NUC2401MN Integrated Common Mode Choke with Integrated ESD Protection Description The NUC2401MN is an Integrated Common Mode Filter for the elimination of common mode noise in high speed data line applications such as IEEE1394, USB2.0 and other LVDS type applications. ESD protection is integrated into the Common mode filter for superior protection and significant part count reduction. Features • • • • • • • Common mode EMI Filtering and ESD Protection Integration of 5 Discrete components ±12 kV ESD Protection per IEC61000−4−2 (Contact Discharge) DFN: 2.0 x 2.2 mm Package Moisture Sensitivity Level 1 ESD Rating: Machine Model (MM) = 1.6 kV; Human Body Model (HBM) = 16 kV This is a Pb−Free Device SIMPLIFIED SCHEMATIC VCC 6 I/O 1, 9 I/O 8, 12 I/O 2, 10 I/O 7, 11 MARKING DIAGRAM 8 DFN8 CASE 506BL 1 Benefits • Reduces EMI/RFI Emissions on a Data Line • Integrated Solution offers Cost and Space Savings • Reduces Parasitic Inductances Which Offer a More “Ideal” Common • http://onsemi.com Mode Filtering Integrated Solution Improves System Reliability 1 C2 = Specific Device Code M = Date Code G = Pb−Free Device (Note: Microdot may be in either location) PIN CONNECTIONS* Applications • • • • • • C2 MG G High Speed Differential Data Lines USB2.0 IEEE1394 LVDS MIPI MDDI D− 1 N/C 9 N/C 12 8 D− D+ 2 10 11 7 D+ GND 3 N/C N/C 6 VCC GND 4 5 GND GND (Top View) *NOTE: Pins 1 and 9, Pins 2 and 10, Pins 7 and 11, Pins 8 and 12 are internally connected in pairs. It is recommended not to solder to Pins 9, 10, 11, 12. ORDERING INFORMATION Device Package Shipping† NUC2401MNTAG DFN8 (Pb−Free) 3000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2010 January, 2010 − Rev. 2 1 Publication Order Number: NUC2401MN/D NUC2401MN MAXIMUM RATINGS (TA = 25°C unless otherwise stated) Symbol Value Units VPP ±12 kV Operating Temperature Range TOP −40 to 85 °C Storage Temperature Range TSTG −55 to 125 °C TL 260 °C ILINE 100 mA Parameter ESD Discharge IEC61000−4−2 Contact Discharge Maximum Lead Temperature for Soldering Purposes (1/8” from Case for 10 Seconds) DC Current per Line Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified) Symbol Parameter Maximum Reverse Working Voltage Breakdown Voltage Test Conditions Min Typ Max Unit 5.0 V 8.6 V VRWM VBR IR = 1 mA 6.0 7.6 Leakage Current IR VRWM = 5.5 V 2.0 mA Maximum Peak Pulse Current IPP 8x20 ms Waveform 12 A Clamping Voltage VC IPP = 5 A 10 V Resistance Pin 1 to Pin 8 RA 2.2 5.0 W Resistance Pin 2 to Pin 7 RB 2.2 5.0 W Capacitance (Note 1) CLINE 1 0.8 1.0 pF Capacitance (Note 2) CLINE 2 0.8 1.0 pF Common Mode Cut−Off Frequency (Note 3) f3dB (Above this Frequency, Appreciable Common Mode Attenuation Occurs) 40 MHz Common Mode Impedance ZC @ 100 MHz 90 W 1. Measured at 25°C, VR = 0 V, f = 1 MHz, Pins 1 or 4 to GND. 2. Measured at 25°C, VR = 0 V, f = 1 MHz, Pins 8 or 5 to GND. 3. 50 W source and 50 W load termination. 10000 0 Differential Mode INSERTION LOSS (dB) −5 IMPEDANCE (W) 1000 Common Mode 100 10 Differential Mode 1 1 10 100 −10 −15 Common Mode −20 −25 −30 1000 10000 −35 1 FREQUENCY (MHz) 10 100 1000 10000 FREQUENCY (MHz) Figure 1. Impedance Characteristics vs. Frequency Figure 2. Insertion Loss Characteristics vs. Frequency http://onsemi.com 2 NUC2401MN I/O 1 I/O 8 I/O 2 I/O 7 NUC2401MN 2 4 Network Analyzer 1 3 Normal (Differential) Mode Figure 3. Normal (Differential) Mode Test Configuration I/O 1 I/O 8 I/O 2 I/O 7 Differential Signal Driver and Transmission Line NUC2401MN Figure 4. Application Circuit http://onsemi.com 3 Differential Signal Buffer and Transmission Line NUC2401MN PACKAGE DIMENSIONS DFN8, 2.2x2, 0.5P CASE 506BL−01 ISSUE O A B D PIN ONE REFERENCE 2X 0.10 C 2X ÉÉÉ ÉÉÉ ÉÉÉ 0.10 C E NOTE 5 END VIEW DETAIL B A A1 A3 SIDE VIEW C ÇÇÇ ÉÉÉ EXPOSED Cu 9X 0.08 C MOLD CMPD DETAIL B OPTIONAL CONSTRUCTION SEATING PLANE 0.10 C A B DETAIL A 1 4 L1 E2 DETAIL A 0.10 C A B 8 5 e 8X MILLIMETERS MIN MAX 0.85 0.95 0.00 0.05 0.20 REF 0.15 0.25 2.20 BSC 0.34 0.54 2.00 BSC 0.60 0.80 0.50 BSC 0.20 −−− 0.30 0.50 −−− 0.15 L D2 L K DIM A A1 A3 b D D2 E E2 e K L L1 TOP VIEW 0.10 C NOTE 4 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. 5. EXPOSED ENDS OF THE TERMINALS ARE ELECTRICALLY ACTIVE. OPTIONAL CONSTRUCTIONS b 8X 0.10 C A B e/2 0.05 C SOLDERING FOOTPRINT* 0.90 0.24 0.55 NOTE 3 BOTTOM VIEW 8X (0.28) (0.825) 2.30 0.62 0.80 (0.20) 1 (0.50) PACKAGE OUTLINE 0.50 PITCH DIMENSIONS: MILLIMETERS 4X (0.25) *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. AUXILIARY BOTTOM VIEW (FOR REFERENCE ONLY) ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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