NLX2G08 Dual 2-Input AND Gate The NLX2G08 is a high performance dual 2−input AND Gate operating from a 1.65 V to 5.5 V supply. Features • • • • • • • • • • Extremely High Speed: tPD 2.5 ns (typical) at VCC = 5 V Designed for 1.65 V to 5.5 V VCC Operation Over Voltage Tolerant Inputs LVTTL Compatible − Interface Capability With 5 V TTL Logic with VCC = 3 V LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current Substantially Reduces System Power Requirements Replacement for NC7WZ08 Chip Complexity: FET = 124 This is a Pb−Free Device A1 7 B1 6 Y2 5 http://onsemi.com 1 MARKING DIAGRAM 8 1 UQFN8 MU SUFFIX CASE 523AN AD MG G AD = Device Code M = Date Code* G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. VCC 8 4 GND IEEE/IEC A1 B1 1 Y1 2 B2 Figure 1. Pinout 1 Y1 2 B2 3 A2 4 GND 5 Y2 6 B1 7 A1 8 VCC © Semiconductor Components Industries, LLC, 2009 April, 2009 − Rev. 0 Y2 Figure 2. Logic Symbol PIN ASSIGNMENT Function Y1 A2 B2 3 A2 Pin & FUNCTION TABLE Y = AB Inputs Output A B Y L L L L H L H L L H H H H = HIGH Logic Level L = LOW Logic Level 1 Publication Order Number: NLX2G08/D NLX2G08 MAXIMUM RATINGS Symbol Parameter Value Unit VCC DC Supply Voltage *0.5 to )7.0 V VI DC Input Voltage *0.5 to )7.0 V VO DC Output Voltage *0.5 to VCC + 0.5 V IIK DC Input Diode Current VI < GND *50 mA IOK DC Output Diode Current VO < GND *50 mA IO DC Output Sink Current $50 mA ICC DC Supply Current per Supply Pin $100 mA IGND DC Ground Current per Ground Pin $100 mA TSTG Storage Temperature Range *65 to )150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature under Bias qJA Thermal Resistance PD Power Dissipation in Still Air at 85°C MSL Moisture Sensitivity FR Flammability Rating VESD ESD Withstand Voltage Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) > 2000 > 200 N/A V ILatch−Up Latch−Up Performance Above VCC and Below GND at 85°C (Note 5) $500 mA (Note 1) 260 °C )150 °C TBD °C/W 250 mW Level 1 Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. 5. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Supply Voltage VI Input Voltage VO Output Voltage TA Operating Free−Air Temperature Dt/DV Input Transition Rise or Fall Rate Min Max Unit 1.65 1.5 5.5 5.5 V (Note 6) 0 5.5 V (HIGH or LOW State) 0 VCC V −55 +125 °C 0 0 0 20 10 5 ns/V Operating Data Retention Only VCC = 2.5 V $0.2 V VCC = 3.0 V $0.3 V VCC = 5.0 V $0.5 V 6. Unused inputs may not be left open. All inputs must be tied to a high− or low−logic input voltage level. http://onsemi.com 2 NLX2G08 DC ELECTRICAL CHARACTERISTICS Symbol Parameter Condition TA = 255C VCC (V) Min 0.75 VCC 0.7 VCC VIH High−Level Input Voltage 1.65 2.3 to 5.5 VIL Low−Level Input Voltage 1.65 2.3 to 5.5 VOH High−Level Output Voltage VIN = VIL or VIH IOH = 100 mA IOH = −3 mA IOH = −8 mA IOH = −12 mA IOH = −16 mA IOH = −24 mA IOH = −32 mA 1.65 to 5.5 165 2.3 2.7 3.0 3.0 4.5 VOL Low−Level Output Voltage VIN = VIH or VOH IOL = 100 mA IOL = 3 mA IOL = 8 mA IOL = 12 mA IOL = 16 mA IOL = 24 mA IOL = 32 mA 1.65 to 5.5 IIN Input Leakage Current VIN = VCC or GND ICC Quiescent Supply Current VIN = VCC or GND −555C v TA v 1255C Typ Max Min 0.75 VCC 0.7 VCC 0.25 VCC 0.3 VCC VCC − 0.1 1.29 1.9 2.2 2.4 2.3 3.8 Max VCC 1.5 2.1 2.4 2.7 2.5 4.0 Unit V 0.25 0.3 VCC VCC − 0.1 1.5 1.9 2.2 2.4 2.3 3.8 V V 0.1 0.24 0.3 0.4 0.4 0.55 0.55 0.1 0.24 0.3 0.4 0.4 0.55 0.55 V 0 to 5.5 $0.1 $1.0 mA 5.5 1.0 10 mA 0.08 0.20 0.22 0.28 0.38 0.42 2.3 2.7 3.0 3.0 4.5 AC ELECTRICAL CHARACTERISTICS tR = tF = 3.0 ns TA = 255C VCC Symbol tPLH tPHL Condition (V) Min Typ Max Min Max Unit RL = 1 MW, CL = 15 pF 1.8 $ 0.15 2.0 5.7 10.5 2.0 11.0 ns 2.5 $ 0.2 1.0 3.5 5.8 2.0 6.2 RL = 1 MW, CL = 15 pF RL = 500 W, CL = 50 pF 3.3 $ 0.3 0.8 1.2 2.6 3.2 3.9 4.8 0.8 1.2 4.3 5.2 RL = 1 MW, CL = 15 pF RL = 500 W, CL = 50 pF 5.0 $ 0.5 0.5 0.8 1.9 2.5 3.1 3.7 0.5 0.8 3.3 4.0 Parameter Propagation Delay (Figure 3 and 4) −555C v TA v 1255C CAPACITIVE CHARACTERISTICS Symbol Parameter Condition Typical Unit CIN Input Capacitance VCC = 5.5 V, VI = 0 V or VCC 4 pF CPD Power Dissipation Capacitance (Note 7) 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 10 MHz, VCC = 5.5 V, VI = 0 V or VCC 25 30 pF 7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. http://onsemi.com 3 NLX2G08 VCC INPUT 50% An and Bn 50% VCC GND tPLH RL CL tPHL VOH OUTPUT Yn 50% VCC A 1−MHz square input wave is recommended for propagation delay tests. VOL Figure 3. Switching Waveform Figure 4. Test Circuit DEVICE ORDERING INFORMATION Device Order Number NLX2G08MUTCG Package Type Tape and Reel Size† UQFN8 (Pb−Free) 3000 Unit / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 4 NLX2G08 PACKAGE DIMENSIONS UQFN8 MU SUFFIX CASE 523AN−01 ISSUE O A B D PIN ONE REFERENCE 2X 0.10 C ÉÉÉ ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ ÉÉÉ MOLD CMPD EXPOSED Cu E A1 A3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. DETAIL B DIM A A1 A3 b D E e L L1 L3 OPTIONAL CONSTRUCTION 2X 0.10 C TOP VIEW L1 (A3) DETAIL B L3 A 0.05 C b 0.05 C SIDE VIEW (0.10) C A1 SEATING PLANE MILLIMETERS MIN MAX 0.45 0.60 0.00 0.05 0.13 REF 0.15 0.25 1.60 BSC 1.60 BSC 0.50 BSC 0.35 0.45 −−− 0.15 0.25 0.35 (0.15) SOLDERING FOOTPRINT* DETAIL A OPTIONAL CONSTRUCTION 1.70 0.50 PITCH 8X 8X L3 L 1 e 5 3 0.35 1 DETAIL A 1.70 7 8 8X b 0.10 C A B BOTTOM VIEW 0.05 C 7X 0.25 8X 0.53 NOTE 3 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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