NUF2450MU 2 Line EMI Filter with ESD Protection in UDFN8 Package This device is a 2 line EMI filter array for audio applications. Greater than −30 dB attenuation is obtained at frequencies from 800 MHz to 5.0 GHz. The NUF2450MU has a cut−off frequency of 20 MHz and minimal line resistance, making it ideal for applications requiring low bandpass attenuation. This UDFN package is specifically designed to enhance EMI filtering for low−profile or slim design electronics especially where space and height is a premium. It also offers ESD protection−clamping transients from static discharges. ESD protection is provided across all capacitors. http://onsemi.com L 1 8 Cd Cd L 4 Cd Features • EMI Filtering and ESD Protection • Integration of 10 Discrete Components • Compliance with IEC61000−4−2 (Level 4) 5 Cd (Top View) 20 kV (Contact) • UDFN Package, 1.2 x 1.8 mm • Moisture Sensitivity Level 1 • ESD Ratings: Machine Model = C • 1 UDFN8 CASE 517AD Human Body Model = 3B This is a Pb−Free Device* Benefits • • Particularly for Portable Electronics Integrated Solution Offers Cost and Space Savings in UDFN Package Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass Filter Response Integrated Solution Improves System Reliability Excellent ESD Performance with Large GND Pad 1 4 GND 8 • Headsets, MP3 Players, and PDAs • Portable DVDs • Hands−Free Interface 5 (Bottom View) ORDERING INFORMATION *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. December, 2006 − Rev. 0 24 MG G PIN CONNECTIONS Applications © Semiconductor Components Industries, LLC, 2006 1 24 = Specific Device Code M = Month Code G = Pb−Free Package (Note: Microdot may be in either location) • Reduces EMI/RFI Emissions on Audio Lines • Low Profile Package; Typical Height of 0.5 mm • Design−Friendly and Easy−to−Use Pin Configurations, • • MARKING DIAGRAM 8 1 Device Package Shipping † NUF2450MUT2G UDFN8 (Pb−Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Publication Order Number: NUF2450MU/D NUF2450MU MAXIMUM RATINGS Parameter Symbol ESD Discharge IEC61000−4−2 Value VPP Unit kV Contact Discharge Machine Model Human Body Model 20 1.6 16 Operating Temperature Range TOP −40 to 85 °C Storage Temperature Range TSTG −55 to 150 °C TL 260 °C Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 s) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted) Parameter Symbol Maximum Reverse Working Voltage VRWM Breakdown Voltage Test Conditions Min Typ Max Unit − − 5.0 V VBR IR = 1.0 mA 6.0 7.0 8.0 V Leakage Current IR VRWM = 3.3 V − − 100 nA Inductance L − 2.3 − nH 0.9 1.3 1.7 Capacitance (Note 1) Cline VR = 0 V, f = 1.0 MHz 190 240 290 pF Cut−Off Frequency (Note 2) f3dB Above this frequency, Appreciable Attenuation Occurs − 20 − MHz Series Resistance RS 1. Measured at 25°C. 2. 50 source and 50 load termination. 0 0 −5 −10 −10 −20 −20 S41 (dB) S21 (dB) −15 −25 −30 −35 −30 −40 −50 −40 −60 −45 −50 1.00E+06 1.00E+07 1.00E+08 1.00E+09 1.00E+10 −70 1.E+06 1.E+07 1.E+08 1.E+09 FREQUENCY (Hz) FREQUENCY (Hz) Figure 1. Typical Insertion Loss Characteristics (S21 Measurement) Figure 2. Analog Crosstalk Curve (S41 Measurement) http://onsemi.com 2 1.E+10 NUF2450MU PACKAGE DIMENSIONS UDFN8, 1.8x1.2, 0.4P CASE 517AD−01 ISSUE O A B D 2X 0.10 C PIN ONE REFERENCE 2X ÉÉ ÉÉ ÉÉ ÇÇ ÉÉ E A1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. A3 DETAIL A 0.10 C DIM A A1 A3 b D D2 E E2 e K L TOP VIEW (A3) DETAIL A A 0.10 C 8X 0.08 C SEATING PLANE SIDE VIEW C A1 SOLDERING FOOTPRINT* 1.35 D2 8X MILLIMETERS MIN NOM MAX 0.45 0.50 0.55 0.00 0.03 0.05 0.127 REF 0.15 0.20 0.25 1.80 BSC 0.90 1.00 1.10 1.20 BSC 0.20 0.30 0.40 0.40 BSC 0.20 −−− −−− 0.20 0.25 0.30 6X 0.35 e L 1 4 E2 0.30 8X K 8 5 8X b BOTTOM VIEW 0.10 C A B 0.05 C 1.05 7X 0.20 NOTE 3 8X 0.32 0.40 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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