PRELIMINARY CM1230 2, 4 and 8-Channel Low Capacitance ESD Protection Array Features Product Description • • The CM1230 is a family of 2, 4 and 8 channel, very low capacitance ESD protection diode arrays in CSP form factor. This device is ideal for protecting systems with high data and clock rates or for circuits that require low capacitive loading. Each channel consists of a pair of ESD diodes that act as clamp diodes that steer positive or negative ESD current pulses to either the positive or negative supply rail. A zener diode is integrated into the array between the positive and negative supply rails. The VCC rail is thus protected from ESD strikes and eliminates the need for a bypass capacitor to absorb positive ESD strikes to ground. Each channel of the CM1230 can safely dissipate ESD strikes of ±8kV, meeting the Level 4 requirement of the IEC61000-4-2 international standard for contact discharges as well as ±15kV air discharges per the IEC61000-4-2 specification. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±15kV. • • • • • • • • • 2, 4 and 8 channels of ESD protection Provides ESD protection to IEC61000-4-2 Level 4 • ±8kV contact discharge • ±15kV air discharge Low loading capacitance of 0.8pF typical Minimal capacitance change with temperature and voltage Channel I/O to GND capacitance difference of 0.02pF typical is ideal for differential signals Channel I/O to I/O capacitance 0.15pF typical Zener diode protects supply rail and eliminates the need for external by-pass capacitors Each I/O pin can withstand over 1000 ESD strikes Available in 4, 6 and 10 bump Chip Scale Packages (CSP) OptiGuard™ coated for improved reliability at assembly Lead-free version available Applications • • • • • LCD and Camera data lines in wireless handsets that use high-speed serial interfaces. I/O port protection for mobile handsets, notebook computers, DSCs, MP3 players, PDAs, etc. including USB, 1394 and Serial ATA Wireless handsets Handheld PCs/PDAs LCD and camera modules This device is particularly well-suited for next generation wireless handsets that implement high-speed serial interface solutions for the LCD display and camera interfaces. In these wireless handset designs, a tolerance above 1.5pF cannot be tolerated due to the high data rates that are transferred between the baseband chipset and the LCD driver/controller ICs because a higher capacitive loading will cause the rise and fall times to slow which in turn hampers the functionality of circuit and operation of the wireless handset. The CM1230 incorporates OptiGuard™ which results in improved reliability at assembly. The CM1230 is available in a space-saving, low profile Chip Scale Package with optional lead-free finishing. Electrical Schematic VP CH4 VP CH3 CH8 CH1 VN CH2 CH1 CH7 CH6 VP CH5 CH2 CH1 VN CM1230-02CS/CP CM1230-04CS/CP CH2 VN CH3 CH4 CM1230-08CS/CP © 2006 California Micro Devices Corp. All rights reserved. 03/15/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 1 PRELIMINARY CM1230 PACKAGE / PINOUT DIAGRAMS BOTTOM VIEW (Bumps Up View) TOP VIEW (Bumps Down View) Orientation Marking 1 2 (see note 2) A1 A A1 B2 B1 Orientation Marking L CM1230-02 4-Bump CSP Package B Orientation Marking A2 1 2 3 (see note 2) A1 A A2 A1 B3 B2 B1 A5 A4 A3 A2 A1 B5 B4 B3 B2 B1 L30 B Orientation Marking Orientation Marking A3 CM1230-04 6-Bump CSP Package 1 2 3 4 5 (see note 2) A1 A L308 B Orientation Marking CM1230-08 10-Bump CSP Package Notes: 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. Ordering Information PART NUMBERING INFORMATION Lead-free Finish2 Standard Finish # of Channels Bumps Package Ordering Part Number1 Part Marking Ordering Part Number1 2 4 CSP-4 CM1230-02CS Part Marking L CM1230-02CP L 4 6 CSP-6 CM1230-04CS L30 CM1230-04CP L30 8 10 CSP-10 CM1230-08CS L308 CM1230-08CP L308 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. © 2006 California Micro Devices Corp. All rights reserved. 2 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 03/15/06 PRELIMINARY CM1230 Pin Descriptions PIN DESCRIPTIONS PIN DESCRIPTIONS (CONT’D) 2-CHANNEL, 4-BUMP CSP 8-CHANNEL, 10-BUMP CSP PIN NAME TYPE DESCRIPTION PIN NAME TYPE A1 VN GND Negative voltage supply rail A1 CH1 I/O ESD Channel B1 CH2 I/O ESD Channel B1 CH2 I/O ESD Channel A2 CH1 I/O ESD Channel A2 CH3 I/O ESD Channel B2 VP PWR Positive voltage supply rail B2 CH4 I/O ESD Channel A3 VP PWR Positive voltage supply rail DESCRIPTION B3 VN GND Negative voltage supply rail 4-CHANNEL, 6-BUMP CSP DESCRIPTION PIN NAME TYPE A1 CH1 I/O ESD Channel A4 CH5 I/O ESD Channel B1 CH2 I/O ESD Channel B4 CH6 I/O ESD Channel A2 VP PWR Positive voltage supply rail A5 CH7 I/O ESD Channel B2 VN GND Negative voltage supply rail B5 CH8 I/O ESD Channel A3 CH3 I/O ESD Channel B3 CH4 I/O ESD Channel © 2006 California Micro Devices Corp. All rights reserved. 03/15/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 3 PRELIMINARY CM1230 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS 6.0 V Operating Temperature Range -40 to +85 °C Storage Temperature Range -65 to +150 °C (VN - 0.5) to (VP + 0.5) V Operating Supply Voltage (VP - VN) DC Voltage at any channel input STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING UNITS -40 to +85 °C ELECTRICAL OPERATING CHARACTERISTICS(SEE NOTE 1) SYMBOL PARAMETER VP Operating Supply Voltage (VP-VN) CONDITIONS IP Operating Supply Current (VP-VN)=3.3V VF Diode Forward Voltage Top Diode Bottom Diode Channel Leakage Current IF = 8mA; TA=25°C ILEAK MIN 0.60 0.60 TA=25°C; VP=5V, VN=0V, VIN = 0V to 5V TYP 3.3 MAX 5.5 UNITS V 8.0 μA 0.80 0.80 ±0.1 0.95 0.95 ±1.0 V V μA 1.20 pF Channel Input Capacitance At 1 MHz, VP=3.3V, VN=0V, VIN=1.65V; Note 2 applies 0.8 Channel Input Capacitance Matching At 1 MHz, VP=3.3V, VN=0V, VIN=1.65V; Note 2 applies 0.02 pF CMUTUAL Mutual Capacitance between signal pin and adjacent signal pin At 1 MHz, VP=3.3V, VN=0V, VIN=1.65V; Note 2 applies 0.15 pF VESD In-system ESD Protection Peak Discharge Voltage at any channel input, in system a) Contact discharge per IEC 61000-4-2 standard b) Human Body Model, MILSTD-883, Method 3015 Channel Clamp Voltage Positive Transients Negative Transients CIN ΔCIN VCL RDYN Dynamic Resistance Positive Transients Negative Transients Note 1: Note 2: Note 3: Note 4: Note 5: Note 6: Notes 2, 4 & 5; TA=25°C ±8 kV Notes 2, 3 & 5; TA=25°C ±15 kV TA=25°C, IPP = 1A, tP = 8/20μS; Notes 2, & 5 IPP = 1A, tP = 8/20μS Any I/O pin to Ground; Note 2 and 5 +9.8 -1.8 V V 0.76 0.56 Ω Ω All parameters specified at TA = -40°C to +85°C unless otherwise noted. These parameters guaranteed by design and characterization. Human Body Model per MIL-STD-883, Method 3015, CDischarge = 100pF, RDischarge = 1.5KΩ, VP = 3.3V, VN grounded. Standard IEC 61000-4-2 with CDischarge = 150pF, RDischarge = 330Ω, VP = 3.3V, VN grounded. These measurements performed with no external capacitor on VP. Measured under pulsed conditions, pulse width = 0.7ms, maximum current = 1.5A. © 2006 California Micro Devices Corp. All rights reserved. 4 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 03/15/06 PRELIMINARY CM1230 Performance Information Input Channel Capacitance Performance Curves 2.000 1.800 Capacitance (pF) 1.600 1.400 1.200 1.000 0.800 0.600 0.400 0.200 0.000 0 0.5 1 1.5 2 2.5 3 Bias Voltage (V) Typical Variation of CIN vs. VIN (f=1MHz, VP = 3.3V, VN = 0V, 0.1 μF chip capacitor between VP and VN, TA = 25°C) Capacitance [pF] 0.90 0V DC Input Bias 1.65 DC Input Bias 0.85 0.80 0.75 0.70 0.65 0.60 -50 -25 0 25 50 75 100 Temperature ['C] Typical Variation of CIN vs. Temp (f=1MHz, VIN=30mV, VP = 3.3V, VN = 0V, 0.1 μF chip capacitor between VP and VN) © 2006 California Micro Devices Corp. All rights reserved. 03/15/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 5 PRELIMINARY CM1230 Performance Information (Cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Insertion Loss VS. Frequency (0V DC Bias, VP=3.3V) Insertion Loss VS. Frequency (2.5V DC Bias, VP=3.3V) © 2006 California Micro Devices Corp. All rights reserved. 6 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 03/15/06 PRELIMINARY CM1230 Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE Pad Size on PCB 0.275mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.325mm Round Solder Stencil Thickness 0.125mm - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50μm Solder Ball Side Coplanarity +20μm Maximum Dwell Time Above Liquidous (183°C) 60 seconds Maximum Soldering Temperature for a Eutectic Device using Eutectic Solder Paste 240°C Maximum Soldering Temperature for a Lead-free Device using Lead-free Solder Paste 260°C Non-Solder Mask Defined Pad 0.275mm DIA. Solder Stencil Opening 0.330mm DIA. Solder Mask Opening 0.325mm DIA. Figure 1. Recommended Non-Solder Mask Defined Pad Illustration Temperature (°C) 250 200 150 100 50 0 Figure 2. Eutectic (SnPb) Solder Ball Reflow Profile 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 3. Lead-free (SnAgCu) Solder Ball Reflow Profile © 2006 California Micro Devices Corp. All rights reserved. 03/15/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 7 PRELIMINARY CM1230 Mechanical Details CSP-4 Mechanical Specifications The CM1230-02CS/CP is supplied in a 4 bump Chip Scale Package (CSP). Dimensions are shown below. For complete information on the CSP, see the California Micro Devices CSP Package Information document. Mechanical Package Diagrams BOTTOM VIEW OptiGuardTM Coating A1 C1 PACKAGE DIMENSIONS B2 B1 Custom CSP B Bumps 4 A Min Nom Max Inches Min Nom Max A1 0.915 0.960 1.005 0.0360 0.0378 0.0396 A2 0.915 0.960 1.005 0.0360 0.0378 0.0396 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.495 0.500 0.505 0.0195 0.0197 0.0199 C1 0.180 0.230 0.280 0.0071 0.0091 0.0110 C2 0.180 0.230 0.280 0.0071 0.0091 0.0110 D1 0.575 0.644 0.714 0.0226 0.0254 0.0281 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel 1 2 C2 Dim Millimeters A2 Package 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS SIDE VIEW D1 D2 DIMENSIONS IN MILLIMETERS Package Dimensions for CM1230-02 Chip Scale Package 3500 pieces Controlling dimension: millimeters © 2006 California Micro Devices Corp. All rights reserved. 8 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 03/15/06 PRELIMINARY CM1230 Mechanical Details (cont’d) CSP-6 Mechanical Specifications The CM1230-04CS/CP is supplied in a 6 bump Chip Scale Package (CSP). Dimensions are shown below. For complete information on the CSP, see the California Micro Devices CSP Package Information document. Mechanical Package Diagrams BOTTOM VIEW OptiGuardTM Coating A1 C1 PACKAGE DIMENSIONS Custom CSP Bumps 6 Dim Millimeters Nom Max 2 1 Inches Min Nom A1 0.915 0.960 1.005 0.0360 0.0378 0.0396 A2 1.415 1.460 1.505 0.0557 0.0575 0.0593 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.495 0.500 0.505 0.0195 0.0197 0.0199 C1 0.180 0.230 0.280 0.0071 0.0091 0.0110 C2 0.180 0.230 0.280 0.0071 0.0091 0.0110 D1 0.575 0.644 0.714 0.0226 0.0254 0.0281 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel B Max A C2 Min 3 A2 Package B3 B2 B1 D1 D2 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 95.5/3.8/0.7 Sn/Ag/Cu (Lead-free) SOLDER BUMPS SIDE VIEW NOTE: DIMENSIONS IN MILLIMETERS Package Dimensions for CM1230-04 Chip Scale Package 3500 pieces Controlling dimension: millimeters © 2006 California Micro Devices Corp. All rights reserved. 03/15/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 9 PRELIMINARY CM1230 Mechanical Details (cont’d) CSP-10 Mechanical Specifications The CM1230-08CS/CP is supplied in a 10 bump Chip Scale Package (CSP). Dimensions are shown below. For complete information on the CSP, see the California Micro Devices CSP Package Information document. Mechanical Package Diagrams BOTTOM VIEW OptiGuardTM Coating A1 C1 B2 B1 PACKAGE DIMENSIONS Package Custom CSP Bumps 10 Millimeters 4 Inches Nom Max 0.915 0.960 1.005 0.0360 0.0378 0.0396 Nom Max A2 2.415 2.460 2.505 0.0951 0.0969 0.0986 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.495 0.500 0.505 0.0195 0.0197 0.0199 C1 0.180 0.230 0.280 0.0071 0.0091 0.0110 C2 0.180 0.230 0.280 0.0071 0.0091 0.0110 D1 0.575 0.644 0.714 0.0226 0.0254 0.0281 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 2 B A B A C2 Min A1 # per tape and reel Min 3 A2 Dim 5 1 D1 0.30 DIA. D2 63/37 Sn/Pb (Eutectic) or 95.5/3.8/0.7 Sn/Ag/Cu (Lead-free) SOLDER BUMPS SIDE VIEW NOTE: DIMENSIONS IN MILLIMETERS 3500 pieces Package Dimensions for CM1230-08 Chip Scale Package Controlling dimension: millimeters © 2006 California Micro Devices Corp. All rights reserved. 10 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 03/15/06 PRELIMINARY CM1230 CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1230-02 0.96 x 0.96 x 0.644 1.14 x 1.00 x 0.70 8mm 178mm (7") 3500 4mm 4mm CM1230-04 1.46 x 0.96 x 0.644 1.72 x 1.17 x 0.73 8mm 178mm (7") 3500 4mm 4mm CM1230-08 2.46 x 0.96 x 0.644 2.62 x 1.12 x 0.76 8mm 178mm (7") 3500 4mm 4mm Po Top Cover Tape 10 Pitches Cumulative Tolerance On Tape ±0.2 mm Ao W Bo Ko For Tape Feeder Reference Only including Draft. Concentric Around B. Embossment P1 Center Lines of Cavity User Direction of Feed Figure 4. Tape and Reel Mechanical Data © 2006 California Micro Devices Corp. All rights reserved. 03/15/06 490 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.cmd.com 11