2-Phase Stepper-Motor Driver Bipolar-IC TLE4729G Features • 2 × 0.7 amp. full bridge outputs • Integrated driver, control logic and current control (chopper) • Very low current consumption in inhibit mode • Fast free-wheeling diodes • Max. supply voltage 45 V • Output stages are free of crossover current • Offset-phase turn-ON of output stages • All outputs short-circuit proof • Error-flag for overload, open load, over-temperature • SMD package PG-DSO-24-16 • Green Product (RoHS compliant) • AEC Qualified Type Package TLE4729G PG-DSO-24-16 (SMD) PG-DSO-24-16 Functional Description TLE4729G is a bipolar, monolithic IC for driving bipolar stepper motors, DC motors and other inductive loads that operate by constant current. It is fully pin and function compatible except the current programming is inverse to the TLE4728G with an additional inhibit feature. The control logic and power output stages for two bipolar windings are integrated on a single chip which permits switched current control of motors with 0.7 A per phase at operating voltages up to 16 V. The direction and value of current are programmable for each phase via separate control inputs. In the case of low at all four current program inputs the device is switched to inhibit mode automatically. A common oscillator generates the timing for the current control and turn-on with phase offset of the two output stages. The two output stages in full-bridge configuration include fast integrated freewheeling diodes and are free of crossover current. The device can be driven directly by a microprocessor in several modes by programming phase direction and current control of each bridge independently. Data Sheet 1 V1.2, 2008-03-18 TLE 4729 G With the two error outputs the TLE4729G signals malfunction of the device. Setting the control inputs low resets the error flag and by reactivating the bridges one by one the location of the error can be found. Pin Configuration (top view) TLE4729G Ι 10 Ι 11 Phase 1 OSC GND GND GND GND Q11 R1 +V S Q12 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 Ι 20 Ι 21 Phase 2 Error 1 GND GND GND GND Q21 R2 Error 2 Q22 AEP02195 Figure 1 Data Sheet 2 V1.2, 2008-03-18 TLE 4729 G Pin Definitions and Functions Pin Function 1, 2, 23, 24 Digital control inputs IX0, IX1 for the magnitude of the current of the particular phase. Iset = 450 mA with Rsense = 1 Ω IX1 IX0 Phase Current Example of Motor Status L 0 No current1) L L H 0.155 × Iset Hold H L Iset Normal mode H H 1.55 × Iset Accelerate 1) “No current” in both bridges inhibits the circuit and current consumption will sink below 50 µA (inhibit-mode) 3 Input phase 1; controls the current through phase winding 1. On H-potential the phase current flows from Q11 to Q12, on L-potential in the reverse direction. 5 … 8, 17 … 20 Ground; all pins are connected at leadframe internally. 4 Oscillator; works at approx. 25 kHz if this pin is wired to ground across 2.2 nF. 10 Resistor R1 for sensing the current in phase 1. 9, 12 Push-pull outputs Q11, Q12 for phase 1 with integrated free-wheeling diodes. 11 Supply voltage; block to ground, as close as possible to the IC, with a stable electrolytic capacitor of at least 47 µF in parallel with a ceramic capacitor of 100 nF. 14 Error 2 output; signals with “low” the errors: short circuit to ground of one or more outputs or over-temperature. 13, 16 Push-pull outputs Q22, Q21 for phase 2 with integrated free-wheeling diodes. 15 Resistor R2 for sensing the current in phase 2. 21 Error 1 output; signals with “low” the errors: open load or short circuit to + VS of one or more outputs or short circuit of the load or overtemperature. 22 Input phase 2; controls the current flow through phase winding 2. On H-potential the phase current flows from Q21 to Q22, on L-potential in the reverse direction. Data Sheet 3 V1.2, 2008-03-18 TLE 4729 G Block Diagram +V S OSC Oscillator C OSC T11 Ι 10 Ι 11 Phase 1 Error 1 Function Logic T12 D11 D12 D13 D14 T13 T14 Q11 Q12 Phase 1 R1 R sense Error-Flag Generation Error 2 TLE 4729 G +V S Inhibit T21 T22 D21 Ι 20 Ι 21 Phase 2 Function Logic D22 T23 T24 D23 Q21 Q22 D24 Phase 2 R2 GND R sense AEB02196 Figure 2 Data Sheet 4 V1.2, 2008-03-18 TLE 4729 G Absolute Maximum Ratings Tj = – 40 to 150 °C Parameter Supply voltage Error outputs Output current Ground current Logic inputs Oscillator voltage R1, R2 input voltage Junction temperature Storage temperature Symbol Limit Values Unit Remarks min. max. – 0.3 45 V – – 0.3 – 45 3 V mA – – –1 1 A – –2 – A – – 15 15 V IXX; Phase 1, 2 – 0.3 6 V – – 0.3 5 V – – 40 150 °C – 50 150 °C – – 75 50 K/W – K/W – – 15 K/W Measured on pin 5 VS TC 5 16 V – – 40 110 °C Measured on pin 5 Pdiss = 2 W IQ VIXX VErr IErr – 800 800 mA – –5 +6 V IXX; Phase 1, 2 – 0 25 1 V mA – – VS VErr IErr IQ IGND VIXX VOSC VRX Tj Tstg Thermal resistances Junction-ambient Rth ja Junction-ambient Rth ja (soldered on a 35 µm thick 20 cm2 PC board copper area) Junction-case Rth jc – Operating Range Supply voltage Case temperature Output current Logic inputs Error outputs Data Sheet 5 V1.2, 2008-03-18 TLE 4729 G Characteristics VS = 6 to 16 V; Tj = – 40 to 130 °C Parameter Symbol Limit Values min. typ. max. Unit Test Condition Current Consumption From + VS IS – – 50 µA From + VS IS 20 30 50 mA IOSC VOSCL VOSCH fOSC 90 0.8 1.7 18 120 1.3 2.3 24 150 1.9 2.9 30 µA V V kHz – – – IQ – 0 – mA IX0 = L; IX1 = L Vch Vcs Vca 40 410 630 70 450 700 100 510 800 mV mV mV IX0 = H; IX1 = L IX0 = L; IX1 = H IX0 = H; IX1 = H VI VIHy IIL IIL IIH 1.2 – – 10 – 100 –1 1.7 200 –1 – 20 0 2.2 – 1 –5 10 V mV µA µA µA – – VI VIHy IIL IIH 0.8 – – 100 5 1.7 200 – 20 2.2 – +5 50 V mV µA µA – – IXX = L; VS = 12 V; Tj ≤ 85 °C IQ1, 2 = 0 A Oscillator Output charging current Charging threshold Discharging threshold Frequency COSC = 2.2 nF Phase Current (VS = 9 … 16 V) Mode “no current” Voltage threshold of current Comparator at Rsense in mode: Hold Setpoint Accelerate Logic Inputs (Phase X) Threshold Hysteresis L-input current L-input current H-input current VI = 1.2 V VI = 0 V VI = 5 V Logic Inputs (IX1; IX0) Threshold Hysteresis L-input current H-input current Data Sheet 6 VI = 0 V VI = 5 V V1.2, 2008-03-18 TLE 4729 G Characteristics (cont’d) VS = 6 to 16 V; Tj = – 40 to 130 °C Parameter Symbol Limit Values Unit Test Condition min. typ. max. VErrSat IErrL 50 – 200 – 500 10 mV µA IErr = 1 mA VErr = 25 V Tjsd Tjpa ∆Tj Tjsdhy Tjpahy 140 120 10 – – 150 130 20 20 20 160 140 30 – – °C °C K K K IQ1, 2 = 0 A VErr = L ∆Tj = Tjsd – Tjpa 0.3 0.5 1000 0.9 1.0 0.5 0.8 1500 1.2 1.3 V V µA V V IQ = – 0.45 A IQ = – 0.7 A VS = VQ = 40 V IQ = 0.45 A IQ = 0.7 A IQ = 0.45 A; charge IQ = 0.45 A; Error Outputs Saturation voltage Leakage current Thermal Protection Shutdown Prealarm Delta Hysteresis shutdown Hysteresis prealarm – – Power Outputs Diode Transistor Sink Pair (D13, T13; D14, T14; D23, T23; D24, T24) Saturation voltage Saturation voltage Reverse current Forward voltage Forward voltage VsatI VsatI IRI VFI VFI 0.1 0.2 500 0.6 0.7 Diode Transistor Source Pair (T11, D11; T12, D12; T21, D21; T22, D22) Saturation voltage Saturation voltage VsatuC VsatuD 0.6 0.1 1.0 0.3 1.2 0.6 V V Saturation voltage Saturation voltage VsatuC VsatuD 0.7 0.2 1.2 0.5 1.5 0.8 V V Reverse current Forward voltage Forward voltage Diode leakage current IRu VFu VFu ISL 400 0.7 0.8 0 800 1.0 1.1 3 1200 1.3 1.4 10 µA V V mA Data Sheet 7 discharge IQ = 0.7 A; charge IQ = 0.7 A; discharge VS = 40 V, VQ = 0 V IQ = – 0.45 A IQ = – 0.7 A IF = – 0.7 A V1.2, 2008-03-18 TLE 4729 G Characteristics (cont’d) VS = 6 to 16 V; Tj = – 40 to 130 °C Parameter Symbol Limit Values min. typ. max. – – – – – – – 5 12 45 15 30 3 1 20 100 100 50 80 10 5 Unit Test Condition Error Output Timing Time Phase X to IXX Time IXX to Phase X Delay Phase X to Error 2 Delay Phase X to Error 1 Delay IXX to Error 2 Reset delay after Phase X Reset delay after IXX tPI tIP tPEsc tPEol tIEsc tRP tRI µs µs µs µs µs µs µs – For details see next four pages. These parameters are not 100% tested in production, but guaranteed by design. Data Sheet 8 V1.2, 2008-03-18 TLE 4729 G Diagrams Timing between IXX and Phase X to prevent setting the error flag Operating conditions: + VS = 14 V, Tj = 25 °C, Ierr = 1 mA, load = 3.3 mH, 1 Ω a) Ι XX Phase X t PI AET02197 If tPI < typ. 5 µs, an error “open load” will be set. b) Ι XX Phase X t IP AET02198 If tIP < typ. 12 µs, an error “open load” will be set. Data Sheet 9 V1.2, 2008-03-18 TLE 4729 G This time strongly depends on + VS and inductivity of the load, see diagram below. Time tIP vs. Load Inductivity AED02199 30 t IP µs 25 VS= 6 V 20 15 10 9V 12 V 16 V 5 0 0 10 20 30 40 mH L 60 Propagation Delay of the Error Flag Operating conditions: + VS = 14 V, Tj = 25 °C, Ierr = 1 mA, load = 3.3 mH, 1 Ω a) IXX = H, error condition: short circuit to GND. Phase X Error 2 t PEsc AED02200 typ. tPEsc: 45 µs Data Sheet 10 V1.2, 2008-03-18 TLE 4729 G b) IXX = H, error condition: open load (equivalent: short circuit to + VS). Phase X Error 1 t PEol AET02201 typ. tPEol: 15 µs c) Phase X = H or L, const.; error condition: short circuit to GND. Ι XX Error 2 t IEsc AET02202 typ. tIEsc: 30 µs tIEsc is also measured under the condition: begin of short circuit to GND till error flag set. Data Sheet 11 V1.2, 2008-03-18 TLE 4729 G d) IXX = H, reset of error flag when error condition is not true. Phase x Error X t RP AET02203 typ. tRP: 3 µs e) Phase X = H or L, const.; reset of error flag when error condition is not true. Ι XX Error X t RI AET02204 typ. tRI: 1 µs Data Sheet 12 V1.2, 2008-03-18 TLE 4729 G Quiescent Current IS vs. Supply Voltage VS; bridges not chopping; Tj = 25 °C AED02205 60 ΙS Quiesc. Current IS vs. Junct. Temp. Tj; bridges not chopping, VS = 14 V mA Ι QX = 50 0.70 A AED02206 60 Ι QX = 0.70 A mA ΙS 50 0.45 A 0.45 A 40 40 0.07 A 0.07 A 30 30 20 20 10 10 0 -50 0 5 10 15 V 20 0 50 VS Oscillator Frequency fOsc vs. Junction Temperature Tj Output Current IQX vs. Junction Temperature Tj AED02207 30 100 C 150 Tj AED02208 800 mA 700 kHz f Osc Ι QX Ι X1 = H, Ι X0 = H 600 25 500 Ι X1 = H, Ι X0 = L 400 VS = 14 V C OSC = 2.2 nF 300 20 V S = 14 V R X = 1Ω 200 100 15 -50 Data Sheet 0 50 0 -50 100 C 150 Tj 13 0 50 100 C 150 Tj V1.2, 2008-03-18 TLE 4729 G Output Saturation Voltages Vsat vs. Output Current IQ Forward Current IF of Free-Wheeling Diodes vs. Forward Voltages VF AED02209 2.0 V sat ΙF V S = 14 V T j = 25 C V A T j = 25 ˚C V Fl V Fu 0.8 1.5 0.6 V satuC 1.0 AED02210 1.0 0.4 V satl V satuD 0.5 0.2 0 0 0.2 0.4 0 0.6 A 0.8 ΙQ C OSC TC 3 V 1.5 AED02212 16 P tot L phase x = 10 mH R phase x = 2 Ω W 1.0 Permissible Power Dissipation Ptot vs. Case Temp. TC (measured at pin 5) AED02211 4 0.5 VF Typical Power Dissipation Ptot vs. Output Current IQ (non stepping) P tot 0 W = 2.2 nF = 25 C 12 10 both phases active 8 2 V S = 14 V T jmax = 150 C 6 120 C 4 1 2 0 0 0.2 0.4 0 -25 0.6 A 0.8 ΙQ Data Sheet 14 0 25 75 125 C 175 TC V1.2, 2008-03-18 TLE 4729 G Input Characteristics of IXX, Phase X i Ι xx Output Leakage Current AED02213 40 µA 20 AED02214 1.2 Ι xx ΙR mA 0.8 0 V S = 40 V Phase X -20 0.4 V S = 16 V -40 Tj = -60 0 40 C 25 C 150 C -80 -0.4 -100 -120 -6 -0.8 -4 -2 0 2 4 V 6 V Ι xx 0 10 20 30 V VQ 40 Quiescent Current IS vs. Supply Voltage VS; inhibit mode; Tj = 25 °C ΙS AED02215 250 µA 200 150 100 50 0 0 Data Sheet 5 10 15 V VS 20 15 V1.2, 2008-03-18 TLE 4729 G +12V 100 nF 1 2 3 21 Microcontroller 14 24 23 22 11 VS Ι 10 Ι 11 Q11 Phase 1 Error 1 Error 2 Q12 TLE 4729 G Ι 20 Ι 21 Phase 2 OSC 4 22 nF 100 µ F Q21 Q22 15 R2 1Ω 10 R1 1Ω 9 12 16 13 M Stepper Motor GND 5,6,7,8, 17,18,19,20 AES02216 Figure 3 Data Sheet Application Circuit 16 V1.2, 2008-03-18 TLE 4729 G 100 µF VS 100 nF ΙS +V S ΙΙ Ι Err VΙ V satu Ι XX, Phase X V Fu Ι Rl TLE 4729 G Output Error X Ι Ru ΙQ V satl Osc V Err Ι OSC V OSC R sense GND Ι SL Ι GND 2.2 nF V Fl Ι Rsense VC 1Ω AES02217 Figure 4 Data Sheet Test Circuit 17 V1.2, 2008-03-18 TLE 4729 G full step operation normal mode accelerate mode Ι 10 H L Ι 11 H L Phase 1 H L t t t i acc i set Ι Q1 t - i set - i acc i acc i set Ι Q2 t - i set - i acc Phase 2 H L Ι 20 H L Ι 21 H L t t t AED02218 Figure 5 Data Sheet Full Step Operation 18 V1.2, 2008-03-18 TLE 4729 G half step operation normal mode accelerate mode Ι 10 H L Ι 11 H L Phase 1 H L t t t i acc i set Ι Q1 t - i set - i acc i acc i set Ι Q2 t - i set - i acc Phase 2 H L Ι 20 H L Ι 21 H L t t t AED02219 Figure 6 Data Sheet Half Step Operation 19 V1.2, 2008-03-18 TLE 4729 G V Osc V Osc H V Osc L t Ι Rsense 1 0 t Ι Rsense 2 0 t V Q12 + VS V FU V satl V ca 0 t V Q11 + VS V satu D V satu C V Q22 + VS 0 V Q21 + VS t Ι Q1 i acc Ι Q2 t i acc t Operating conditions: VS = 14 V L phase x = 10 mH R phase x = 4 Ω Figure 7 Data Sheet Phase x = H =H Ι XX AED02220 Current Control in Chop-Mode 20 V1.2, 2008-03-18 TLE 4729 G V Osc 2.3 V 1.3 V 0V Oscillator High Imped. Phase change-over t Phase H L t Ι Rsense 1 0 t V Q11 +V S High Impedance t V Q12 +VS High Impedance t Ι set Ι Phase 1 fast current decay slow current decay T1 - Ι set Operating conditions: VS = 14 V L phase 1 = 1 mH R phase 1 = 4 Ω Figure 8 Data Sheet t Ι 11 = L for t < T 1 Ι 11 = H for t > T 1 Ι 10 = Ι 2X = L slow current decay AED02221 Phase Reversal and Inhibit 21 V1.2, 2008-03-18 TLE 4729 G Calculation of Power Dissipation The total power dissipation Ptot is made up of Saturation losses Psat (transistor saturation voltage and diode forward voltages), Quiescent losses Pq (quiescent current times supply voltage) and Switching losses Ps (turn-ON / turn-OFF operations). The following equations give the power dissipation for chopper operation without phase reversal. This is the worst case, because full current flows for the entire time and switching losses occur in addition. Ptot = 2 × Psat + Pq + 2 × Ps where Psat ≅ IN {VsatI × d + VFu (1 – d) + VsatuC × d + VsatuD (1 – d)} Pq = Iq × VS V i D × t DON ( i D + i R ) × t ON I N P q ≅ ------S- ------------------------ + -------------------------------------- + ----- ( t DOFF + t OFF ) 2 2 4 T IN = Nominal current (mean value) Iq = Quiescent current iD = Reverse current during turn-on delay iR = Peak reverse current tp = Conducting time of chopper transistor tON = Turn-ON time tOFF = Turn-OFF time tDON = Turn-ON delay tDOFF = Turn-OFF delay T = Cycle duration d = Duty cycle tp / T Vsatl = Saturation voltage of sink transistor (TX3, TX4) VsatuC = Saturation voltage of source transistor (TX1, TX2) during charge cycle VsatuD = Saturation voltage of source transistor (TX1, TX2) during discharge cycle VFu = Forward voltage of free-wheeling diode (DX1, DX2) VS = Supply voltage Data Sheet 22 V1.2, 2008-03-18 TLE 4729 G +V S Dx1 Tx1 Dx2 Tx2 L Dx3 Tx3 Dx4 Tx4 VC R sense AET02222 Figure 9 Turn-ON Turn-OFF ΙN iR Voltage and Current on Chopper Transistor iD V S + V Fu V S + V Fu V satl t D ON t ON t D OFF t OFF tP Figure 10 Data Sheet t AET02223 Voltage and Current on Chopper Transistor 23 V1.2, 2008-03-18 TLE 4729 G Application Hints The TLE4729G is intended to drive both phases of a stepper motor. Special care has been taken to provide high efficiency, robustness and to minimize external components. Power Supply The TLE4729G will work with supply voltages ranging from 5 V to 16 V at pin VS. Surges exceeding 16 V at VS wont harm the circuit up to 45 V, but whole function is not guaranteed. As soon as the voltage drops below approximately 16 V the TLE4729G works promptly again. As the circuit operates with chopper regulation of the current, interference generation problems can arise in some applications. Therefore the power supply should be decoupled by a 0.1 µF ceramic capacitor located near the package. Unstabilized supplies may even afford higher capacities. Inhibit Mode In the case of low at all four current program inputs IXX the device will switch into inhibit condition; the current consumption is reduced to very low values. When starting operation again, i.e. putting at least one IXX to high potential, the Error 1 output signals an open load error if the corresponding phase input is high. The error is reset by first recirculation in chop mode. Current Sensing The current in the windings of the stepper motor is sensed by the voltage drop across Rsense. Depending on the selected current internal comparators will turn off the sink transistor as soon as the voltage drop reaches certain thresholds (typical 0 V, 0.07 V, 0.45 V and 0.7 V). These thresholds are not affected by variations of VS. Consequently instabilized supplies will not affect the performance of the regulation. For precise current level it must be considered, that internal bounding wire (typ. 60 mΩ) is a part of Rsense. Due to chopper control fast current rises (up to 10 A/µs) will occur at the sensing resistors. To prevent malfunction of the current sensing mechanism Rsense should be pure ohmic. The resistors should be wired to GND as directly as possible. Capacitive loads such as long cables (with high wire to wire capacity) to the motor should be avoided for the same reason. Synchronizing Several Choppers In some applications synchrone chopping of several stepper motor drivers may be desirable to reduce acoustic interference. This can be done by forcing the oscillator of the TLE4729G by a pulse generator overdriving the oscillator loading currents (approximately ± 120 µA). In these applications low level should be between 0 V and 0.8 V while high level should between 3 V and 5 V. Data Sheet 24 V1.2, 2008-03-18 TLE 4729 G Application Hints (cont’d) Optimizing Noise Immunity Unused inputs should always be wired to proper voltage levels in order to obtain highest possible noise immunity. To prevent crossconduction of the output stages the TLE4729G uses a special break before make timing of the power transistors. This timing circuit can be triggered by short glitches (some hundred nanoseconds) at the phase inputs causing the output stage to become high resistive during some microseconds. This will lead to a fast current decay during that time. To achieve maximum current accuracy such glitches at the phase inputs should be avoided by proper control signals. To lower EMI a ceramic capacitor of max. 3 nF is advisable from each output to GND. Thermal Shut Down To protect the circuit against thermal destruction, thermal shut down has been implemented. Error Monitoring The error outputs signal corresponding to the logic table the errors described below. Logic Table Kind of Error Error Output Error 1 Error 2 a) No error H H b) Short circuit to GND H L c) Open load1) L H d) b) and c) simultaneously H L e) Temperature prealarm L L 1) Also possible: short circuit to + VS or short circuit of the load. Over-Temperature is implemented as pre-alarm; it appears approximately 20 K before thermal shut down. To detect an open load, the recirculation of the inductive load is watched. If there is no recirculation after a phase change-over, an internal error flipflop is set. Because in most kinds of short circuits there won’t flow any current through the motor, there will be no recirculation after a phase change-over, and the error flipflop for open load will be set, too. Additionally an open load error is signaled after a phase change-over during hold mode. Data Sheet 25 V1.2, 2008-03-18 TLE 4729 G Only in the case of a short circuit to GND, the most probably kind of a short circuit in automotive applications, the malfunction is signaled dominant (see d) in logic table) by a separate error flag. Simultaneously the output current is disabled after 30 µs to prevent disturbances. A phase change-over or putting both current control inputs of the affected bridge on low potential resets the error flipflop. Being a separate flipflop for every bridge, the error can be located in easy way. Data Sheet 26 V1.2, 2008-03-18 TLE 4729 G 1.27 0.35 8˚ MAX. +0.0 7.6 -0.2 1) 9 0.35 x 45˚ 0.23 2.45 -0.2 2.65 MAX. 0.2 -0.1 Package Outlines 0.4 +0.8 0.1 +0.15 2) 0.2 24x 24 1 10.3 ±0.3 13 15.6 -0.4 1) 12 Index Marking 1) 2) Figure 11 Does not include plastic or metal protrusion of 0.15 max. per side Lead width can be 0.61 max. in dambar area PG-DSO-24-16 (Plastic Green Dual Small Outline) Green Product (RoHS compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020). You can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”: http://www.infineon.com/products. Dimensions in mm SMD = Surface Mounted Device Data Sheet 27 V1.2, 2008-03-18 TLE 4729 G Revision History Version Rev. 1.1 Date Changes 2007-09-17 RoHS-compliant version of the TLE 4729 G • All pages: Infineon logo updated • Page 2: “added AEC qualified” and “RoHS” logo, “Green Product (RoHS compliant)” and “AEC qualified” statement added to feature list, package name changed to RoHS compliant versions, package picture updated, ordering code removed • Page 27: Package name changed to RoHS compliant versions, “Green Product” description added • added Revision History • added Legal Disclaimer Rev. 1.2 Data Sheet 2008-03-18 • Update Package suffix 28 V1.2, 2008-03-18 TLE 4729 G Edition V1.2, 2008-03-18 Published by Infineon Technologies AG 81726 Munich, Germany © 2008 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Data Sheet 29 V1.2, 2008-03-18