1.66 +/- 0.06 ® (0.066" +/- 0.003”) 1.04 PULSE-GUARD ESD Suppressors (0.041") REF 0.15 +/- 0.08 (0.006" +/- 0.003”) Surface Mount Polymeric Electrostatic Discharge Suppressors 0.36 (0.014") 0.84 +/- 0.05 (0.033" +/- 0.002”) PGB2 0201 Series RoHS 0.43 +/- 0.18 (0.017" +/- 0.007”) Description Wave Solder Reflow Solder 0.51 (0.020") PULSE-GUARD® ESD Suppressors help protect sensitive electronic equipment against electrostatic discharge (ESD). 0.76 (0.030") 3.30 (0.130") 3.05 (0.120") 1.27 (0.050") They use polymer composite materials to suppress fastrising ESD transients (as specified in IEC 61000-4-2), while adding virtually no capacitance to the circuit. 1.27 (0.050") 0.76 (0.030") They supplement the on-chip protection of integrated circuitry and are best suited for low-voltage, high-speed applications where low capacitance is important to ensure minimal interference of data signal integrity. 0.76 (0.030") The new and ultra-small surface mount PGB2 0201 series offers a RoHS Compliant, Halogen Free, and 100% Lead Free circuit protection alternative. Equivalent Circuits Equivalent Circuit 2 1 Features Product Characteristics Part Number Lines Protected Component Package 1 0201 PGB2010201KR • Lead-free, Halogen-free and RoHS compliant • Ultra-low capacitance • Low leakage current • Fast response time • One line of protection • Bi-directional • Withstands multiple ESD strikes • Compatible with pick-and-place processes Applications • HDTV Hardware • Laptop/Desktop Computer • Network Hardware • HDMI/USB 3.0 • Computer Peripherals • Digital Camera • External Storage • Set-Top Box Electrical Characteristics Specification ESD Capability: IEC 61000-4-2 Direct Discharge (typical) IEC 61000-4-2 Air Discharge (typical) PGB2010201 8kV 10kV - 15kV Trigger Voltage (typical) Clamping Voltage (typical) 400V 55V Rated Voltage (maximum) 12VDC, max Capacitance (typical) 0.07 pF, typical Notes The ESD capability measured by direct and air discharge method is subject to testing equipment and conditions. Numerous factors could affect the reliability and reproducibility of the direct and air discharge test results. Measured per IEC 61000-4-2 8kV Direct Discharge Method Measured at 250 MHz Response Time <1nS Measured per IEC 61000-4-2 8kV Direct Discharge Method Leakage Current (typical) <1nA Measured at 12 VDC ESD Pulse Withstand © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 04/16/15 1000 pulses min Some shifting in characteristics may occur when tested over multiple pulses at a very rapid rate PULSE-GUARD® ESD Suppressors Surface Mount Polymeric Electrostatic Discharge Suppressors Typical ESD Response Curve Dimensions (8 kV IEC 61000-4-2 Direct Discharge) Dimensions: mm (inch) 500 25 75 Time (ns) 100 125 Reflow Solder50 0 25 -25 75 100 Time (ns) Recommended for 200 Voltage (V) 150 125 175 150 50 0.38 75 Time (ns) (0.015") 25 150 175 -25 Insertion Loss Insertion (dB) Loss (dB) 125 175 60 150 175 Time (ns) Voltage (V) 0.35 (0.014”) 150 200 0 15 45 60 75 30 45 60 15 30 0.23 Typical0Insertion Loss (0.009") Time (ns) 60 0.20 -4 -10(0.008" 0 0.30 +/- 0.08 (0.012" +/- 0.003") 0.10 10000 100000 -6-12 10 100 -8 1000 Frequency (MHz) 10000 100000 60 75 Time (ns) DEVICE SIZE CODE: 0201 = 0201 (0603) 0.10 0.01 100 0 15 30 45 60 75 Time (ns) To Be Determined 2 -4 -10 -10 -4 -12 -6 100 1000 Frequency (MHz) 10000 100000 To Be Determined 100 1000 Frequency (MHz) -8 10000 100000 -12 100 1000 Frequency (MHz) 10000 100000 0.1 250.00 10 0.1 1000 Frequency (MHz) 10000 1000 2500.00 10000 100000 PENDING 0.1 0.01 100 100 Frequency (MHz) PENDING Frequency (MHz) To Be Determined 100 F) 0.01 Capacitance (pF) Capacitance (pF) 0.01 10 To Be Determined © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 04/16/15 1000 10000 Frequency (MHz) 0 0.10 0.01 100 -10 -12 0 0.101.00 PENDING 10 -10 1.00 To Be Determined 0 1 0.01 100 PENDING -6 -12 -2 -810 0.1 50 1.00 0.10 PENDING Typical Device Capacitance 0 -4 Capaciatnce (pF) -4-10 -15 2 -2 -8 1000 Frequency (MHz) 45 QUANTITY & PACKAGING CODE: 30 45 60 pieces 75 KR = 10,000 15 -6 +/- 0.09 +/- 0.004") 100 30 Time (ns) 0 -2 -6 -12 -2 -8 10 15 2 75 -6 -2 -8 0 100 LINES PROTECTED: 001 = 1 line 45 60 1.00 PGB2 01 0201 KR LEAD-FREE HALOGEN-FREE ® PULSE-GUARD 0 ESD SUPPRESSORS 50 -15 0 75 70 50 40 150 -15 50 0.27 +/- 0.09 (0.011" +/- 0.004") 0 100 0.01 1 Capacitance (pF) Capacitance (pF) 30 Time (ns) -2 -15 2 Nom. -4 Insertion Loss (dB) 0.810 75 100 (0.032”) 50 70 100 125 150 Recommended for reflow soldering only Capacitance (pF) Capacitance (pF) -15 0 Capacitance (pF)Capacitance (pF) 75 Time (ns) 1 0.01 1.00 100 Capacitance (pF) citance (pF) 15 Time (ns) 2 0 F) 0.280 (0.011”) 100 0 0 0.1 50 0.10 0.01 100 40 Voltage (V) 0 0.50 +/- 0.05 (0.020" +/- 0.002") 0.1 175 200 1.00 +/- 0.05 (0.039" +/- 0.002") 50 -15 2 150 50 Part Numbering System 0 50 25 00.250 25 (0.010”) 150 50 150 Voltage (V 150 Voltage (V) Voltage (V 100 0 0.56 (0.022") 200150 0 200 125 125 Recommended Soldering Pad Layout -25 Insertion Loss (dB) Insertion Loss (dB) Voltage (V 100 100 100 Time (ns) 0 100 175 .58 (0.023") 200 0.18 +/- 0.10 (0.007” 0 25 +/- 0.004”) 50 75 -25 100 200 reflow soldering Typical TLP Response Curve (500 V Directonly Discharge) 0 -25 1.550 (0.061") 0.10 0.01 100 200 300 0 50 Capacitance (pF) 0 1.00 Capacitance (pF) -25 0.32 Max (0.013” Max) 0.21 (0.0084”) 100 0.51 +/- 0.05 (0.020" +/- 0.002") 0 400 300 Insertion Loss (dB) Voltage (V 100 300200 400 200 Voltage (V) 0.24 +/- 0.09 300 (0.009" +/- 0.004") 1.00 0.10 300 Voltage (V) Voltage (V 0.99 +/- 0.05 (0.039" +/- 0.002") 400 Voltage (V 0.30 +/- .03 (0.012”500+/- .001”) 0.310 +/- 0.08 (0.012" +/- 0.003") 200 100 1.00 Capacitance (pF) 500 300 0.25 500 (0.010") 400 100 0 0.63 +/- .03 (0.025” +/- .001”) 400 Capacitance (fF) Capacitance (fF) 0.15 +/- 0.08 (0.006" +/- 0.003") 400 200100 Device Dimensions 500 Capacitance (pF) Capacitance (pF) 500 0.101.00 0.01 0.10 100 0 0 PULSE-GUARD® ESD Suppressors Surface Mount Polymeric Electrostatic Discharge Suppressors Physical Specifications Environmental Specifications Materials Body: Epoxy / Glass Substrate Terminations: Cu/Ni/Sn Device Weight 0.349 mg Solderability MIL-STD-202, Method 208 Soldering Parameters Operating Temperature -65°C to +125°C Biased Humidity: 40°C, 95% RH, 1000 hours Biased Heat: 85°C, 1000 hours Thermal Shock MIL-STD-202, Method 107, -65°C to 125°C, 30 min. cycle, 10 cycles Vibration MIL-STD-202, Method 201 Chemical Resistance MIL-STD-202, Method 215 Solder Leach Resistance and Terminal Adhesion IPC/EIA J-STD-002 Wave solder - 260°C, 10 seconds maximum Reflow solder - 260°C, 30 seconds maximum Design Consideration Because of the fast rise-time of the ESD transient, proper placement of PULSE-GUARD® suppressors are a key design consideration to achieving optimal ESD suppression. The devices should be placed on the circuit board as close to the source of the ESD transient as possible. Install PULSE-GUARD® suppressors (connected from signal/data line to ground) directly behind the connector so that they are the first board-level circuit component encountered by the ESD transient. Soldering Parameters Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 seconds Average ramp up rate (Liquidus Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds tP TP Ramp-up TL tL TS(max) Temperature Reflow Condition Ramp-do Ramp-down TS(min) 25 Preheat tS time to peak temperature Time Peak Temperature (TP) 260°C Time within 5°C of actual peak Temperature (tp) 10 – 30 seconds Ramp-down Rate 6°C/second max - Recommended profile based on IPC/JEDED J-STD-020C Time 25°C to peak Temperature (TP) 8 minutes max - For recommended soldering pad layout dimensions, please refer to Dimensions section of this data sheet © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 04/16/15 Notes: - PGB2 Series recommended for reflow soldering only PULSE-GUARD® ESD Suppressors Surface Mount Polymeric Electrostatic Discharge Suppressors Packaging Part Number Quantity & Packaging Code Quantity Packaging Option Packaging Specification KR 10000 Tape & Reel (7” reel) Carrier Tape: 8mm, paper Reel: 7” (178mm) reel PGB2010201 Tape and Reel Specifications 4.000±0.100 Ø1.550±0.030 2.000±0.050 0.420±0.020 0201 Series (mm) Description 1.750±0.050 3.500±0.050 A0 - Pocket Width 0.360±0.020 B0 - Pocket Height 0.680±0.020 K0 - Pocket Depth 0.300±0.020 8.000 Ko Bo 2.000±0.050 Ao Typical ESD Pulse Test Setup FARADAY CAGE COMPUTER AGILENT INFINIIUM 1.5 GHz 8 GS/s 30dB PASTERNAK ATTENUATOR PE7025-30 TEKTRONIX LOW CAP PROBE 6158 (20x TIP) QUADTECH 1865 RESISTANCE METER RESISTANCE TEST FIXTURE ESD TEST FIXTURE TEST BOARD W/ DUT ESD PULSE GENERATOR Notes: - QuadQuadTech 1865 High Resistance Meter: Measures insulation resistance values - KeyTek MiniZap ESD simulator with IEC tip: Simulates 8kV, direct discharge ESD event per IEC 61000-4-2 - Faraday cage: Shields the acquisition equipment from the electromagnetic fields generated by the simulator - Agilent 2.25 GHz 54846A Oscilloscope: Records the voltage waveform from the device under test - Tektronix 6158 probe with 30dB attenuator: Transmits the waveform from the device to the oscilloscope © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 04/16/15