LaneLink™ assemblies feature user friendly squeeze-to-release latch to guarantee proper mating LaneLink cable assemblies meet the new InfiniBand* architecture, which is an approach to I/O technology that was created by the industry’s top computer manufacturers to address the need for greater scalability, reliability, availability and performance in and around servers. The technology will be used to connect servers with remote storage and networking devices, as well as other servers, through host-channel adapters (HCAs) and target-channel adapters (TCAs). The InfiniBand specification grew out of the merger of two earlier groups, Next-Generation I/O and Future I/O, to become one of the enablers for industry-standard server networks. It is designed to support bandwidths well beyond today’s prevailing I/O technologies and will run at 2.5Gbps in a single-directional link. Scaling in bandwidth and frequency is achieved in links of 1 bit, 4 bit and 12 bit bidirectional connections (1X, 4X and 12X). The Molex design adds desirable features, solving issues existing with competitive product. This I/O system has been adapted by several other standards or MSA groups in addition to InfiniBand. *InfiniBand is a registered trademark of the InfiniBand Trade Association Features and Benefits ■ Squeeze-to-release latch provides user with friendly, positive latch/ unlatch from the PCB connector ■ Molex offers a total InfiniBand solution that provides an industry standard compatible interface with 4x (91525) and 12x (91629) connectors ■ Lengths up to 20m are possible with equalization and pre-emphasis (10m standard InfiniBand) ■ Greater system flexibility is available with either latch or jackscrew connector and plug designs ■ High performance production test rack provides 100% testing to XAUI and InfiniBand industry standards ■ Standard 4x interface mates with XenPak (74734) and XPAK (74732) copper transceivers SPECIFICATIONS Reference Information Mates With: 91525-XXXX (latch) 91629-XXXX (jackscrew) Designed In: Millimeters Electrical Voltage: 30V AC/contact Current: 0.5A/contact Contact Resistance: 80ohms Dielectric Withstanding Voltage: 300V/min DC Insulation Resistance: 103 M Ohms minimum between adjacent contacts Mechanical Mating Force: 55.5N Unmating Force: 49.0N Durability: 250 cycles Physical Housing: Zinc die cast Contact: Gold flash over Nickel plating Plating: Contact Area --Nickel Solder Tail Area –Nickel allover Underplating – Gold flash over Paladium Nickel Operating Temperature: -20 + 85°C 0.50mm (.020”) Pitch LaneLink™ 4x and 12x Cable Assemblies 4x – 74506 12x – 74509 0.50mm (.020”) Pitch LaneLink™ 4x and 12x Cable Assemblies APPLICATIONS ■ ■ Server storage applications: – SAN (Storage Area Network) switches, routers and servers, storage racks – RAID (Random Array of Integrated Discs) devices 4x – 74506 12x – 74509 Industry Standard organizations: – 4x and 12x InfiniBand – 10 Gigabit Ethernet – 10 Gigabit Fibre Channel – 4x Serial ATA – 4x Serial Attach SCSI ORDERING INFORMATION Order No. Description 74506-XXXX 74509-XXXX LaneLink 4x Cable Assemblies LaneLink 12x Cable Assemblies Americas Headquarters Lisle, Illinois 60532 U.S.A. 1-800-78MOLEX [email protected] Far East North Headquarters Yamato, Kanagawa, Japan 81-462-65-2324 [email protected] Far East South Headquarters Jurong, Singapore 65-6-268-6868 [email protected] European Headquarters Munich, Germany 49-89-413092-0 [email protected] Corporate Headquarters 2222 Wellington Ct. Lisle, IL 60532 U.S.A. 630-969-4550 Fax:630-969-1352 V isit o u r W e b si t e at www.mo l e x .co m Order No. USA-212 Printed in USA/JI/2003.12 2003, Molex ©