PulseGuard ® Suppressors Surface Mount Polymeric ESD Suppressors RoHS Pb PGB1 Series Lead-Free 0805 ESD Suppressor Product Overview PulseGuard ESD Suppressors help protect sensitive electronic equipment against electrostatic discharge (ESD). They supplement the on-chip protection of integrated circuitry and are best suited for lowvoltage, high-speed applications where low capacitance is important. Data ports utilizing such high-speed protocols as USB 2.0, IEEE1394, HDMI and DVI can benefit from this new technology. PulseGuard suppressors use polymer composite materials to suppress fast-rising ESD transients (as specified in IEC 61000-4-2 and MIL-STD-883E), while adding virtually no capacitance to the circuit. Features • Lead-Free • Ultra-low capacitance • Low leakage current • Fast response time • 4-lines of protection • Bi-directional • Withstands multiple ESD strikes • Based on industry standard 2012 package • Compatible with pick-and-place processes • Available in 1,000 and 5,000 piece reels (EIA-RS481) Reference Dimensions: Reflow Solder 0.74 (.029") Typical Applications • • • • • • 2.03 (.080") TYP 0.71 (.028") 1.27 (.050") 1.27 (.050") TYP HDTV Hardware Laptop/Desktop Computers Network Hardware Computer Peripherals Digital Cameras External Storage 0.203 (.008") TYP 0.51 (.020") 0.635 (.025") 0.127 (.005") TYP 0.279 (.011") 0.74 (.029") Sn NOTE: When wave soldering, the gap between pads should be covered with photo-imageable solder mask to prevent bridging between terminations under the component. Also the spacing between the ground contacts should be increased from .635mm (.025") to .889 (.035"). • Set-Top Boxes 0.406 (.016") TYP Ordering Information Equivalent Circuit CATALOG NUMBER PIECES PER REEL PGB1040805MR 1,000 PGB1040805NR 5,000 2 Design Consideration Because of the fast rise-time of the ESD transient, placement of PulseGuard suppressors is a key design consideration. To achieve optimal ESD suppression, the devices should be placed on the circuit board as close to the source of the ESD transient as possible. Install PulseGuard suppressors directly behind the connector so that they are the first board-level circuit component encountered by the ESD transient. They are connected from signal/data line to ground. 208 1 3 w w w. l i t t e l f u s e . c o m 6 5 4 1 6 2 5 3 4 PulseGuard ® Suppressors Surface Mount Polymeric ESD Suppressors RoHS Pb PGB1 Series Lead-Free 0805 ESD Suppressor Electrical Characteristics Capacitance vs. Frequency ESD Capability ** Note: 1,000 fF = 1 pF 70 Capacitance (fF) IEC 61000-4-2 Direct Discharge ....................................................8kV IEC 61000-4-2 Air Discharge .......................................................15kV Trigger Voltage1 .....................................................................500 V, typical Clamping Voltage1 ..................................................................150V, typical Rated Voltage ........................................................................24VDC, max Capacitance2 ................................................................................0.055 pF 1 Response Time ................................................................................< 1ns Leakage Current3 .............................................................................< 1nA 60 50 40 4 ESD Pulse Withstand4 ..........................................1,000 pulses, minimum Notes: 1.0 1.5 2.0 PULSEGUARD® SUPPRESSORS 0.5 Frequency (GHz) 1. Trigger and clamping voltage measured per IEC 61000-4-2, 8kV direct discharge method. 2. Capacitance measured at 1MHZ. 3. Leakage current measured at 6VDC. 4. Pulse Withstand- some shifting in characteristics may occur when tested over multiple pulses at a very rapid rate. Environmental Specifications Carrier Tape Specifications Parts are delivered on 7" (178mm) reel, paper carrier tape Tt Operating Temperature: -65°C to +125°C. Moisture Resistance, steady state: MIL-STD-833, method 1004.7, 85% RH, 85°C, 1000hrs. Thermal Shock: MIL-STD-202, Method 107G, -65°C to 125°C, 30 min cycle, 10 cycles. Vibration: MIL-STD-202F, Method 201A, (10 to 55 to 10Hz, 1 min. cycle, 2grs each in X-Y-Z) Ds Dd + + + + Tw + Pd Physical Specifications Ct Materials: Ph + + Pw Ps Body: Glass Epoxy Terminations: 100% Copper/Nickel/Tin Solderability: MIL-STD-202, Method 208 (95% coverage) Soldering Parameters: Wave Solder – 260°C, 10 seconds maximum. Reflow Solder – 260°C, 30 seconds maximum. DESCRIPTION Packaging Specifications 8mm Tape and Reel per EIA-RS481-1 (IEC 286, part3); 1,000 pieces per reel, add packaging suffix, MR; 5,000 per reel, add packaging suffix NR. MEASUREMENT (MM) Ct - Cover tape thickness 0.06 Dd - Drive hole diameter 1.50 Ds - Drive hole spacing 4.00 Pd - Pocket depth 0.58 Ph - Pocket height 2.21 Ps - Pocket spacing 4.00 Pw - Pocket width 1.45 Tt - Carrier tape thickness 0.65 Tw - Carrier tape width 8.00 w w w. l i t t e l f u s e . c o m 209