Reference Dimensions: PulseGuard® Suppressors 2.24 +/- 0.18 (0.088" +/- 0.007") Surface Mount Polymeric ESD Suppressors 1.66 +/- 0.06 (0.066" +/- 0.003”) 1.04 (0.041") REF 3.00 +/- 0.20 (0.118" +/- 0.008") 0.15 +/- 0.08 (0.006" +/- 0.003”) 1.91 (0.075") 1.09 (0.043") PGB1 Series Lead-Free 0.84 +/- 0.05 0.36 (0.014") 0.69 +/- 0.10 (0.027" +/- 0.004) (0.033"0.91 +/- 0.002”) (0.036") TYP 0.81 (0.032") TYP 0.43 +/- 0.18 (0.017" +/- 0.007”) Description 0.15 +/- 0.08 (0.006 +/- 0.003") TYP Reflow Solder Wave Solder Reflow Solder 1.02 (0.040") 0.51 (0.020") 3.05 (0.120") 2.29 (0.090") 0.64 (0.025") 1.27 (0.050") 1.02 (0.040") 1.27 0.76 (0.030") (0.050") 1.02 (0.040") 2.54 (0.100") 1.02 (0.040") 3.30 (0.130") 0.64 (0.025") 0.51 (0.020") 1.27 (0.050") 2.03 (0.080") 0.76 (0.030") PulseGuard ESD Suppressors help protect sensitive electronic equipment against electrostatic discharge (ESD). They supplement the on-chip protection of integrated 1.27 (0.050") circuitry and are best suited for low-voltage, high-speed 1.27 applications where low capacitance is important. Data ports (0.050") utilizing such high-speed protocols as USB 2.0, IEEE1394, HDMI and DVI can benefit from this new technology. Wave Solder 2.29 (0.090") 0.76 (0.030") PulseGuard suppressors use polymer composite materials to suppress fast-rising ESD transients (as specified in IEC 61000-4-2), while adding virtually no capacitance to the circuit. Equivalent Circuits Features 0402 and 0603 Devices Equivalent Circuit SOT23 Device Equivalent Circuit • RoHS compliant and lead-free • Ultra-low capacitance • Low leakage current • Fast response time • Bi-directional 3 2 1 1 2 • Withstands multiple ESD strikes • Compatible with pick-and-place processes • Available in 1000, 3000, 5000 and 10000 piece reels (EIA-RS481) Applications • HDTV Hardware • Laptop/Desktop Computers • Network Hardware Product Characteristics Part Number Lines Protected Component Package PGB1010402 1 0402 PGB1010603 1 0603 PGB102ST23 2 SOT23 • Computer Peripherals • Digital Cameras • External Storage • Set-Top Boxes Electrical Characteristics Specification PGB1010402 PGB1010603 PGB102ST23 8kV 15kV 8kV 15kV 8kV 15kV Peak Voltage (typical) 1000V 500V 500V Measured per IEC 61000-4-2 8kV Contact Discharge1 Clamping Voltage (typical) 250V 150V 150V Measured per IEC 61000-4-2 8kV Contact Discharge1, at 25 nsec. ESD Capability: IEC 61000-4-2 Contact Discharge IEC 61000-4-2 Air Discharge Rated Voltage (maximum) 12VDC 24VDC 24VDC Capacitance (typical) 0.04 pF 0.06 pF 0.12 pF Response Time <1nS <1nS <1nS Leakage Current (typical) <1nA (12 VDC) <1nA (6 VDC) <1nA (6 VDC) ESD Pulse Withstand 100 pulses min 1000 pulses min 1000 pulses min Notes Measured at 250 MHz Some shifting in characteristics may occur when tested over multiple pulses at a very rapid rate Notes: 1 Testing performed on Littelfuse Test Set up as described in typical test setup section. PGB1 Series Specifications are subject to change without notice. Electronics Designers Guide www.littelfuse.com ©2007 Littelfuse Vo Capa PGB102ST23 PGB1040805 400 PulseGuard® Suppressors 200 1,000 0 -25 10,000 0 25 50 Part Numbering System PGB1 01 0603 MR Capacitance (fF) Voltage (V) LINES 1000PROTECTED: 01 = 1 line 50 80002 = 2 lines 04 = 4 lines Dimensions: mm (inch) 0.5 1.0 0.51 +/- 0.05 (0.020" +/- 0.002") PGB102ST23 PGB1040805 1.5 Reflow Solder 2.0 Recommended for reflow soldering only 75 100 125 150 1.55 (0.061") 0.38 (0.015") .58 (0.023") 175 0.56 (0.022") 1200 Time (ns) 1000 Reference Dimensions: 0603 Device Voltage (V) Capacitance (pF) 50 0.99 +/- 0.05 (0.039" +/- 0.002") 0.24 +/- 0.09 (0.009" +/- 0.004") 200 Device Capacitance Typical 00 fF = 1 pF 0.10 800 Dimensions: mm (inch) PGB102ST23 PGB1010603 PGB1010402 1.66 +/- 0.06 (0.066" +/- 0.003”) 600 1.04 PGB1010603 0.15 +/- 0.08 PGB102ST23 (0.006" +/- 0.003”) (0.041") REF 400 0.36 (0.014") PGB10104020.84 +/- 0.05 200 0.01 100 1,000 2.0 0.51 (0.020") Typical Device Capacitance 3.30 (0.130") 1.27 (0.050") 1.27 (0.050") 0.76 (0.030") 600Device SOT23 04000015NR 600 0.01 200 100 PGB1010402 1,000 200 0 -25 10,000 25 50 75 100 125 (0.088" +/- 0.007") 2 1 0 3.00 +/- 0.20 (0.118" +/- 0.008") 25 50 1.91 75 (0.075")100 125 150 150 0.69 +/- 0.10 (0.027" +/- 0.004) 175 0.81 (0.032") TYP Time (ns) Typical ESD Response 0.91 (0.036") TYP Typical ESD Response 0.15 +/- 0.08 (0.006 +/- 0.003") TYP Reflow Solder 1.02 (0.040") Wave Solder 1.02 (0.040") 1.27 (0.050") 1200 2.29 (0.090") 1000 1.02 (0.040") 0.64 (0.025") 800 0.51 (0.020") 600 1751.09 (0.043") Time (ns) Frequency (MHz) 0 04000015NR 2.24 +/- 0.18 Dimensions: mm (inch) 400 Equivalent Circuit PGB1010603 PGB102ST23 400 Voltage (V) 175 800 Typical Device Capacitance 1.02 (0.040") 1.27 (0.050") 2.54 (0.100") 1.27 (0.050") 0.64 (0.025") 2.03 (0.080") 2.29 (0.090") 04000015NR 400 PGB1 Series 200 Electronics Designers Guide Specifications are subject to change without notice. 10,000 150 Reference Dimensions: 1000 0 -25 125 0.76 (0.030") Typical ESD Response 1000 Voltage (V) Capacitance (pF) Voltage (V) 1200 0.10 800 04000015NR 100 Time (ns) Wave Solder Note: For wave solder, increase the spacing in both the horizontal and vertical dimensions by 0.254 (.010") where0.76 denoted by an asterisk (*) (0.030") 1200 10,000 75 3.05 (0.120") 1.00 0 -25 50 Reflow Solder Typical ESD Response PGB1010603 PGB1010402 (0.033" +/- 0.002”) 0 0.43 +/- 0.18 -25(0.017"0+/- 0.007”) 25 10,000 Frequency (MHz) PGB102ST23 175 0.310 +/- 0.08 (0.012" +/- 0.003") Frequency (GHz) PGB1010402 25 150 0.15 +/- 0.08 (0.006" +/- 0.003") 0.25 (0.010") DEVICE SIZE CODE: 0402 = 0402 (1005) 0603 = 0603 (1608) ST23 = SOT23 PGB1010603 600 40 0 125 0402 Device ** Note: 1,000 fF = 1 pF QUANTITY & PACKAGING CODE: MR = 1000 pieces WR = 3000 pieces NR = 5000 pieces KR = 10,000 pieces LEAD-FREE PULSEGUARD® 60 1200 ESD SUPPRESSORS 0 -25 1.00 100 Dimensions 70 400 75 Time (ns) Frequency (MHz) 10,000 PGB1010402 Surface Mount Polymeric ESD Suppressors 0.01 100 B102ST23 B1040805 B1010603 B1010402 .5 PGB1010603 PGB1010402 0 25 50 75 100 125 150 175 www.littelfuse.com ©2007 Littelfuse PulseGuard® Suppressors Surface Mount Polymeric ESD Suppressors Physical Specifications Environmental Specifications Materials Body: Glass Epoxy Terminations: Copper/Nickel/Tin Solderability MIL-STD-202, Method 208 Operating Temperature Moisture Resistance Soldering Parameters Wave solder - 260°C, 10 seconds maximum Reflow solder - 260°C, 30 seconds maximum 0402 series: 40°C, 95% RH, 1000 hours 0603, ST23: 85°C, 85% RH, 1000 hours Thermal Shock MIL-STD-202, Method 107, -65°C to 125°C, 30 min. cycle, 10 cycles Vibration MIL-STD-202, Method 201, (10 to 55 to 10 Hz, 1 min. cycle, 2 hrs each in X-Y-Z) Chemical Resistance MIL-STD-202, Method 215 Solder Leach Resistance and Terminal Adhesion IPC/EIA J-STD-002 Design Consideration Because of the fast rise-time of the ESD transient, proper placement of PulseGuard suppressors are a key design consideration to achieving optimal ESD suppression. The devices should be placed on the circuit board as close to the source of the ESD transient as possible. Install PulseGuard suppressors (connected from signal/data line to ground) directly behind the connector so that they are the first boardlevel circuit component encountered by the ESD transient. -65°C to +125°C Soldering Parameters Reflow Condition Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 seconds Average ramp up rate (Liquidus Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260°C Time within 5°C of actual peak Temperature (tp) 10 – 30 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes max PGB1 Series Specifications are subject to change without notice. Based on IPC/JEDEC J-STD-020 Electronics Designers Guide www.littelfuse.com ©2007 Littelfuse PulseGuard® Suppressors Surface Mount Polymeric ESD Suppressors Packaging Quantity & Packaging Code Quantity Packaging Option Packaging Specification KR 10000 Tape & Reel (7” reel) EIA RS-481-1 (IEC 286, part 3) PGB1010603 MR 1000 Tape & Reel (7” reel) EIA RS-481-1 (IEC 286, part 3) PGB102ST23 WR 3000 Tape & Reel (7” reel) EIA RS-481-1 (IEC 286, part 3) PGB1010603 NR 5000 Tape & Reel (7” reel) EIA RS-481-1 (IEC 286, part 3) Part Number PGB1010402 Tape and Reel Specifications Tt Ds Dd + + + + Tw Pd + + + + Pw Ps Ct Ph 0603 Series SOT23 Series (mm) (mm) Description 0402 Series (mm) Ct - Cover tape thickness 0.05 0.05 0.06 Dd - Drive hole diameter 1.50 1.50 1.50 Ds - Drive hole spacing 4.00 4.00 4.00 Pd - Pocket depth 0.41 0.58 1.02 Ph - Pocket height 1.12 1.85 3.23 Ps - Pocket spacing 2.00 4.00 4.00 Pw - Pocket width 0.62 1.02 2.46 Tt - Carrier tape thickness 0.61 0.65 1.77 Tw - Carrier tape width 8.00 8.00 8.00 Typical Test Setup FARADAY CAGE COMPUTER AGILENT INFINIIUM 1.5 GHz 8 GS/s 30dB PASTERNAK ATTENUATOR PE7025-30 TEKTRONIX LOW CAP PROBE 6158 (20x TIP) QUADTECH 1865 RESISTANCE METER RESISTANCE TEST FIXTURE ESD TEST FIXTURE TEST BOARD W/ DUT ESD PULSE GENERATOR PGB1 Series Specifications are subject to change without notice. Electronics Designers Guide www.littelfuse.com ©2007 Littelfuse