E2D0032-39-21 ¡ Semiconductor MSM6587 ¡ Semiconductor This version: Feb. 1999 MSM6587 Previous version: May. 1997 524,288-Word x 1-Bit Serial Register GENERAL DESCRIPTION The MSM6587 is a serial register in 524,288 words x 1 bit configuration featuring medium speed operation with low-power consumption. The MSM6587 has a built-in internal address generator circuit allowing continuous serial read/write operation by external clock input. The internal address is automatically incremented or decremented by one by read/write operation. Address increment or decrement can be selected by external input. Address designation in units of 1024 words in the direction of words is possible by an external serial address input. A refresh timer and refresh counter are built in to eliminate the need of the external refresh circuit and to realize low power consumption. 18-pin plastic QFJ (PLCC) is used as the package and the operating temperature range is between 0°C and 70°C. The MSM6587 is suitable for storing large capacity data with battery backup. A solid state recording and playback system can easily be constructed in combination with OKI’s voice synthesizer ICs. FEATURES • Configuration : 524,288 x 1 bit • Serial access operation Serial access time : 1.5 ms (3.0 ms) Serial read/write cycle time : 2.0 ms (4.0 ms) Fast mode read/write cycle time : 0.4 ms (0.4 ms) Times in parentheses indicate ones in self-refresh mode. • Low current consumption : 100 mA max. (for data holding, Vcc=4.0 V) • Wide operating supply voltage range : Single 3.5 to 5.5 V • Auto-refresh/self-refresh changeable • Package: 18-pin plastic QFJ (PLCC) (QFJ18-P-R290-1.27) (Product name : MSM6587JS) 1/13 ¡ Semiconductor MSM6587 BLOCK DIAGRAM TEST VCC VBB Generator SAD AU/D SAS FAM (TEST) RWCK 524,288 Data Register DIN I/O Control DOUT Y-decoder/sense Amp Refresh Counter Timing Generator TEST RFSH (TEST) Load Clock VSS X-decoder/ Driver Clock U/D X-address Register Address Multiplexer CS Sin Address Register Pout U/D Y-address Counter Reset Clock Write Clock Generator WE Clock Refresh Timer RS/A (TEST) TAS PIN CONFIGURATION (TOP VIEW) WE DIN VSS DOUT 2 1 18 17 TEST 3 16 TEST CS 4 15 AU/D NC 5 14 NC SAD 6 13 RWCK SAS 7 12 FAM (TEST) 8 9 10 11 TAS VCC RS/A RFSH (TEST) (TEST) NC: No connection 18-Pin Plastic QFJ 2/13 ¡ Semiconductor MSM6587 PIN DESCRIPTIONS Pin Symbol 1 DIN Data input Write enable Description 2 WE 3, 16 TEST Test input 4 CS Chip select 6 SAD Serial address data 7 SAS TAS Serial address strobe Power supply (+5V) 8 Transfer address strobe 9 VCC 10 RS/A (TEST) Self-refresh/auto-refresh select (Test input) 11 RFSH (TEST) Refresh clock input (Test input) 12 FAM (TEST) Fast access mode select (Test input) 13 RWCK Read/write clock 15 AU/D Address up/down select 17 DOUT Data output 18 VSS Ground (0V) 3/13 ¡ Semiconductor MSM6587 ABSOLUTE MAXIMUM RATINGS Parameter Symbol Condition Rating Unit Terminal Voltage VT Ta = 25°C, relative to VSS –1.0 to +7.0 V Output Short-Circuit Current IOS Ta = 25°C 50 mA Power Dissipation PD Ta = 25°C 1 W Operating Temperature Top — 0 to 70 °C Storage Temperature TSTG — –55 to +150 °C RECOMMENDED OPERATING CONDITIONS (Ta = 0 to 70°C) Parameter Symbol Min. Typ. Max. Unit Supply Voltage VCC 3.5 5.0 5.5 V Supply Voltage VSS 0 0 0 V "H" Input Voltage VIH VCC – 0.5 VCC VCC + 0.5 V "L" Input Voltage VIL –0.5 0 +0.5 V ELECTRICAL CHARACTERISTICS DC Characteristics (VCC = 3.5 V to 5.5 V, Ta = 0 to 70°C) Symbol Condition Min. Max. Unit "H" Output Voltage Parameter VOH IOH = –0.5 mA VCC – 0.5 — V "L" Output Voltage VOL IOL = 0.5 mA — 0.4 V Input Leakage Current ILI VI = 0 V to VCC –1 +1 mA Output Leakage Current ILO VO = 0 V to VCC –1 +1 mA Supply Current (in operating state) ICC1 VCC = 4 V, tRWC = 2 µs — 5 mA Supply Current (in standby state) ICC2 VCC = 4V — 100 mA Supply Current (FAM) ICC3 VCC = 4 V, tRWC = 0.4 ms — 15 mA 4/13 ¡ Semiconductor MSM6587 AC Characteristics (VCC = 3.5 V to 5.5 V, Ta = 0 to 70°C) Parameter Symbol MSM6587-SELF Min. Max. MSM6587-AUTO Min. Max. Unit Refresh Cycle tREF — — — 100 ms Read/Write Cycle Time tRWC 4,000 — 2,000 — ns Access Time tACC — 3,000 — 1,500 ns Output Turn-off Delay Time tOFF 0 50 0 50 ns Input Signal Rise/Fall Time tT 3 50 3 50 ns RWCK Precharge Time tRWP 1,000 — 500 — ns RWCK Pulse Width tRW 3,000 10,000 1,500 10,000 ns SAS Cycle Time tSSC 100 — 100 — ns SAS Precharge Time tSAP 50 — 50 — ns SAS Pulse Width tSAS 50 — 50 — ns Address Setup Time tAS 0 — 0 — ns Address Hold Time tAH 50 — 50 — ns TAS Setup Time tATS 50 — 50 — ns TAS to RWCK Setup Time tTRS 50 — 50 — ns TAS Pulse Width tTAS 50 — 50 — ns Read Command Setup Time tRRS 0 — 0 — ns Read Command Hold Time tRRH 250 — 250 — ns Write Command Setup Time tWRS 0 — 0 — ns Write Command Hold Time tWRH 50 — 50 — ns Write Command Pulse Width tWP 50 — 50 — ns WE to RWCK Lead Time tRWL 50 — 50 — ns tDS 0 — 0 — ns tDH 50 — 50 — ns tRWD 100 — 100 — ns Data Setup Time Data Hold Time RWCK to WE Delay Time AU/D Setup Time tUDS 0 — 0 — ns AU/D Hold Time tUDH 50 — 50 — ns AU/D to TAS Setup Time tUDTS 0 — 0 — ns RFSH Setup Time tRFS — — 500 — ns RFSH Precharge Time tRFP — — 500 — ns RFSH Pulse Width tRF — — 1,500 10,000 ns RFSH RWCK Precharge Time tRRP — — 500 — ns Fast RWCK Precharge Time tFC 400 — 400 — ns Fast RWCK Mode Cycle tFAC — 300 — 300 ns Fast Mode Access Time tFCP 100 — 100 — ns Fast RWCK Mode Cycle Time tFR 300 — 300 — ns Fast Mode Setup Time tFS 0 — 0 — ns Fast Mode Hold Time tFH 50 — 50 — ns 5/13 ¡ Semiconductor MSM6587 AC Characteristics (Continued) Parameter Fast Mode Width Symbol tFCC MSM6586-SELF MSM6586-AUTO Unit Min. Max. Min. Max. 4,000 100,000 2,000 100,000 ns Slow Mode Setup Time tSS 0 — 0 — ns Slow Mode Hold Time tSH 50 — 50 — ns Note: 1. Up/down switching for internal addresses is not available in fast mode. 2. Switching to the fast mode should be made satisfying the timings of tFS and tSS at the "L" level of RWCK. 6/13 tRW RWCK tSSC tUDS tRWP tRW tUDH tUDTS tSAS tTRS tSAP SAS tAS SAD (Note) ¡ Semiconductor tRWC TIMING DIAGRAMS AU/D Read/Write/Read Modify Write Cycle , , , , ,, , , CS tAH A0 A1 A2 A9 tATS tTAS tRWL TAS tRWD tRRS tWP tWRH tWRS tRRH WE tDH tDS DIN DY1 tACC DY2 tOFF XnY0 XnY1 High-Z 7/13 Note: Out of ten bits from A0 to A9, only the nine bits from A0 to A8 are effective. Fix A9 to "L". MSM6587 DOUT tDH tDS ¡ Semiconductor SAS Address Up/Down Select Mode CS SAD TAS AU/D RWCK DOUT XnY0 XnY1 XnY1023 Xn+1Y0 Xn+1Y1 XmY1023 XmY1022 XmY1 XmY0 Xm–1Y1023 MSM6587 8/13 ¡ Semiconductor Auto-Refresh Mode CS TAS RS/A RWCK tRFS tRRP WE DIN DOUT XnY0 XnY1 XnY2 XnY4 XnY5 XnY6 XnY7 RFSH tRFP 9/13 MSM6587 tRF ¡ Semiconductor Fast Access Mode CS SAS SAD TAS AU/D tFR tFCP RWCK tFS tFCC tSS tSH FAM tFAC DOUT XnY0 XnYn Yn+1 Yn+3 Ym+1 Ym+3 Ym+4 Y1021 Y1023 Xn+1Y0 Y2 Y3 Y4 Yn+2 Ym+2 Ym+5 Y1022 Y1 Xn+1Y3 Xn+1Y2 MSM6587 10/13 ¡ Semiconductor MSM6587 FUNCTIONAL DESCRIPTION Serial Address Input (SAD) Pin for inputting the start address for read/write. Address data can be input in units of 1024 words. The 1,024 address data can be input as 10-bit (A0-A9) serial from the SAD pin. (A0-A8 has enable address, A9 keeps "L".) Serial Address Strobe (SAS) Pin for the clock used to store the serial address data into the internal register. Address Transfer Strobe (TAS) Input pin for setting the serial address data stored in the address register to the internal address counter. When the TAS falls, and the Y address is set to address 0 in the increment mode or to address 1023 in the decrement mode. Read/Write Clock (RWCK) Input pin for the data register information read/write clock. Internal operation starts at the falling edge of RWCK. The information in the data register is output to the DOUT pin in the read mode, and the information at the DIN pin is written into the data register in the write mode. The internal address counter is automatically incremented or decremented also when RWCK falls. Write Enable (WE) Input pin for selecting the read mode, write mode or read modify write mode. The read mode is set when WE is "H", and the write mode is set when WE is "L". When WE falls from "H" to "L" while RWCK is active, the read modify write mode is set. Data Input (DIN) Input pin for write data. The information at the data input pin is stored at the falling edge of RWCK in the write mode, and at the falling edge of WE in the read modify write mode. Data Output (DOUT) The data output pin is always kept in the high impedance state when RWCK or CS is kept at "H". When "H" or "L" information is read in the read operation, the output pin is set to "H" or "L" and holds the read information until RWCK is again set to "H". In the early write mode the output pin maintains the high impedance state, so I/O common operation by connecting DIN and DOUT is possible. Address Up/Down Select (AU/D) Input pin for selecting the direction of automatic address updating. When the TAS signal is input with the AU/D pin set to "H", the internal address counters are set to the externally set address for X and to address 0 for Y. Then the address is incremented by 1 every time RWCK is input. When the TAS signal is input with the AU/D pin set to "L", the internal address counters are set to the externally set address in the same way for X but set to address 1023 for Y. Then the address is decremented by 1 every time RWCK is input. In either case, the X address is automatically incremented or decremented by 1 when read/write operation for 1024 words ends. The AU/D pin setting change is possible in any read/write cycle so long as the timing specifications for tUDS, tUDH are satisfied. 11/13 ¡ Semiconductor MSM6587 Chip Select (CS) Input pin for disabling all input and output pins. This pin enables parallel use of multiple MSM6587s by connecting the data input and output pins. Self/Auto Refresh Select (RS/A (TEST)) Pin for selecting a refresh mode in order to retain memory cell data. If the RS/A pin is set to "L" level, the self-refresh mode is selected and no external refresh control is required. If the RS/A pin is set to "H" level, the auto-refresh mode is selected and refresh operation is required to retain memory cell data. Refresh Clock Input (RFSH (TEST)) Input pin for controlling the external refresh when the auto refresh mode is selected. When the auto-refresh mode is selected, 1024 refresh operations are required within 100ms via the RFSH pin while the RWCK is at "H" level. Fast Access Mode Select (FAM (TEST)) Pin for fast read/write operations. Fast read/write is possible by keeping the FAM pin at "L" level. The fast access mode is set or released by inputting "L" level or "H" level to the FAM pin when the RWCK pin is at "L" level, and when tFS and tSS are satisfied. When 1024-word data access is complete, be sure to insert a normal cycle in order to increment or decrement the X address. Test (TEST, TEST) The TEST pin is fixed to "L" level. The TEST pin is fixed to "H" level. Turning the power ON To stabilize the device, it is required to pause for over 100ms after the VCC reaches the specified voltage. Then it is needed to add eight or more RWCK cycles (read cycles or pseudo data write cycles). 12/13 ¡ Semiconductor MSM6587 PACKAGE DIMENSIONS (Unit : mm) QFJ18-P-R290-1.27 Spherical surface Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.50 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 13/13 E2Y0002-29-11 NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. 3. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. 4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. 5. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party’s right which may result from the use thereof. 6. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. 8. No part of the contents cotained herein may be reprinted or reproduced without our prior permission. 9. MS-DOS is a registered trademark of Microsoft Corporation. Copyright 1999 Oki Electric Industry Co., Ltd. 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