OKI MSM64162

E2E0033-38-93
¡ Semiconductor
MSM64162
¡ Semiconductor
This version: MSM64162
Sep. 1998
Previous version: Mar. 1996
4-Bit Microcontroller with Built-in RC Oscillation Type A/D Converter and LCD Driver
GENERAL DESCRIPTION
The MSM64162 is a low power 4-bit microcontroller that employs Oki's original CPU core nX4/20.
The MSM64162 has 2-channel RC oscillation type A/D converter, LCD driver for up to 80
segments, and buzzer output port. It is best suited for applications such as low power, high
precision thermometers and hygrometers.
FEATURES
• Operating range
Operating frequencies
Operating voltage
Operating temperature
• Memory space
Internal program memory
Internal data memory
• Minimum instruction execution time
:
:
:
:
:
:
• RC oscillation type A/D converter
• LCD driver
(1) At 1/4 duty and 1/3 bias
(2) At 1/3 duty and 1/3 bias
(3) At 1/2 duty and 1/2 bias
• Buzzer driver
• Capture circuit
• Watchdog timer
• Clock
:
:
:
:
:
:
:
CPU clock
Time base clock
• Power supply voltage
• I/O port
Input-output port
Input port
Output port
:
:
:
• Interrupt sources
External interrupt
Internal interrupt
• Battery check circuit
:
32.768 kHz, 400 kHz
1.25 to 1.7 V (1.5 V spec.)
2.0 to 3.5 V (3 V spec.)
2.2 to 3.5 V (3 V spec., 1/2 duty)
–40 to +85°C
2016 bytes
128 nibbles
7.5 ms @ 400 kHz
91.6 ms @ 32.768 kHz
2 channels
24 outputs; duty ratio switchable by software
80 segments (max)
63 segments (max)
44 segments (max)
1 output (4 output modes selectable)
2 channels
32.768 kHz crystal oscillator and 400 kHz RC
oscillator (with an external resistor)
32.768 kHz/400 kHz (switchable by software)
32.768 kHz
1.5 V/3 V (selectable by mask option)
:
:
:
2 ports ¥ 4 bits
1 port ¥ 4 bits
1 port ¥ 4 bits
(8 out of the 24 LCD driver outputs can be used
as output-only ports by mask option.)
:
:
:
2 sources
7 sources
1 (incorporated into the input-only port)
1/39
¡ Semiconductor
MSM64162
• Package options:
64-pin plastic QFP (QFP64-P-1420-1.00-BK) : (Product name : MSM64162-¥¥¥GS-BK)
80-pin plastic QFP (QFP80-P-1420-0.80-BK) : (Product name : MSM64162-¥¥¥GS-BK-F)
Chip
: (Product name : MSM64162-¥¥¥)
¥¥¥ indicates a code number.
2/39
¡ Semiconductor
MSM64162
BLOCK DIAGRAM
CPU CORE: nX-4/20
BSR
TR2
TR1
TR0
(4)
HALT
A11 to A8
ALU
C
ROM
2016B
PCH
PCM PCL
A7 to A0
B
MIEF
(4)
A
(4)
H
L
X
Y
DB7 to DB0
OSC2
OSC1
XT
XT
RESET
2CLK
ROMR
(8)
IR
SP
IR
DECODER
TIMING
CONTROLLER
RAM
128N
(8)
TBC
INTC
INT
PORT3
RSTG
WDT
INT
TST1
TST2
TST
VSSL
VR
5
PORT2
P2.3
P2.2
P2.1
P2.0
PORT1
P1.3
P1.2
P1.1
P1.0
INT
INT
BC
L0
L1
LCD
CAPR
L23
VSS1
VSS2
VSS3
C1
C2
P3.3
P3.2
P3.1
P3.0
INT
BIAS
PORT0
PORT ADDRESS
P0.3
P0.2
P0.1
P0.0
DB7 to DB0
INT
BD
ADC
BD
RT1
RS1
CS1
IN1
RT0
CRT0
RS0
CS0
IN0
VDD
3/39
¡ Semiconductor
MSM64162
52 P3.2
53 P3.3
54 BD
55 P1.0
56 P1.1
57 P1.2
58 P1.3
60 VSS2
59 VSS1
61 VSSL
62 VSS3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
P3.1
P3.0
P2.3
P2.2
P2.1
P2.0
RT1
RS1
CS1
IN1
IN0
CS0
RS0
CRT0
RT0
P0.3
P0.2
P0.1
P0.0
32
31
30
29
28
27
26
25
24
23
22
21
20
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
L19/P5.3
L20/P6.0
L21/P6.1
L22/P6.2
L23/P6.3
OSC1
OSC2
VDD
XT
XT
RESET
TST1
TST2
L0
L1
L2
L3
L4
L5
L6
L7
L8
L9
L10
L11
L12
L13
L14
L15
L16/P5.0
L17/P5.1
L18/P5.2
63 C1
64 C2
PIN CONFIGURATION (TOP VIEW)
64-Pin Plastic QFP
4/39
¡ Semiconductor
MSM64162
65 L20/P6.0
66 L21/P6.1
67 (NC)
68 L22/P6.2
69 L23/P6.3
70 (NC)
71 OSC1
72 OSC2
73 (NC)
74 VDD
75 (NC)
76 XT
78 (NC)
77 XT
2
64 L19/P5.3
63 L18/P5.2
3
62 L17/P5.1
4
61 L16/P5.0
5
60 L15
6
59 (NC)
7
8
58 L14
57 L13
1
9
56 L12
10
55 L11
11
12
54 L10
53 (NC)
13
52 L9
14
51 L8
15
16
50 L7
49 L6
17
48 L5
18
47 L4
19
46 L3
20
45 L2
44 L1
21
23
43 L0
42 C2
24
41 C1
22
P3.2 25
P3.3 26
BD 27
(NC) 28
P1.0 29
(NC) 30
P1.1 31
(VDD) 32
(NC) 33
P1.2 34
P1.3 35
VSS1 36
VSS2 37
(NC) 38
VSSL 39
VSS3 40
TST2
P0.0
P0.1
P0.2
P0.3
RT0
(NC)
CRT0
RS0
CS0
IN0
IN1
CS1
(NC)
RS1
RT1
P2.0
P2.1
P2.2
P2.3
P3.0
(NC)
P3.1
(NC)
79 RESET
80 TST1
PIN CONFIGURATION (TOP VIEW) (continued)
80-Pin Plastic QFP
Notes: 1. Pins marked as (NC) are no-connection pins which are left open.
2. VDD should be supplied from pin 74. Pin 32 is internally connected to VDD.
5/39
¡ Semiconductor
MSM64162
PAD CONFIGURATION
Pad Layout
50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
51
52
53
32
31
30
54
29
55
28
56
27
57
26
58
25
24
59
60
23
22
61
62
63
64
21
20
19
1 2 3 4 5 6 7 8 9 10 1112 13 14 15 16 17 18
Chip Size
Chip Thickness
Coordinate Origin
Pad Hole Size
Pad Size
Minimum Pad Pitch
:
:
:
:
:
:
y
x
4.69 mm ¥ 4.41 mm
350 mm (typ.)
Chip center
110 mm ¥ 110 mm
130 mm ¥ 130 mm
180 mm
Note: The chip substrate voltage is VDD.
6/39
¡ Semiconductor
MSM64162
Pad Coordinates
Pad No.
Pad Name
X (µm)
Y (µm)
Pad No.
Pad Name
X (µm)
Y (µm)
1
L0
–2168
–2042
33
P0.0
2168
2042
2
L1
–1918
–2042
34
P0.1
1899
2042
3
L2
–1669
–2042
35
P0.2
1628
2042
4
L3
–1426
–2042
36
P0.3
1364
2042
5
L4
–1170
–2042
37
RT0
1100
2042
6
L5
–934
–2042
38
CRT0
829
2042
7
L6
–727
–2042
39
RS0
565
2042
8
L7
–519
–2042
40
CS0
349
2042
9
L8
–312
–2042
41
IN0
141
2042
10
L9
–104
–2042
42
IN1
–67
2042
11
L10
104
–2042
43
CS1
–274
2042
12
L11
311
–2042
44
RS1
–482
2042
13
L12
527
–2042
45
RT1
–689
2042
14
L13
791
–2042
46
P2.0
–911
2042
15
L14
1062
–2042
47
P2.1
–1160
2042
16
L15
1340
–2042
48
P2.2
–1416
2042
17
L16/P5.0
1618
–2042
49
P2.3
–1666
2042
18
L17/P5.1
1897
–2042
50
P3.0
–1916
2042
19
L18/P5.2
2168
–2042
51
P3.1
–2168
1829
20
L19/P5.3
2168
–1714
52
P3.2
–2168
1563
21
L20/P6.0
2168
–1424
53
P3.3
–2168
1382
22
L21/P6.1
2168
–1134
54
BD
–2168
1017
23
L22/P6.2
2168
–844
55
P1.0
–2168
688
24
L23/P6.3
2168
–554
56
P1.1
–2168
328
25
OSC1
2168
–264
57
P1.2
–2168
6
26
OSC2
2168
26
58
P1.3
–2168
–353
27
VDD
2168
316
59
VSS1
–2168
–645
28
XT
2168
606
60
VSS2
–2168
–826
29
XT
2168
896
61
VSSL
–2168
–1254
30
RESET
2168
1186
62
VSS3
–2168
–1435
31
TST1
2168
1476
63
C1
–2168
–1616
32
TST2
2168
1766
64
C2
–2168
–1796
7/39
¡ Semiconductor
MSM64162
PIN DESCRIPTIONS
The following tables describe the pin basic functions and secondary functions of the MSM64162.
For pin, "64QFP" and "80QFP" denote 64-pin flat package and 80-pin flat package respectively.
Basic Functions
Function Symbol
Power
Supply
Pin
64QFP 80QFP
Pad
Type
Description
VDD
27
74
27
—
VSS1
59
36
59
—
VSS2
60
37
60
—
VSS3
62
40
62
—
Bias output for driving LCD (–4.5 V).
C1
63
41
63
—
Pins for connecting a capacitor for generating LCD
C2
64
42
64
—
driving bias
0 V power supply
Negative power supply (for 1.5 V spec.)
Bias output for drivig LCD (–1.5 V) (for 3.0 V spec.)
Negative power supply (for 3.0 V spec.)
Bias output for driving LCD (–3.0 V) (for 1.5 V spec.)
Negative power supply for internal logic
VSSL
61
39
61
—
(An internally generated constant voltage is present at
this pin.)
Oscillation
Test
XT
28
76
28
I
Low-speed clock oscillation input and output pins:
XT
29
77
29
O
Connect to a crystal (32.768 kHz).
OSC1
25
71
25
I
High-speed clock oscillation input and output pins:
OSC2
26
72
26
O
Connect to an external resistor for oscillation (ROS).
TST1
31
80
31
I
Input pins for testing.
TST2
32
1
32
I
A pull-up resistor is internally connected to these pins.
System reset input pin.
Setting this pin to "L" level puts this device into a reset state.
Reset
RESET
30
79
30
I
Then, setting this pin to "H" level starts executing an
instruction from address 000H.
A pull-up resistor is internally connected to this pin.
8/39
¡ Semiconductor
MSM64162
Basic Functions (continued)
Function Symbol
Pin
64QFP 80QFP
Pad
Type
Description
4-bit input port (P0):
P0.0
33
2
33
I
P0.1
34
3
34
I
P0.2
35
4
35
I
P0.3
36
5
36
I
P1.0
55
29
55
O
4-bit output port (P1):
P1.1
56
31
56
O
Selectable as NMOS open drain output or CMOS output
P1.2
57
34
57
O
by the port 01 control register (P01CON). P1.0 is a
P1.3
58
35
58
O
high current drive output port.
P2.0
46
17
46
I/O
P2.1
47
18
47
I/O
P2.2
48
19
48
I/O
P2.3
49
20
49
I/O
P3.0
50
21
50
I/O
P3.1
51
23
51
I/O
P3.2
52
25
52
I/O
P3.3/MON
53
26
53
I/O
BD
54
27
54
O
Selectable as pull-up resistor input, pull-down resistor
input, or high impedance input by the port 01 control
register (P01CON).
As secondary functions, P0.0 to P0.3 are assigned
external interrupt functions, P0.0 and P0.1 are assigned
a capture trigger function, and P0.3 is assigned an
Ports
analog comparator input for battery check.
4-bit input-output port (P2):
Following can be specified for each bit by the port 2
control registers 0 to 3 (P20CON to P23CON): (1) input
or output, (2) pull-up/pull-down resistor input or high
impedance input, and (3) NMOS open drain output or
CMOS output.
As secondary functions, P2.0 to P2.3 are assigned
Buzzer
RT0
37
6
37
O
external interrupt functions.
4-bit input-output port (P3):
Following can be specified for each bit by the port 3
control registers 0 to 3 (P30CON to P33CON): (1) input
or output, (2) pull-up/pull-down resistor input or high
impedance input, and (3) NMOS open drain output or
CMOS output.
As secondary functions, P3.0 to P3.3 are assigned
external interrupt functions, P3.3 is assigned a function
that monitors the RC oscillation clock for A/D converter.
Output pin for the buzzer driver
Resistance temperature sensor connection pin
(for channel 0)
Resistance/capacitance temperature sensor connection
CRT0
38
8
38
O
RS0
39
9
39
O
Reference resistor connection pin (for channel 0)
A/D
CS0
40
10
40
O
Reference capacitor connection pin (for channel 0)
Converter
IN0
41
11
41
I
pin (for channel 0)
Input pin for RC oscillator circuit (for channel 0)
Resistance temperature sensor connection pin
RT1
45
16
45
O
RS1
44
15
44
O
CS1
43
13
43
O
Reference capacitor connection pin (for channel 1)
IN1
42
12
42
I
Input pin for RC oscillator circuit (for channel 1)
(for channel 1)
Reference resistor connection pin (for channel 1)
9/39
¡ Semiconductor
MSM64162
Basic Functions (continued)
Function Symbol
LCD
Driver
Pin
64QFP 80QFP
Pad
Type
L0
1
43
1
O
L1
2
44
2
O
L2
L3
3
4
45
3
46
4
O
O
L4
5
47
5
O
L5
L6
6
7
48
49
6
7
O
O
L7
8
50
8
O
L8
L9
9
10
51
52
9
10
O
O
L10
11
54
11
O
L11
L12
12
13
55
56
12
13
O
O
L13
14
57
14
O
L14
L15
15
16
58
60
15
16
O
O
L16/P5.0
17
61
17
O
L17/P5.1
L18/P5.2
18
19
62
18
63
19
O
O
L19/P5.3
20
64
20
O
L20/P6.0
L21/P6.1
21
22
65
21
66
22
O
O
L22/P6.2
23
68
23
O
L23/P6.3
24
69
24
O
Description
LCD segment and common signals output pins.
LCD segment and common signals output pins.
Functions as output ports by mask option.
10/39
¡ Semiconductor
MSM64162
Secondary Functions
Function Symbol
Pin
64QFP 80QFP
Pad
Type
Description
P0.0
33
2
33
P0.1
34
3
34
P0.2
35
4
35
P0.3
36
5
36
occur.
Secondary functions of P0.0 to P0.3:
I
Level-triggered external interrupt input pins.
The change of input signal level causes an interrupt to
P2.0
46
17
46
Secondary functions of P2.0 to P2.3 and P3.0 to P3.3:
External
P2.1
47
18
47
Level-triggered external interrupt input pins.
Interrupt
P2.2
48
19
48
The change of input signal level causes an interrupt to
P2.3
49
20
49
P3.0
50
21
50
P3.1
51
23
51
P3.2
52
25
52
P3.3
53
26
53
Capture
P0.0
33
2
33
Trigger
P0.1
34
3
34
I
I
occur.
Secondary functions of P0.0 and P0.1:
Capture circuit trigger input pins.
Secondary function of P3.3:
RC Oscillation
Monitor
P3.3
53
26
53
O
Monitor output pin for an RC oscillation clock for A/D
converter and a 400 kHz RC oscillation clock for the
system clock.
Battery
Check
P0.3
36
5
36
I
Secondary function of P0.3:
Analog comparator input pin for battery check.
11/39
¡ Semiconductor
MSM64162
MEMORY MAPS
Program Memory
Test program area
,,,,,,,,,,,,,
,,,,,,,,,,,,,
,,,,,,,,,,,,,
07E0H,,,,,,,,,,,,,
,,,,,,,,,,,,,
07FFH
32 bytes
Contents of interrupt area
2016 bytes
03EH
Interrupt area
03BH
Watchdog interrupt
038H
External interrupt (0)
032H
External interrupt (1)
02FH
ADC interrupt
02CH
256 Hz interrupt
029H
32 Hz interrupt
026H
16 Hz interrupt
023H
1 Hz interrupt
020H
4 Hz interrupt
020H
CZP area
010H
Start address
000H
8 bits
Program Memory Map
Address 000H is the instruction execution start address by the system reset.
The CZP area from address 010H to address 01FH is the start address for the CZP subroutine of
1-byte call instruction.
The start address of interrupt subroutine is assigned to the interrupt address from address 020H
to 03DH.
The user area has 2016 bytes of address 000H to address 07DFH. No program can be stored in
the test program area.
12/39
¡ Semiconductor
MSM64162
Data Memory
The data memory area consists of 8 banks and each bank has 256 nibbles (256 ¥ 4 bits).
The data RAM is assigned to BANK 7 and peripheral ports are assigned to BANK 0.
7FFH
780H
77FH
700H
BANK 7
Data RAM area
Data/Stack area (128 nibbles)
Unused area
Contents of 000H to 07FH
07FH
Inaccessible area
SFR area
100H
0FFH
080H
07FH
Unused area
BANK 0
000H
000H
4 bits
Data Memory Map
The data RAM area (128 nibbles) is shared by the stack area. The stack is a memory starting from
address 7FFH toward the low-order addresses where 4 nibbles are used by Subroutine Call
Instruction and 8 nibbles are used by an interrupt.
The addresses 080H to 0FFH of BANK 0 and the addresses 700H to 77FH of BANK 7 are not
assigned as the data memory, so access to these addresses has no effect. Moreover, it is
impossible to access BANK 1 to BANK 6.
13/39
¡ Semiconductor
MSM64162
ABSOLUTE MAXIMUM RATINGS (1.5 V Spec.)
(VDD = 0 V)
Symbol
Condition
Rating
Unit
Power Supply Voltage 1
Parameter
VSS1
Ta = 25°C
–2.0 to +0.3
V
Power Supply Voltage 2
VSS2
Ta = 25°C
–4.0 to +0.3
V
Power Supply Voltage 3
VSS3
Ta = 25°C
–5.5 to +0.3
V
Power Supply Voltage 4
VSSL
Ta = 25°C
–2.0 to +0.3
V
Input Voltage 1
VIN1
VSS1 Input, Ta = 25°C
VSS1 – 0.3 to +0.3
V
Input Voltage 2
VIN2
VSSL Input, Ta = 25°C
VSSL – 0.3 to +0.3
V
Output Voltage 1
VOUT1
VSS1 Output, Ta = 25°C
VSS1 – 0.3 to +0.3
V
Output Voltage 2
VOUT2
VSS2 Output, Ta = 25°C
VSS2 – 0.3 to +0.3
V
Output Voltage 3
VOUT3
VSS3 Output, Ta = 25°C
VSS3 – 0.3 to +0.3
V
Output Voltage 4
VOUT4
VSSL Output, Ta = 25°C
VSSL – 0.3 to +0.3
V
Storage Temperature
TSTG
—
–55 to +150
°C
RECOMMENDED OPERATING CONDITIONS (1.5 V Spec.)
(VDD = 0 V)
Symbol
Condition
Range
Unit
Operating Temperature
Parameter
Top
—
–40 to +85
°C
Operating Voltage
VSS1
—
–1.7 to –1.25
V
ROS
—
250 to 500
kW
fXT
—
30 to 35
kHz
External 400 kHz RC Oscillator
Resistance
Crystal Oscillation Frequency
14/39
¡ Semiconductor
MSM64162
ELECTRICAL CHARACTERISTICS (1.5 V Spec.)
DC Characteristics
(VDD = 0 V, VSS1 = –1.5 V, Ta = –40 to +85°C unless otherwise specified)
Parameter
Condition
Symbol
VSS2 Voltage
VSS2
Ca, Cb, C12 = 0.1 mF
VSS3 Voltage
VSS3
Ca, Cb, C12 = 0.1 mF
VSSL Voltage
VSSL
Crystal Oscillation
Start Voltage
Crystal Oscillation
Hold Voltage
Crystal Oscillation
Stop Detection Time
Internal Crystal
Oscillator Capacitance
External Crystal
Oscillator Capacitance
Internal Crystal
Oscillator Capacitance
Internal 400k RC
Oscillator Capacitance
400k RC Oscillation
Frequency
POR Generation
Voltage
POR Non-generation
Voltage
Battery Check
Reference Voltage
VRB Temperature
Variation
VSTA
+100%
–50%
+100%
–50%
—
Oscillation start time:
within 5 seconds
Min.
Typ.
Max.
Unit
–3.2
–3.0
–2.8
V
–4.7
–4.5
–4.3
V
–1.5
–1.3
–0.6
V
—
—
–1.45
V
VHOLD
—
—
—
–1.25
V
TSTOP
—
0.1
—
1000
ms
CG
—
10
15
20
pF
10
—
30
pF
CGEX
When external CG used
CD
—
10
15
20
pF
COS
—
8
12
16
pF
80
220
350
kHz
–0.4
—
0
V
–1.5
—
–1.2
V
–0.73
–0.63
–0.53
V
fOSC
VPOR1
VPOR2
VRB
External resistor ROS = 300 kW
VSS1 = –1.25 to –1.7 V
When VSS1 is between VPOR1
and –1.5 V
No POR when VSS1 is between
VPOR2 and –1.5 V
Ta = 25°C
Measuring
Circuit
1
2
DVRB
—
—
–2.0
—
mV/°C
Notes: 1. "POR" denotes Power On Reset.
2. "TSTOP" indicates that if the crystal oscillator stops over the value of TSTOP, the
system reset occurs.
15/39
¡ Semiconductor
MSM64162
DC Characteristics (continued)
(VDD = 0 V, VSS1 = –1.5 V, Ta = –40 to +85°C unless otherwise specified)
Parameter
Symbol
Supply Current 1
IDD1
Supply Current 2
IDD2
Supply Current 3
IDD3
Condition
Min.
Typ.
Max.
Unit
Ta = –40 to +40°C
—
2
5
mA
(400k RC oscillation halt) Ta = +40 to +85°C
—
2
30
mA
CPU in halt state
CPU in operating state Ta = –40 to +40°C
—
5
15
mA
(400k RC oscillation halt) Ta = +40 to +85°C
—
5
40
mA
—
40
80
mA
RT0 = 10 kW
—
150
230
mA
RT0 = 2 kW
—
600
900
mA
—
25
125
mA
Measuring
Circuit
CPU in operating state
(400k RC oscillation in operation)
ROS = 300 kW
1
CPU in halt state
(400k RC oscillation
Supply Current 4
IDD4
halt), RC oscillator for
A/D converter is in
operating state
Battery check circuit in operating
Supply Current 5
IDD5
state, CPU in operating state
(400k RC oscillation halt)
16/39
¡ Semiconductor
MSM64162
DC Characteristics (continued)
(VDD = 0 V, VSS1 = VSSL = –1.5 V, VSS2 = –3.0 V, VSS3 = –4.5 V,
Ta = –40 to +85°C unless otherwise specified)
Parameter
(Pin Name)
Symbol
Condition
Min.
Typ.
Max.
Unit
Output Current 1
(P1.0)
IOH1
VOH1 = –0.5 V
–2.1
–0.7
–0.2
mA
IOL1
VOL1 = VSS1 + 0.5 V
1.0
3.0
9.0
mA
Output Current 2
(P1.1 to P1.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
IOH2
VOH2 = –0.5 V
–2.1
–0.7
–0.2
mA
IOL2
VOL2 = VSS1 + 0.5 V
0.2
0.7
2.1
mA
Output Current 3
(BD)
IOH3
VOH3 = –0.7 V
–1.8
–0.6
–0.2
mA
IOL3
VOL3 = VSS1 + 0.7 V
0.2
0.6
1.8
mA
Output Current 4
(RT0, RT1, RS0, RS1,
CRT0, CS0, CS1)
IOH4
VOH4 = –0.1 V
–1.1
–0.6
–0.3
mA
IOL4
VOL4 = VSS1 + 0.1 V
0.3
0.6
1.1
mA
Output Current 5
(When L16 to L23 are
configured as output
ports)
IOH5
VOH5 = –0.5 V
–1.5
–0.5
–0.1
mA
IOL5
VOL5 = VSS1 + 0.5 V
0.1
0.5
1.5
mA
Output Current 6
(OSC2)
IOH6
VOH6 = –0.5 V
–2.1
–0.7
–0.2
mA
IOL6
VOL6 = VSS1 + 0.5 V
0.2
0.7
2.1
mA
IOH7
VOH7 = –0.2 V
(VDD level)
—
—
–4.0
mA
IOMH7
VOMH7 = VSS1 + 0.2 V (VSS1 level)
4.0
—
—
mA
IOMH7S
VOMH7S = VSS1 – 0.2 V (VSS1 level)
—
—
–4.0
mA
IOML7
VOML7 = VSS2 + 0.2 V (VSS2 level)
4.0
—
—
mA
IOML7S
VOML7S = VSS2 – 0.2 V (VSS2 level)
—
—
–4.0
mA
(VSS3 level)
4.0
—
—
mA
Output Current 7
(L0 to L23)
Output Leakage Current
(P1.0 to P1.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
(RT0, RT1, RS0, RS1,
CRT0, CS0, CS1)
IOL7
VOL7 = VSS3 + 0.2 V
IOOH
VOH = VDD
—
—
0.3
mA
IOOL
VOL = VSS1
–0.3
—
—
mA
Measuring
Circuit
2
17/39
¡ Semiconductor
MSM64162
DC Characteristics (continued)
(VDD = 0 V, VSS1 = VSSL = –1.5 V, VSS2 = –3.0 V, VSS3 = –4.5 V,
Ta = –40 to +85°C unless otherwise specified)
Parameter
(Pin Name)
Symbol
Condition
Min.
Typ.
Max.
Unit
IIH1
VIH1 = VDD (when pulled down)
5
18
60
mA
IIL1
VIL1 = VSS1 (when pulled up)
–60
–18
–5
mA
IIH1Z
VIH1 = VDD (in a high impedance state)
0
—
1.0
mA
IIL1Z
VIL1 = VSS1 (in a high impedance state) –1.0
—
0
mA
IIH2
VIH2 = VDD (when pulled down)
5
18
60
mA
IIH2Z
VIH2 = VDD (in a high impedance state)
0
—
1.0
mA
IIL2Z
VIL2 = VSS1 (in a high impedance state) –1.0
—
0
mA
IIL3
VIL3 = VSS1 (when pulled up)
–60
–22
–6
mA
IIH3Z
VIH3 = VDD (in a high impedance state)
0
—
1.0
mA
IIL3Z
VIL3 = VSS1 (in a high impedance state)
–1.0
—
0
mA
Input Current 4
(RESET, TST1, TST2)
IIH4
VIH4 = VDD
0
—
1.0
mA
IIL4
VIL4 = VSS1
–1.5
–0.75
–0.3
mA
Input Voltage 1
(P0.0 to P0.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
VIH1
—
–0.3
—
0
V
VIL1
—
–1.5
—
–1.2
V
Input Voltage 2
(IN0, IN1, OSC1)
VIH2
—
–0.3
—
0
V
VIL2
—
–1.5
—
–1.2
V
Input Voltage 3
(RESET, TST1, TST2)
VIH3
—
–0.3
—
0
V
VIL3
—
–1.5
—
–1.2
V
Input Current 1
(P0.0 to P0.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
Input Current 2
(IN0, IN1)
Input Current 3
(OSC1)
Measuring
Circuit
3
4
18/39
¡ Semiconductor
MSM64162
DC Characteristics (continued)
(VDD = 0 V, VSS1 = VSSL = –1.5 V, VSS2 = –3.0 V, VSS3 = –4.5 V,
Ta = –40 to +85°C unless otherwise specified)
Parameter
(Pin Name)
Symbol
Condition
Min.
Typ.
Max.
Unit
0.05
0.1
0.3
V
Hysteresis Width
(P0.0 to P0.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
DVT1
Hysteresis Width
(RESET, TST1, TST2)
DVT2
—
0.05
0.1
0.3
V
Input Pin Capacitance
(P0.0 to P0.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
CIN
—
—
—
5.0
pF
—
Measuring
Circuit
4
1
19/39
¡ Semiconductor
MSM64162
Measuring circuit 1
CS0
RT0
RI0
RT0
CS0
IN0
XT
Crystal
32.768 kHz
OSC1
ROS
XT
OSC2
C1
C12
C2
VSSL
VDD
VSS1
A
Cl
VSS2
VSS3
Ca
V
Cb
V
V
Cl
Ca, Cb, C12
ROS
RT0
CS0
RI0
: 0.47 mF
: 0.1 mF
: 300 kW
: 10 kW/2 kW
: 820 pF
: 10 kW
Measuring circuit 2
(*1)
INPUT
VIH
OUTPUT
(*2)
A
VIL
VDD
VSS1
VSS2
VSS3
VSSL
20/39
¡ Semiconductor
MSM64162
Measuring circuit 3
INPUT
A
OUTPUT
(*3)
VDD
VSS1
VSS2
VSS3
VSSL
(*3)
INPUT
VIH
OUTPUT
Measuring circuit 4
Waveform
Monitoring
VIL
VDD
VSS1
VSS2
VSS3
VSSL
*1 Input logic circuit to determine the specified measuring conditions.
*2 Measured at the specified output pins.
*3 Measured at the specified input pins.
21/39
¡ Semiconductor
MSM64162
A/D Converter Characteristics
(VDD = 0 V, VSS1 = –1.5 V, Ta = –40 to +85°C unless otherwise specified)
Parameter
Symbol
Resistor
for Oscillation
RS0, RS1,
RT0,
RT0-1,
RT1
Input Current
Limiting Resistor
RI0, RI1
Condition
CS0, CT0, CS1 ≥ 740 pF
—
Min.
Typ.
Max.
Unit
2.0
—
—
kW
1.0
10
—
kW
Measuring
Circuit
5
Oscillation
Frequency
RS•RT Oscillation
Frequency Ratio (*)
*
fOSC1
Resistor for oscillation = 2 kW
165
221
256
kHz
fOSC2
Resistor for oscillation = 10 kW
41.8
52.2
60.6
kHz
fOSC3
Resistor for oscillation = 200 kW
2.55
3.04
3.53
kHz
Kf1
RT0, RT0-1, RT1 = 2 kW
3.89
4.18
4.35
—
Kf2
RT0, RT0-1, RT1 = 10 kW
0.990
1.0
1.010
—
Kf3
RT0, RT0-1, RT1 = 200 kW
0.0561 0.0584 0.0637
—
Kfx is the ratio of the oscillation frequency by a sensor resistor to the oscillation frequency
by a reference resistor in the same condition.
Kfx =
fOSCX (RT0–CS0 Oscillation)
fOSCX (RT0-1–CS0 Oscillation)
fOSCX (RS0–CS0 Oscillation) ,
(x = 1, 2, 3)
fOSCX (RS0–CS0 Oscillation)
fOSCX (RT1–CS1 Oscillation)
, fOSCX (RS1–CS1 Oscillation)
22/39
¡ Semiconductor
MSM64162
Measuring circuit 5
RT0-1
RT0
CT0
RS0
CS0
(CROSC0)
RI0
RI1
CS1
RS1
RT1
(CROSC1)
Oscillation Mode Designation
RT1 RS1 CS1 IN1
IN0 CS0 RS0
CRT0
RT0
RESET
TST1
P3.3
TST2
P0.0
D. U. T.
Frequency
Measurement
(fOSCX)
P0.1
P0.2
P0.3
VDD
VSS1
VSSL
Cl
RT0, RT0-1, RT1 = 2 kW/10 kW/200 kW
RS0, RS1 = 10 kW
RI0, RI1 = 10 kW
CS0, CT0, CS1 = 820 pF
Cl = 0.1 mF
23/39
¡ Semiconductor
MSM64162
ABSOLUTE MAXIMUM RATINGS (3.0 V Spec.)
(VDD = 0 V)
Parameter
Symbol
Condition
Rating
Unit
Power Supply Voltage 1
VSS1
Ta = 25°C
–2.0 to +0.3
V
Power Supply Voltage 2
VSS2
Ta = 25°C
–4.0 to +0.3
V
Power Supply Voltage 3
VSS3
Ta = 25°C
–5.5 to +0.3
V
Power Supply Voltage 4
VSSL
Ta = 25°C
–4.0 to +0.3
V
Input Voltage 1
VIN1
VSS2 Input, Ta = 25°C
VSS2 – 0.3 to +0.3
V
Input Voltage 2
VIN2
VSSL Input, Ta = 25°C
VSSL – 0.3 to +0.3
V
Output Voltage 1
VOUT1
VSS1 Output, Ta = 25°C
VSS1 – 0.3 to +0.3
V
Output Voltage 2
VOUT2
VSS2 Output, Ta = 25°C
VSS2 – 0.3 to +0.3
V
Output Voltage 3
VOUT3
VSS3 Output, Ta = 25°C
VSSL – 0.3 to +0.3
V
Output Voltage 4
VOUT4
VSSL Output, Ta = 25°C
VSSL – 0.3 to +0.3
V
Storage Temperature
TSTG
—
–55 to +150
°C
RECOMMENDED OPERATING CONDITIONS (3.0 V Spec.)
(VDD = 0 V)
Parameter
Operating Temperature
Symbol
Condition
Range
Unit
—
–40 to +85
°C
Top
Using LCD driver with
"duty 1/2"
Operating Voltage
VSS2
Except using LCD driver
with "duty 1/2"
External 400 kHz RC Oscillator
Resistance
Crystal Oscillation Frequency
–3.5 to –2.2
V
–3.5 to –2.0
ROS
—
90 to 500
kW
fXT
—
30 to 66
kHz
24/39
¡ Semiconductor
MSM64162
ELECTRICAL CHARACTERISTICS (3.0 V Spec.)
DC Characteristics
(VDD = 0 V, VSS2 = –3.0 V, Ta = –40 to +85°C unless otherwise specified)
Parameter
Condition
Symbol
VSS1 Voltage
VSS1
Ca, Cb, C12 = 0.1 mF
VSS3 Voltage
VSS3
Ca, Cb, C12 = 0.1 mF
VSSL Voltage
VSSL
Crystal Oscillation
Start Voltage
Crystal Oscillation
Hold Voltage
Crystal Oscillation
Stop Detection Time
Internal Crystal
Oscillator Capacitance
External Crystal
Oscillator Capacitance
Internal Crystal
Oscillator Capacitance
Internal 400k RC
Oscillator Capacitance
400k RC Oscillation
Frequency
POR Generation
Voltage
POR Non-generation
Voltage
Battery Check
Reference Voltage
VRB Temperature
Variation
VSTA
+100%
–50%
+100%
–50%
—
Oscillation start time:
within 5 seconds
Min.
Typ.
Max.
Unit
–1.7
–1.5
–1.3
V
–4.7
–4.5
–4.3
V
–1.9
–1.3
–0.6
V
—
—
–2.0
V
VHOLD
—
—
—
–2.0
V
TSTOP
—
0.1
—
1000
ms
CG
—
10
15
20
pF
10
—
30
pF
CGEX
When external CG used
CD
—
10
15
20
pF
COS
—
8
12
16
pF
300
400
620
kHz
–0.7
—
0
V
–3.0
—
–2.0
V
–0.73
–0.63
–0.53
V
fOSC
VPOR1
VPOR2
VRB
External resistor ROS = 100 kW
VSS2 = –2.0 to –3.5 V
When VSS2 is between VPOR1
and –3.0 V
No POR when VSS2 is between
VPOR2 and –3.0 V
Ta = 25°C
Measuring
Circuit
1
2
DVRB
—
—
–2.0
—
mV/°C
Notes: 1. "POR" denotes Power On Reset.
2. "TSTOP" indicates that if the crystal oscillator stops over the value of TSTOP, the
system reset occurs.
25/39
¡ Semiconductor
MSM64162
DC Characteristics (continued)
(VDD = 0 V, VSS2 = –3.0 V, Ta = –40 to +85°C unless otherwise specified)
Parameter
Symbol
Supply Current 1
IDD1
Supply Current 2
IDD2
Supply Current 3
IDD3
Condition
Min.
Typ.
Max.
Unit
Ta = –40 to +40°C
—
1.5
4.5
mA
(400k RC oscillation halt) Ta = +40 to +85°C
—
1.5
30
mA
CPU in halt state
CPU in operating state Ta = –40 to +40°C
—
5.0
15
mA
(400k RC oscillation halt) Ta = +40 to +85°C
—
5.0
40
mA
—
220
450
mA
RT0 = 10 kW
—
300
450
mA
RT0 = 2 kW
—
1300
2000
mA
—
55
150
mA
Measuring
Circuit
CPU in operating state
(400k RC oscillation in operation)
ROS = 100kW
1
CPU in halt state
(400k RC oscillation
Supply Current 4
IDD4
halt), RC oscillator for
A/D converter is in
operating state
Battery check circuit in operating
Supply Current 5
IDD5
state, CPU in operating state
(400k RC oscillation halt)
26/39
¡ Semiconductor
MSM64162
DC Characteristics (continued)
(VDD = 0 V, VSS1 = VSSL = –1.5 V, VSS2 = –3.0 V, VSS3 = –4.5 V,
Ta = –40 to +85°C unless otherwise specified)
Parameter
(Pin Name)
Symbol
Condition
Min.
Typ.
Max.
Unit
IOH1
VOH1 = –0.5 V
–6.0
–2.0
–0.7
mA
IOL1
VOL1 = VSS2 + 0.5 V
3.0
8.0
25
mA
IOH2
VOH2 = –0.5 V
–6.0
–2.0
–0.7
mA
IOL2
VOL2 = VSS2 + 0.5 V
0.7
2.0
6.0
mA
Output Current 3
(BD)
IOH3
VOH3 = –0.7 V
–6.0
–2.0
–0.7
mA
IOL3
VOL3 = VSS2 + 0.7 V
0.7
2.0
6.0
mA
Output Current 4
(RT0, RT1, RS0, RS1,
CRT0, CS0, CS1)
IOH4
VOH4 = –0.1 V
–2.5
–1.3
–0.7
mA
IOL4
VOL4 = VSS2 + 0.1 V
0.7
1.3
2.5
mA
Output Current 5
(When L16 to L23 are
configured as output
ports)
IOH5
VOH5 = –0.5 V
–1.5
–0.6
–0.15
mA
IOL5
VOL5 = VSS2 + 0.5 V
0.15
0.6
1.5
mA
Output Current 6
(OSC2)
IOH6
VOH6 = –0.5 V
–6.0
–2.0
–0.7
mA
IOL6
VOL6 = VSS2 + 0.5 V
0.7
2.0
6.0
mA
IOH7
VOH7 = –0.2 V
(VDD level)
—
—
–4.0
mA
IOMH7
VOMH7 = VSS1 + 0.2 V (VSS1 level)
4.0
—
—
mA
IOMH7S
VOMH7S = VSS1 – 0.2 V (VSS1 level)
—
—
–4.0
mA
IOML7
VOML7 = VSS2 + 0.2 V (VSS2 level)
4.0
—
—
mA
IOML7S
VOML7S = VSS2 – 0.2 V (VSS2 level)
—
—
–4.0
mA
(VSS3 level)
4.0
—
—
mA
Output Current 1
(P1.0)
Output Current 2
(P1.1 to P1.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
Output Current 7
(L0 to L23)
Output Leakage Current
(P1.0 to P1.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
(RT0, RT1, RS0, RS1,
CRT0, CS0, CS1)
Measuring
Circuit
2
IOL7
VOL7 = VSS3 + 0.2 V
IOOH
VOH = VDD
—
—
0.3
mA
IOOL
VOL = VSS2
–0.3
—
—
mA
27/39
¡ Semiconductor
MSM64162
DC Characteristics (continued)
(VDD = 0 V, VSS1 = VSSL = –1.5 V, VSS2 = –3.0 V, VSS3 = –4.5 V,
Ta = –40 to +85°C unless otherwise specified)
Parameter
(Pin Name)
Symbol
Condition
Min.
Typ.
Max.
Unit
IIH1
VIH1 = VDD (when pulled down)
30
90
300
mA
IIL1
VIL1 = VSS2 (when pulled up)
–300
–90
–30
mA
IIH1Z
VIH1 = VDD (in a high impedance state)
0
—
1.0
mA
IIL1Z
VIL1 = VSS2 (in a high impedance state) –1.0
—
0
mA
IIH2
VIH2 = VDD (when pulled down)
30
90
300
mA
IIH2Z
VIH2 = VDD (in a high impedance state)
0
—
1.0
mA
IIL2Z
VIL2 = VSS2 (in a high impedance state)
–1.0
—
0
mA
IIL3
VIL3 = VSS2 (when pulled up)
–300
–110
–10
mA
IIH3Z
VIH3 = VDD (in a high impedance state)
0
—
1.0
mA
IIL3Z
VIL3 = VSS2 (in a high impedance state)
–1.0
—
0
mA
Input Current 4
(RESET, TST1, TST2)
IIH4
VIH4 = VDD
0
—
1.0
mA
IIL4
VIL4 = VSS2
–3.0
–1.5
–0.75
mA
Input Voltage 1
(P0.0 to P0.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
VIH1
—
–0.6
—
0
V
VIL1
—
–3.0
—
–2.4
V
Input Voltage 2
(IN0, IN1, OSC1)
VIH2
—
–0.6
—
0
V
VIL2
—
–3.0
—
–2.4
V
Input Voltage 3
(RESET, TST1, TST2)
VIH3
—
–0.6
—
0
V
VIL3
—
–3.0
—
–2.4
V
Input Current 1
(P0.0 to P0.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
Input Current 2
(IN0, IN1)
Input Current 3
(OSC1)
Measuring
Circuit
3
4
28/39
¡ Semiconductor
MSM64162
DC Characteristics (continued)
(VDD = 0 V, VSS1 = VSSL = –1.5 V, VSS2 = –3.0 V, VSS3 = –4.5 V,
Ta = –40 to +85°C unless otherwise specified)
Parameter
(Pin Name)
Symbol
Condition
Min.
Typ.
Max.
Unit
0.2
0.5
1.0
V
Hysteresis Width
(P0.0 to P0.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
DVT1
Hysteresis Width
(RESET, TST1, TST2)
DVT2
—
0.2
0.5
1.0
V
Input Pin Capacitance
(P0.0 to P0.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
CIN
—
—
—
5.0
pF
—
Measuring
Circuit
4
1
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¡ Semiconductor
MSM64162
Measuring circuit 1
CS0
RT0
RI0
RT0
CS0
IN0
XT
Crystal
32.768 kHz
OSC1
ROS
XT
OSC2
C1
C12
C2
VSSL
VDD
VSS2
A
Cl
VSS1
VSS3
Ca
V
Cb
V
V
Cl
Ca, Cb, C12
ROS
RT0
CS0
RI0
: 0.47 mF
: 0.1 mF
: 100 kW
: 10 kW/2 kW
: 820 pF
: 10 kW
Measuring circuit 2
(*1)
INPUT
VIH
OUTPUT
(*2)
A
VIL
VDD
VSS1
VSS2
VSS3
VSSL
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¡ Semiconductor
MSM64162
Measuring circuit 3
INPUT
A
OUTPUT
(*3)
VDD
VSS1
VSS2
VSS3
VSSL
(*3)
INPUT
VIH
OUTPUT
Measuring circuit 4
Waveform
Monitoring
VIL
VDD
VSS1
VSS2
VSS3
VSSL
*1 Input logic circuit to determine the specified measuring conditions.
*2 Measured at the specified output pins.
*3 Measured at the specified input pins.
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¡ Semiconductor
MSM64162
A/D Converter Characteristics
(VDD = 0 V, VSS2 = –3.0 V, Ta = –40 to +85°C unless otherwise specified)
Parameter
Symbol
Resistor
for Oscillation
RS0, RS1,
RT0,
RT0-1,
RT1
Input Current
Limiting Resistor
RI0, RI1
Condition
CS0, CT0, CS1 ≥ 740 pF
—
Min.
Typ.
Max.
Unit
1.0
—
—
kW
1.0
10
—
kW
Measuring
Circuit
5
Oscillation
Frequency
RS•RT Oscillation
Frequency Ratio(*)
*
fOSC1
Resistor for oscillation = 2 kW
200
239
277
kHz
fOSC2
Resistor for oscillation = 10 kW
46.5
55.4
64.3
kHz
fOSC3
Resistor for oscillation = 200 kW
2.79
3.32
3.85
kHz
Kf1
RT0, RT0-1, RT1 = 2 kW
4.115
4.22
4.326
—
Kf2
RT0, RT0-1, RT1 = 10 kW
0.990
1.0
1.010
—
Kf3
RT0, RT0-1, RT1 = 200 kW
0.0573 0.0616 0.0659
—
Kfx is the ratio of the oscillation frequency by a sensor resistor to the oscillation frequency
by a reference resistor in the same condition.
Kfx =
fOSCX (RT0–CS0 Oscillation)
fOSCX (RS0–CS0 Oscillation) ,
(x = 1, 2, 3)
fOSCX (RT0-1–CS0 Oscillation)
fOSCX (RS0–CS0 Oscillation)
fOSCX (RT1–CS1 Oscillation)
, fOSCX (RS1–CS1 Oscillation)
32/39
¡ Semiconductor
MSM64162
Measuring circuit 5
RT0-1
RT0
CT0
RS0
CS0
(CROSC0)
RI0
RI1
CS1
RS1
RT1
(CROSC1)
Oscillation Mode Designation
RT1 RS1 CS1 IN1
IN0 CS0 RS0
CRT0
RT0
RESET
TST1
P3.3
TST2
P0.0
D. U. T.
Frequency
Measurement
(fOSCX)
P0.1
P0.2
P0.3
VDD
VSS2
VSSL
Cl
RT0, RT0-1, RT1 = 2 kW/10 kW/200 kW
RS0, RS1 = 10 kW
RI0, RI1 = 10 kW
CS0, CT0, CS1 = 820 pF
Cl = 0.47 mF
33/39
¡ Semiconductor
MSM64162
FUNCTIONAL DESCRIPTION
• A/D converter (ADC)
The MSM64162 has a built-in 2-channel RC oscillation type A/D converter. The A/D converter
is composed of a 2-channel oscillation circuit, Counter A (CNTA0-4, a 4.8-digit decade counter),
Counter B (CNTB0-3, a 14-bit binary counter), and A/D Converter Control Registers 0 and 1
(ADCON0, ADCON1).
By counting oscillation frequencies that vary depending on a resistor or capacitor connected to
the RC oscillation circuit, the A/D converter converts resistance values or capacitance values to
corresponding digital values. By using a thermistor or humidity sensor as a resistance, a
thermometer or a hygrometer can be constructed. By applying a separate sensor to each channel
of the 2-channel RC oscillation circuit, it is also possible to extend measure ranges or measure at
two places.
• LCD driver (LCD)
The MSM64162 has a built-in LCD driver for 24 outputs.
The LCD driver consists of 21 ¥ 4-bit display registers (DSPR0-20), the Display Control Register
(DSPCON), a 24-output LCD driver circuit, and a bias generation circuit (BIAS).
There are three types of driving methods: 1/4 duty, 1/3 duty and 1/2 duty. Software selects the
duty mode.
A mask option can select either a common driver or a segment driver for each LCD driver pin.
A mask option can also specify assignment of each bit of the display register to each segment.
All the display registers must be selected by a mask option.
L16 to L23 of the LCD driver can be configured to be output ports by a mask option.
The relationship between the duty, the bias method, and the maximum segment number follows:
1/4 duty 1/3 bias method ------- 80 segments
1/3 duty 1/3 bias method ------- 63 segments
1/2 duty 1/2 bias method ------- 44 segments
• Buzzer driver (BD)
The MSM64162 has a built-in buzzer driver with 2 buzzer output frequencies and 4 buzzer output
modes. Each buzzer output is selected by the Buzzer Control Register (BDCON) and the Buzzer
Frequency Control Register (BFCON).
• Capture circuit (CAPR)
The MSM64162 captures 32 Hz to 256 Hz output of the time base counter at the falling of Port 0.0
or 0.1 (P0.0 or P0.1) to "L" level when the pull-up resistor input is chosen, or at the rising to "H"
level when the pull-down resistor input is chosen. The capture circuit is composed of the Capture
Control Register (CAPCON) and the Capture Registers (CAPR0, CAPR1) that fetch output from
the time base counter.
• Watchdog timer (WDT)
The MSM64162 has a built-in watchdog timer to detect CPU malfunction. The watchdog timer
is composed of a 6-bit watchdog timer counter (WDTC) to count a 16 Hz output and a watchdog
timer control register (WDTCON) to reset WDTC.
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¡ Semiconductor
MSM64162
• Clock generation circuit (2CLK)
The clock generation circuit (2CLK) in the MSM64162 contains a 32.768 kHz crystal oscillation
circuit, a 400 kHz RC oscillation circuit, and a clock control port. This circuit generates the system
clock (CLK) and the time base clock (32.768 kHz).
The system clock drives the CPU while the time base clock drives the time base counter and the
buzzer driver.
Via the contents of the frequency Control Register (FCON), the system clock can be switched
between 32.768 kHz (the output of the crystal oscillation circuit) and 400 kHz (the output of the
RC oscillation circuit).
Note: The oscillation frequency of the RC oscillation circuit varies depending on the value of
an external resistor (ROS), operating power supply voltage (VDD), and ambient
temperatures (Ta).
• Time base counter (TBC)
The MSM64162 has a built-in time base counter (TBC) that generates clocks to be supplied to
internal peripheral circuits. The time base counter is composed of 15 binary counters. The count
clock of the time base is driven by the oscillation clock (32.768 kHz) of the crystal oscillation
circuit. The output of the time base counter is used for the buzzer driver, the system reset circuit,
the watchdog timer, the time base interrupt, the sampling clocks of each port, and the capture
circuit.
• I/O port
Input-output ports (P2, P3) (8 bits)
Input port (P0) (4 bits)
Output port (P1) (4 bits)
: Pull-up (pull-down) resistor input or highimpedance input, CMOS output or NMOS
open drain output: these can be specified for
each bit; external 0 interrupt
: Pull-up (pull-down) resistor input or highimpedance input; external 1 interrupt
: CMOS output or NMOS open drain output
• Interrupt (INTC)
The MSM64162 has 9 interrupt sources (9 vector addresses), of which two are external interrupts
from ports and seven are internal interrupts.
Of the nine interrupt sources, only the watchdog interrupt cannot be disabled (non-maskable
interrupt). The other eight interrupts are controlled by the master interrupt enable flag (MI) and
the interrupt enable registers (IE0, IE1 and IE2). When an interrupt condition is met, the CPU
branches to a vector address corresponding to the interrupt source.
• Battery check circuit (BC)
The battery check circuit (BC) detects the level of the supply voltage by comparing the voltage
generated by an external supply-voltage dividing resistor (RBLD) with the internal reference
voltage (Vrb).
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ROS
XT
XT
RESET
P1.0
P1.1
P1.2
P1.3
P0.0
P0.1
P0.2
P0.3
L23
L0
VDD
C2
C1
C
VSS3 12
MSM64162-xxx
(1.5 V spec.)
VSS2
IN0
CS0
RS0
CRT0
RT0
IN1
CS1
RS1
RT1
BD
P3.3
1.5 V Spec. Application Circuit
Crystal
32.768 kHz
OSC2
OSC1
Switch matrix (4 ¥ 4)
VSS1
VSSL
TST2
TST1
RT0
RT1 RS1 CS1 RI1
RS0
RI0
CS0
¡ Semiconductor
APPLICATION CIRCUITS
L C D
C1
1.5 V
Cb
Ca
Cl
• Temperature
measurement
by two thermistors
• CG of crystal
oscillator : Internal
Buzzer
36/39
MSM64162
OSC monitor
CGEX
L23
L0
VDD
C2
XT
XT
RESET
P1.0
P1.1
P1.2
P1.3
P0.0
P0.1
P0.2
P0.3
MSM64162-xxx
(3.0 V spec.)
C2
C1 C
12
VSS3
3V
Cb
VSS2
VSS1
VSSL
TST2
TST1
IN0
CS0
RS0
CRT0
RT0
IN1
CS1
RS1
RT1
BD
P3.3
P3.1
3.0 V Spec. Application Circuit
Crystal
32.768 kHz
OSC2
OSC1
Switch matrix (4 ¥ 4)
RT0
RT1 RS1 CS1 RI1
RS0
CS0
RI0
¡ Semiconductor
ROS
APPLICATION CIRCUITS (continued)
L C D
Ca
Cl
• Temperature
measurement
by two thermistors
• Battery check
circuit is used
• CGEX of crystal
oscillator : External
RBLD
Buzzer
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MSM64162
OSC monitor
¡ Semiconductor
MSM64162
PACKAGE DIMENSIONS
(Unit : mm)
QFP64-P-1420-1.00-BK
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
1.25 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
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¡ Semiconductor
MSM64162
(Unit : mm)
QFP80-P-1420-0.80-BK
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Epoxy resin
42 alloy
Solder plating
5 mm or more
Package weight (g)
1.27 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
39/39