LINER RH1573K

DICE/DWF SPECIFICATION
RH1573K
Low Dropout PNP
Regulator Driver
PAD FUNCTION
5
6
1.
2.
3.
4.
5.
6.
7.
8.
9.
4
7
3
8
DRIVE
VIN
VOUT
COMP
GND1**
FB
LATCH
SHDN
GND2**
DIE CROSS REFERENCE
LTC Finished
Part Number
RH1573K†
RH1573K†
Order
Part Number
RH1573KDICE†
RH1573KDWF*,†
Please refer to LTC standard product data sheet for
other applicable product information.
*DWF = DICE in wafer form.
2
9
1
**GND1 and GND2 are
connected together to
form GND
61mils × 72mils,
12mils thick.
†
Backside metal: Alloyed gold layer
(K designator)
Backside potential: lowest (GND) voltage
L, LT, LTC and LTM are registered trademarks of Linear Technology Corporation. All other
trademarks are the property of their respective owners.
DICE/DWF ELECTRICAL TEST LIMITS
TA = 25°C.
PARAMETER
CONDITIONS
MIN
MAX
UNITS
Reference Voltage
IDRIVE = 20mA, TJ = 25°C
1.252
1.278
V
Line Regulation (VFB)
IDRIVE = 20mA, 3V < VIN < 7V
2
mV
Load Regulation (VFB)
IDRIVE = 20mA to 250mA
18
mV
FB Pin Bias Current
VFB = 1.265V
4
μA
DRIVE Pin Current
VFB = 1.35V, VDRIVE = 7V
VFB = 1.15V, VDRIVE = 1.5V
1.2
mA
mA
0.2
1
V
V
DRIVE Pin Saturation Voltage
290
IDRIVE = 20mA, VFB = 1.15V
IDRIVE = 250mA, VFB = 1.15V
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
1
DICE/DWF SPECIFICATION
RH1573K
DICE/DWF ELECTRICAL TEST LIMITS
PARAMETER
TA = 25°C.
CONDITIONS
SHDN Pin Threshold Voltage
MIN
MAX
1
1.5
V
300
μA
1.8
V
VSHDN = 5V
SHDN Pin Current
LATCH Pin Latch-Off Threshold Voltage
1.1
LATCH Pin Charging Current
4
LATCH Pin Latching Current
VIN to VOUT Differential Threshold for Latch
Disable
0.55
Input Quiescent Current
VIN = 7V
Minimum Input Voltage for Bias Operation
10
μA
0.85
mA
0.8
V
2.8
mA
2.4
Note 1: For circuit operation and application information refer to LT1573
data sheet.
UNITS
V
Note 2: For post radiation performance contact factory.
Wafer level testing is performed per the indicated specifications for dice. Considerable differences in performance can often be observed for dice versus
packaged units due to the influences of packaging and assembly on certain devices and/or parameters. Please consult factory for more information
on dice performance and lot qualifications via lot sampling test procedures.
Dice data sheet subject to change. Please consult factory for current revision in production.
I.D.No. 66-13-rh1573
2
Linear Technology Corporation
LT 0808 • PRINTED IN USA
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
●
www.linear.com
© LINEAR TECHNOLOGY CORPORATION 2008