CM1293 2, 4, and 8-Channel Low Capacitance ESD Protection Arrays Features Product Description • • The CM1293 family of diode arrays has been designed to provide ESD protection for electronic components or sub-systems requiring minimal capacitive loading. These devices are ideal for protecting systems with high data and clock rates or for circuits requiring low capacitive loading. Each ESD channel consists of a pair of diodes in series which steer the positive or negative ESD current pulse to either the positive (VP) or negative (VN) supply rail. A Zener diode is embedded between VP and VN, offering two advantages. First, it protects the VCC rail against ESD strikes, and second, it eliminates the need for a bypass capacitor that would otherwise be needed for absorbing positive ESD strikes to ground. The CM1293 will protect against ESD pulses up to (±15kV air, ±8kV contact discharge) per the IEC 61000-4-2 Level 4 standard. • • • • • • • 2, 4, and 8 channels of ESD protection Provides ESD protection to IEC61000-4-2 - 8kV contact discharge - 15kV air discharge Low loading capacitance of 2.0pF max. Low clamping voltage Channel I/O to I/O capacitance 1.5pF typical Zener diode protects supply rail and eliminates the need for external by-pass capacitors Each I/O pin can withstand over 1000 ESD strikes Available in SOT, and MSOP packages Lead-free version available Applications • • • • DVI ports, HDMI ports in notebooks, set top boxes, digital TVs, LCD displays Serial ATA ports in desktop PCs and hard disk drives PCI Express ports General purpose high-speed data line ESD protection This device is particularly well-suited for protecting systems using high-speed ports such as USB2.0, IEEE1394 (Firewire®, iLink™), Serial ATA, DVI, HDMI and corresponding ports in removable storage, digital camcorders, DVD-RW drives and other applications where extremely low loading capacitance with ESD protection are required in a small package footprint. The CM1293 family of devices is available with optional lead-free finishing. Electrical Schematics VP CH1 CH4 VP CH3 CH8 CH1 VN CH2 CH1 CH7 CH6 VP CH5 CH2 VN CM1293-02ST/SO CM1293--02SR CH2 VN CH3 CH4 CM1293-08MS/MR CM1293-04ST/SO CM1293-04MS/MR © 2006 California Micro Devices Corp. All rights reserved. 01/26/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 1 CM1293 PACKAGE / PINOUT DIAGRAMS VN VP 4 1 3 CH1 4-Lead SOT143-4 VP 4 CH1 1 10 CH8 CH2 2 9 CH7 CH3 3 8 VP CH4 4 VN 5 CH2 5-Lead SOT23-5 CH1 1 CH2 3 5 VP 4 CH3 1 10 NC 2 9 CH4 VP 3 8 VN CH2 4 7 NC NC 5 6 CH3 6-Lead SOT23-6 CH6 6 CH5 NC CH1 D040 / D041 2 D034 / D035 VN CH4 6 7 10-Lead MSOP-10 Top View Top View D038 / D039 CH2 5 D032 / D033 2 VN 3 2 1 NC D036 CH1 Top View Top View Top View 10-Lead MSOP-10 Note: These drawings are not to scale. PIN DESCRIPTIONS 4-CHANNEL, 10-LEAD MSOP-10 PACKAGE 2-CHANNEL, 4-LEAD SOT143-4 PACKAGE PIN NAME TYPE PIN NAME TYPE PIN 1 CH1 I/O 1 VN GND 1 2 NC 2 CH1 I/O 2 3 VP PWR 3 CH2 I/O 3 4 CH2 I/O 4 VP PWR 4 5 NC PIN NAME 1 NC 2 VN GND 3 CH1 I/O 4 CH2 I/O 5 VP PWR 2-CHANNEL, 5-LEAD SOT23-5 PACKAGE TYPE NAME TYPE 1 CH1 I/O 2 VN GND 3 CH2 I/O 4 CH3 I/O 5 VP PWR 6 CH4 I/O 5 VP PWR 6 CH4 I/O ESD Channel No connect Positive voltage supply rail ESD Channel No connect 6 CH3 DESCRIPTION 7 NC No connect I/O ESD Channel No connect 8 VN GND Negative voltage supply rail 9 CH4 I/O ESD Channel 10 NC PIN NAME TYPE 1 CH1 I/O ESD Channel DESCRIPTION 2 CH2 I/O ESD Channel ESD Channel 3 CH3 I/O ESD Channel Negative voltage supply rail 4 CH4 I/O ESD Channel 5 VN PWR Negative voltage supply rail ESD Channel No connect ESD Channel 8-CHANNEL, 10-LEAD MSOP-10 PACKAGE Positive voltage supply rail 4-CHANNEL, 6-LEAD SOT23-6 PACKAGE PIN DESCRIPTION ESD Channel 6 CH5 I/O Positive voltage supply rail 7 CH6 I/O ESD Channel 8 VN GND DESCRIPTION ESD Channel Positive voltage supply rail ESD Channel ESD Channel Negative voltage supply rail Positive voltage supply rail 9 CH7 I/O ESD Channel ESD Channel 10 CH8 I/O ESD Channel © 2006 California Micro Devices Corp. All rights reserved. 2 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 01/26/06 CM1293 Ordering Information PART NUMBERING INFORMATION Standard Finish Ordering Part Number1 Lead-free Finish Ordering Part Number1 Part Marking CM1293-02SR D036 # of Channels Leads Package 2 4 SOT143-4 2 5 SOT23-5 CM1293-02ST D032 CM1293-02SO D033 4 6 SOT23-6 CM1293-04ST D034 CM1293-04SO D035 4 10 MSOP-10 CM1293-04MS D040 CM1293-04MR D041 8 10 MSOP-10 CM1293-08MS D038 CM1293-08MR D039 Part Marking Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS 6.0 V -40 to +85 °C -65 to +150 °C (VN - 0.5) to (VP + 0.5) V Operating Supply Voltage (VP - VN) Operating Temperature Range Storage Temperature Range DC Voltage at any channel input STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range Package Power Rating SOT143-4 Package (CM1293-02SR) SOT23-5 Package (CM1293-02ST/SO) SOT23-6 Package (CM1293-04ST/SO) MSOP-10 Package (CM1293-04MS/MR) MSOP-10 Package (CM1293-08MS/MR) RATING UNITS -40 to +85 °C 225 225 225 400 400 mW mW mW mW mW © 2006 California Micro Devices Corp. All rights reserved. 01/26/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 3 CM1293 Specifications (cont’d) ELECTRICAL OPERATING CHARACTERISTICS1 SYMBOL PARAMETER CONDITIONS MIN VP Operating Supply Voltage (VP-VN) IP Operating Supply Current (VP-VN)=3.3V VF Diode Forward Voltage Top Diode Bottom Diode IF = 8mA; TA=25°C Channel Leakage Current TA=25°C; VP=5V, VN=0V Channel Input Capacitance At 1 MHz, VP=3.3V, VN=0V, VIN=1.65V; Note 2 ILEAK CIN ΔCIO Channel I/O to I/O capacitance VESD ESD Protection Peak Discharge Voltage at any channel input, in system a) Contact discharge per IEC 61000-4-2 standard b) Human Body Model, MIL-STD-883, Method 3015 0.60 0.60 MAX UNITS 3.3 5.5 V 8.0 μA 0.80 0.80 0.95 0.95 V V ±0.1 ±1.0 μA 2.0 pF 1.5 pF Notes 2, 4 & 5; TA=25°C ±8 kV Notes 2, 3 & 5; TA=25°C ±15 kV VCL Channel Clamp Voltage Positive Transients Negative Transients At 8kV ESD HBM; TA=25°C; Notes 2 & 3 RDYN Dynamic Resistance Positive Transients Negative Transients TA=25°C; Notes 5 & 6 Note 1: Note 2: Note 3: Note 4: Note 5: Note 6: TYP +9.0 -9.0 V V 1.2 0.6 Ω Ω All parameters specified at TA = -40°C to +85°C unless otherwise noted. These parameters guaranteed by design and characterization. Human Body Model per MIL-STD-883, Method 3015, CDischarge = 100pF, RDischarge = 1.5KΩ, VP = 3.3V, VN grounded. Standard IEC 61000-4-2 with CDischarge = 150pF, RDischarge = 330Ω, VP = 3.3V, VN grounded. These measurements performed with no external capacitor on VP. Measured under pulsed conditions, pulse width = 0.7mS, maximum current = 1.5A. © 2006 California Micro Devices Corp. All rights reserved. 4 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 01/26/06 CM1293 Performance Information (Cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 1. Insertion Loss (S21) VS. Frequency (0V DC Bias, VP=3.3V) Figure 2. Insertion Loss (S21) VS. Frequency (2.5V DC Bias, VP=3.3V) © 2006 California Micro Devices Corp. All rights reserved. 01/26/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 5 CM1293 Application Information Design Considerations In order to realize the maximum protection against ESD pulses, care must be taken in the PCB layout to minimize parasitic series inductances on the Supply/ Ground rails as well as the signal trace segment between the signal input (typically a connector) and the ESD protection device. Refer to Figure 3, which illustrates an example of a positive ESD pulse striking an input channel. The parasitic series inductance back to the power supply is represented by L1 and L2. The voltage VCL on the line being protected is: inductance L2 on VCL by clamping VP at the breakdown voltage of the Zener diode. However, for the lowest possible VCL, especially when VP is biased at a voltage significantly below the Zener breakdown voltage, it is recommended that a 0.22μF ceramic chip capacitor be connected between VP and the ground plane. As a general rule, the ESD Protection Array should be located as close as possible to the point of entry of expected electrostatic discharges. The power supply bypass capacitor mentioned above should be as close to the VP pin of the Protection Array as possible, with minimum PCB trace lengths to the power supply, ground planes and between the signal input and the ESD device to minimize stray series inductance. VCL = Fwd voltage drop of D1 + VSUPPLY + L1 x d(IESD) / dt + L2 x d(IESD) / dt where IESD is the ESD current pulse, and VSUPPLY is the positive supply voltage. An ESD current pulse can rise from zero to its peak value in a very short time. As an example, a level 4 contact discharge per the IEC61000-4-2 standard results in a current pulse that rises from zero to 30 Amps in 1ns. Here d(IESD)/dt can be approximated by Additional Information See also California Micro Devices Application Note AP209, “Design Considerations for ESD Protection”, in the Applications section at www.calmicro.com. ΔIESD/Δt, or 30/(1x10-9). So just 10nH of series inductance (L1 and L2 combined) will lead to a 300V increment in VCL! Similarly for negative ESD pulses, parasitic series inductance from the VN pin to the ground rail will lead to drastically increased negative voltage on the line being protected. The CM1293 has an integrated Zener diode between VP and VN. This greatly reduces the effect of supply rail L2 VP POSITIVE SUPPLY RAIL VCC PATH OF ESD CURRENT PULSE IESD 0.22μF L1 D1 ONE CHANNEL LINE BEING PROTECTED SYSTEM OR CIRCUITRY BEING PROTECTED CHANNEL INPUT D2 OF 25A CM1213 VCL 0A GROUND RAIL VN CHASSIS GROUND Figure 3. Application of Positive ESD Pulse between Input Channel and Ground © 2006 California Micro Devices Corp. All rights reserved. 6 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 01/26/06 CM1293 Mechanical Details SOT143 Mechanical Specifications Dimensions for CM1293-02SR devices supplied in 4pin SOT143 packages are presented below. Mechanical Package Diagrams For complete information on the SOT143, see the California Micro Devices SOT143 Package Information document. TOP VIEW e 4 3 PACKAGE DIMENSIONS Package SOT143 Pins 4 Dimensions E1 E 1 Millimeters e1 Inches Min Max Min Max A 0.80 1.22 0.031 0.048 A1 0.05 0.15 0.002 0.006 b 0.30 0.50 0.012 0.019 b2 0.76 0.89 0.030 0.035 c 0.08 0.20 0.003 0.008 D 2.80 3.04 0.110 0.119 E 2.10 2.64 0.082 0.103 E1 1.20 1.40 0.047 0.055 e 1.92 BSC 0.075 BSC e1 0.20 BSC 0.008 BSC L 0.4 L1 0.6 0.54 REF # per tape and reel 0.016 2 SIDE VIEW D A b2 b A1 END VIEW 0.024 c 0.021 REF 3000 pieces L1 Controlling dimension: millimeters L Package Dimensions for SOT143. © 2006 California Micro Devices Corp. All rights reserved. 01/26/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 7 CM1293 Mechanical Details (cont’d) SOT23-5 Mechanical Specifications Dimensions for CM1293-02ST/SO devices packaged in 5-pin SOT23 packages are presented below. Mechanical Package Diagrams For complete information on the SOT23-5 package, see the California Micro Devices SOT23 Package Information document. TOP VIEW e1 e 5 4 E1 E PACKAGE DIMENSIONS Package SOT23-5 (JEDEC name is MO-178) Pins 5 Dimensions 1 Inches SIDE VIEW Max Min Max A -- 1.45 -- 0.0571 A1 0.00 0.15 0.0000 0.0059 b 0.30 0.50 0.0118 0.0197 c 0.08 0.22 0.0031 0.0087 D 2.75 3.05 0.1083 0.1201 E 2.60 3.00 0.1024 0.1181 E1 1.45 1.75 0.0571 0.0689 e 0.95 BSC 0.0374 BSC e1 1.90 BSC 0.0748 BSC 0.30 L1 # per tape and reel 0.60 0.60 REF 3 b Millimeters Min L 2 0.0118 D A A1 END VIEW 0.0236 c 0.0236 REF L1 L 3000 pieces Controlling dimension: millimeters © 2006 California Micro Devices Corp. All rights reserved. 8 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 01/26/06 CM1293 Mechanical Details (cont’d) SOT23-6 Mechanical Specifications CM1293-04ST/SO devices are packaged in 6-pin SOT23 packages. Dimensions are presented below. Mechanical Package Diagrams For complete information on the SOT23-6 package, see the California Micro Devices SOT23 Package Information document. TOP VIEW e1 6 PACKAGE DIMENSIONS SOT23-6 (JEDEC name is MO-178) Pins 6 Min Max Min Max -- 1.45 -- 0.0571 A1 0.00 0.15 0.0000 0.0059 b 0.30 0.50 0.0118 0.0197 c 0.08 0.22 0.0031 0.0087 D 2.75 3.05 0.1083 0.1201 E 2.60 3.00 0.1024 0.1181 E1 1.45 1.75 0.0571 0.0689 e 0.95 BSC 0.0374 BSC e1 1.90 BSC 0.0748 BSC 0.30 L1 0.60 0.60 REF # per tape and reel 0.0118 2 3 b Inches A L 4 E1 E 1 Millimeters 5 Pin 1 Marking Package Dimensions e SIDE VIEW D A A1 END VIEW 0.0236 0.0236 REF 3000 pieces c L1 L Controlling dimension: millimeters Package Dimensions for SOT23-6. © 2006 California Micro Devices Corp. All rights reserved. 01/26/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 9 CM1293 Mechanical Details (cont’d) MSOP-10 Mechanical Specifications CM1293-04MS/MR and CM1293-08MS/MR devices are packaged in 10-pin MSOP packages. Dimensions are presented below. Mechanical Package Diagrams TOP VIEW For complete information on the MSOP-10 package, see the California Micro Devices MSOP Package Information document. D 10 9 8 6 7 PACKAGE DIMENSIONS Package MSOP Pins 10 Dimensions Millimeters Max Min Max A 0.75 0.95 0.028 0.038 A1 0.05 0.15 0.002 0.006 B 0.18 0.40 0.006 0.016 0.18 2.90 3.10 0.114 0.122 E 2.90 3.10 0.114 0.122 0.50 BSC 0.0196 BSC H 4.76 5.00 0.187 0.197 L 0.40 0.70 0.0137 0.029 # per tape and reel 1 2 3 5 4 SIDE VIEW 0.007 D e Pin 1 Marking Inches Min C E H A A1 SEATING PLANE B e END VIEW 4000 C Controlling dimension: inches L Package Dimensions for MSOP-10 © 2006 California Micro Devices Corp. All rights reserved. 10 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 01/26/06