SEMICONDUCTOR TECHNICAL DATA % # ##! ! " " $ The MC12036 is a 1.1GHz ÷64/65, ÷128/129 dual modulus prescaler used in phase–locked loop (PLL) applications. Stand–By mode is featured to reduce current drain to 0.5mA typical when the standby pin (SB) is switched LOW, disabling the prescaler. On–chip output termination provides sufficient output current to drive a 12pF (typical) high impedance load. The MC12036A can be used with CMOS synthesizers requiring positive edges to trigger internal counters such as Motorola’s MC145xxx series in a PLL to provide tuning signals up to 1.1GHz in programmable frequency steps. The MC12036B can be used with CMOS synthesizers requiring negative edges to trigger internal counters. MECL PLL COMPONENTS ÷64/65, ÷128/129 DUAL MODULUS PRESCALER WITH STAND–BY MODE A Divide Ratio Control (SW) permits selection of a 64/65 or 128/129 divide ratio as desired. The Modulus Control (MC) selects the proper divide number after SW has been biased to select the desired divide ratio. • • • • • • • • P SUFFIX 8–LEAD PLASTIC PACKAGE CASE 626–05 1.1GHz Toggle Frequency Low Power 4.0mA Typical Stand–By Mode On–Chip Output Termination D SUFFIX 8–LEAD PLASTIC SOIC PACKAGE CASE 751–05 Supply Voltage 4.5V to 5.5V Operating Temperature Range of –40°C to +85°C Short Setup Time (tset ) 16ns Maximum @ 1.1GHz Modulus Control Input Level is Compatible With Standard CMOS and TTL FUNCTION TABLE Pinout: 8–Lead Plastic (Top View) IN SB MC GND 8 7 6 5 SW MC H H Divide Ratio 64 H L 65 L H 128 L L 129 Note: SW: H = VCC, L = OPEN MC: H = 2.0V to VCC, L = GND to 0.8V 1 2 3 4 IN VCC SW OUT Design Criteria Internal Gate Count * Value Unit 67 ea Internal Gate Propagation Delay 200 ps Internal Gate Power Dissipation 0.75 mW Speed Power Product 0.15 pJ *Equivalent to a two–input NAND gate. 1/97 Motorola, Inc. 1997 1 REV 2 MC12036A MC12036B MAXIMUM RATINGS Range Unit VCC TA Symbol Power Supply Voltage, Pin 2 Characteristic –0.5 to +7.0 Vdc Operating Temperature Range –40 to +85 °C Tstg MC Storage Temperature Range –65 to +150 °C Modulus Control Input, Pin 6 –0.5 to +6.5 Vdc ELECTRICAL CHARACTERISTICS (VCC = 4.5 to 5.5 Vdc, TA = –40°C to +85°C) Symbol Characteristic Min Typ Max Unit ft ICC Toggle Frequency (Sine Wave Input) 0.1 1.4 1.1 GHz Supply Current (Pin 2) — 4.0 6.5 mA VIH1 VIL1 Modulus Control & Standby Input High (MC & SB) 2.0 — V VIH2 VIL2 Divide Ratio Control Input High (SW) Vout tSET Vin Input Voltage Sensitivity 250–1100 MHz 100–250 MHz ISB Standby Current — — VCC 0.8 VCC OPEN VCC OPEN VCC OPEN Vdc Output Voltage Swing, CL = 8pF 1.0 1.4 — Modulus Setup Time MC to Out — 11 16 Vp–p ns 100 400 — — 1000 1000 mVpp — 0.5 — mA Modulus Control & Standby Input Low (MC & SB) Divide Ratio Control Input Low (SW) D Q D A C D Q QB C C M QB In In — Prop. Delay Q C B V In QB Out MC MC MC Setup SB D Q D D C QB D E QB C Q D F Q C QB D G QB C MC Release QB H Q C S Q Out Modulus setup time MC to out is the MC setup or MC release plus the prop. delay. SW Figure 1. Logic Diagram (MC12036A) 500 m≈ Figure 2. Modulus Setup Time 20 ns 500 m≈ (÷64, 500MHz Input Frequency, VCC = 5.0V, TA = 25°C, Output Loaded) 20 ns (÷128, 1.1GHz Input Frequency, VCC = 5.0V, TA = 25°C, Output Loaded) Figure 3. Typical Output Waveform MOTOROLA 2 HIPERCOMM BR1334 — Rev 4 MC12036A MC12036B VCC = 4.5 to 5.5 V C3 Sine Wave Generator VCC C1 SW IN SB 50 Ω Standby Input OUT C2 CL IN MC GND EXTERNAL COMPONENTS C1 = C2 = 1000pF C3 = 0.1µF CL = 8pF (Including Scope CL = and jig capacitance) MC Input Figure 4. AC Test Circuit 200 150 R 100 MHz 50 0 –50 OHMS –100 –150 –200 –250 –300 –350 –400 –450 jX –500 –550 –600 –650 100 200 300 400 500 600 700 800 900 1000 1100 1200 Figure 5. Typical Input Impedance versus Input Frequency HIPERCOMM BR1334 — Rev 4 3 MOTOROLA MC12036A MC12036B OUTLINE DIMENSIONS 8 P SUFFIX PLASTIC PACKAGE CASE 626–05 ISSUE K 5 –B– 1 NOTES: 1. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 2. PACKAGE CONTOUR OPTIONAL (ROUND OR SQUARE CORNERS). 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 4 F –A– NOTE 2 L DIM A B C D F G H J K L M N C J –T– N SEATING PLANE D M K G H 0.13 (0.005) M T A M 8 C 5 0.25 H E M B M 1 4 B e h A C X 45 _ q SEATING PLANE 0.10 A1 B 0.25 M L C B S A INCHES MIN MAX 0.370 0.400 0.240 0.260 0.155 0.175 0.015 0.020 0.040 0.070 0.100 BSC 0.030 0.050 0.008 0.012 0.115 0.135 0.300 BSC ––– 10_ 0.030 0.040 M D SUFFIX PLASTIC SOIC PACKAGE CASE 751–05 ISSUE R D A B MILLIMETERS MIN MAX 9.40 10.16 6.10 6.60 3.94 4.45 0.38 0.51 1.02 1.78 2.54 BSC 0.76 1.27 0.20 0.30 2.92 3.43 7.62 BSC ––– 10_ 0.76 1.01 S NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS ARE IN MILLIMETERS. 3. DIMENSION D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE MOLD PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A A1 B C D E e H h L q MILLIMETERS MIN MAX 1.35 1.75 0.10 0.25 0.35 0.49 0.18 0.25 4.80 5.00 3.80 4.00 1.27 BSC 5.80 6.20 0.25 0.50 0.40 1.25 0_ 7_ Motorola reserves the right to make changes without further notice to any products herein. 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