Order this document by MC12022A/D MC12022A Consider MC12052A for New Designs MC12022B 1.1GHz Dual Modulus Prescaler The MC12022A can be used with CMOS synthesizers requiring positive edges to trigger internal counters such as Motorola’s MC145XXX series in a PLL to provide tuning signals up to 1.1GHz in programmable frequency steps. The MC12022B can be used with CMOS synthesizers requiring negative edges to trigger internal counters. A Divide Ratio Control (SW) permits selection of a 64/65 or 128/129 divide ratio as desired. The Modulus Control (MC) selects the proper divide number after SW has been biased to select the desired divide ratio. • • • • • • MECL PLL COMPONENTS ÷64/65, ÷128/129 DUAL MODULUS PRESCALER SEMICONDUCTOR TECHNICAL DATA 1.1 GHz Toggle Frequency Supply Voltage of 4.5 to 5.5 V 8 1 Low–Power 7.5 mA Typical Operating Temperature Range of –40 to +85°C D SUFFIX PLASTIC PACKAGE CASE 751 (SO–8) Short Setup Time (tset) 16ns Maximum @ 1.1 GHz Modulus Control Input Level Is Compatible With Standard CMOS and TTL. Maximum Input Voltage Should Be Limited to 6.5 Vdc FUNCTIONAL TABLE SW MC Divide Ratio H H 64 H L 65 L H 128 L L 129 8 1 P SUFFIX PLASTIC PACKAGE CASE 626 NOTES: 1. SW: H = VCC, L = Open. A logic L can also be applied by grouunding this pin, but this is not recommended due to increased power soncumption. 2. MC: H = 2.0 V to VCC, L = GND to 0.8 V. Figure 1. Logic Diagram (MC12022A) D Q D QB C Q D QB C M B A PIN CONNECTIONS IN VCC SW OUT Q C QB C In In 1 8 2 7 3 6 4 5 IN NC MC Gnd (Top View) MC ORDERING INFORMATION D Q D D C QB QB D E C Q D F Q C QB G QB C D QB Device H Q SW C S Q Out Operating Temperature Range Package MC12022AD SO–8 MC12022AP Plastic MC12022BD TA = – 40° to +85°C MC12022BP Motorola, Inc. 1997 SO–8 Plastic Rev 3 MC12022A MC12022B MAXIMUM RATINGS Rating Symbol Value Unit VCC –0.5 to + 7.0 Vdc Operating Temperature Range TA –40 to +85 °C Storage Temperature Range Tstg –65 to +150 °C Power Supply Voltage, Pin 2 NOTE; ESD data available upon request. ELECTRICAL CHARACTERISTICS (VCC = 4.5 to 5.5 V; TA = –40°C to 85°C, unless otherwise noted.) Characteristic Toggle Frequency (Sine Wave Input) Symbol Min Typ Max Unit ft 0.1 1.6 1.1 GHz Supply Current Output Unloaded (Pin 2) ICC – 7.5 10 mA Modulus Control Input High (MC) VIH1 2.0 – VCC V Modulus Control Input Low (MC) VIL1 – – 0.8 V Divide Ratio Control Input High (SW) VIH2 VCC VCC VCC Vdc Divide Ratio Control Input Low (SW) VIL2 Open Open Open – Output Voltage Swing (CL = 12 pF; RL = 2.2 kΩ) Vout 1.0 1.6 – Vpp Modulus Setup Time MC to Out tset – 11 16 ns Input Voltage Sensitivity 250–1100 MHz 100–250 MHz Vin 100 400 – – 1500 1500 mVpp Output Current (CL = 12 pF; RL = 2.2 kΩ) IO – 1.5 4.0 mA Figure 2. Typical Output Waveforms 500 m ≈ 20 ns (÷64, 500MHz Input Frequency, VCC = 5.0V, TA = 25°C, Output Loaded) 2 500 m ≈ 20 ns (÷128, 1.1GHz Input Frequency, VCC = 5.0V, TA = 25°C, Output Loaded) MOTOROLA RF/IF DEVICE DATA MC12022A MC12022B Figure 3. Modulus Setup Time Prop. Delay In Out MC Setup MC MC Release Modulus setup time MC to out is the MC setup or MC release plus the prop delay. Figure 4. AC Test Circuit VCC = 4.5 to 5.5 V C3 Sine Wave Generator C1 VCC SW IN 50Ω OUT C2 RL IN MC GND CL EXTERNAL COMPONETS C1 = C2 = 1000 pF C3 = 0.1 µF CL = 12 pF (Including Scope and jig capacitance) RL = 2.2 kΩ MC Input MOTOROLA RF/IF DEVICE DATA 3 MC12022A MC12022B +15.0 +1257.40 +10.0 +707.11 +5.0 +397.64 0 +223.61 –5.0 +125.74 –10.0 +70.71 –15.0 +39.76 –20.0 +22.36 –25.0 +12.57 –30.0 +7.07 –35.0 +3.98 –40.0 +2.24 –45.0 +1.26 –50.0 0 250 500 750 1000 1250 1500 1750 2000 mVrms AMPLITUDE (dBm) Figure 5. Input Signal Amplitude versus Input Frequency Divide Ratio = 8; VCC = 5.0V; TA = 25°C +0.71 2250 FREQUENCY (MHz) Figure 6. Output Amplitude versus Input Frequency 2000 1200 800 mVpp 1600 400 0 250 500 750 1000 1250 1500 1750 2000 0 2250 FREQUENCY (MHz) 4 MOTOROLA RF/IF DEVICE DATA MC12022A MC12022B Figure 7. Typical Input Impedance versus Input Frequency 1000 900 800 700 600 R 500 400 300 200 GHz OHMS 100 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 –100 –200 jX –300 –400 –500 –600 MOTOROLA RF/IF DEVICE DATA 5 MC12022A MC12022B OUTLINE DIMENSIONS 8 P SUFFIX PLASTIC PACKAGE CASE 626–05 ISSUE K 5 –B– 1 NOTES: 1. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 2. PACKAGE CONTOUR OPTIONAL (ROUND OR SQUARE CORNERS). 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 4 F –A– NOTE 2 L C J –T– N SEATING PLANE D M K G H 0.13 (0.005) T A M B M MILLIMETERS MIN MAX 9.40 10.16 6.10 6.60 3.94 4.45 0.38 0.51 1.02 1.78 2.54 BSC 0.76 1.27 0.20 0.30 2.92 3.43 7.62 BSC ––– 10_ 0.76 1.01 DIM A B C D F G H J K L M N INCHES MIN MAX 0.370 0.400 0.240 0.260 0.155 0.175 0.015 0.020 0.040 0.070 0.100 BSC 0.030 0.050 0.008 0.012 0.115 0.135 0.300 BSC ––– 10_ 0.030 0.040 M D SUFFIX PLASTIC SOIC PACKAGE CASE 751–06 (SO–8) ISSUE T D A 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS ARE IN MILLIMETER. 3. DIMENSION D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION. C 5 0.25 H E M B M 1 4 h B e X 45 _ q A C SEATING PLANE L 0.10 A1 B 0.25 6 M C B S A S DIM A A1 B C D E e H h L q MILLIMETERS MIN MAX 1.35 1.75 0.10 0.25 0.35 0.49 0.19 0.25 4.80 5.00 3.80 4.00 1.27 BSC 5.80 6.20 0.25 0.50 0.40 1.25 0_ 7_ MOTOROLA RF/IF DEVICE DATA MC12022A MC12022B Motorola reserves the right to make changes without further notice to any products herein. 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