PRELIMINARY MQPI-18 ® 28 Volt Input, 7 Amp MIL COTS EMI Filter for V•I Chips Description Typical Applications The MQPI-18 attenuates conducted common-mode (CM) and differential mode (DM) noise for 28 V input MIL PRMs to comply with MIL-461E EMI requirements for conducted noise measurements. The filter operates within the full input operating range of a 28 V MIL PRM and supports 7 A loads up to 60°C without derating. • Military mobile and fixed communications • Radar and Targeting • Missile and Launch systems • Airborne flight management systems Assembly process compatibility • Intended for Pb solder SMT assembly Features • 28 V input, compatible with MIL PRM • Compatible with typical aqueous cleaning processes (open-frame only) • MIL-STD-461E compliant* CE101, CE102, CS101, CS114, C5115, and CS116 • Compatible with most conformal coating compounds [after reflow] (open frame only). • 100 Vdc surge, 100 ms • 1,500 Vdc hi-pot hold off to shield plane • 7 A rating • Efficiency >99% • Low profile LGA package • -55°C to 100°C operation (PCB Temp.) 12.9 x 25.3 x 5 mm Weight = 2.4 grams • Pb solder construction *When combined with MP028 PRMs, and MV036 VTMs Cy1 Cbus Bus– Shield Vi+ Bus+ Out+ MQPI-18 QPI-12 Bus– Out– Cin Vo+ Vi+ PRM Vi– Vo+ VTM Vi– Vo– Load Bus+ Vo– Shield Cy2 Cin: Recommended input capacitance per V•I Chip requirement. Cy1 & Cy2: 4.7 nF, or recommended per V•I Chip requirement. Cbus: 47 uF, 50 V electrolytic in parallel with 2.2 µF, 100 V ceramic. Figure 1 – MQPI-18 Typical application schematic Picor Corporation • www.picorpower.com Figure 2 – MIL-STD-461, CE102 compliance with MQPI-18 using 28 V input MIL PRM and 12 V output MIL VTM MQPI-18 Data Sheet Rev. 1.0 Page 1 of 2 PRELIMINARY Absolute Maximum Ratings – Exceeding these parameters may result in permanent damage to the product. Pins Parameter Notes Min Bus+ to Bus– Input voltage Continuous Bus+ to Bus– Input voltage 100 ms transient -1500 1500 Vdc 7 Adc BUS+ / BUS– to shield plane BUS inputs to shield hipot QPI+ to QPI– Input to output current Package Power dissipation @ 25°C Package Operating temperature PCB to filter interface Package Thermal resistance Free air Package Thermal resistance PCB Package Storage temperature Package Peak reflow temperature 20 s exposure All Pins ESD HBM Max Units -80 80 Vdc -100 100 Vdc Continuous @ 25°C -55 (1) -65 -2 1.50 W 100 °C 75 °C/W 30 °C/W 125 °C 225 °C +2 kV Note 1: PCB layout guidelines will be available in final version of this data sheet. Electrical Characteristics – Parameter limits apply over the operating PCB temperature range unless otherwise noted Parameter Notes Bus+ to Bus- input range Measured at 7 A Min Typ Max Units 80 Vdc (2) 110 mVdc (2) 110 mVdc Bus+ to Out+ voltage drop Measured at 7 A Bus- to Out- voltage drop Measured at 7 A Common mode attenuation VBUS = 28 V Frequency = 1.0 MHz@25ºC 45 dB Differential mode attenuation VBUS = 28 V Frequency = 1.0 MHz@25ºC 75 dB Input bias current at 80 V Input current from Bus+ to Bus- 10 µA Note 2: Derating curve TBD. Pad Description Ordering Information Pin Number Name Description 8, 9 1, 10 6, 7 4, 5 Bus + Bus – Out + Out – 2, 3 Shield Positive bus potential Negative bus potential Positive input to the converter Negative input to the converter Shield connects to system chassis or safety ground. Part Number Description MQPI-18LP MQPI-18LP-01 LGA, Pb solder, lidded package LGA, Pb solder, open-frame package Package Outline Drawing (lidded version) Bottom View Top View 0.400" [10.16mm] 0.232" [5.89mm] 0.232" [5.89mm] 0.057" [1.45mm] 0.057" [1.45mm] 0.996"[25.28mm] 0.096" [2.44mm] 7 6 8 0.200" [5.08mm] 0.508"[12.90mm] 10 5 0.132" [3.35mm] 4 Pin 1 0.196"[4.98mm] 0.15 [0.006] 3 0.200" [5.08mm] 0.200" [5.08mm] 2 0.0900"[2.286mm] 9 1 0.1100"[2.794mm] Pad Detail: 10 Places (Dimensions indicate finished soldermask pad openings) 0.060" [1.52mm] 0.190"[4.826mm] 0.200" [5.08mm] NOTES: 1. Demensions are all in inches [MM]. 2. Top & Bottom Package Planarity:0.15 [0.006] Picor Corporation • www.picorpower.com MQPI-18 Data Sheet Rev. 1.0 11-08 Page 2 of 2