MA4SPS552 SURMOUNTTM PIN Diode RoHS Compliant Rev. V1 Features Surface Mount Device No Wirebonds Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Ultra-Low Parasitic Capacitance and Inductance Higher Power Handling ( Efficient Heat sinking ) A B Description This device is a silicon-glass PIN diode chip fabricated with M/A-COM Technology Solutions patented HMIC process. This device features two silicon pedestals embedded in a low loss glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls conductive. Selective backside metalization is applied producing a surface mount device. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly. C D E F Absolute Maximum Ratings TA = +25°C (unless otherwise specified) Parameter Forward Current 100 mA Reverse Voltage -200 V Operating Temperature -65°C to +150°C Storage Temperature -65°C to +150°C Junction Temperature +175°C Dissipated RF & DC Power Mounting Temperature G Absolute Maximum 1W +235°C for 10 seconds Applications These packageless devices are suitable for usage in Moderate Incident Power ( 5 W C.W. ) or Higher Incident Peak Power ( 200 W, 1 uS, 0.001 Duty ) Series, Shunt, or Series-Shunt Switches. Small Parasitic Inductance, 0.7 nH, and Excellent RC Constant, 0.20 pS, make the devices ideal for TR Switch and Accessory Switch Circuits, where higher P1db and IP3 values are required. These diodes can also be used in π, T, Tapered Resistance, and Switched-Pad Attenuator Control Circuits for 50Ω or 75Ω systems dim. in mm min. max. min. max. A 0.0207 0.0226 0.525 0.575 B 0.0108 0.0128 0.275 0.325 C 0.0040 0.0080 0.102 0.203 D 0.0069 0.0089 0.175 0.225 E 0.0018 0.0037 0.045 0.095 F 0.0061 0.0081 0.155 0.205 G 0.0069 0.0089 0.175 0.225 1. Backside metal: 0.1 micron thk. 1 ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. MA-COM Technical Solutions and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. MA4SPS552 SURMOUNTTM PIN Diode RoHS Compliant Rev. V1 Electrical Specifications at +25°C Symbol CT Parameter Total Capacitance Conditions -40V, 1MHz Units pF CT Total Capacitance -40V, 1GHz pF 0.06 RS Series Resistance 100mA, 100MHz Ω 1.7 RS Series Resistance 20mA, 100MHz Ω 2.4 VF Forward Voltage 100mA V 1.00 1.25 VF Forward Voltage 10mA V 0.88 1.00 VR Reverse Voltage -10 µA V IR Reverse Leakage -40 V Current Thermal ResisSteady State tance Minority Carrier ( 50 % - 90 % V ) Lifetime +10mA / -6mA RqJL TL Min. Value | - 200 | Typ. Value 0.08 Max. Value 0.14 | -275 | nA | - 10 | °C/W 30 µs 2.5 Capacitance vs Frequency 0.20 0.18 0.16 Cp ( pF ) 0V 0.14 0.12 -5V 0.10 0.08 -40V 0.06 0.04 0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 1.00 Frequency ( GHz ) 2 ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. MA-COM Technical Solutions and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. MA4SPS552 SURMOUNTTM PIN Diode RoHS Compliant Rev. V1 Capacitance vs Voltage Cp ( pF ) 0.20 0.18 100 MHz 0.16 1 GHz 0.14 1 GHz 100 MHz 0.12 0.10 0.08 0.06 0.04 0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 40.0 Voltage ( V ) Rs vs I Rs ( Ohms ) 100.0 1GHz 10.0 100MHz 1.0 0.01 0.10 1.00 10.00 100.00 I ( mA ) 3 ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. MA-COM Technical Solutions and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. MA4SPS552 SURMOUNTTM PIN Diode RoHS Compliant Rev. V1 Rs vs Frequency 4.0 3.5 10mA Rs ( Ohms ) 3.0 2.5 20mA 2.0 50mA 1.5 100mA 1.0 0.5 0.0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 Frequency (GHz) Parallel Resistance vs V 1.0E+06 Rp ( Ohms ) 100MHz 1.0E+05 1GHz 1.0E+04 1.0E+03 0.0 -5.0 -10.0 -15.0 -20.0 -25.0 -30.0 -35.0 -40.0 Reverse Bias ( -V ) 4 ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. MA-COM Technical Solutions and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. MA4SPS552 SURMOUNTTM PIN Diode RoHS Compliant Rev. V1 MA4SPS552 Ins & Ret Loss 0 0 S21 - 0.2 S11 - 0.3 S22 - 0.4 -5 - 10 - 15 - 0.5 - 20 - 0.6 - 0.7 Loss dB Loss dB -0.1 - 25 - 0.8 - 30 - 0.9 -1 - 35 0 1 2 3 4 5 6 Freq GHz MA4SPS522 Isolation 0 S21 -5 Loss dB -10 -15 -20 -25 -30 0 1 2 3 4 5 6 Freq GHz 5 ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. MA-COM Technical Solutions and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. MA4SPS552 SURMOUNTTM PIN Diode RoHS Compliant Rev. V1 Handling All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should insure that abrasion and mechanical shock are minimized. Die Attach Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are conveniently located on the bottom surface of these devices and are removed from the active junction locations. These devices are well suited for solder attachment onto hard and soft substrates. The use of 80Au/20Sn and 60Sn/40Pb solder is recommended. Conductive epoxy for attachment may also be used. When soldering these devices to a hard substrate, hot gas die bonding is preferred. We re-commend utilizing a vacuum tip and force of 60 to 100 grams applied normal to the top surface of the device. When soldering to soft substrates, it is recommended to use a lead-tin interface at the circuit board mounting pads. Position the die so that its mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the circuit trace near the mounting pad while applying 60 to 100 grams of force perpendicular to the top surface of the die. Equal Heat must be applied to both ohmic contacts. Since the HMIC glass is transparent, the edges of the mounting pads closest to each other can be visually inspected through the die after attach is completed. Recommended temperature and re-flow profiles for 60/40, Sn/Pb and RoHS compliant solders are provided in Application Note M538 , “Surface Mounting Instructions“. MA4SPS552 SURMOUNTS may be ordered in either gel packs or tape and reeled by adding the appropriate suffix per the table below. Tape and reel dimensions are provided in Application Note M513 located on the M/ACOM website at www.macomtech.com. Ordering Information Part Number Package MA4SPS552 Die in Carrier MA4SPS552-T Tape/Reel MA4SPS552-W Wafer on Frame 6 ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. MA-COM Technical Solutions and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.