2- and 4-Channel Low Capacitance ESD Protection Arrays CM1224 Features • • • • • • • • • • Two or four channels of ESD protection Provides ESD protection to IEC61000-4-2 Level 4 • ±8kV contact discharge Low channel input capacitance of 0.7pF typical Minimal capacitance change with temperature and voltage Channel input capacitance matching of 0.02pF typical is ideal for differential signals Zener diode protects supply rail and eliminates the need for external by-pass capacitors Low clamping voltage (VCLAMP) at 10V Low Dynamic resistance (RDYN) at 1.08Ω Each I/O pin can withstand over 1000 ESD strikes* Available in SOT and MSOP lead-free packages Applications • • • • • • USB 2.0 ports at 480Mbps in desktop PCs, notebooks and peripherals IEEE1394 Firewire ports at 400Mbps / 800Mbps DVI ports, HDMI ports in notebooks, set top boxes, digital TVs, LCD displays Serial ATA ports in desktop PCs and hard disk drives PCI Express ports General purpose high-speed data line ESD protection Product Description The CM1224 family of diode arrays has been designed to provide ESD protection for electronic components or subsystems requiring minimal capacitive loading. These devices are ideal for protecting systems with high data and clock rates or for circuits requiring low capacitive loading. Each ESD channel consists of a pair of diodes in series which steer the positive or negative ESD current pulse to either the positive (VP) or negative (VN) supply rail. A Zener diode is embedded between VP and VN, offering two advantages. First, it protects the VCC rail against ESD strikes, and second, it eliminates the need for a bypass capacitor that would otherwise be needed for absorbing positive ESD strikes to ground. The CM1224 protects against ESD pulses up to ±8kV per the IEC 61000-4-2 standard. These devices are particularly well-suited for protecting systems using high-speed ports such as USB 2.0, IEEE1394 (Firewire, iLink), Serial ATA, DVI, HDMI and corresponding ports in removable storage, digital camcorders, as well as DVD-RW drives and other applications where extremely low loading capacitance with ESD protection are required. The CM1224 family of devices has lead-free finishing in a small package footprint. Block Diagram ©2010 SCILLC. All rights reserved. April 2010 – Rev. 3 Publication Order Number: CM1224/D CM1224 Package/Pinout Diagrams Pin Configuration PIN 1 2 3 4 PIN 1 2-CHANNEL, 4-LEAD SOT143-4 PACKAGE NAME TYPE DESCRIPTION VN GND Negative voltage supply rail CH1 I/O ESD Channel CH2 I/O ESD Channel VP PWR Positive voltage supply rail 4-CHANNEL, 6-LEAD SOT23-6 PACKAGES NAME TYPE DESCRIPTION CH1 I/O ESD Channel PIN 1 2 3 4 5 6 7 4-CHANNEL, 10-LEAD MSOP-10 PACKAGES NAME TYPE DESCRIPTION CH1 I/O ESD Channel NC No Connect VP PWR Positive voltage supply rail CH2 I/O ESD Channel NC No Connect CH3 I/O ESD Channel NC No Connect 2 VN GND Negative voltage supply rail 8 VN GND 3 4 5 6 CH2 CH3 VP CH4 I/O I/O PWR I/O ESD Channel ESD Channel Positive voltage supply rail ESD Channel 9 CH4 I/O 10 NC Rev. 3 | Page 2 of 14 | www.onsemi.com Negative voltage supply rail ESD Channel No Connect CM1224 Ordering Information PART NUMBERING INFORMATION Lead-free Finish 1 # of Channels Leads Package Ordering Part Number Part Marking 2 4 SOT143-4 CM1224-02SR L242 4 6 SOT23-6 CM1224-04SO L244 4 10 MSOP-10 CM1224-04MR L243 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS 6.0 V Operating Temperature Range –40 to +85 °C Storage Temperature Range –65 to +150 °C (VN - 0.5) to (VP + 0.5) V Operating Supply Voltage (VP - VN) DC Voltage at any channel input STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range Package Power Rating SOT23-3, SOT143-4,SOT23-5 and SOT23-6 Packages MSOP-10 Package Rev. 3 | Page 3 of 14 | www.onsemi.com RATING UNITS –40 to +85 °C 225 400 mW mW CM1224 ELECTRICAL OPERATING CHARACTERISTICS SYMBOL PARAMETER CONDITIONS VP Operating Supply Voltage (VP-VN) IP Operating Supply Current (VP-VN)=3.3V VF Diode Forward Voltage Top Diode Bottom Diode IF = 8mA; TA=25°C ILEAK Channel Leakage Current TA=25°C; VP=5V, VN=0V CIN Channel Input Capacitance At 1 MHz, VP=3.3V, VN=0V, VIN=1.65V ∆C Channel Input Capacitance Matching At 1 MHz, VP=3.3V, VN=0V, VIN=1.65V VESD ESD Protection - Peak Discharge Voltage at any channel input, in system Contact discharge per IEC 61000-4-2 standard RDYN MIN 0.60 0.60 IN VCL (SEE NOTE 1) Notes 2 and 3; TA=25°C Channel Clamp Voltage Positive Transients Negative Transients TA=25°C, IPP = 1A, tP = 8/20µS; Note 3 Dynamic Resistance Positive Transients Negative Transients IPP = 1A, tP = 8/20µS Any I/O pin to Ground; Note 3 Note 1: All parameters specified at TA = –40°C to +85°C unless otherwise noted. Note 2: Standard IEC 61000-4-2 with CDischarge = 150pF, RDischarge = 330Ω, VP = 3.3V, VN grounded. Note 3: These measurements performed with no external capacitor on VP (VP floating). Rev. 3 | Page 4 of 14 | www.onsemi.com 0.60 TYP MAX UNITS 3.3 5.5 V 8.0 µA 0.80 0.80 0.95 0.95 V V ±0.1 ±1.0 µA 0.70 0.80 pF 0.02 pF kV ±8 +10.0 –1.8 V V V 1.08 0.66 Ω Ω CM1224 Performance Information Input Channel Capacitance Performance Curves Rev. 3 | Page 5 of 14 | www.onsemi.com CM1224 Performance Information (cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 1. Insertion Loss (S21) VS. Frequency (0V DC Bias, VP=3.3V) Figure 2. Insertion Loss (S21) VS. Frequency (2.5V DC Bias, VP=3.3V) Rev. 3 | Page 6 of 14 | www.onsemi.com CM1224 Application Information Design Considerations To realize the maximum protection against ESD pulses, care must be taken in the PCB layout to minimize parasitic series inductances on the Supply/ Ground rails as well as the signal trace segment between the signal input (typically a connector) and the ESD protection device. Application of Positive ESD Pulse between Input Channel and Ground illustrates an example of a positive ESD pulse striking an input channel. The parasitic series inductance back to the power supply is represented by L1 and L2. The voltage VCL on the line being protected is: VCL = Fwd + L2 x d(IESD) / dt voltage drop of D1 + VSUPPLY + L1 x d(IESD) / dt where IESD is the ESD current pulse, and VSUPPLY is the positive supply voltage. An ESD current pulse can rise from zero to its peak value in a very short time. As an example, a level 4 contact discharge per the IEC61000-4-2 standard results in a current pulse that rises from 0 to 30 Amps in 1ns. Here -9 d(IESD)/dt can be approximated by ∆IESD/∆t, or 30/(1x10 ). So just 10nH of series inductance (L1 and L2 combined) will lead to a 300V increment in VCL! Similarly for negative ESD pulses, parasitic series inductance from the VN pin to the ground rail will lead to drastically increased negative voltage on the line being protected. The CM1224 has an integrated Zener diode between VP and VN. This greatly reduces the effect of supply rail inductance L2 on VCL by clamping VP at the breakdown voltage of the Zener diode. However, for the lowest possible VCL, especially when VP is biased at a voltage significantly below the Zener breakdown voltage, it is recommended that a 0.22µF ceramic chip capacitor be connected between VP and the ground plane. As a general rule, the ESD Protection Array should be located as close as possible to the point of entry of expected electrostatic discharges. The power supply bypass capacitor mentioned earlier should be as close to the VP pin of the Protection Array as possible, with minimum PCB trace lengths to the power supply, ground planes and between the signal input and the ESD device to minimize stray series inductance. Additional Information See also California Micro Devices Application Note AP209, “Design Considerations for ESD Protection,” in the Applications section at www.calmicro.com. Figure 3. Application of Positive ESD Pulse between Input Channel and Ground Rev. 3 | Page 7 of 14 | www.onsemi.com CM1224 Mechanical Details The CM1224 is available in SOT143-4, SOT23-6, and MSOP-10 packages with a lad-free finishing option. The various package drawings are presented below. SOT143-4 Mechanical Specifications Dimensions for CM1224-02SR devices supplied in 4-pin SOT143 packages are presented below. PACKAGE DIMENSIONS Package SOT143 Pins 4 Dimensions Millimeters Inches Min Max Min Max A 0.80 1.22 0.031 0.048 A1 0.05 0.15 0.002 0.006 b 0.30 0.50 0.012 0.019 b2 0.76 0.89 0.030 0.035 c 0.08 0.20 0.003 0.008 D 2.80 3.04 0.110 0.119 E 2.10 2.64 0.082 0.103 E1 1.20 1.40 e 1.92 BSC e1 0.20 BSC L L1 # per tape and reel 0.4 0.055 0.075 BSC 0.008 BSC 0.6 0.54 REF 0.047 0.016 0.024 0.021 REF 3000 pieces Package Dimensions for SOT143 Controlling dimension: millimeters Rev. 3 | Page 8 of 14 | www.onsemi.com CM1224 Tape and Reel Specifications PACKAGE SIZE PART NUMBER (mm) CM1224-02SR 2.92 X 2.37 X 1.01 POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH REEL W DIAMETER QTY PER REEL P0 P1 2.60 X 3.15 X 1.20 8mm 3000 4mm 4mm Rev. 3 | Page 9 of 14 | www.onsemi.com 178mm (7") CM1224 Mechanical Details (cont’d) SOT23-6 Mechanical Specifications CM1224-04SO devices are packaged in 6-pin SOT23 packages. Dimensions are presented below. PACKAGE DIMENSIONS Package SOT23-6 (JEDEC name is MO-178) Pins 6 Dimensions Millimeters Inches Min Max Min Max A -- 1.45 -- 0.0571 A1 0.00 0.15 0.0000 0.0059 b 0.30 0.50 0.0118 0.0197 c 0.08 0.22 0.0031 0.0087 D 2.75 3.05 0.1083 0.1201 E 2.60 3.00 0.1024 0.1181 E1 1.45 1.75 0.0571 0.0689 e 0.95 BSC 0.0374 BSC e1 1.90 BSC 0.0748 BSC L L1 # per tape and reel 0.30 0.60 0.60 REF 0.0118 0.0236 0.0236 REF 3000 pieces Controlling dimension: millimeters Package Dimensions for SOT23-6 Rev. 3 | Page 10 of 14 | www.onsemi.com CM1224 Tape and Reel Specifications PART NUMBER PACKAGE SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1224-04SO 2.90 X 2.80 X 1.45 3.20 X 3.20 X 1.40 8mm 178mm (7") 3000 4mm 4mm Rev. 3 | Page 11 of 14 | www.onsemi.com CM1224 Mechanical Details (cont’d) MSOP-10 Mechanical Specifications, 10 pin The CM1224-04MR 10-lead MSOP package dimensions are presented below. PACKAGE DIMENSIONS Package MSOP Pins 10 Dimensions Millimeters Inches Min Max Min Max A 0.75 0.95 0.028 0.038 A1 0.05 0.15 0.002 0.006 B 0.17 0.27 0.007 0.013 C 0.13 0.23 0.005 0.009 D 2.90 3.10 0.114 0.122 E 2.90 3.10 0.114 0.122 e 0.50 BSC 0.0196 BSC H 4.90 BSC 0.193 BSC L # per tape and reel 0.40 0.70 0.0137 0.029 4000 Controlling dimension: millimeters Package Dimensions for MSOP-10 Rev. 3 | Page 12 of 14 | www.onsemi.com CM1224 Tape and Reel Specifications PART NUMBER PACKAGE SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1224-04MR 3.00 X 3.00 X 0.85 3.30 X 5.30 X 1.30 12mm 330mm (13") 4000 4mm 8mm Rev. 3 | Page 13 of 14 | www.onsemi.com CM1224 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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