2.0V, VDD = 4.5V–5.5V, CL = 15 pF
Between 0.2VDD–0.8VDD, VDD = 4.5V–5.5V, CL = 50 pF
Between 0.2VDD–0.8VDD, VDD = 3.0V–3.6V, CL = 30 pF
Between 0.2VDD–0.8VDD, VDD = 2.7V–3.6V, CL = 15 pF
1.8
1.2
0.9
3.4
4.0
2.4
ns
ns
ns
ns
ns
ns
t3
Output Clock Fall Time
Between 0.8V–2.0V, VDD = 4.5V–5.5V, CL = 50 pF
Between 0.8V–2.0V, VDD = 4.5V–5.5V, CL = 25 pF
Between 0.8V–2.0V, VDD = 4.5V–5.5V, CL = 15 pF
Between 0.2VDD– 0.8VDD, VDD = 4.5V-5.5V, CL = 50 pF
Between 0.2VDD– 0.8VDD, VDD = 3.0V–3.6V, CL = 30 pF
Between 0.2VDD– 0.8VDD, VDD = 2.7V–3.6V, CL = 15 pF
1.8
1.2
0.9
3.4
4.0
2.4
ns
ns
ns
ns
ns
ns
t4
Start-up Time Out of
Power D own
PD# pin LOW to HIGH[7]
1
2
ms
t5a
Power Down Delay Time PD# pin LOW to output LOW
(synchronous setting)
(T = period of Output clk)
T/2
T+10
ns
t5b
Power Down Delay Time PD# pin LOW to output LOW
(asynchronous setting)
10
15
ns
t6
Power Up Time
From power on[7]
1
2
ms
t7a
Output Disable Time
(synchronous setting)
OE pin LOW to output Hi-Z
(T = period of output clk)
T/2
T+10
ns
t7b
Output Disable Time
(asynchronous setting)
OE pin LOW to output Hi-Z
10
15
ns
t8
Output Enable Time
(always synchronous
enable)
OE pin LOW to HIGH
(T = period of output clk)
T
1.5T+2
5
ns
t9
Peak-to-Peak Period
Jitter
VDD = 4.5V–5.5V, Fo > 33 MHz, VCO > 100 MHz
VDD = 2.7V–3.6V, Fo > 33 MHz, VCO > 100 MHz
VDD = 2.7V–5.5V, Fo < 33 MHz
±100
±125
±250
±125
±200
1% of
FO
ps
ps
ps
Notes
6. Not all parameters measured in production testing.
7. Oscillator start time cannot be guaranteed for all crystal types. This specification is for operation with AT cut crystals with ESR < 70 ohms.
Document #: 38-07354 Rev. *D
Page 7 of 10
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CY2037
Switching Waveforms
Figure 2. Duty Cycle Timing (t1w, t1x, t1y, t1z)
t1A
OUTPUT
t1B
Figure 3. Output Rise/Fall Time
VDD
OUTPUT
0V
t2
t3
Figure 4. Power Down Timing (synchronous and asynchronous modes)
POWER
DOWN
VDD
VIH
VIL
0V
t4
CLKOUT
(synchronous[8])
T
t5a
1/f
CLKOUT
(asynchronous[9])
t5b
1/f
Figure 5. Power-up Timing
VDD
POWER
UP
0V
VDD – 10%
t6
min. 30 μs
max. 30 ms
CLKOUT
1/f
Notes
8. In synchronous mode the power down or output tri-state is not initiated until the next falling edge of the output clock.
9. In asynchronous mode the power down or output tri-state occurs within 25 ns regardless of position in the ouput clock cycle.
Document #: 38-07354 Rev. *D
Page 8 of 10
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CY2037
]
Ordering Information[10]
Ordering Code
Type
Wafer Thickness
Operating Range
CY2037AWAF[11]
Wafer
14 ± 0.5 mils
–10°C to +100°C
[11]
Wafer
14 ± 0.5 mils
–10°C to +100°C
CY2037-3WAF[11]
Wafer
14 ± 0.5 mils
–10°C to +100°C
CY2037BWAF
Wafer
14 ± 0.5 mils
–10°C to +100°C
CY2037B-11WAF
Wafer
11 ± 0.5 mils
–10°C to +100°C
CY2037-2WAF
Note
10. The only difference between the CY2037A/CY2037B and the CY2037-2 is that the CY2037-2 has the shadow register disabled. The CY2037-3 replaces the
power-down options with a Frequency Select, and contains the shadow register.
11. The CY2037B is recommended for all new designs
Document #: 38-07354 Rev. *D
Page 9 of 10
© Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
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CY2037
Document History Page
Document Title: CY2037 High-Accuracy EPROM Programmable PLL Die for Crystal Oscillators
Document Number: 38-07354
REV.
ECN NO.
Issue Date
Orig. of
Change
Description of Change
**
112248
03/01/02
DSG
Change from Spec number: 38-00679 to 38-07354
*A
121857
12/14/02
RBI
Power-up requirements added to Operating Conditions Information
*B
291092
See ECN
RGL
Updated Min. Operating Temperature, Junction
*C
522769
See ECN
RGL
Added CY2037B information. Updated absolute maximum Junction temperature specification. Updated Ordering information table.
Added Die Pad description and coordinates
*D
804376
See ECN
RGL
Minor Change: To post on web
Document #: 38-07354 Rev. *D
Page 10 of 10
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