NL37WZ04 Triple Inverter The NL37WZ04 is a high performance triple inverter operating from a 1.65 V to 5.5 V supply. High impedance TTL compatible inputs significantly reduce current loading to input drivers while TTL compatible outputs offer improved switching noise performance. http://onsemi.com Features • • • • • • • • • Extremely High Speed: tPD 2.0 ns (typical) at VCC = 5 V Designed for 1.65 V to 5.5 V VCC Operation Over Voltage Tolerant Inputs and Outputs LVTTL Compatible − Interface Capability With 5 V TTL Logic with VCC = 3 V LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current Substantially Reduces System Power Requirements Chip Complexity: FET = 72 Pb−Free Package is Available MARKING DIAGRAM 8 8 1 US8 US SUFFIX CASE 493 L5 M G G 1 L5 M G = Device Code = Date Code* = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. IN A1 1 8 VCC OUT Y3 2 7 OUT Y1 PIN ASSIGNMENT IN A2 GND IN A3 6 3 5 4 OUT Y2 1 IN A1 2 OUT Y3 3 IN A2 4 GND 5 OUT Y2 6 IN A3 7 OUT Y1 8 VCC Figure 1. Pinout (Top View) 1 IN A1 FUNCTION TABLE OUT Y1 A Input IN A2 1 OUT Y2 IN A3 1 OUT Y3 L H Y Output H L Figure 2. Logic Symbol ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. © Semiconductor Components Industries, LLC, 2006 April, 2006 − Rev. 4 1 Publication Order Number: NL37WZ04/D NL37WZ04 MAXIMUM RATINGS Symbol Parameter Value Unit VCC DC Supply Voltage *0.5 to )7.0 V VI DC Input Voltage *0.5 to )7.0 V VO DC Output Voltage *0.5 to )7.0 V IIK DC Input Diode Current VI < GND *50 mA IOK DC Output Diode Current VO < GND *50 mA IO DC Output Sink Current $50 mA ICC DC Supply Current per Supply Pin $100 mA IGND DC Ground Current per Ground Pin $100 mA TSTG Storage Temperature Range *65 to )150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature under Bias qJA Thermal Resistance PD Power Dissipation in Still Air at 85°C MSL Moisture Sensitivity FR Flammability Rating VESD ESD Withstand Voltage (Note 1) 260 °C )150 °C 250 °C/W 250 mW Level 1 Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) > 2000 > 200 N/A V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Supply Voltage VI Input Voltage VO Output Voltage TA Operating Free−Air Temperature Dt/DV Input Transition Rise or Fall Rate Min Max Unit 1.65 1.5 5.5 5.5 V (Note 5) 0 5.5 V (HIGH or LOW State) 0 VCC V *40 )85 °C 0 0 0 20 10 5 ns/V Operating Data Retention Only VCC = 2.5 V $0.2 V VCC = 3.0 V $0.3 V VCC = 5.0 V $0.5 V 5. Unused inputs may not be left open. All inputs must be tied to a high− or low−logic input voltage level. http://onsemi.com 2 NL37WZ04 DC ELECTRICAL CHARACTERISTICS Symbol VIH VIL VOH VOL Parameter Min 1.65 0.75 VCC 0.75 VCC 2.3 to 5.5 0.7 VCC 0.7 VCC Condition High−Level Input Voltage Low−Level Input Voltage High−Level Output Voltage VIN = VIL Low−Level Output Voltage VIN = VIH *405C v TA v 855C TA = 255C VCC (V) Typ Max Min 1.65 0.25 VCC 0.25 VCC 0.3 VCC 0.3 VCC 1.65 to 5.5 VCC *0.1 VCC VCC *0.1 IOH = *3 mA 1.65 1.29 1.52 1.29 IOH = *8 mA 2.3 1.9 2.1 1.9 IOH = *12 mA 2.7 2.2 2.4 2.2 IOH = *16 mA 3.0 2.4 2.7 2.4 IOH = *24 mA 3.0 2.3 2.5 2.3 IOH = *32 mA 4.5 3.8 4.0 3.8 1.65 to 5.5 Unit V 2.3 to 5.5 IOH = −100 mA IOL = 100 mA Max V V 0.1 0.1 V IOL = 3 mA 1.65 0.08 0.24 0.24 IOL = 8 mA 2.3 0.20 0.3 0.3 IOL = 12 mA 2.7 0.22 0.4 0.4 IOL = 16 mA 3.0 0.28 0.4 0.4 IOL = 24 mA 3.0 0.38 0.55 0.55 IOL = 32 mA 4.5 0.42 0.55 0.55 0 to 5.5 $0.1 $1.0 mA 0 1 10 mA 1.65 to 5.5 1 10 mA IIN Input Leakage Current VIN = VCC or GND IOFF Power Off−Output Leakage Current VOUT = 5.5 V ICC Quiescent Supply Current VIN = VCC or GND AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns; CL = 50 pF; RL = 500 W *405C v TA v 855C TA = 255C VCC (V) Min Typ Max Min Max Unit RL = 1 MW, CL = 15 pF 1.8 $ 0.15 1.8 4.4 9.5 2.0 10 ns RL = 1 MW, CL = 15 pF 2.5 $ 0.2 1.2 5.0 5.7 1.2 6.1 RL = 1 MW, CL = 15 pF 3.3 $ 0.3 0.8 2.2 3.4 0.8 3.8 1.2 3.9 4.5 1.2 5.0 0.5 1..8 2.8 0.5 3.1 0.8 2.3 3.6 0.8 4.0 ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Symbol tPLH tPHL Parameter Condition Propagation Delay (Figure 3 and 4) RL = 500 W, CL = 50 pF RL = 1 MW, CL = 15 pF 5.0 $ 0.5 RL = 500 W, CL = 50 pF CAPACITIVE CHARACTERISTICS Symbol Parameter Condition Typical Unit 2.5 pF pF CIN Input Capacitance VCC = 5.5 V, VI = 0 V or VCC CPD Power Dissipation Capacitance (Note 6) 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 9 10 MHz, VCC = 5.5 V, VI = 0 V or VCC 11 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin ) ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin ) ICC VCC. http://onsemi.com 3 NL37WZ04 tr = 3 ns tf = 3 ns 90% 50% INPUT VCC 90% 50% 10% 10% tPHL INPUT GND OUTPUT RL tPLH CL* VOH OUTPUT Y 50% 50% *CL includes all probe and jig capacitances. VOL A 1−MHz square input wave is recommended for propagation delay tests. Figure 3. Switching Waveform Figure 4. Test Circuit DEVICE ORDERING INFORMATION Device Order Number NL37WZ04US NL37WZ04USG Package Type Tape and Reel Size† US8 178 mm, 3000 Units / Tape & Reel US8 (Pb−Free) 178 mm, 3000 Units / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 4 NL37WZ04 PACKAGE DIMENSIONS US8 US SUFFIX CASE 493−02 ISSUE B −X− A 8 −Y− 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION “A” DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURR. MOLD FLASH. PROTRUSION AND GATE BURR SHALL NOT EXCEED 0.140 MM (0.0055”) PER SIDE. 4. DIMENSION “B” DOES NOT INCLUDE INTER−LEAD FLASH OR PROTRUSION. INTER−LEAD FLASH AND PROTRUSION SHALL NOT E3XCEED 0.140 (0.0055”) PER SIDE. 5. LEAD FINISH IS SOLDER PLATING WITH THICKNESS OF 0.0076−0.0203 MM. (300−800 “). 6. ALL TOLERANCE UNLESS OTHERWISE SPECIFIED ±0.0508 (0.0002 “). J DETAIL E B L 1 4 R S G P U C −T− SEATING PLANE D 0.10 (0.004) M H 0.10 (0.004) T K N R 0.10 TYP T X Y V M F DETAIL E DIM A B C D F G H J K L M N P R S U V MILLIMETERS MIN MAX 1.90 2.10 2.20 2.40 0.60 0.90 0.17 0.25 0.20 0.35 0.50 BSC 0.40 REF 0.10 0.18 0.00 0.10 3.00 3.20 0_ 6_ 5_ 10 _ 0.23 0.34 0.23 0.33 0.37 0.47 0.60 0.80 0.12 BSC INCHES MIN MAX 0.075 0.083 0.087 0.094 0.024 0.035 0.007 0.010 0.008 0.014 0.020 BSC 0.016 REF 0.004 0.007 0.000 0.004 0.118 0.126 0_ 6_ 5_ 10 _ 0.010 0.013 0.009 0.013 0.015 0.019 0.024 0.031 0.005 BSC SOLDERING FOOTPRINT* 3.8 0.15 0.50 0.0197 1.8 0.07 0.30 0.012 1.0 0.0394 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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